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1. 发明申请

WO01095375A1 AN ELECTRO-FLUIDIC ASSEMBLY PROCESS FOR INTEGRATION OF ELECTRONIC DEVICES ONTO A SUBSTRATE 审中-公开
标题翻译：将电子设备集成到基板上的电流装配工艺
公开(公告)号：WO01095375A1
公开(公告)日：2001-12-13
申请号：PCT/US2001/040851
申请日：2001-06-06
IPC分类号： H01L21/98 , H01L21/00 , H01L21/30
CPC分类号： H01L24/95 , B82Y30/00 , H01L25/50 , H01L2224/95085 , H01L2224/95122 , H01L2224/95145 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01049 , H01L2924/01051 , H01L2924/01061 , H01L2924/01073 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/09701 , H01L2924/10329 , H01L2924/10336 , H01L2924/14 , H01L2924/1423 , H01L2924/3025 , Y10T29/49004 , Y10T29/49117 , Y10T29/49128 , Y10T29/4913
摘要： An electro-fluidic assembly process for integration of an electronic device or component onto a substrate which comprises: disposing components within a carrier fluid; attracting the components to an alignment sites on the substrate by means of electrophoresis or dielectrophoresis; and aligning the components within the alignment site by means of energy minimization. The substrate comprises: a biased backplane layer, a metal plane layer having one or more alignment sites, a first insulating layer disposed between the backplane layer and the metal plane layer, and a second insulating layer, e.g., benzocyclobute, having a recess disposed therein, wherein the second insulating layer is on the surface of the metal plane layer opposite from the first insulating layer and wherein the recess is in communication with the alignment site.
摘要翻译：一种用于将电子装置或部件集成到基板上的电流装配工艺，包括：将部件放置在载体流体内; 通过电泳或介电电泳将组分吸引到底物上的取向位点; 并通过能量最小化对齐对准位置内的组分。衬底包括：偏置的背板层，具有一个或多个取向位置的金属平面层，设置在背板层和金属平面层之间的第一绝缘层，以及设置在其中的凹部的例如benzocyclobute的第二绝缘层，其中所述第二绝缘层在与所述第一绝缘层相反的所述金属平面层的表面上，并且所述凹部与所述对准部位连通。

2. 发明申请

WO2008054326A1 DEVICE, UNIT, SYSTEM AND METHOD FOR THE MAGNETICALLY-ASSISTED ASSEMBLING OF CHIP-SCALE, AND NANO AND MICRO-SCALE COMPONENTS ONTO A SUBSTRATE 审中-公开
标题翻译：设备，单元，用于磁性辅助组装芯片尺寸的系统和方法，以及纳米和微尺寸组件到基板上
公开(公告)号：WO2008054326A1
公开(公告)日：2008-05-08
申请号：PCT/SG2006/000330
申请日：2006-11-03
申请人： AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH , RAMADAN, Qasem , YOON, Seung Uk , KRIPESH, Vaidyanathan , TEO, Poi Siong , IYER, Mahadevan Krishna
发明人： RAMADAN, Qasem , YOON, Seung Uk , KRIPESH, Vaidyanathan , TEO, Poi Siong , IYER, Mahadevan Krishna
IPC分类号： H01L21/68 , H01L21/50
CPC分类号： H01L23/13 , H01L21/6835 , H01L24/27 , H01L24/45 , H01L24/81 , H01L24/95 , H01L2221/68354 , H01L2221/68363 , H01L2224/16 , H01L2224/274 , H01L2224/45144 , H01L2224/45147 , H01L2224/95085 , H01L2224/95122 , H01L2224/95144 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01056 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , Y10T29/49133 , Y10T29/53178 , H01L2924/00 , H01L2224/48 , H01L2224/81 , H01L2224/0401
摘要： A magnetically-assisted chip assembly unit for assembling at least one chip having a mounting surface and an attachment surface, wherein the attachment surface supports a magnetisable layer thereon and opposes said mounting surface, onto a substrate that has a corresponding chip mounting surface. The unit comprises a template wafer having at least one recess adapted to accommodate therein said chip; and a master wafer having at least one magnetisable element; wherein the template wafer is mounted on the master wafer and said magnetisable element is located at least proximate to the at least one recess such that the magnetisable element is capable of manipulating the chip into the recess, via its magnetisable layer when the magnetisable element is magnetized and generates a magnetic field. Once in the recess, the attachment surface of the chip faces at least a portion of the recess and the mounting surface of the chip faces an opening of the recess.
摘要翻译：一种用于组装具有安装表面和附接表面的至少一个芯片的磁辅助芯片组装单元，其中所述附接表面在其上支撑可磁化层并将其与所述安装表面相对，到达具有相应芯片安装表面的基板上。该单元包括具有适于在其中容纳其中的至少一个凹部的模板晶片; 以及具有至少一个可磁化元件的母晶片; 其中所述模板晶片安装在所述主晶片上，并且所述可磁化元件至少位于所述至少一个凹部处，使得所述可磁化元件能够通过其可磁化层将所述芯片操纵到所述凹槽中，当所述可磁化元件被磁化时并产生磁场。一旦在凹部中，芯片的附接表面面向凹部的至少一部分，并且芯片的安装表面面向凹部的开口。

