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1. 发明申请

WO1996037332A1 FABRICATING INTERCONNECTS AND TIPS USING SACRIFICIAL SUBSTRATES 审中-公开
标题翻译：制造互连和使用基板的提示
公开(公告)号：WO1996037332A1
公开(公告)日：1996-11-28
申请号：PCT/US1996008107
申请日：1996-05-24
申请人： FORMFACTOR, INC. , KHANDROS, Igor, Y. , ELDRIDGE, Benjamin, N. , MATHIEU, Gaetean, L.
发明人： FORMFACTOR, INC.
IPC分类号： B23K31/02
CPC分类号： H05K3/4015 , B23K20/004 , B23K2101/40 , C23C18/1605 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/06711 , G01R1/06727 , G01R1/07357 , G01R3/00 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L23/66 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/04042 , H01L2224/05644 , H01L2224/05647 , H01L2224/06136 , H01L2224/11003 , H01L2224/1147 , H01L2224/13099 , H01L2224/13111 , H01L2224/16145 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48644 , H01L2224/48647 , H01L2224/48747 , H01L2224/48844 , H01L2224/48847 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2224/85205 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/0001 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H01L2924/1532 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K2201/1031 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , Y02P70/611 , H01L2924/00 , H01L2224/48744 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/2075 , H01L2924/20754 , H01L2224/05599
摘要： Interconnection elements (752) and/or tip structures (770) for interconnection elements (752) may first be fabricated upon sacrificial substrates (702) for subsequent mounting to electronic components (784). In this manner, the electronic components (784) are not "at risk" during the fabrication process. The sacrificial substrate (702) establishes a predetermined spatial relationship between the interconnection elements (752) which may be composite interconnection elements (752) having a relatively soft elongate element (752) as a core and a relatively hard (springy material) overcoat (754). Interconnection elements (752) may be fabricated upon tip structures (770), or may first be mounted to the electronic component (784) and the tip structures (770) joined to the free-ends of the interconnection elements (752). Tip structures (770) formed as cantilever beams are described.
摘要翻译：用于互连元件（752）的互连元件（752）和/或尖端结构（770）可首先制造在牺牲基板（702）上，以便随后安装到电子部件（784）。以这种方式，电子部件（784）在制造过程中不“处于危险中”。牺牲衬底（702）在互连元件（752）之间建立预定的空间关系，其可以是具有作为芯的相对柔软的细长元件（752）和相对硬（弹性材料）外涂层（754）的复合互连元件（752））。互连元件（752）可以制造在尖端结构（770）上，或者可以首先安装到电子部件（784），并且尖端结构（770）连接到互连元件（752）的自由端。描述形成为悬臂梁的尖端结构（770）。

2. 发明申请

WO1995014314A1 CONTACT STRUCTURE FOR INTERCONNECTIONS, INTERPOSER, SEMICONDUCTOR ASSEMBLY AND METHOD 审中-公开
标题翻译：接触结构用于互连，间接器，半导体组件和方法
公开(公告)号：WO1995014314A1
公开(公告)日：1995-05-26
申请号：PCT/US1994013373
申请日：1994-11-16
申请人： FORMFACTOR, INC.
发明人： FORMFACTOR, INC. , KHANDROS, Igor, Y. , MATHIEU, Gaetan, L.
IPC分类号： H01R09/00
CPC分类号： H05K7/1069 , B23K2101/40 , G01R1/0466 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06761 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/563 , H01L21/67138 , H01L21/6715 , H01L22/20 , H01L23/49811 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/06153 , H01L2224/1134 , H01L2224/13083 , H01L2224/13099 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/136 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/49109 , H01L2224/73203 , H01L2224/78301 , H01L2224/81801 , H01L2224/85045 , H01L2224/85205 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01055 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15312 , H01L2924/15787 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10T29/49124 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149 , Y10T29/49162 , Y10T29/49169 , Y10T29/49217 , Y10T29/49224 , H01L2924/00 , H01L2224/48 , H01L2224/81205
摘要： An interconnection contact structure assembly including an electronic component (102) having a surface and a conductive contact terminal (103) carried by the electronic component (102) and accessible at the surface. The contact structure (101) includes an internal flexible elongate member (106) having first (107) and second ends (108) and with the first end (107) forming a first intimate bond to the surface of the conductive contact terminal (103) without the use of a separate bonding material. An electrically conductive shell (116) is provided and is formed of at least one layer of a conductive material enveloping the elongate member (106) and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.
摘要翻译：一种互连接触结构组件，包括具有表面的电子部件（102）和由所述电子部件（102）承载且可在所述表面处接近的导电接触端子（103）。接触结构（101）包括具有第一（107）和第二端（108）的内部柔性细长构件（106），并且第一端（107）形成与导电接触端子（103）的表面的第一紧密接合，而不使用单独的粘合材料。提供导电外壳（116）并且由至少一层导电材料形成，该导电材料包围细长构件（106），并形成与紧邻第一紧密接合点的导电接触端子的至少一部分的第二紧密接合。

