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1. 发明申请

WO1998026638A1 PROCESS FOR REFLOW SOLDERING OF CIRCUIT BOARDS FITTED WITH SMD COMPONENTS 审中-公开
标题翻译：于回流WITH SMD元件方法组装的PCB
公开(公告)号：WO1998026638A1
公开(公告)日：1998-06-18
申请号：PCT/DE1997001997
申请日：1997-09-09
申请人： ROBERT BOSCH GMBH , NEUTEL, Andreas , SCHMIDT, Joachim , SABOTKE, Jens , HAUSCHILD, Frank-Dieter , GRAEN, Ansgar , BARAN, Carola
发明人： ROBERT BOSCH GMBH
IPC分类号： H05K03/34
CPC分类号： H05K3/305 , H05K3/3415 , H05K2201/09072 , H05K2203/1476 , H05K2203/1572 , Y02P70/613
摘要： This invention concerns a process for reflow soldering of circuit boards fitted SMD components in which SMD components are placed on soldering surfaces of the first side of a circuit board and soldered to the circuit board in a first reflow soldering step. Subsequently the circuit board is turned with the first side underneath and SMD components are placed on soldering surfaces of the upward-facing second side, which are soldered to the circuit board in a subsequent reflow soldering step. The SMD components on the first side of the circuit board are firmly cemented to the circuit board before the second reflow soldering step on the first side. It is proposed that after the first reflow soldering step a cement be injected from the second side of the circuit board through holes which pass through the circuit board and correspond to the components soldered to the first side of the board into the space between the components and circuit board.
摘要翻译：根据与SMD元件组装的印刷电路板的回流焊的方法，其中，所述贴片元件被放置在电路板的第一侧的焊接表面，并且被焊接在第一Reflowlötschritt到电路板，所述印刷电路板的本发明则涉及所述第一侧调低和SMD元件被放置在现在覆盖所述第二侧的焊接表面在随后的第二Reflowlötschritt被焊接到所述电路板，其中在电路板的第一侧面上的第一页上的SMD元件的第二Reflowlötschritt之前粘。所以建议第一Reflowlötschritt从所述电路板的第二侧上的粘接剂通过在每种情况下一个位于的钎焊从所述第一侧到所述印刷电路板的第二侧延伸的第一端组件孔的位置，在两者之间的空间后注入部件和电路板。

2. 发明申请

WO1997023121A1 SPHERES USEFUL IN A DETACHABLE CONNECTIVE MEDIUM FOR BALL GRID ARRAY ASSEMBLIES 审中-公开
标题翻译：球员可用于球场阵列组合的可拆卸连接介质
公开(公告)号：WO1997023121A1
公开(公告)日：1997-06-26
申请号：PCT/CA1996000863
申请日：1996-12-19
申请人： WESTAIM TECHNOLOGIES INC. , HAJMRLE, Karel , REID, Kenneth, G. , CHILKOWICH, Anthony, P. , RAMSDEN, James, B.
发明人： WESTAIM TECHNOLOGIES INC.
IPC分类号： H05K03/34
CPC分类号： H05K3/4015 , B23K35/0244 , H01L23/49816 , H01L2224/81141 , H01L2224/81193 , H05K3/3436 , H05K7/1084 , H05K2201/10234 , H05K2201/10992 , H05K2203/041 , H05K2203/0435 , H05K2203/162 , Y02P70/613 , Y10T428/12181 , Y10T428/12687 , Y10T428/12701 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722
摘要： A connective medium is provided for use in ball grid assemblies for detachable connections between electronic devices and circuit boards. The medium includes novel, discrete spheres defining an inner metallic, spherical core and one or more outer, electrically conductive concentric, hard and non-deformable metallic layers.
摘要翻译：提供连接介质用于球栅组件，用于电子设备和电路板之间的可拆卸连接。介质包括限定内部金属球形芯和一个或多个外部，导电的同心的硬和不可变形的金属层的新颖的离散球体。