3. 发明申请

WO2007019067A1 APPARATUS AND METHOD FOR DEPOSITING FUNCTIONAL BLOCKS 审中-公开
标题翻译：放置功能块的装置和方法
公开(公告)号：WO2007019067A1
公开(公告)日：2007-02-15
申请号：PCT/US2006/029183
申请日：2006-07-26
申请人： ALIEN TECHNOLOGY CORPORATION , SCHATZ, Kenneth, D.
发明人： SCHATZ, Kenneth, D.
IPC分类号： H01L21/68 , H01L21/98 , H01L21/58 , G06K19/077
CPC分类号： H01L24/19 , G06K19/07718 , G06K19/07745 , H01L24/24 , H01L24/95 , H01L24/97 , H01L25/50 , H01L2223/6677 , H01L2224/0401 , H01L2224/04105 , H01L2224/13022 , H01L2224/20 , H01L2224/24101 , H01L2224/24227 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2224/83136 , H01L2224/95085 , H01L2224/95122 , H01L2224/95136 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01074 , H01L2924/01077 , H01L2924/01082 , H01L2924/10155 , H01L2924/10158 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15157 , H01L2924/15165 , H01L2924/15313 , H01L2924/181 , H01L2924/19041 , H01L2924/30105 , H01L2224/82 , H01L2924/00
摘要： A guiding feature used to assist deposition of a functional block into a recessed region formed in a substrate. A template is used to create the guiding feature on a substrate. The template comprises a first feature configured to create a corresponding recessed region in a substrate and a second feature configured to form a guiding line on the substrate. The guiding line is continuous for a section of the substrate and located proximate to the recessed region. The guiding line configured to guide a functional block toward the recessed region during a fluidic self-assembly deposition process. The substrate can include an array, divided into rows and columns, of the recessed regions to receive a plurality of functional blocks and the template includes more than one of the first features configured to create such array of recessed regions in the substrate.
摘要翻译：用于辅助功能块沉积到形成在基底中的凹陷区域中的引导特征。模板用于在基板上创建引导特征。模板包括被配置为在衬底中创建相应的凹陷区域的第一特征和被配置成在衬底上形成引导线的第二特征。引导线对于基底的一部分是连续的并且位于靠近凹陷区域的位置。引导线被配置为在流体自组装沉积过程期间将功能块引向凹陷区域。衬底可以包括被分成行和列的凹陷区域的阵列，以接收多个功能块，并且模板包括被配置为在衬底中产生这种凹陷区域阵列的多于一个的第一特征。