3. 发明申请

WO2017091548A1 SOLDERED INTERCONNECT FOR A PRINTED CIRCUIT BOARD HAVING AN ANGULAR RADIAL FEATURE 审中-公开
标题翻译：具有斜角径向特征的印刷电路板的焊接互连
公开(公告)号：WO2017091548A1
公开(公告)日：2017-06-01
申请号：PCT/US2016/063260
申请日：2016-11-22
申请人： MERCURY SYSTEMS, INC.
发明人： MCKENNEY, Darryl, J. , METHRATTA, Absu , OUELLETTE, Erica
IPC分类号： H05K1/11 , H01R12/00 , H05K3/30
CPC分类号： H01R12/716 , H01R4/028 , H01R9/091 , H01R12/526 , H01R12/58 , H01R12/714 , H01R13/05 , H01R13/405 , H01R13/652 , H05K1/0213 , H05K1/0237 , H05K1/0298 , H05K1/11 , H05K1/111 , H05K1/115 , H05K1/181 , H05K1/184 , H05K3/308 , H05K3/34 , H05K3/421 , H05K2201/09545 , H05K2201/09827 , H05K2201/10098 , H05K2201/10189 , H05K2201/10295 , H05K2201/1078 , H05K2201/10803 , H05K2201/10878 , H05K2201/10901 , Y02P70/611
摘要： According to exemplary embodiments, a tapered surface interconnect is formed on a printed circuit board (PCB). A compliant pin of an electrical connector may be coupled to the tapered surface interconnect and soldered thereto. The depth of the surface interconnect may be shorter than a height or a thickness of the PCB. The surface interconnect may have a tapered side wall to allow for a better fit with a tapered compliant pin. The inclination of the side wall of the surface interconnect may be linear or concave. The intersection between the tapered sidewall and the bottom of the surface interconnect may be rounded to minimize pin insertion issues and may allow for easier solder flux evacuation from the surface interconnect during the soldering process. The compliant pin may be soldered into place upon being coupled to the tapered surface interconnect.
摘要翻译：根据示例性实施例，在印刷电路板（PCB）上形成锥形表面互连。电连接器的顺从针可以连接到锥形表面互连并焊接到其上。表面互连的深度可以短于PCB的高度或厚度。表面互连可以具有锥形侧壁以允许与锥形顺应针更好地配合。表面互连的侧壁的倾斜可以是线性的或凹陷的。锥形侧壁和表面互连的底部之间的交点可以被倒圆以最小化引脚插入问题并且可以允许在焊接工艺期间更容易从表面互连排出焊料流。顺应针可以在连接到锥形表面互连时焊接到位。