3. 发明申请

WO1993023981A1 METHOD, APPARATUS AND PRODUCT FOR SURFACE MOUNT SOLDER JOINTS 审中-公开
标题翻译：方法，装置和表面安装焊接接头的产品
公开(公告)号：WO1993023981A1
公开(公告)日：1993-11-25
申请号：PCT/US1993004168
申请日：1993-05-03
申请人： MASK TECHNOLOGY, INC. , HOLZMANN, Damian, J.
发明人： MASK TECHNOLOGY, INC.
IPC分类号： H05K03/34
CPC分类号： H05K3/3457 , B23K1/0002 , B23K1/0016 , H05K3/3452 , H05K3/3484 , H05K3/3494 , H05K2201/029 , H05K2203/0278 , H05K2203/043 , H05K2203/0568 , H05K2203/0776 , Y10T428/12396 , Y10T428/12993
摘要： A method and apparatus for the forming of a solder deposit (2) on an SMD pad (4) on a printed circuit (3) or hybrid circuit board, the formed solder deposit (2) itself as well as a circuit board with the solder so formed thereon. This formed solder deposit (2) is in a defined three-dimensional well having the proper profile and a defined solder gap. By the placement of a mesh (14) on the surface of the circuit board with the solder in place on the pads, applying a slight positive pressure on a rigid or elastic surface (13) on the other side of the mesh, and subjecting this system to a temperature just low enough to reflow the solder by means of a heat transfer fluid, thereby the laminate structure of the board and the coating thereon remain substantially unaffected, then cooling the board to solidify the solder, a product results having the above properties.
摘要翻译：一种用于在印刷电路（3）或混合电路板上的SMD焊盘（4）上形成焊料沉积物（2）的方法和装置，所形成的焊料沉积物（2）本身以及具有焊料的电路板如此形成。这种形成的焊料沉积物（2）在具有适当轮廓和限定的焊料间隙的限定的三维孔中。通过将焊料（14）放置在电路板的表面上，焊料就位于焊盘上，在网的另一侧的刚性或弹性表面（13）上施加轻微的正压力，并对其进行处理系统达到刚刚低到足以通过传热流体回流焊料的温度，由此板上的层压结构和其上的涂层基本上不受影响，然后冷却板以固化焊料，具有上述性能的产品结果。

4. 发明申请

WO1993019576A1 METHOD AND APPARATUS FOR CONNECTING FINE PITCH LEADED ELECTRONIC COMPONENTS TO PRINTED CIRCUIT BOARDS 审中-公开
标题翻译：将精密电子元件连接到印刷电路板的方法和装置
公开(公告)号：WO1993019576A1
公开(公告)日：1993-09-30
申请号：PCT/US1993002552
申请日：1993-03-16
申请人： RAYCHEM CORPORATION
发明人： RAYCHEM CORPORATION , CARLOMAGNO, William, D. , WEIHE, Gary, R.
IPC分类号： H05K03/34
CPC分类号： H05K3/363 , H05K1/117 , H05K3/303 , H05K3/3452 , H05K2201/09909 , H05K2201/10681 , H05K2203/0594 , H05K2203/167 , Y02P70/613
摘要： A method is provided for forming a high density circuit board for connection of a leaded component (28) wherein at least two adjacent beam leads of the component have a pitch smaller than 0.010". The method comprises the steps of: forming connection pads (26) on the circuit board in nominal alignment with the said at least two adjacent beam leads of the component, and forming a guiding structure (30) as a peaked structure between the connection pads (26) for guiding the said at least two adjacent beam leads into alignment with the connection pads (26) during attachment of the leaded component (28) to the circuit board in accordance with the further steps of: coating a photosensitive curable polyimide material in uncured state onto the circuit board, patterning the coated polyimide material by selective exposure to light energy, removing unexposed portions of the polyimide material by an etching step to form the guiding structure means, and curing the polyimide material forming the guiding structure.
摘要翻译：提供一种形成用于连接有铅元件（28）的高密度电路板的方法，其中元件的至少两个相邻的光束引线具有小于0.010“的间距，该方法包括以下步骤：形成连接焊盘（26 ）在所述电路板上与所述组件的所述至少两个相邻的光束引线标称对准，并且在所述连接焊盘（26）之间形成作为峰值结构的引导结构（30），用于引导所述至少两个相邻的光束引线在将有铅部件（28）附接到电路板的过程中，与连接焊盘（26）对准，根据以下步骤：将未固化状态的光敏可固化聚酰亚胺材料涂覆到电路板上，将涂覆的聚酰亚胺材料图案化选择性地暴露于光能，通过蚀刻步骤去除未曝光的部分聚酰亚胺材料以形成引导结构装置，并且固化形成导光体的聚酰亚胺材料结构。

5. 发明申请

WO1993019575A1 PROCESS FOR SOLDERING PRINTED CIRCUIT BOARDS UNDER LOW PRESSURE 审中-公开
标题翻译：在低压下焊接印刷电路板的工艺
公开(公告)号：WO1993019575A1
公开(公告)日：1993-09-30
申请号：PCT/EP1993000624
申请日：1993-03-17
申请人： LINDE AKTIENGESELLSCHAFT , WANDKE, Ernst
发明人： LINDE AKTIENGESELLSCHAFT
IPC分类号： H05K03/34
CPC分类号： B23K1/012 , B23K1/0016 , B23K1/085 , H05K3/3489 , H05K2203/095
摘要： The invention relates to a process for soldering printed circuit boards or the like fitted with components, especially without flux, in which the soldering process and any preceding, intermediate or following steps take place under low pressure and under the plasma effect of a special process gas atmosphere.

