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1. 发明申请

WO2004111659A2 METHODS AND APPARATUS FOR PACKAGING INTEGRATED CIRCUIT DEVICES 审中-公开
标题翻译：包装集成电路设备的方法和装置
公开(公告)号：WO2004111659A2
公开(公告)日：2004-12-23
申请号：PCT/IL2004/000521
申请日：2004-06-16
申请人： SHELLCASE LTD. , ZILBER, Gil , KATRARO, Reuven , AKSENTON, Julia , OGANESIAN, Vage
发明人： ZILBER, Gil , KATRARO, Reuven , AKSENTON, Julia , OGANESIAN, Vage
IPC分类号： G01R
CPC分类号： H01L24/13 , H01L23/3114 , H01L24/11 , H01L24/12 , H01L24/94 , H01L2224/02319 , H01L2224/02321 , H01L2224/02335 , H01L2224/0236 , H01L2224/024 , H01L2224/0401 , H01L2224/13099 , H01L2224/274 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/00
摘要： An integrally packaged integrated circuit device including an integrated circuit die including a crystalline substrate having first and second generally planar surfaces and edge surfaces and an active surface formed on the first generally planar surface, at least one chip scale packaging layer formed over the active surface and at least one electrical contact formed over the at least one chip scale packaging layer, the at least one electrical contact being connected to circuitry on the active surface by at least one pad formed on the first generally planar surface.
摘要翻译：一种集成封装的集成电路器件，包括集成电路管芯，该集成电路管芯包括具有第一和第二大致平面的表面和边缘表面的结晶衬底和形成在第一大致平坦表面上的有源表面，形成在有源表面上的至少一个芯片级封装层，至少一个电触点形成在所述至少一个芯片级封装层上，所述至少一个电触点通过形成在所述第一大致平坦表面上的至少一个焊盘连接到所述有源表面上的电路。

2. 发明申请

WO2005004195A2 METHOD AND APPARATUS FOR PACKAGING INTEGRATED CIRCUIT DEVICES 审中-公开
标题翻译：用于封装集成电路器件的方法和装置
公开(公告)号：WO2005004195A2
公开(公告)日：2005-01-13
申请号：PCT/IL2004/000589
申请日：2004-07-01
申请人： SHELLCASE LTD. , ZILBER, Gil , AKSENTON, Julia , OGANESIAN, Vage
发明人： ZILBER, Gil , AKSENTON, Julia , OGANESIAN, Vage
IPC分类号： H01L
CPC分类号： H01L27/14618 , H01L23/3114 , H01L24/11 , H01L27/14621 , H01L27/14632 , H01L27/14683 , H01L27/14685 , H01L27/14687 , H01L31/0203 , H01L31/02327 , H01L33/385 , H01L33/486 , H01L33/62 , H01L2224/0231 , H01L2224/0401 , H01L2224/05624 , H01L2224/05647 , H01L2224/05666 , H01L2224/05671 , H01L2224/1147 , H01L2224/13099 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/00 , H01L2924/00014 , H01L2924/013
摘要： An integrally packaged integrated circuit device including an integrated circuit die including a crystalline substrate having first and second generally planar surfaces and edge surfaces and semiconductor circuitry formed over the first generally planar surface, at least one chip scale packaging layer formed over the semiconductor circuitry and the first generally planar surface, an insulation layer formed over the second generally planar surface and the edge surfaces and at least one electrical conductor formed directly on the insulation layer overlying the second generally planar surface, the at least one electrical conductor being connected to the circuitry by at least one pad formed directly on the first generally planar surface.
摘要翻译：一种集成封装的集成电路器件，包括集成电路管芯，该集成电路管芯包括具有第一和第二大体上平坦的表面和边缘表面的晶体衬底和形成在第一大致平坦表面上的半导体电路，形成在半导体电路上的至少一个芯片级封装层和第一大致平坦的表面，形成在第二大体上平坦的表面和边缘表面上的绝缘层和直接形成在绝缘层上的至少一个电导体，覆盖在第二大体上平坦的表面上，所述至少一个电导体通过至少一个焊盘直接形成在第一大致平坦的表面上。