4. 发明申请

WO0194640A3 BIO-MEDIATED ASSEMBLY OF MICROMETER-SCALE AND NANOMETER-SCALE STRUCTURES 审中-公开
标题翻译：生物介导的微尺度和纳米尺度结构的组装
公开(公告)号：WO0194640A3
公开(公告)日：2003-01-30
申请号：PCT/US0118641
申请日：2001-06-11
申请人： PURDUE RESEARCH FOUNDATION , BASHIR RASHID , BERGSTROM DONALD E , LEE SANGWOO , MCNALLY HELEN , GUO DONG , DENTON JOHN P , PINGLE MANEESH
发明人： BASHIR RASHID , BERGSTROM DONALD E , LEE SANGWOO , MCNALLY HELEN , GUO DONG , DENTON JOHN P , PINGLE MANEESH
IPC分类号： B44C1/22 , C40B40/06 , H01L21/98 , H01L51/00 , H01L51/30
CPC分类号： C40B40/06 , B82Y5/00 , B82Y10/00 , B82Y30/00 , H01L24/95 , H01L25/50 , H01L51/0093 , H01L2224/95085 , H01L2224/95122 , H01L2224/95145 , H01L2224/95147 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01016 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01033 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/10329 , H01L2924/13091 , H01L2924/14 , H01L2924/19041
摘要： A method of assembling a nanometer-scale construct by: a) providing a nanometer-scale object such as an active electron device; b) attaching a first bio-link to said nanometer-scale object from a functionalized nanometer-scale object; c) providing a substrate; d) attaching a second bio-link to said substrate to form a functionalized substrate, wherein said second bio-link is a complement to said first bio-link in that said second bio-link selectively binds with said first bio-link; and e) bringing said functionalized nanometer-scale object within close enough proximity of said functionalized substrate that said second bio-link selectively binds with said first bio-link, and thereby forms an assembled nanometer-scale construct.
摘要翻译：一种通过以下方法组装纳米级构造的方法：a）提供纳米级物体，例如活性电子器件; b）从功能化的纳米级物体附接到所述纳米级物体的第一生物链接; c）提供衬底; d）将第二生物链接附着到所述基底以形成官能化底物，其中所述第二生物链接是所述第一生物链接的补体，因为所述第二生物链接选择性地与所述第一生物链接结合; 以及e）使所述功能化纳米级物体在所述第二生物链接与所述第一生物链接选择性结合的所述功能化底物的足够接近的范围内，从而形成组装的纳米级结构。

5. 发明申请

WO2011099848A3 AIR FLOW ASSISTED CHIP SELF-ASSEMBLY 审中-公开
标题翻译：空气流辅助芯片自组装
公开(公告)号：WO2011099848A3
公开(公告)日：2012-10-26
申请号：PCT/NL2011050089
申请日：2011-02-08
申请人： TNO , DIETZEL ANDREAS HEINRICH , VAN DEN BRAND JEROEN
发明人： DIETZEL ANDREAS HEINRICH , VAN DEN BRAND JEROEN
IPC分类号： H01L21/98 , G06K19/077 , H01L21/60 , H01L21/68
CPC分类号： H01L24/95 , B81C3/005 , B81C99/002 , H01L21/67721 , H01L21/68 , H01L23/13 , H01L23/4985 , H01L23/5387 , H01L24/80 , H01L24/83 , H01L25/0655 , H01L25/50 , H01L2224/80001 , H01L2224/80003 , H01L2224/80121 , H01L2224/804 , H01L2224/83121 , H01L2224/834 , H01L2224/8349 , H01L2224/95001 , H01L2224/95093 , H01L2224/95115 , H01L2224/95122 , H01L2224/95123 , H01L2224/95136 , H01L2224/95148 , H01L2924/01015 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/15151 , H01L2924/15153 , H01L2924/15165 , H01L2924/0001
摘要： The invention relates to a placement method for placement of a chip component (10) on a flexible substrate (20), comprising: providing a support face (21 ) comprised of the flexible substrate (20) or of a support structure (70) to be aligned with the flexible substrate (20); administering a chip (10) to the support face (21 ); generating with a pressure chamber (60) an air flow in an out of plane orientation relative to the support face (21); and directing the chip (10) to a placement position (30) by means of a directional structure (40) provided on the support face (21 ). In particular the chip (10) is levitated from the support face (21 ) by said air flow or by vibrational contact between the support face (21 ) and the chip (10) induced by said air flow. When the support face (21 ) is comprised by a support structure (70) distinct from the flexible substrate (20), the support face (21 ) is aligned with the flexible substrate (20). Accordingly, air cushion or intermittent contact forces (modulated in time and space using modulated micro-features) can be used to provide local interactions with the micro-part (chip) (10) so as to position micro-parts (10) with reference to micro-features arranged on the flexible substrate (20). The placement method may be applied for self-assembly of chips (10) on the flexible substrate (20), using a reel-to-reel process.
摘要翻译：本发明涉及一种用于将芯片部件（10）放置在柔性基板（20）上的放置方法，包括：提供由柔性基板（20）或支撑结构（70）组成的支撑面（21），与柔性基板（20）对准; 向所述支撑面（21）施加芯片（10）; 用压力室（60）产生相对于支撑面（21）的面外取向的空气流; 以及通过设置在所述支撑面（21）上的定向结构（40）将所述芯片（10）引导到放置位置（30）。特别地，芯片（10）通过所述空气流从支撑面（21）悬浮，或通过由所述空气流引起的支撑面（21）和芯片（10）之间的振动接触。当支撑面（21）由与柔性基板（20）不同的支撑结构（70）构成时，支撑面（21）与柔性基板（20）对准。因此，可以使用气垫或间歇接触力（使用调制的微特征在时间和空间上调制）以提供与微零件（芯片）（10）的局部相互作用，以便以参考方式定位微零件（10）涉及布置在柔性基板（20）上的微特征。放置方法可以应用于使用卷到卷工艺在芯片（10）上自组装在柔性基板（20）上。

