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1. 发明申请

WO2005122285A2 METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENTS 审中-公开
标题翻译：用于制作和组装可印刷的半导体元件的方法和装置
公开(公告)号：WO2005122285A2
公开(公告)日：2005-12-22
申请号：PCT/US2005/019354
申请日：2005-06-02
申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS , NUZZO, Ralph, G. , ROGERS, John, A. , MENARD, Etienne , LEE, Keon Jae , KHANG, Dahl-Young , SUN, Yugang , MEITL, Matthew , ZHU, Zhengtao
发明人： NUZZO, Ralph, G. , ROGERS, John, A. , MENARD, Etienne , LEE, Keon Jae , KHANG, Dahl-Young , SUN, Yugang , MEITL, Matthew , ZHU, Zhengtao
IPC分类号： H01L31/0312
CPC分类号： H01L29/76 , B81C2201/0185 , B82Y10/00 , H01L21/02521 , H01L21/02603 , H01L21/02628 , H01L21/308 , H01L21/322 , H01L21/6835 , H01L23/02 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/1285 , H01L27/1292 , H01L29/04 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/12 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03926 , H01L31/1804 , H01L31/1864 , H01L31/1896 , H01L33/007 , H01L33/0079 , H01L33/32 , H01L2221/68368 , H01L2221/68381 , H01L2224/03 , H01L2224/0332 , H01L2224/0345 , H01L2224/03614 , H01L2224/0362 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05644 , H01L2224/05666 , H01L2224/08225 , H01L2224/2919 , H01L2224/32225 , H01L2224/80 , H01L2224/80006 , H01L2224/80121 , H01L2224/80862 , H01L2224/80895 , H01L2224/83 , H01L2224/83005 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2224/83862 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2924/00012 , H01L2924/01032 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15162 , H01L2924/15788 , H01L2924/1579 , Y02E10/547 , Y02P70/521 , Y10S977/707 , Y10S977/724 , H01L2924/00014 , H01L2924/00
摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
摘要翻译：本发明提供了用于制造可印刷半导体元件并将可印刷半导体元件组装到衬底表面上的方法和装置。本发明的方法，装置和装置部件能够在包含聚合物材料的基底上产生宽范围的灵活的电子和光电器件和器件阵列。本发明还提供了拉伸配置中能够具有良好性能的可拉伸半导体结构和可拉伸电子器件。