4. 发明申请

WO2015023540A1 LIGHT-EMITTING ELEMENT REPAIR IN ARRAY-BASED LIGHTING DEVICES 审中-公开
标题翻译：基于阵列照明设备的发光元件修复
公开(公告)号：WO2015023540A1
公开(公告)日：2015-02-19
申请号：PCT/US2014/050376
申请日：2014-08-08
申请人： COOLEDGE LIGHTING INC. , TISCHLER, Michael, A. , PINNINGTON, Thomas , SCHICK, Philippe , JUNGWIRTH, Paul
发明人： TISCHLER, Michael, A. , PINNINGTON, Thomas , SCHICK, Philippe , JUNGWIRTH, Paul
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/62 , H01L2924/0002 , H05B33/0893 , H05B37/036 , H05B37/04 , H05K1/0268 , H05K1/0269 , H05K1/0386 , H05K1/141 , H05K1/147 , H05K3/225 , H05K3/288 , H05K3/305 , H05K2201/049 , H05K2201/09045 , H05K2201/09063 , H05K2201/09918 , H05K2201/10106 , H05K2201/10113 , H05K2201/10303 , H05K2201/10386 , H05K2201/10757 , H05K2201/10795 , H05K2201/10871 , H05K2201/10878 , H05K2201/2054 , H05K2203/1545 , H05K2203/162 , H05K2203/166 , H05K2203/175 , H05K2203/176 , H01L2924/00
摘要： A method for repairing a lighting system comprises identifying a fault location; disposing over or under the substrate at the fault location a patch comprising (i) a patch substrate, (ii) two conductive traces disposed on the patch substrate, and (iii) a replacement light-emitting element electrically coupled to the two conductive traces of the patch; and electrically connecting the replacement light-emitting element across the fault location by electrically connecting each of the conductive traces of the patch to one of the conductive traces defining the fault location.
摘要翻译：修理照明系统的方法包括识别故障位置; 在所述故障位置处布置在所述基底之上或之下的贴片，所述贴片包括（i）贴片衬底，（ii）布置在所述贴片衬底上的两个导电迹线，以及（iii）替代发光元件，电耦合到所述两个导电迹线补丁; 以及通过将所述贴片的每个所述导电迹线电连接到限定所述故障位置的导电迹线之一来将所述替代发光元件电连接在所述故障位置上。

5. 发明申请

WO1998014039A1 PASSIVE COMPONENT 审中-公开
标题翻译：被动组件
公开(公告)号：WO1998014039A1
公开(公告)日：1998-04-02
申请号：PCT/IB1997000888
申请日：1997-07-17
申请人： PHILIPS ELECTRONICS N.V. , PHILIPS NORDEN AB
发明人： PHILIPS ELECTRONICS N.V. , PHILIPS NORDEN AB , DIJKSTRA, Rinse
IPC分类号： H05K07/10
CPC分类号： H01G4/228 , H01G2/06 , H05K3/308 , H05K3/3447 , H05K2201/094 , H05K2201/0979 , H05K2201/10651 , H05K2201/10856 , H05K2201/10863 , H05K2201/10878
摘要： In this application, a description is given of a passive component comprising two electric connections with a plug-in portion for securing and electrically connecting the component to a printed circuit board, for example an electrolytic capacitor. In accordance with the invention, this component is so constructed that both plug-in portions are provided with two pins, with the plug-in portions being so positioned that the four pins do not extend in a flat plane. By virtue of the measure in accordance with the invention, resoldering of such components can be dispensed with. The use of pins whose length and width are different enables the manual installation of the components in accordance with the invention in the correct position to be simplified.
摘要翻译：在本申请中，给出了一种无源元件的描述，该无源部件包括具有插入部分的两个电连接，用于固定和电连接该部件到印刷电路板，例如电解电容器。根据本发明，该部件被构造成使得两个插入部分设置有两个销，插入部分被定位成使得四个销不在平面内延伸。凭借根据本发明的措施，可以省去这些部件的分解。使用长度和宽度不同的销可以将根据本发明的部件手动安装在正确的位置以被简化。