6. 发明申请

WO2011099848A2 PRESSURE ASSISTED SELF TARGETING ASSEMBLY 审中-公开
标题翻译：压力自助定位组件
公开(公告)号：WO2011099848A2
公开(公告)日：2011-08-18
申请号：PCT/NL2011/050089
申请日：2011-02-08
申请人： NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO , DIETZEL, Andreas, Heinrich , VAN DEN BRAND, Jeroen
发明人： DIETZEL, Andreas, Heinrich , VAN DEN BRAND, Jeroen
IPC分类号： H01L21/98 , H01L21/60 , H05K13/02
CPC分类号： H01L24/95 , B81C3/005 , B81C99/002 , H01L21/67721 , H01L21/68 , H01L23/13 , H01L23/4985 , H01L23/5387 , H01L24/80 , H01L24/83 , H01L25/0655 , H01L25/50 , H01L2224/80001 , H01L2224/80003 , H01L2224/80121 , H01L2224/804 , H01L2224/83121 , H01L2224/834 , H01L2224/8349 , H01L2224/95001 , H01L2224/95093 , H01L2224/95115 , H01L2224/95122 , H01L2224/95123 , H01L2224/95136 , H01L2224/95148 , H01L2924/01015 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/15151 , H01L2924/15153 , H01L2924/15165 , H01L2924/0001
摘要： The invention relates to a placement method for placement of a chip component (10) on a flexible substrate (20), comprising: providing a support face (21) comprised of by the flexible substrate (20) or by a support structure to be aligned with the flexible substrate (20); administering a chip (10) to the support face (21); generating with a pressure chamber (60) an air flow in an out of plane orientation relative to the support face (21); and directing the chip to a placement position (30) by means of a directional structure (40) provided on the support face (21). In particular the chip (10) is levitated from the support face (21) by said air flow or by vibrational contact between the support face (21) and the chip (10) induced by said air flow; and wherein, when the support face is comprised by a support structure distinct from the flexible substrate, the support face is aligned with the flexible substrate. Accordingly, air cushion or intermittent contact forces (modulated in time and space using modulated micro- features) can be used to provide local interactions with the micro-part so as to position micro-parts with reference to micro-features arranged on the flexible substrate.
摘要翻译：本发明涉及一种用于将芯片部件（10）放置在柔性基板（20）上的放置方法，包括：提供由柔性基板（20）构成的支撑面（21）或由对准的支撑结构与所述柔性基板（20）接合; 向所述支撑面（21）施加芯片（10）; 用压力室（60）产生相对于支撑面（21）的面外取向的空气流; 以及通过设置在所述支撑面（21）上的定向结构（40）将所述芯片引导到放置位置（30）。特别地，芯片（10）通过所述空气流从支撑面（21）悬浮或通过由所述空气流引起的支撑面（21）和芯片（10）之间的振动接触; 并且其中当所述支撑面由与所述柔性基板不同的支撑结构构成时，所述支撑面与所述柔性基板对准。因此，可以使用气垫或间歇接触力（使用调制的微特征在时间和空间上调制）以提供与微部件的局部相互作用，以便参考布置在柔性基板上的微特征来定位微零件。

