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1. 发明申请

WO2019106002A1 TEST JIG FOR PROBING ELECTRICAL DEVICES 审中-公开
公开(公告)号：WO2019106002A1
公开(公告)日：2019-06-06
申请号：PCT/EP2018/082823
申请日：2018-11-28
申请人： RF360 EUROPE GMBH
发明人： YAP, Yousheng
IPC分类号： G01R1/04 , G01R1/067 , G01R1/18
CPC分类号： G01R1/07342 , G01R1/06772 , G01R1/18
摘要： An improved test jig comprises a printed circuit board with a number of cantilever contacts on top. An electrically conducting grounding plane is mounted on top of the printed circuit board, spanning over the cantilever contacts, and grounded via a connection to ground contacts of the printed circuit board. A number of recesses are in the grounding plane wherein tips of the cantilever contacts are exposed.

2. 发明申请

WO2014007890A3 SENSOR PROBE FOR BIO-SENSING AND CHEMICAL-SENSING APPLICATIONS 审中-公开
标题翻译：用于生物传感和化学传感应用的传感器探头
公开(公告)号：WO2014007890A3
公开(公告)日：2014-03-27
申请号：PCT/US2013034297
申请日：2013-03-28
申请人： CALIFORNIA INST OF TECHN
发明人： RAJAGOPAL ADITYA , SCHERER AXEL , HENRY MICHAEL D , WALAVALKAR SAMEER , TOMBRELLO THOMAS A , HOMYK ANDREW P
IPC分类号： G01N27/30 , G01N27/403
CPC分类号： C12Q1/02 , A61B5/04001 , G01N27/3275 , G01N27/4146 , G01R1/06711 , G01R1/07342 , H01L29/413 , H01L29/42376 , H01L29/4966 , H01L29/66477 , H01L29/78 , H01L29/7831
摘要： The basic structure and functionality of a probe as disclosed herein allows for flexibly incorporating into the probe, various sensing elements for various sensing applications. Two example applications among these various sensing applications include bio-sensing and chemical-sensing applications. For bio-sensing applications the probe, which is fabricated upon a silicon substrate, includes a bio-sensing element such as a nano-pillar transistor, and for chemical-sensing applications the probe includes a sensing element that has a functionalized contact area whereby the sensing element generates a voltage when exposed to one or more chemicals of interest.
摘要翻译：本文公开的探针的基本结构和功能允许灵活地并入到探针中，用于各种感测应用的各种感测元件。这些各种感测应用中的两个示例应用包括生物感测和化学感测应用。对于生物感测应用，制造在硅衬底上的探针包括诸如纳米柱晶体管的生物感测元件，并且对于化学感测应用，探针包括具有功能化接触区域的感测元件，当暴露于感兴趣的一种或多种化学品时，感测元件产生电压。

3. 发明申请

WO2012099405A2 PROBE BLOCK 审中-公开
标题翻译：探测块
公开(公告)号：WO2012099405A2
公开(公告)日：2012-07-26
申请号：PCT/KR2012/000461
申请日：2012-01-19
申请人： PRO-2000 Co. LTD. , CHO, Jun Soo , PARK, Jong Hyun
发明人： CHO, Jun Soo , PARK, Jong Hyun
IPC分类号： G01R1/067 , G01R31/28
CPC分类号： G01R1/07342 , G01R1/06705
摘要： A probe block for testing a panel including one or more rows of pads is provided. The probe block includes a body block configured to be coupled to a bottom surface of a manipulator and vertically move by means of elasticity; a pressurizing block configured to be coupled to a bottom surface of the body block and have one or more pressurizing blocks protruding from a bottom surface; and a sheet configured to be coupled to a bottom surface of the pressurizing unit and have electrode lines arranged thereon so as to contact the pads for testing the panel, wherein each of the one or more pressurizing units is located at a position corresponding to a contacting portion between each of the electrode lines of the sheet and a corresponding row of pads of the panel.
摘要翻译：提供了用于测试包括一排或多排衬垫的面板的探针块。探针块包括被构造成联接到操纵器的底表面并且通过弹性而垂直移动的主体块; 加压块，其构造成联接到所述主体块的底表面，并且具有从底表面突出的一个或多个加压块; 以及被配置为联接到所述加压单元的底表面并且具有布置在其上的电极线以与所述垫接触以测试所述面板的片材，其中所述一个或多个加压单元中的每一个位于对应于接触的位置片材的每个电极线和面板的相应排的衬垫之间的部分。