3. 发明申请

WO2012075371A1 STACKED MICROELECTRONIC ASSEMBLY HAVING INTERPOSER CONNECTING ACTIVE CHIPS 审中-公开
标题翻译：具有连接主动插座的插座的堆叠式微电子组件
公开(公告)号：WO2012075371A1
公开(公告)日：2012-06-07
申请号：PCT/US2011/063025
申请日：2011-12-02
申请人： TESSERA, INC. , HABA, Belgacem , OGANESIAN, Vage , MOHAMMED, Ilyas , SAVALIA, Piyush , MITCHELL, Craig
发明人： HABA, Belgacem , OGANESIAN, Vage , MOHAMMED, Ilyas , SAVALIA, Piyush , MITCHELL, Craig
IPC分类号： H01L25/065 , H01L23/48 , H01L25/16
CPC分类号： H01L25/0657 , H01L21/486 , H01L21/76898 , H01L23/36 , H01L23/481 , H01L23/49822 , H01L23/49827 , H01L25/16 , H01L2224/16225 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06572 , H01L2924/15311
摘要： A microelectronic assembly (100) can include first and second microelectronic elements (102, 112) each embodying active semiconductor devices adjacent a front surface (104, 114) thereof, and an interposer (120) of a material having a CTE less than 10 ppm/°C. Each microelectronic element (102, 112) can have a conductive pad (106, 116) exposed at the respective front surface (104, 114). The interposer (120) can have a second conductive element (118) extending within an opening (222) in the interposer and exposed at first and second surfaces (227, 229) of the interposer. The first and second surfaces (227, 229) can face the front surface (104, 114) of the respective first and second microelectronic elements (102, 112). Each microelectronic element (102, 112) can include a first conductive element (236, 238) extending within an opening (206, 216) extending from a rear surface (237, 239) towards the front surface (104, 114) of the respective microelectronic element. At least one of the first conductive elements (236, 238) can extend through the conductive pad (204, 214) of the respective first or second microelectronic element (102, 112).
摘要翻译：微电子组件（100）可以包括第一和第二微电子元件（102,112），每个微电子元件（102,112）各自体现邻近其前表面（104,114）的有源半导体器件，以及具有CTE小于10ppm的材料的插入件（120） /C。每个微电子元件（102,112）可以具有在相应的前表面（104,114）处暴露的导电垫（106,116）。插入器（120）可以具有在插入器中的开口（222）内延伸并在插入件的第一和第二表面（227,229）处露出的第二导电元件（118）。第一和第二表面（227,229）可面对相应的第一和第二微电子元件（102,112）的前表面（104,114）。每个微电子元件（102,112）可以包括第一导电元件（236,238），该第一导电元件（236,238）在从后表面（237,239）朝向相应的后表面（227,119）的前表面（104,114）延伸的开口（206,216）内延伸微电子元件。第一导电元件（236,238）中的至少一个可以延伸通过相应的第一或第二微电子元件（102,112）的导电焊盘（204,214）。