7. 发明申请

WO0245159A3 METHOD FOR FABRICATING ELECTRONICS 审中-公开
标题翻译：电子制作方法
公开(公告)号：WO0245159A3
公开(公告)日：2003-04-10
申请号：PCT/US0123584
申请日：2001-07-26
申请人： HRL LAB LLC , SAYYAH KEYVAN
发明人： SAYYAH KEYVAN
IPC分类号： H01L21/98
CPC分类号： H01L25/50 , H01L24/95 , H01L2224/95092 , H01L2224/95122 , H01L2924/01013 , H01L2924/01019 , H01L2924/01074 , H01L2924/01079 , H01L2924/14 , H01L2924/15155 , H01L2924/15165 , H01L2924/15153 , H01L2924/00
摘要： A method for transferring of individual devices or circuit elements, fabricated on a semiconducting substrate, to a new substrate and placing said devices and elements in predetermined locations on the new substrate. The method comprises shaping the devices and circuits as truncated cones, lifting them off the original semiconducting substrates and depositing them en masse onto the new substrate, followed by their placing into receptors on the new substrate. The new substrate has preliminarily made receptors in a form of a truncated cone and the devices and circuits fill these receptors. Both the receptors and the devices and circuits have metallization contacts enabling to establish electrical contact between them. A method for real-time monitoring and verification of correctness of placement of the devices and circuits into the receptors by applying voltage pulse waveforms and measuring the resulting current pulse.
摘要翻译：一种用于将在半导体衬底上制造的各个器件或电路元件传送到新衬底并将所述器件和元件放置在新衬底上的预定位置的方法。该方法包括将器件和电路成形为截锥体，将其从原始半导体衬底上提起并将其大量沉积到新衬底上，随后将其放置在新衬底上的受体中。新的底物预先制成截锥形的受体，并且装置和电路填充这些受体。受体和器件和电路都具有能够在它们之间建立电接触的金属化接触。一种通过施加电压脉冲波形并测量所得到的电流脉冲来实时监测和验证设备和电路放置到受体中的正确性的方法。

8. 发明申请

WO1996041372A1 METHOD AND APPARATUS FOR FABRICATING SELF-ASSEMBLING MICROSTRUCTURES 审中-公开
标题翻译：用于制造自组装微结构的方法和装置
公开(公告)号：WO1996041372A1
公开(公告)日：1996-12-19
申请号：PCT/US1996007492
申请日：1996-05-22
申请人： THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
发明人： THE REGENTS OF THE UNIVERSITY OF CALIFORNIA , SMITH, John, Stephen , YEH, Hsi-Jen, J. , HADLEY, Mark, A. , VERMA, Ashish, K.
IPC分类号： H01L21/68
CPC分类号： H01L21/6835 , G02F1/136 , G02F1/1362 , G02F1/1368 , H01L21/78 , H01L21/7813 , H01L23/13 , H01L23/147 , H01L24/24 , H01L24/26 , H01L24/82 , H01L24/83 , H01L24/95 , H01L25/04 , H01L25/0655 , H01L25/0753 , H01L25/50 , H01L29/0657 , H01L33/20 , H01L2221/68359 , H01L2224/24227 , H01L2224/83136 , H01L2224/8319 , H01L2224/8385 , H01L2224/95085 , H01L2224/95092 , H01L2224/95122 , H01L2224/95136 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01049 , H01L2924/01061 , H01L2924/01072 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/07802 , H01L2924/09701 , H01L2924/10158 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15157 , H01L2924/15165 , H01L2924/15787 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01S5/02252 , H01S5/02284 , H01S5/183 , H01L2924/3512 , H01L2924/00
摘要： A method and apparatus for assembling microstructures onto a substrate through fluid transport. The microstructures being shaped blocks (19) self-align into recessed regions (55) located on a substrate (50) such that the microstructure becomes integral with the substrate. The improved method includes a step of transferring the shaped blocks into a fluid to create a slurry. Such slurry is then dispensed evenly or circulated over the top surface of a substrate having recessed regions thereon. The microstructure via the shape and fluid tumbles onto the surface of the substrate, self-aligns, and engages into a recessed region.
摘要翻译：一种用于通过流体输送将微结构组装在基底上的方法和装置。成形块（19）的微观结构自对准到位于基底（50）上的凹陷区域（55），使得微结构与衬底成为一体。改进的方法包括将成形块转移到流体中以产生浆料的步骤。然后将这样的浆料均匀地分配或在其上具有凹陷区域的基底的顶表面上循环。通过形状和流体的微观结构滚动到基底的表面上，自对准并接合到凹陷区域中。