4. 发明申请

WO2011004956A1 PROBE CARD 审中-公开
标题翻译：探针卡
公开(公告)号：WO2011004956A1
公开(公告)日：2011-01-13
申请号：PCT/KR2010/002540
申请日：2010-04-22
申请人： AMST CO., LTD. , SHIM, yun hee , YOON, sung hee , YOO, seung ho , SONG, byung chang , CHUNG, in buhm , KIM, dong il
发明人： SHIM, yun hee , YOON, sung hee , YOO, seung ho , SONG, byung chang , CHUNG, in buhm , KIM, dong il
IPC分类号： H01L21/66
CPC分类号： G01R31/2889 , G01R1/06727 , G01R1/07342
摘要： Provided is a probe card which has a space transformer which may be effectively changed to correspond to a change in wafer chip structure and is capable of maximizing acceptable channels of the space transformer. The probe card for testing a semiconductor chip on a wafer includes: a space transformer body in which a plurality of unit probe modules are arranged at intervals; a main circuit board to which an electrical signal is applied from an external test device; a reinforcement plate for supporting the main circuit board such that the unit probe modules become stable against an external effect; a standing conductive medium which is inserted into a penetration portion provided in the space transformer body; a lower surface circuit board in which the standing conductive medium is electrically connected to the unit probe module as a flexible conductive medium and the standing conductive media are mounted; and a mutual connection member for electrically connecting the lower surface circuit board to the main circuit board.
摘要翻译：提供了一种具有可以有效地改变以对应于晶片芯片结构的变化并且能够使空间变压器的可接受的通道最大化的空间变压器的探针卡。用于测试晶片上的半导体芯片的探针卡包括：空间变换器主体，多个单元探针模块间隔排列; 主电路板，从外部测试装置向其施加电信号; 用于支撑主电路板的加强板，使得单元探针模块抵抗外部效应变得稳定; 插入到设置在所述空间变换器主体中的贯通部的立体导电介质; 其中，所述立体导电介质与所述单元探针模块电连接为柔性导电介质并且所述直立导电介质安装在其中; 以及用于将下表面电路板电连接到主电路板的相互连接构件。

5. 发明申请

WO2010104337A3 PROBE CARD FOR TESTING FILM PACKAGE 审中-公开
标题翻译：用于测试电影包装的探针卡
公开(公告)号：WO2010104337A3
公开(公告)日：2010-12-23
申请号：PCT/KR2010001517
申请日：2010-03-11
申请人： PRO 2000 CO LTD , IHM YI BIN , HER NAM JUNG , CHO JUN SOO
发明人： IHM YI BIN , HER NAM JUNG , CHO JUN SOO
IPC分类号： H01L21/66 , G01R1/067
CPC分类号： G01R1/06716 , G01R1/07342
摘要： There is provided a probe card for testing a film package. The probe card for testing a film package includes a body block and a film probe. The body block is mounted on a printed circuit board (PCB). The film probe is mounted on the body block, the film probe on which there are leads having the same pitch as that of out lead bonding (OLB) pads of the film package. The leads of the film probe are in contact with corresponding OLB pads of the film package and test the film package.
摘要翻译：提供了用于测试胶片包的探针卡。用于测试薄膜包装的探针卡包括主体块和薄膜探针。主体块安装在印刷电路板（PCB）上。薄膜探针安装在主体块上，其上有导线的薄膜探针具有与薄膜封装的引出键合（OLB）焊盘相同的间距。薄膜探针的引线与薄膜封装的相应OLB焊盘接触并测试薄膜封装。