4. 发明申请

WO2012074570A2 STACKED MICROELECTRONIC ASSEMBLY WITH TSVS FORMED IN STAGES AND CARRIER ABOVE CHIP 审中-公开
标题翻译：堆叠式微电脑组件与TSVS在步骤中形成和载体上面的芯片
公开(公告)号：WO2012074570A2
公开(公告)日：2012-06-07
申请号：PCT/US2011/029394
申请日：2011-03-22
申请人： TESSERA, INC , OGANESIAN, Vage , HABA, Belgacem , MOHAMMED, Ilyas , MITCHELL, Craig , SAVALIA, Piyush
发明人： OGANESIAN, Vage , HABA, Belgacem , MOHAMMED, Ilyas , MITCHELL, Craig , SAVALIA, Piyush
IPC分类号： H01L21/60
CPC分类号： H01L23/481 , H01L21/76802 , H01L21/76805 , H01L21/76877 , H01L21/76898 , H01L21/78 , H01L23/145 , H01L23/147 , H01L23/49827 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/89 , H01L24/92 , H01L2224/0401 , H01L2224/0557 , H01L2224/13009 , H01L2224/13099 , H01L2224/16225 , H01L2224/16235 , H01L2224/83 , H01L2224/9202 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/01061 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2224/05552 , H01L2924/00
摘要： A microelectronic assembly 100 is provided which includes a first element 110 consisting essentially of at least one of semiconductor or inorganic dielectric material having a surface 103 facing and attached to a major surface 104 of a microelectronic element 102 at which a plurality of conductive pads 106 are exposed, the microelectronic element 102 having active semiconductor devices therein. A first opening 111 extends from an exposed surface 118 of the first element 110 towards the surface 103 attached to the microelectronic element 102, and a second opening 113 extends from the first opening 111 to a first one of the conductive pads 106, wherein where the first and second openings meet, interior surfaces 121, 123 of the first and second openings extend at different angles relative to the major surface 104 of the microelectronic element 102. A conductive element 114 extends within the first and second openings 111, 113 and contacts the at least one conductive pad 106.
摘要翻译：提供微电子组件100，其包括基本上由半导体或无机电介质材料中的至少一种组成的第一元件110，其具有面向103并附着到微电子元件102的主表面104的表面103，多个导电焊盘106 微电子元件102在其中具有有源半导体器件。第一开口111从第一元件110的暴露表面118延伸到附接到微电子元件102的表面103，并且第二开口113从第一开口111延伸到导电焊盘106中的第一开口111，其中第一和第二开口相交，第一和第二开口的内表面121,123相对于微电子元件102的主表面104以不同的角度延伸。导电元件114在第一和第二开口111,113内延伸并接触至少一个导电垫106。

5. 发明申请

WO2012037216A2 STAGED VIA FORMATION FROM BOTH SIDES OF CHIP 审中-公开
标题翻译：通过芯片的两面形成
公开(公告)号：WO2012037216A2
公开(公告)日：2012-03-22
申请号：PCT/US2011/051552
申请日：2011-09-14
申请人： TESSERA, INC. , OGANESIAN, Vage , HABA, Belgacem , MOHAMMED, Ilyas , MITCHELL, Craig , SAVALIA, Piyush
发明人： OGANESIAN, Vage , HABA, Belgacem , MOHAMMED, Ilyas , MITCHELL, Craig , SAVALIA, Piyush
IPC分类号： H01L21/768 , H01L23/48 , H01L25/065
CPC分类号： H01L23/481 , H01L21/76898 , H01L23/50 , H01L24/03 , H01L24/05 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/05009 , H01L2224/06181 , H01L2224/16145 , H01L2224/32145 , H01L2224/73204 , H01L2225/06513 , H01L2225/06541 , H01L2225/06544 , H01L2924/01322 , H01L2924/07811 , H01L2924/12042 , H01L2924/14 , H01L2924/00012 , H01L2924/00
摘要： A method of fabricating a semiconductor assembly 10 can include providing a semiconductor element 20 having a front surface 21, a rear surface 22, and a plurality of conductive pads 50, forming at least one hole 40 extending at least through a respective one of the conductive pads 50 by processing applied to the respective conductive pad 50 from above the front surface 21, forming an opening 30 extending from the rear surface 22 at least partially through a thickness of the semiconductor element 20, such that the at least one hole 30 and the opening 40 meet at a location between the front and rear surfaces, and forming at least one conductive element 60, 80 exposed at the rear surface 22 for electrical connection to an external device, the at least one conductive element extending within the at least one hole 30 and at least into the opening 40, the conductive element being electrically connected with the respective conductive pad 50.
摘要翻译：制造半导体组件10的方法可以包括提供具有前表面21，后表面22和多个导电焊盘50的半导体元件20，形成至少一个至少通过导电通过从前表面21上方施加到相应的导电焊盘50的处理的焊盘50形成从后表面22至少部分延伸穿过半导体元件20的厚度的开口30，使得至少一个孔30和开口40在前表面和后表面之间的位置相遇，并且形成在后表面22处暴露的至少一个导电元件60,80，用于电连接到外部装置，所述至少一个导电元件在至少一个孔内延伸 30并且至少进入开口40中，导电元件与相应的导电焊盘50电连接。