9. 发明申请

WO2006052955A3 METHOD OF MANUFACTURING RFID DEVICES USING FLUIDIC SELF ASSEMBLY AND A LOCAL 审中-公开
标题翻译：使用流体自组装和本地制造RFID设备的方法
公开(公告)号：WO2006052955A3
公开(公告)日：2007-04-19
申请号：PCT/US2005040410
申请日：2005-11-08
申请人： ALIEN TECHNOLOGIES INC , CRAIG GORDON S W , TOOTOONCHI ALY , EISENHARDT RANDY , HERRMANN SCOTT , HADLEY MARK A , DRZAIC PAUL
发明人： CRAIG GORDON S W , TOOTOONCHI ALY , EISENHARDT RANDY , HERRMANN SCOTT , HADLEY MARK A , DRZAIC PAUL
IPC分类号： H01L21/98 , H01L21/60 , H01L23/498
CPC分类号： G06K19/07752 , G06K19/07749 , H01L23/49855 , H01L24/19 , H01L24/24 , H01L24/82 , H01L24/95 , H01L24/97 , H01L25/50 , H01L29/0657 , H01L2223/6677 , H01L2224/0401 , H01L2224/04105 , H01L2224/16 , H01L2224/20 , H01L2224/24101 , H01L2224/24227 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2224/95085 , H01L2224/95122 , H01L2224/95136 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/10155 , H01L2924/10158 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15157 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , H01L2224/82
摘要： Methods and apparatuses for an electronic assembly. A material is selectively- printed on a web substrate (2502) at one or more selected areas. The web substrate (2502) includes a plurality of functional components having integrated circuits. A local printing system equipped with a print head (2510, 2512) that dispenses the selected material is used to print. The print head is coupled to a guidance system (2508) capable of registering an alignment feature on the web substrate.
摘要翻译：电子组件的方法和装置。在一个或多个选定区域上的材料被选择性地印刷在网状基底（2502）上。网状基板（2502）包括具有集成电路的多个功能部件。使用配备有分配所选材料的打印头（2510,2512）的本地打印系统进行打印。打印头连接到能够在纸幅基材上记录对准特征的引导系统（2508）。

10. 发明申请

WO2006052955A2 AN ASSEMBLY COMPRISING FUNCTIONAL DEVICES AND METHOD OF MAKING SAME 审中-公开
标题翻译：包括功能装置的组装件及其制造方法
公开(公告)号：WO2006052955A2
公开(公告)日：2006-05-18
申请号：PCT/US2005/040410
申请日：2005-11-08
申请人： ALIEN TECHNOLOGIES, INC. , CRAIG, Gordon, S., W. , TOOTOONCHI, Aly , EISENHARDT, Randy , HERRMANN, Scott , HADLEY, Mark, A. , DRZAIC, Paul
发明人： CRAIG, Gordon, S., W. , TOOTOONCHI, Aly , EISENHARDT, Randy , HERRMANN, Scott , HADLEY, Mark, A. , DRZAIC, Paul
CPC分类号： G06K19/07752 , G06K19/07749 , H01L23/49855 , H01L24/19 , H01L24/24 , H01L24/82 , H01L24/95 , H01L24/97 , H01L25/50 , H01L29/0657 , H01L2223/6677 , H01L2224/0401 , H01L2224/04105 , H01L2224/16 , H01L2224/20 , H01L2224/24101 , H01L2224/24227 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2224/95085 , H01L2224/95122 , H01L2224/95136 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/10155 , H01L2924/10158 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15157 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , H01L2224/82
摘要： Methods and apparatuses for an electronic assembly. A material is selectively printed on a web substrate at one or more selected areas. The web substrate includes a plurality of functional components having integrated circuits., A local printing system equipped with a print head that dispenses the selected material is used to print. The print head is coupled to a guidance system capable of registering an alignment feature on the web substrate.
摘要翻译：用于电子组件的方法和装置。材料在一个或多个选定区域选择性地印刷在幅材基底上。纤维网基材包括具有集成电路的多个功能部件。配备有分配所选材料的打印头的本地打印系统用于打印。打印头连接到能够在纤网基材上记录对齐特征的引导系统。

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