6. 发明申请

WO2010018463A2 PROBE HEAD CONTROLLING MECHANISM FOR PROBE CARD ASSEMBLIES 审中-公开
标题翻译：探头卡组件探头控制机制
公开(公告)号：WO2010018463A2
公开(公告)日：2010-02-18
申请号：PCT/IB2009/007028
申请日：2009-10-03
申请人： FORMFACTOR , INC. , MCFARLAND, Andrew W. , LIEW, Brandon , PORTER, James, M. , YASUMURA, Kevin, Y.
发明人： MCFARLAND, Andrew W. , LIEW, Brandon , PORTER, James, M. , YASUMURA, Kevin, Y.
CPC分类号： G01R31/2891 , G01R1/07342
摘要： A probe card assembly includes a first probe head having contact elements disposed on a respective surface for forming electrical contacts with corresponding terminals of corresponding electronic devices, a second probe head having contact elements disposed on a respective surface for forming electrical contacts with corresponding terminals of corresponding electronic devices, and a controlling mechanism coupled to the first and second probe heads for controlling movement of the first and second probe heads in a first direction substantially parallel to the respective surfaces more than in a second direction substantially normal to the respective surfaces.
摘要翻译：探针卡组件包括第一探针头，其具有设置在相应表面上的接触元件，用于与对应的电子器件的相应端子形成电触点;第二探针头，其具有设置在相应表面上的接触元件，用于与对应的端子相应的端子形成电触头电子设备和耦合到第一和第二探针头的控制机构，用于控制第一和第二探头在基本上平行于相应表面的第一方向上比基本上垂直于各个表面的第二方向更大的运动。

7. 发明申请

WO2008118677A3 STIFFENING CONNECTOR AND PROBE CARD ASSEMBLY INCORPORATING SAME 审中-公开
标题翻译：加固连接器和探头卡组合
公开(公告)号：WO2008118677A3
公开(公告)日：2009-12-30
申请号：PCT/US2008057284
申请日：2008-03-17
申请人： FORMFACTOR INC , HOBBS ERIC D , MATHIEU GAETAN L
发明人： HOBBS ERIC D , MATHIEU GAETAN L
IPC分类号： G01R1/06
CPC分类号： G01R31/2889 , G01R1/07342
摘要： A stiffening connector assembly and methods of use are provided herein. In some embodiments a stiffening connector assembly includes a connector configured to be coupled to a substrate; and a mechanism coupled to the connector and configured to restrict rotational movement of the connector with respect to the substrate when coupled thereto. The mechanism may further provide a lateral degree of freedom of movement in a direction substantially parallel to the substrate.
摘要翻译：本文提供了加强连接器组件和使用方法。在一些实施例中，加强连接器组件包括被配置为联接到基板的连接器; 以及耦合到所述连接器并且被配置为当连接到所述连接器时相对于所述基板限制所述连接器的旋转运动的机构。该机构还可以在基本上平行于基底的方向上提供横向移动自由度。

8. 发明申请

WO2009147804A1 プローブ装置製造方法审中-公开
标题翻译：制造探针装置的方法
公开(公告)号：WO2009147804A1
公开(公告)日：2009-12-10
申请号：PCT/JP2009/002366
申请日：2009-05-28
申请人：株式会社アドバンテスト , 甲元芳雄 , 梅村芳春
发明人：甲元芳雄 , 梅村芳春
IPC分类号： H01L21/66 , G01R1/073 , G01R31/28
CPC分类号： G01R1/0491 , G01R1/07342 , G01R3/00
摘要：　被試験デバイスに対する電気的接続を形成するプローブ装置を製造にあたり、短期間に被試験デバイスの仕様に応じた調整を可能にする。このプローブ装置の製造方法は、試験用基板（３０１）を表裏に貫通するビアホール（３３０）を形成するビアホール形成段階と、ビアホールの表面側端部に接続された表面側接続パッド（３２０）を、試験用基板の表面に形成する表面側接続パッド形成段階と、試験用基板の裏面に向かって液滴状の導電材料を吐出して付着させることにより、裏面側接続パッド（３５０）と、ビアホールの裏面側端部および裏面側接続パッドを電気的に接続する裏面側の配線（３４０）とを形成する裏面側導体パターン形成段階とを含む。
摘要翻译：在与要测试的装置形成电连接的探针装置的制造中，可以在与被测试装置的规格相对应的短时间内进行调整。一种探针装置的制造方法，其特征在于，包括：通孔形成工序，从前后形成穿过测试基板（301）的通路孔（330）前表面侧连接焊盘形成步骤，形成连接到测试基板前表面上的通孔的前表面侧端部的前表面侧连接焊盘（320）以及后表面侧导体图案形成步骤，形成将所述通孔的后表面侧端部与所述后表面侧连接垫电连接的后表面侧连接焊盘（350）和后表面侧配线（340）通过将导电材料的液滴喷射到测试基板的后表面并将材料粘附在其上。