2. 发明申请

WO2015107290A2 PROCESS FOR PLACING AND BONDING CHIPS ON A RECEIVER SUBSTRATE 审中-公开
标题翻译：在接收器基板上放置和接合晶片的过程
公开(公告)号：WO2015107290A2
公开(公告)日：2015-07-23
申请号：PCT/FR2015050052
申请日：2015-01-09
申请人： COMMISSARIAT L ÉNERGIE ATOMIQUE ET AUX ÉNERGIES ALTERNATIVES
发明人： DEGUET CHRYSTEL , FOURNEL FRANK , MORICEAU HUBERT , SANCHEZ LOIC
IPC分类号： H01L21/58
CPC分类号： H01L24/80 , H01L21/6835 , H01L21/6836 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/74 , H01L24/92 , H01L24/94 , H01L24/97 , H01L2221/68363 , H01L2221/68368 , H01L2221/68381 , H01L2221/68386 , H01L2224/0345 , H01L2224/03616 , H01L2224/0381 , H01L2224/039 , H01L2224/05082 , H01L2224/05083 , H01L2224/05147 , H01L2224/05181 , H01L2224/0519 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/0566 , H01L2224/05687 , H01L2224/08225 , H01L2224/74 , H01L2224/7565 , H01L2224/75701 , H01L2224/75702 , H01L2224/75725 , H01L2224/75734 , H01L2224/75735 , H01L2224/75841 , H01L2224/7598 , H01L2224/80004 , H01L2224/80006 , H01L2224/80007 , H01L2224/80011 , H01L2224/80012 , H01L2224/80019 , H01L2224/80121 , H01L2224/802 , H01L2224/80203 , H01L2224/80385 , H01L2224/80424 , H01L2224/80444 , H01L2224/80447 , H01L2224/80893 , H01L2224/80894 , H01L2224/80948 , H01L2224/80986 , H01L2224/8385 , H01L2224/92 , H01L2224/94 , H01L2224/97 , H01L2924/10157 , H01L2924/15159 , H01L2224/80 , H01L2924/00012 , H01L2924/00014 , H01L2224/03 , H01L2924/00015 , H01L2924/01026 , H01L2924/01028 , H01L2924/01014 , H01L2224/05155 , H01L2224/0516 , H01L2924/05442 , H01L21/78
摘要： This process comprises: placing (70) chips in preset locations by attracting a transfer layer of the chip using a pad, the attractive force between the transfer layer and the pad being a force chosen from the group composed of a magnetic force, an electrostatic force and an electromagnetic force; and bonding (74) the chips thus placed on respective receiving zones of an active side of a receiver substrate, this bonding comprising: preparing (30, 62, 72) bonding sides of the chips and the receiving zones so that they are able to bond without adhesive, then in step c), bringing (78) each bonding side into direct contact with its respective receiving zone and thus bonding the chips to the receiver substrate without adhesive.
摘要翻译：该方法包括：通过使用焊盘吸引芯片的转移层来将（70）芯片放置在预设位置，转移层和焊盘之间的吸引力是从由磁力，静电力和电磁力; 并且将由此放置在接收器基板的有源侧的相应接收区上的芯片接合（74），该接合包括：准备（30,62,72）将芯片和接收区域粘合在一起，使得它们能够结合没有粘合剂，然后在步骤c）中，使（78）每个粘合侧与其相应的接收区域直接接触，并且因此将芯片粘合到接收器基底而没有粘合剂。

3. 发明申请

WO2012013162A1 一种硅通孔互连结构及其制造方法审中-公开
公开(公告)号：WO2012013162A1
公开(公告)日：2012-02-02
申请号：PCT/CN2011/077824
申请日：2011-07-30
申请人：昆山智拓达电子科技有限公司 , 尹海洲 , 骆志炯
发明人：尹海洲 , 骆志炯
IPC分类号： H01L21/768 , H01L21/60 , H01L23/48
CPC分类号： H01L21/76898 , H01L21/6835 , H01L21/7682 , H01L23/481 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/08 , H01L24/80 , H01L25/0657 , H01L25/50 , H01L2221/68327 , H01L2224/02125 , H01L2224/03002 , H01L2224/03462 , H01L2224/03464 , H01L2224/05001 , H01L2224/05025 , H01L2224/05571 , H01L2224/05572 , H01L2224/05624 , H01L2224/05647 , H01L2224/06181 , H01L2224/08147 , H01L2224/0903 , H01L2224/80121 , H01L2224/80895 , H01L2224/80896 , H01L2225/06544 , H01L2924/00014 , H01L2924/30105 , H01L2924/3511 , H01L2924/00012 , H01L2224/05552
摘要：提供一种硅通孔互联结构的制造方法，该方法包括以下步骤：提供半导体衬底（200）；从所述半导体衬底（200）的第一表面形成凹孔（202），并在所述凹孔（202）的侧壁和底面上形成第一绝缘层（203），以及在所述第一绝缘层（203）上形成牺牲层（204）；在所述凹孔（202）内填充硅通孔导体（205），以及在所述半导体衬底（200）的第一表面上形成与该硅通孔导体（205）电性连接的第一接触垫（207）；从所述半导体衬底（200）的第二表面对该半导体衬底（200）进行减薄，直至暴露出所述硅通孔导体（205）；去除所述牺牲层（204），在所述硅通孔导体（205）和第一绝缘层（203）之间形成空隙层（211）；将多个所述半导体衬底（200）堆叠后进行键合。相应地，提供一种硅通孔互连结构。该制造方法和互连结构可以有效地降低硅通孔与半导体衬底（200）之间的寄生电容，以及有效地减小硅通孔导体（205）在热膨胀中对所述半导体衬底（200）产生的应力作用。