6. 发明申请

WO1996016440A1 INTERCONNECTION ELEMENTS FOR MICROELECTRONIC COMPONENTS 审中-公开
标题翻译：微电子元件的互连元件
公开(公告)号：WO1996016440A1
公开(公告)日：1996-05-30
申请号：PCT/US1995014843
申请日：1995-11-13
申请人： FORMFACTOR, INC.
发明人： FORMFACTOR, INC. , KHANDROS, Igor, Y. , MATHIEU, Gaetan, L.
IPC分类号： H01L23/02
CPC分类号： H05K7/1069 , B23K1/0016 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/0466 , G01R1/0483 , G01R1/06711 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07371 , G01R1/07378 , G01R31/2884 , G01R31/2886 , G01R31/2889 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/67138 , H01L22/20 , H01L23/32 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/05124 , H01L2224/05166 , H01L2224/05599 , H01L2224/05647 , H01L2224/1134 , H01L2224/13099 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/16145 , H01L2224/29111 , H01L2224/45014 , H01L2224/45015 , H01L2224/45111 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/456 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/48599 , H01L2224/48699 , H01L2224/48799 , H01L2224/49109 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/78301 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01037 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/0106 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15312 , H01L2924/1532 , H01L2924/15787 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H01R13/2407 , H01R13/2464 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , Y02P70/611 , H01L2924/00 , H01L2924/01013 , H01L2924/01026 , H01L2924/3512 , H01L2224/29099 , H01L2224/48 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/00012 , H01L2924/20751 , H01L2924/20756 , H01L2924/20757 , H01L2924/00015 , H01L2924/2075
摘要： Interconnection elements (210) for electronic components, exhibiting desirable mechanical characteristics (such as resiliency, for making pressure contacts) are formed by shaping an elongate element (core) (216) of a soft material (such as gold) to have a springable shape (including cantilever beam, S-shape, U-shape), and overcoating the shaped elongate element with a hard material (220) (such as nickel and its alloys), to impart a desired spring (resilient) characteristic to the resulting composite interconnection element (210). A final overcoat of a material having superior electrical qualities (e.g., electrical conductivity and/or solderability) may be applied to the composite interconnection element (210). The elongate element (216) may be formed from a wire, or from a sheet (e.g., metal foil). The resulting interconnection elements may be mounted to a variety of electronic components, including directly to semiconductor dies and wafers (in which case the overcoat material anchors the composite interconnection element (210) to a terminal (or the like) on the electronic component), may be mounted to support substrates for use as interposers and may be mounted to substrates for use as probe cards or probe card inserts.
摘要翻译：通过将软材料（例如金）的细长元件（芯）（216）成形为具有弹性形状来形成用于电子部件的用于显示期望的机械特性（例如弹性，用于形成压力接触）的互连元件（210）（包括悬臂梁，S形，U形），并用硬质材料（220）（例如镍及其合金）涂覆成形的细长元件，以赋予所得复合互连件所需的弹簧（弹性）特性元件（210）。可以对复合互连元件（210）施加具有优异电气质量（例如导电性和/或可焊性）的材料的最终外涂层。细长元件（216）可以由导线或从片材（例如，金属箔）形成。所形成的互连元件可以安装到各种电子部件，包括直接连接到半导体管芯和晶片（在这种情况下，外涂层材料将复合互连元件（210）锚定到电子部件上的端子等）上，可以安装到支撑基板上以用作插入件，并且可以安装到用作探针卡或探针卡插入件的基板。