6. 发明申请

WO2012011933A1 MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION 审中-公开
标题翻译：具有后组装平面化的微电子元件
公开(公告)号：WO2012011933A1
公开(公告)日：2012-01-26
申请号：PCT/US2010/052792
申请日：2010-10-15
申请人： TESSERA, INC. , OGANESIAN, Vage , HABA, Belgacem , MITCHELL, Craig , MOHAMMED, Ilyas , SAVALIA, Piyush
发明人： OGANESIAN, Vage , HABA, Belgacem , MITCHELL, Craig , MOHAMMED, Ilyas , SAVALIA, Piyush
IPC分类号： H05K5/00
CPC分类号： H01L21/76819 , H01L21/76877 , H01L23/13 , H01L23/3128 , H01L23/49827 , H01L23/4985 , H01L23/5389 , H01L24/18 , H01L24/19 , H01L24/24 , H01L24/25 , H01L24/82 , H01L24/97 , H01L25/105 , H01L25/117 , H01L25/16 , H01L25/50 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/16235 , H01L2224/24227 , H01L2224/24247 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2225/1023 , H01L2225/1029 , H01L2225/1035 , H01L2225/1041 , H01L2225/1052 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01061 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/07811 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15156 , H01L2924/15165 , H01L2924/15192 , H01L2924/15311 , H01L2924/15313 , H01L2924/15331 , H01L2924/157 , H01L2924/15788 , H01L2924/18161 , Y10T29/49002 , H01L2224/81 , H01L2924/00 , H01L2224/82 , H01L2224/83
摘要： A microelectronic unit includes a carrier structure having a front surface, a rear surface remote from the front surface, and a recess having an opening at the front surface and an inner surface located below the front surface of the carrier structure. The microelectronic unit can include a microelectronic element having a bottom surface adjacent the inner surface, a top surface remote from the bottom surface, and a plurality of contacts at the top surface. The microelectronic element can include terminals electrically connected with the contacts of the microelectronic element. The microelectronic unit can include a dielectric region contacting at least the top surface of the microelectronic element. The dielectric region can have a planar surface located coplanar with or above the front surface of the carrier structure. The terminals can be exposed at the surface of the dielectric region for interconnection with an external element.
摘要翻译：微电子单元包括具有前表面，远离前表面的后表面和在前表面具有开口的凹部和位于载体结构的前表面下方的内表面的载体结构。微电子单元可以包括具有邻近内表面的底表面，远离底表面的顶表面和在顶表面处的多个触点的微电子元件。微电子元件可以包括与微电子元件的触点电连接的端子。微电子单元可以包括至少与微电子元件的顶表面接触的电介质区域。电介质区域可以具有与载体结构的前表面共面或平行的平面。端子可以暴露在电介质区域的表面以与外部元件互连。