4. 发明申请

WO2005122285A3 METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENTS 审中-公开
标题翻译：用于制作和组装可印刷的半导体元件的方法和装置
公开(公告)号：WO2005122285A3
公开(公告)日：2007-08-30
申请号：PCT/US2005019354
申请日：2005-06-02
申请人： UNIV ILLINOIS , NUZZO RALPH G , ROGERS JOHN A , MENARD ETIENNE , LEE KEON JAE , KHANG DAHL-YOUNG , SUN YUGANG , MEITL MATTHEW , ZHU ZHENGTAO
发明人： NUZZO RALPH G , ROGERS JOHN A , MENARD ETIENNE , LEE KEON JAE , KHANG DAHL-YOUNG , SUN YUGANG , MEITL MATTHEW , ZHU ZHENGTAO
IPC分类号： H01L21/00 , B81C1/00 , H01L21/20 , H01L21/30 , H01L21/326 , H01L21/4763 , H01L21/77 , H01L23/48 , H01L27/01 , H01L29/06 , H01L29/08 , H01L29/786 , H01L31/0312 , H01L31/18
CPC分类号： H01L23/02 , B81C2201/0185 , B82Y10/00 , H01L21/02521 , H01L21/02603 , H01L21/02628 , H01L21/308 , H01L21/322 , H01L21/6835 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/1285 , H01L27/1292 , H01L29/04 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/12 , H01L29/76 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03926 , H01L31/1804 , H01L31/1864 , H01L31/1896 , H01L33/007 , H01L33/0079 , H01L33/32 , H01L2221/68368 , H01L2221/68381 , H01L2224/03 , H01L2224/0332 , H01L2224/0345 , H01L2224/03614 , H01L2224/0362 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05644 , H01L2224/05666 , H01L2224/08225 , H01L2224/2919 , H01L2224/32225 , H01L2224/80 , H01L2224/80006 , H01L2224/80121 , H01L2224/80862 , H01L2224/80895 , H01L2224/83 , H01L2224/83005 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2224/83862 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2924/00012 , H01L2924/01032 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15162 , H01L2924/15788 , H01L2924/1579 , Y02E10/547 , Y02P70/521 , Y10S977/707 , Y10S977/724 , H01L2924/00014 , H01L2924/00
摘要： The invention provides methods and devices for fabricating printable semiconductor elements (555) and assembling printable semiconductor elements onto substrate surfaces (330). The present invention also provides stretchable semiconductor structures (760).
摘要翻译：本发明提供了用于制造可印刷半导体元件（555）并将可印刷半导体元件组装到衬底表面（330）上的方法和装置。本发明还提供可拉伸半导体结构（760）。

5. 发明申请

WO2016185883A1 半導体装置および撮像装置审中-公开
标题翻译：半导体器件和成像器件
公开(公告)号：WO2016185883A1
公开(公告)日：2016-11-24
申请号：PCT/JP2016/063037
申请日：2016-04-26
申请人：ソニー株式会社
发明人：琴尾　健吾 , 小池　薫
IPC分类号： H01L25/065 , H01L21/60 , H01L25/07 , H01L25/18
CPC分类号： H01L27/14634 , G06F17/5068 , H01L23/522 , H01L23/5226 , H01L23/528 , H01L23/53228 , H01L23/562 , H01L23/585 , H01L24/08 , H01L24/89 , H01L25/065 , H01L25/07 , H01L25/18 , H01L27/14621 , H01L27/14627 , H01L27/14636 , H01L27/1469 , H01L2224/08145 , H01L2224/80121 , H01L2224/80895 , H01L2224/80896
摘要：半導体チップ間の接合強度を向上させる。　半導体装置において、第１の半導体チップは、第１の絶縁層と第１の絶縁層により絶縁される第１の内層回路が電気的に接続される複数の第１のパッドと複数の第１のパッドの外側に配置される線状の第１の金属層とを有する第１の接合面を備える。第２の半導体チップは、第２の絶縁層と第１のパッドに対向する位置に配置されるとともに第２の絶縁層により絶縁される第２の内層回路が電気的に接続される複数の第２のパッドと第１の金属層に対向する位置に配置される線状の第２の金属層とを有して第１の接合面と接合される第２の接合面を備える。第１の金属層および第２の金属層の幅を、第１の半導体チップの端部から第１のパッドに至る領域の第１の絶縁層および第２の絶縁層の接合強度と第１の金属層および第２の金属層の接合強度とに基づく幅にする。
摘要翻译：本发明提高了半导体芯片之间的接合强度。在该半导体器件中，第一半导体芯片设置有具有第一绝缘层的第一接合面，与第一绝缘层绝缘的第一内层电路与第一绝缘层绝缘的多个第一焊盘电连接的第一焊盘，布线到多个第一焊盘的外侧的线状层。第二半导体芯片设置有用于接合到第一接合表面并具有第二绝缘层的第二接合表面，多个第二焊盘电连接第二内层电路，第二内层电路布置在面向第一焊盘的位置并且被第二绝缘层绝缘，并且布置在面向第一金属层的位置处的线状的第二金属层。第一金属层和第二金属层的宽度是基于第一绝缘层和第二绝缘层在从第一半导体芯片的端部延伸到第一焊盘的区域中的接合强度和在接头上的宽度第一金属层和第二金属层的强度。