7. 发明申请

WO1992022996A1 ELECTRICAL DEVICE WITH AT LEAST ONE CONTACT PIN AND CONDUCTOR TRACK SHEET 审中-公开
标题翻译：具有至少一个触点引脚和导体跟踪片的电气设备
公开(公告)号：WO1992022996A1
公开(公告)日：1992-12-23
申请号：PCT/DE1992000381
申请日：1992-05-12
申请人： ROBERT BOSCH GMBH , MAYER, Rolf , SIEGEL, Heinz , DERINGER, Helmut , SCHURR, Volker
发明人： ROBERT BOSCH GMBH
IPC分类号： H05K03/34
CPC分类号： H01R12/67 , B60T8/3675 , H01R4/02 , H01R4/2404 , H05K1/118 , H05K3/0058 , H05K3/308 , H05K3/326 , H05K3/3447 , H05K2201/091 , H05K2201/1003 , H05K2201/10303 , H05K2201/10878 , H05K2203/1189
摘要： The aim of the invention is to produce a mechanically and electrically secure solder bond between a contact pin and a solder eyelet on a conductor track sheet. With respect to its end (29), the contact pin (14) has a reduced section, in the form of a constriction (32) for instance, in which lodge sheet sections (28) which protrude out from the plane of the conductor track sheet (18) and which are formed when the contact pin pierces the initially virgin solder eyelet (23). The solder (25) connects the conducting film (21) of the solder eyelet (23) and sheet sections (28) with the contact pin (14).

8. 发明申请

WO2016174715A1 作業機审中-公开
标题翻译：工作机
公开(公告)号：WO2016174715A1
公开(公告)日：2016-11-03
申请号：PCT/JP2015/062703
申请日：2015-04-27
申请人：富士機械製造株式会社
发明人：大坪　覚 , 出蔵　和也
IPC分类号： H05K3/34 , H05K13/04
CPC分类号： H05K13/043 , H05K3/306 , H05K3/308 , H05K3/3447 , H05K3/3468 , H05K13/0069 , H05K13/04 , H05K2201/1059 , H05K2201/10757 , H05K2201/10878 , H05K2203/0195 , H05K2203/044
摘要：本発明の作業機では、回路基材の下方から溶融はんだを噴流する噴流装置１００と、回路基材に形成された貫通穴にリード部品のリード線が挿入される際に、回路基材を下方から支持するバックアップピン１２４とが個別に、回路基材の下方において移動される。このため、回路基材を支持する必要がある場合には、バックアップピンを任意の位置に移動させ、はんだ付けを行う必要がある場合には、バックアップピンを、噴流装置の作動に邪魔にならない位置に移動させることが可能となる。これにより、噴流装置の作動を担保するとともに、必要に応じて、回路基材をバックアップピンにより支持することが可能となり、作業機の実用性が向上する。
摘要翻译：在根据本发明的工作机器中，使熔融焊料的射流从电路基板的下方流出的喷射装置100和从下方支承电路基板的备用销124，引线被插入到形成在电路基板中的通孔中，分别在电路基板的下方移动。因此，当电路基板需要被支撑时，备用引脚可以移动到任意限定的位置，并且当需要进行焊接时，备用引脚可以移动到不干扰喷射装置的操作的位置。通过这种方式，可以确保喷射装置的操作，并且可以根据需要通过支撑销支撑电路基板，从而提高作业机器的实用性。

9. 发明申请

WO2014094584A1 电连接件及使用该电连接件的LED灯审中-公开
公开(公告)号：WO2014094584A1
公开(公告)日：2014-06-26
申请号：PCT/CN2013/089611
申请日：2013-12-16
申请人：厦门立达信照明有限公司 , 王林华 , 朱小磊 , 周琳 , 赵函
发明人：王林华 , 朱小磊 , 周琳 , 赵函
IPC分类号： F21V23/00 , F21Y101/02
CPC分类号： F21V23/06 , F21K9/23 , F21K9/232 , F21K9/238 , F21V23/00 , F21V23/006 , F21Y2115/10 , H01R33/18 , H01R33/225 , H05K3/308 , H05K3/366 , H05K2201/10106 , H05K2201/10189 , H05K2201/10318 , H05K2201/10333 , H05K2201/10393 , H05K2201/1059 , H05K2201/10878
摘要：一种电连接件（30）及使用该电连接件（30）的LED灯（100）。电连接件（30）用于LED灯（100）的光源基板（20）与驱动板（40）之间的电连接，包括输入端子（32）和输出端子（34）。LED灯（100）包括驱动板（40）和光源基板（20）。输出端子（34）设置在LED灯（100）的驱动板（40）上，光源基板（20）对应输入端子（32）设有固定孔（22）。输入端子（32）固定在光源基板（20）的固定孔（22）内并与光源基板（20）电连接。输出端子（34）包括两个触头（342），两个触头（342）的一端分别与驱动板（40）电连接。输入端子（32）包括两个连接头，两个连接头分别对应两个触头（342）设置。两个连接头的一端分别与光源基板（20）电连接。组装时，输出端子（34）的两个触头（342）分别插设在输入端子（32）对应的两个连接头内，两个连接头分别弹性地抵接两个触头（342）。电连接件（30）具有便于自动化组装的优点。