6. 发明申请

WO1992004812A1 PRINTED CIRCUIT BOARD MANUFACTURING METHOD ACCOMMODATES WAVE SOLDERING AND PRESS FITTING OF COMPONENTS 审中-公开
标题翻译：印刷电路板制造方法存储波形焊接和组件的压配
公开(公告)号：WO1992004812A1
公开(公告)日：1992-03-19
申请号：PCT/US1991006416
申请日：1991-09-04
申请人： CODEX CORPORATION
发明人： CODEX CORPORATION , McMICHEN, Blane, T. , McMULLEN, Kerry, J. , SUDANOWICZ, John, A., III
IPC分类号： H05K03/34
CPC分类号： H05K3/308 , H05K3/0094 , H05K3/3447 , H05K3/3452 , H05K3/3468 , H05K2201/10303 , H05K2201/1059 , H05K2201/1081 , H05K2203/1189 , H05K2203/1394 , Y10T29/49149 , Y10T29/49153
摘要： A first set of plated-through holes (12) in the printed circuit board (PCB) are covered by a protective solder mask (26) on the solder side of the PCB while a second set of plated-through holes (20) are exposed. Electrical components (22) are disposed on the component side with leads inserted in the second set of holes (20). Solder is prevented from flowing into the first set of holes (12) during wave soldering by the mask covering (26). Conductive pins (30) designed for press fitting into the first set of holes (12) are inserted therethrough to define connecting pins on each side of the PCB following wave soldering. This permits both a wave soldering and press fit operation to be accommodated.

7. 发明申请

WO1986006243A1 PROCESS FOR THE CLOSING UP OF DRILL HOLES PROVIDED FOR IN A PRINTED CIRCUIT BOARD 审中-公开
标题翻译：打印电路板中提供的钻孔闭合的过程
公开(公告)号：WO1986006243A1
公开(公告)日：1986-10-23
申请号：PCT/DE1986000165
申请日：1986-04-15
申请人： EIDENBERG, Kaspar
IPC分类号： H05K03/34
CPC分类号： H05K3/4053 , H05K3/0094 , H05K3/1233 , H05K3/3452 , H05K2201/0959 , H05K2203/082
摘要： Closing up of passive drill holes (14, 18) provided for in a printed circuit board (12). To this effect a mask (24, 26) with screen (30) is laid on the printed circuit board that has been drilled through. At the points corresponding to the drill holes (14) that are to be filled, the mask (24, 26) has holes (28). With a doctor blade (32) solder fill varnish (36) is pressed through the holes in the screen (30) and in the mask (24) into the drill holes (18) as is done in the screen printing process. This pressing of the solder fill varnish into the drill holes (18) can be reinforced through the application of negative pressure from below on the printed circuit board (12).

8. 发明申请

WO1998032314A2 OPTIMIZED SOLDER JOINTS FOR SURFACE MOUNT CHIPS 审中-公开
标题翻译：优化的表面贴装焊接头
公开(公告)号：WO1998032314A2
公开(公告)日：1998-07-23
申请号：PCT/IB1997001602
申请日：1997-12-29
申请人： FORD GLOBAL TECHNOLOGIES, INC.
发明人： FORD GLOBAL TECHNOLOGIES, INC. , McMILLAN, Richard, Keith, II , JAIRAZBHOY, Vivek, Amir , PAO, Yi-Hsin
IPC分类号： H05K03/34
CPC分类号： H05K3/3442 , H05K2201/09427 , H05K2201/09781 , H05K2201/10636 , H05K2203/0465 , H05K2203/306 , Y02P70/611 , Y02P70/613
摘要： There is disclosed herein a surface mount printed circuit board having a substrate (10), at least one surface mount device (14), at least two mounting pads (12) per device (14), solder joints (24) connecting the terminations (22) of the device (14) to their respective mounting pads (12), at least one rectangular lifter pad (30) on the substrate (10) amid the mounting pads (12), and a solder mass (32) on each lifter pad (30) in contact with the bottom surface (18) of the device (14). The inner and outer extensions (li and lo) of the mounting pads (12), the size, number, and shape of the lifter pads, and the amounts of solder deposited on the mounting and lifter pads (30) are designed such that the solder joint (24) has preferably convex outer fillets (28), the device (14) is maintained at a predetermined height (ho) above the mounting pads (12), the inner fillet angle ( alpha ) is maintained above a predetermined minimum angle to increase solder joint crack initiation time, and the overall solder joint crack propagation length is increased. An alternative embodiment also includes plugged vias (34) under the lifter pads (30) and/or mounting pads (12), with gas pockets (40) trapped between the solder masses (32) /solder joints (24) and the plugged vias (34). This trapped gas pocket (40) provides additional buoyant force upon the SMD (14) during reflow.
摘要翻译：这里公开了一种表面安装印刷电路板，其具有基板（10），至少一个表面安装装置（14），每个装置（14）至少两个安装焊盘（12），连接终端的焊接接头（24）（14）的至少一个矩形升降器垫（30），并且在每个升降器（12）上的焊料块（32）上，垫（30）与装置（14）的底表面（18）接触。安装焊盘（12）的内部和外部延伸部（li和lo），提升垫的尺寸，数量和形状以及沉积在安装和升降器垫（30）上的焊料的量被设计成使得焊接接头（24）优选具有凸形的外圆角（28），该装置（14）被保持在安装垫（12）上方的预定高度（ho）处，内圆角（α）保持在预定的最小角度增加焊点裂纹的起始时间，整体焊点裂纹扩展长度增加。替代实施例还包括位于升降器垫（30）和/或安装垫（12）下方的堵塞的通孔（34），其中气囊（40）被捕获在焊料块（32）/焊点（24）和堵塞的通孔（34）。这种被困的气体袋（40）在回流时在SMD（14）上提供额外的浮力。