6. 发明申请

WO2016060274A1 基板どうしの接合方法、基板接合装置审中-公开
标题翻译：用于将基板与基板结合的方法，以及基板结合装置
公开(公告)号：WO2016060274A1
公开(公告)日：2016-04-21
申请号：PCT/JP2015/079446
申请日：2015-10-19
申请人：ボンドテック株式会社
发明人：山内　朗
IPC分类号： H01L21/02 , B23K20/00 , B23K20/16 , B23K20/24 , H01L21/68 , H01L21/683
CPC分类号： H01L24/83 , B23K20/023 , B23K20/233 , B23K20/24 , B23K37/0408 , B23K37/047 , B23K2201/40 , B23K2203/50 , H01L21/187 , H01L21/67092 , H01L21/67259 , H01L21/68 , H01L21/6831 , H01L21/6838 , H01L21/68735 , H01L23/544 , H01L24/75 , H01L24/80 , H01L24/94 , H01L2223/54426 , H01L2224/08145 , H01L2224/08146 , H01L2224/7501 , H01L2224/75102 , H01L2224/75251 , H01L2224/75252 , H01L2224/75272 , H01L2224/75303 , H01L2224/75305 , H01L2224/757 , H01L2224/75701 , H01L2224/75702 , H01L2224/75704 , H01L2224/75705 , H01L2224/75724 , H01L2224/75725 , H01L2224/75744 , H01L2224/75745 , H01L2224/75753 , H01L2224/759 , H01L2224/75901 , H01L2224/7592 , H01L2224/75981 , H01L2224/80012 , H01L2224/80013 , H01L2224/8003 , H01L2224/80047 , H01L2224/8009 , H01L2224/8013 , H01L2224/80132 , H01L2224/80203 , H01L2224/80213 , H01L2224/80893 , H01L2224/80895 , H01L2224/80896 , H01L2224/80907 , H01L2224/80908 , H01L2224/80986 , H01L2224/83009 , H01L2224/8309 , H01L2224/83896 , H01L2224/83908 , H01L2224/94 , H01L2924/00012 , H01L2224/80 , H01L2924/00014 , H01L2224/8001 , H01L2224/80009 , H01L2224/80121
摘要：【課題】基板どうしを接合する際に、基板どうしの間でのボイドの発生を防ぐとともに、ひずみを抑制して、高い位置精度で接合する。【解決手段】第一の基板と第二の基板とを接合する方法であって、前記第一の基板及び前記第二の基板のそれぞれの接合面の表面に水又はＯＨ含有物質を付着させる親水化処理を行う工程と、前記第一の基板と前記第二の基板とを、前記接合面どうしを対向させて配置するとともに、前記第一の基板を、前記接合面の外周部に対して中央部が前記第二の基板側に突出するように撓ませる工程と、前記第一の基板の前記接合面と前記第二の基板の前記接合面とを、前記中央部どうしで突き合わせる工程と、前記中央部どうしが非接合状態を維持する圧力で突き合わせた状態で、前記第一の基板の外周部と前記第二の基板の外周部との距離を縮め、前記第一の基板の前記接合面と前記第二の基板の前記接合面とを全面で突き合わせる突き合わせ工程と、を備える基板どうしの接合方法。
摘要翻译：为了将基板粘合在一起，防止在基板之间形成空隙，使应变最小化，并且以高位置精度进行接合。 [解决方案]一种将第一基板和第二基板结合在一起的方法，其中所述方法具有：进行亲水处理的步骤，其中使水或含OH物质粘附到各个键合物的表面第一基板和第二基板的表面; 用于将所述第一基板和所述第二基板布置成使得所述接合表面彼此面对并且使所述第一基板偏转以使得所述中心部分相对于所述接合表面的外周部分朝向所述第二基板侧突出的步骤; 使第一基板的接合面和第二基板的接合面在中心部彼此抵接的步骤; 并且一旦使中心部分在非粘合状态的压力下彼此抵接，则使得第一基板的外周部分与第二基板的外周部分之间的距离减小的邻接步骤并且使得第一基板的接合表面和第二基板的接合表面在整个表面上彼此邻接。