10. 发明申请

WO00001208A1 ASSEMBLY OF AN ELECTRONIC COMPONENT WITH SPRING PACKAGING 审中-公开
标题翻译：具有弹簧包装的电子部件组装
公开(公告)号：WO00001208A1
公开(公告)日：2000-01-06
申请号：PCT/US1999/014924
申请日：1999-06-30
IPC分类号： H05K1/18 , B23K1/00 , B23K20/00 , C23C18/16 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/04 , G01R1/067 , G01R1/073 , G01R31/01 , G01R31/28 , H01L21/00 , H01L21/48 , H01L21/56 , H01L21/60 , H01L21/603 , H01L21/66 , H01L23/04 , H01L23/12 , H01L23/13 , H01L23/32 , H01L23/48 , H01L23/485 , H01L23/49 , H01L23/498 , H01L23/538 , H01L25/065 , H01L25/16 , H05K1/14 , H05K3/20 , H05K3/32 , H05K3/34 , H05K3/36 , H05K3/40
CPC分类号： H01L25/16 , B23K1/0016 , B23K20/004 , B23K2201/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/0408 , G01R1/0433 , G01R1/06711 , G01R1/07342 , G01R1/07378 , G01R31/01 , G01R31/2863 , G01R31/2886 , G01R31/2889 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/04 , H01L23/13 , H01L23/32 , H01L23/49811 , H01L23/5385 , H01L24/06 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L2223/54473 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/05599 , H01L2224/06136 , H01L2224/1134 , H01L2224/13099 , H01L2224/16145 , H01L2224/45144 , H01L2224/49109 , H01L2224/73203 , H01L2224/81136 , H01L2224/81801 , H01L2224/85201 , H01L2224/85399 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01028 , H01L2924/01033 , H01L2924/01051 , H01L2924/01061 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1433 , H01L2924/1532 , H01L2924/15787 , H01L2924/16152 , H01L2924/19043 , H05K1/141 , H05K3/20 , H05K3/325 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K3/4015 , H05K2201/09472 , H05K2201/1031 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , H01L2924/00 , H01L2224/48
摘要： Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor devices. Socket substrates are provided with capture pads for receiving ends of elongate interconnection elements extending from electronic components. Various capture pad configurations are disclosed. A securing device such as a housing positions the electronic component securely to the socket substrate. Connections to external devices are provided via conductive traces adjacent the surface of the socket substrate. The socket substrate may be supported by a support substrate. In a particularly preferred embodiment the capture pads are formed directly on a primary substrate such as a printed circuit board.
摘要翻译：提供产品和组件用于可插拔地接收从电子部件（例如半导体器件）延伸的细长互连元件，例如弹簧接触元件。插座基板设置有用于接收从电子部件延伸的细长互连元件的端部的捕获垫。公开了各种捕获垫结构。诸如壳体的固定装置将电子部件牢固地定位到插座基板。通过邻近插座基板表面的导电迹线提供与外部设备的连接。插座基板可以由支撑基板支撑。在特别优选的实施例中，捕获垫直接形成在诸如印刷电路板的主要基底上。

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