9. 发明申请

WO2009111741A1 PROVIDING AN ELECTRONICALLY CONDUCTIVE WALL STRUCTURE ADJACENT A CONTACT STRUCTURE OF AN ELECTRONIC DEVICE 审中-公开
标题翻译：提供电子导电壁结构附件电子设备的接触结构
公开(公告)号：WO2009111741A1
公开(公告)日：2009-09-11
申请号：PCT/US2009/036396
申请日：2009-03-06
申请人： FORMFACTOR, INC. , BREINLINGER, Keith, J. , ELDRIDGE, Benjamin, N. , PRITZKAU, David, P.
发明人： BREINLINGER, Keith, J. , ELDRIDGE, Benjamin, N. , PRITZKAU, David, P.
IPC分类号： G01R31/3183 , H01L21/66 , G01R31/26
CPC分类号： G01R1/06772 , G01R1/06716 , G01R1/06744 , G01R1/07342 , Y10T29/49147
摘要： Devices and methods for providing, making, and/or using an electronic apparatus having a wall structure adjacent a resilient contact structure on a substrate. The electronic apparatus can include a substrate and a plurality of electrically conductive resilient contact structures, which can extend from the substrate. A first of the contact structures can be part of an electrical path through the electronic apparatus. A first electrically conductive wall structure can also extend from the substrate, and the first wall structure can be disposed adjacent one of the contact structures. The first wall structure can be electrically connected to a return current path within the electronic apparatus for an alternating current signal or power on the first contact structure.
摘要翻译：用于提供，制造和/或使用具有邻近基板上的弹性接触结构的壁结构的电子设备的设备和方法。电子设备可以包括基板和可从基板延伸的多个导电弹性接触结构。接触结构中的第一个可以是通过电子设备的电路径的一部分。第一导电壁结构也可以从衬底延伸，并且第一壁结构可以邻近一个接触结构设置。第一壁结构可以电连接到电子设备内的回流电路，用于交流信号或第一接触结构上的功率。

10. 发明申请

WO2009084770A1 CONTACT TIP STRUCTURE OF A CONNECTING ELEMENT 审中-公开
标题翻译：连接元件的接触尖端结构
公开(公告)号：WO2009084770A1
公开(公告)日：2009-07-09
申请号：PCT/KR2008/001481
申请日：2008-03-17
申请人： PHICOM CORPORATION , LEE, Oug Ki
发明人： LEE, Oug Ki
IPC分类号： G01R1/067
CPC分类号： G01R1/06727 , G01R1/06738 , G01R1/07342
摘要： The present invention relates to a contact tip structure of a connecting element designed for electric testing of electronic components. The connecting element comprises a fixing post coupled to a first electronic component; a beam extending away from said fixing post; a base coupled at one end of the said beam; and a contact tip extending vertically from the bottom surface of the said base. The beam includes an elastic region and an inelastic region extending at a shorter distance than the elastic region. The base vertically extends from the inelastic region in a certain distance and the horizontally extended length (L) of the elastic region of the beam and the vertically extended length(D) of the base are determined such that the contact tip is horizontally extended at a pre-determined distance according to the following formula: Dsinθ + L(cosθ-l) (θ means an angle of elastic deformation of the beam).
摘要翻译：本发明涉及一种设计用于电子部件的电气测试的连接元件的接触尖端结构。连接元件包括耦合到第一电子元件的固定柱; 远离所述固定柱的梁; 在所述梁的一端连接的基座; 以及从所述基座的底表面垂直延伸的接触尖端。梁包括弹性区域和在比弹性区域更短的距离处延伸的非弹性区域。基座从非弹性区域垂直延伸一定距离，并且确定梁的弹性区域和基部的垂直延伸长度（D）的水平延伸长度（L），使得接触尖端在预定距离根据以下公式：Dsin？ + L（cosθ-1）（θ表示梁的弹性变形角）。

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