7. 发明申请

WO2011099848A3 AIR FLOW ASSISTED CHIP SELF-ASSEMBLY 审中-公开
标题翻译：空气流辅助芯片自组装
公开(公告)号：WO2011099848A3
公开(公告)日：2012-10-26
申请号：PCT/NL2011050089
申请日：2011-02-08
申请人： TNO , DIETZEL ANDREAS HEINRICH , VAN DEN BRAND JEROEN
发明人： DIETZEL ANDREAS HEINRICH , VAN DEN BRAND JEROEN
IPC分类号： H01L21/98 , G06K19/077 , H01L21/60 , H01L21/68
CPC分类号： H01L24/95 , B81C3/005 , B81C99/002 , H01L21/67721 , H01L21/68 , H01L23/13 , H01L23/4985 , H01L23/5387 , H01L24/80 , H01L24/83 , H01L25/0655 , H01L25/50 , H01L2224/80001 , H01L2224/80003 , H01L2224/80121 , H01L2224/804 , H01L2224/83121 , H01L2224/834 , H01L2224/8349 , H01L2224/95001 , H01L2224/95093 , H01L2224/95115 , H01L2224/95122 , H01L2224/95123 , H01L2224/95136 , H01L2224/95148 , H01L2924/01015 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/15151 , H01L2924/15153 , H01L2924/15165 , H01L2924/0001
摘要： The invention relates to a placement method for placement of a chip component (10) on a flexible substrate (20), comprising: providing a support face (21 ) comprised of the flexible substrate (20) or of a support structure (70) to be aligned with the flexible substrate (20); administering a chip (10) to the support face (21 ); generating with a pressure chamber (60) an air flow in an out of plane orientation relative to the support face (21); and directing the chip (10) to a placement position (30) by means of a directional structure (40) provided on the support face (21 ). In particular the chip (10) is levitated from the support face (21 ) by said air flow or by vibrational contact between the support face (21 ) and the chip (10) induced by said air flow. When the support face (21 ) is comprised by a support structure (70) distinct from the flexible substrate (20), the support face (21 ) is aligned with the flexible substrate (20). Accordingly, air cushion or intermittent contact forces (modulated in time and space using modulated micro-features) can be used to provide local interactions with the micro-part (chip) (10) so as to position micro-parts (10) with reference to micro-features arranged on the flexible substrate (20). The placement method may be applied for self-assembly of chips (10) on the flexible substrate (20), using a reel-to-reel process.
摘要翻译：本发明涉及一种用于将芯片部件（10）放置在柔性基板（20）上的放置方法，包括：提供由柔性基板（20）或支撑结构（70）组成的支撑面（21），与柔性基板（20）对准; 向所述支撑面（21）施加芯片（10）; 用压力室（60）产生相对于支撑面（21）的面外取向的空气流; 以及通过设置在所述支撑面（21）上的定向结构（40）将所述芯片（10）引导到放置位置（30）。特别地，芯片（10）通过所述空气流从支撑面（21）悬浮，或通过由所述空气流引起的支撑面（21）和芯片（10）之间的振动接触。当支撑面（21）由与柔性基板（20）不同的支撑结构（70）构成时，支撑面（21）与柔性基板（20）对准。因此，可以使用气垫或间歇接触力（使用调制的微特征在时间和空间上调制）以提供与微零件（芯片）（10）的局部相互作用，以便以参考方式定位微零件（10）涉及布置在柔性基板（20）上的微特征。放置方法可以应用于使用卷到卷工艺在芯片（10）上自组装在柔性基板（20）上。