9. 发明申请

WO1997025843A1 ELECTRICAL COMPONENT WITH FOOT-SHAPED CONNECTION WIRES 审中-公开
标题翻译：用脚ARTIG形连接电线电气COMPONENT
公开(公告)号：WO1997025843A1
公开(公告)日：1997-07-17
申请号：PCT/DE1996002484
申请日：1996-12-20
申请人： SIEMENS AKTIENGESELLSCHAFT , LANGE, Gerhard , LEUSCHNER, Thomas
发明人： SIEMENS AKTIENGESELLSCHAFT
IPC分类号： H05K03/34
CPC分类号： H05K3/3426 , H01C1/14 , H01T4/06 , H05K2201/10651 , H05K2201/10818 , Y02P70/613
摘要： An electrical component provide with connection wires (24, 25) such as a gas-filled overvoltage diverter (40) has to be held in a stable horizontal position on a conducting plate (30) for soldering purposes. The free ends (26, 27, 29) of the connection wires (24, 25, 28) are so bent that they form feet to hold the component (40) in a stable horizontal position. In the case of a three-electrode diverter, the two face-side connection wires (24, 25) and the envelope-side connection wire (28) are so bent in parallel planes that the flattened feet form the corner points of a triangle (D).
摘要翻译：阿与连接线（24，25）设置有电气元件如一个充有气体的电涌放电器（40）意在成为Lötzwecke稳定在电路板（30）的水平位置来安排。为了这个目的，连接线的自由端（26，27，29）（24,25，28）弯曲，以便形成脚为组分（40）的稳定的水平放置。在一个Dreielektrodenableiter两个端排除导线（24，25）和壳侧设置连接线（28）在相互平行的平面，从而弯曲，使得扁平脚形成一个三角形（D）的角点。

10. 发明申请

WO1996026630A1 BOARD MATCHED NESTED SUPPORT FIXTURE 审中-公开
标题翻译：板匹配支持固定
公开(公告)号：WO1996026630A1
公开(公告)日：1996-08-29
申请号：PCT/US1996002412
申请日：1996-02-21
申请人： TRANSITION AUTOMATION, INC.
发明人： TRANSITION AUTOMATION, INC. , CURTIN, Mark
IPC分类号： H05K03/34
CPC分类号： H05K13/0069 , B29C33/30 , B29C33/68 , B29C39/026 , B29C39/10 , B29C39/26 , H05K3/3415 , H05K2203/0173 , H05K2203/085 , Y02P70/613 , Y10S269/903 , Y10S425/06 , Y10S425/119 , Y10T29/49982 , Y10T29/53265
摘要： The invention relates to a support fixture and a method for forming a support fixture. A membrane (15), a PC card (10), a compliant-porous member (13), a vacuum platen (14), a rectangular frame (33), and the cylindrical plug (34) are placed under the membrane (15). The frame (33) is used to create a mold to pour the casting material into and the cylindrical plug (34) is used to create a recess to allow easy finger access to remove the PC card (10) from the fixture.
摘要翻译：本发明涉及一种用于形成支撑夹具的支撑夹具和方法。膜（15），PC卡（10），柔性多孔构件（13），真空压板（14），矩形框架（33）和圆柱形塞子（34））。框架（33）用于制造模具以将铸造材料倒入并且圆柱形塞子（34）用于形成凹部以允许手指容易地从固定装置移除PC卡片（10）。

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