8. 发明申请

WO2011099848A2 PRESSURE ASSISTED SELF TARGETING ASSEMBLY 审中-公开
标题翻译：压力自助定位组件
公开(公告)号：WO2011099848A2
公开(公告)日：2011-08-18
申请号：PCT/NL2011/050089
申请日：2011-02-08
申请人： NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO , DIETZEL, Andreas, Heinrich , VAN DEN BRAND, Jeroen
发明人： DIETZEL, Andreas, Heinrich , VAN DEN BRAND, Jeroen
IPC分类号： H01L21/98 , H01L21/60 , H05K13/02
CPC分类号： H01L24/95 , B81C3/005 , B81C99/002 , H01L21/67721 , H01L21/68 , H01L23/13 , H01L23/4985 , H01L23/5387 , H01L24/80 , H01L24/83 , H01L25/0655 , H01L25/50 , H01L2224/80001 , H01L2224/80003 , H01L2224/80121 , H01L2224/804 , H01L2224/83121 , H01L2224/834 , H01L2224/8349 , H01L2224/95001 , H01L2224/95093 , H01L2224/95115 , H01L2224/95122 , H01L2224/95123 , H01L2224/95136 , H01L2224/95148 , H01L2924/01015 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/15151 , H01L2924/15153 , H01L2924/15165 , H01L2924/0001
摘要： The invention relates to a placement method for placement of a chip component (10) on a flexible substrate (20), comprising: providing a support face (21) comprised of by the flexible substrate (20) or by a support structure to be aligned with the flexible substrate (20); administering a chip (10) to the support face (21); generating with a pressure chamber (60) an air flow in an out of plane orientation relative to the support face (21); and directing the chip to a placement position (30) by means of a directional structure (40) provided on the support face (21). In particular the chip (10) is levitated from the support face (21) by said air flow or by vibrational contact between the support face (21) and the chip (10) induced by said air flow; and wherein, when the support face is comprised by a support structure distinct from the flexible substrate, the support face is aligned with the flexible substrate. Accordingly, air cushion or intermittent contact forces (modulated in time and space using modulated micro- features) can be used to provide local interactions with the micro-part so as to position micro-parts with reference to micro-features arranged on the flexible substrate.
摘要翻译：本发明涉及一种用于将芯片部件（10）放置在柔性基板（20）上的放置方法，包括：提供由柔性基板（20）构成的支撑面（21）或由对准的支撑结构与所述柔性基板（20）接合; 向所述支撑面（21）施加芯片（10）; 用压力室（60）产生相对于支撑面（21）的面外取向的空气流; 以及通过设置在所述支撑面（21）上的定向结构（40）将所述芯片引导到放置位置（30）。特别地，芯片（10）通过所述空气流从支撑面（21）悬浮或通过由所述空气流引起的支撑面（21）和芯片（10）之间的振动接触; 并且其中当所述支撑面由与所述柔性基板不同的支撑结构构成时，所述支撑面与所述柔性基板对准。因此，可以使用气垫或间歇接触力（使用调制的微特征在时间和空间上调制）以提供与微部件的局部相互作用，以便参考布置在柔性基板上的微特征来定位微零件。

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