7. 发明申请

WO2012087364A1 SIMULTANEOUS WAFER BONDING AND INTERCONNECT JOINING 审中-公开
标题翻译：同时连接和互连
公开(公告)号：WO2012087364A1
公开(公告)日：2012-06-28
申请号：PCT/US2011/030871
申请日：2011-04-01
申请人： TESSERA, INC. , OGANESIAN, Vage , HABA, Belgacem , MOHAMMED, Ilyas , SAVALIA, Piyush , MITCHELL, Craig
发明人： OGANESIAN, Vage , HABA, Belgacem , MOHAMMED, Ilyas , SAVALIA, Piyush , MITCHELL, Craig
IPC分类号： H01L21/98 , H01L25/065
CPC分类号： H01L25/00 , H01L23/481 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/04026 , H01L2224/05023 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05186 , H01L2224/0519 , H01L2224/05568 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/0603 , H01L2224/0613 , H01L2224/06131 , H01L2224/06135 , H01L2224/06505 , H01L2224/116 , H01L2224/13023 , H01L2224/13082 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/136 , H01L2224/16146 , H01L2224/16148 , H01L2224/16235 , H01L2224/16238 , H01L2224/276 , H01L2224/29023 , H01L2224/29082 , H01L2224/291 , H01L2224/29109 , H01L2224/29111 , H01L2224/29144 , H01L2224/32148 , H01L2224/32238 , H01L2224/73103 , H01L2224/81191 , H01L2224/81193 , H01L2224/8123 , H01L2224/81815 , H01L2224/8183 , H01L2224/83191 , H01L2224/83193 , H01L2224/8323 , H01L2224/83815 , H01L2224/8383 , H01L2224/9202 , H01L2224/9221 , H01L2224/94 , H01L2225/06513 , H01L2225/06527 , H01L2225/06541 , H01L2225/06565 , H01L2924/00014 , H01L2924/0002 , H01L2924/01029 , H01L2924/09701 , H01L2924/14 , H01L2924/35 , H01L2924/014 , H01L2224/81 , H01L2224/83 , H01L2224/05552 , H01L2924/00012 , H01L2924/00
摘要： Disclosed are a microelectronic assembly (300) of two elements (100, 200) and a method of forming same. A microelectronic element (100) includes a major surface (102), and a dielectric layer (120) and at least one bond pad (110) exposed at the major surface (102). The microelectronic element (100) may contain a plurality of active circuit elements. A first metal layer (130) is deposited overlying the at least one bond pad (110) and the dielectric layer (120). A second element (200) having a second metal layer (230) deposited thereon is provided, and the first metal layer (130) is joined with the second metal layer (230). The assembly (300) may be severed along dicing lanes (301) into individual units each including a chip.
摘要翻译：公开了两个元件（100,200）的微电子组件（300）及其形成方法。微电子元件（100）包括在主表面（102）处暴露的主表面（102）和介电层（120）和至少一个接合焊盘（110）。微电子元件（100）可以包含多个有源电路元件。沉积在所述至少一个接合焊盘（110）和介电层（120）上的第一金属层（130）。提供了具有沉积在其上的第二金属层（230）的第二元件（200），并且第一金属层（130）与第二金属层（230）接合。组件（300）可以沿着切割通道（301）切割成各自包括芯片的单元。

8. 发明申请

WO2012082881A2 VOID-FREE WAFER BONDING USING CHANNELS 审中-公开
标题翻译：无通道波形使用通道
公开(公告)号：WO2012082881A2
公开(公告)日：2012-06-21
申请号：PCT/US2011/064884
申请日：2011-12-14
申请人： TESSERA, INC. , OGANESIAN, Vage , HABA, Belgacem , MOHAMMED, Ilyas , SAVALIA, Piyush , MITCHELL, Craig
发明人： OGANESIAN, Vage , HABA, Belgacem , MOHAMMED, Ilyas , SAVALIA, Piyush , MITCHELL, Craig
IPC分类号： H01L21/98
CPC分类号： H01L23/562 , B81C1/00269 , B81C1/00357 , H01L21/2007 , H01L21/561 , H01L21/563 , H01L21/568 , H01L23/13 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0655 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/29186 , H01L2224/2919 , H01L2224/32057 , H01L2224/32145 , H01L2224/32225 , H01L2224/83051 , H01L2224/83191 , H01L2224/83345 , H01L2224/83385 , H01L2224/83855 , H01L2224/83856 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06555 , H01L2225/06575 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/014 , H01L2924/0665 , H01L2924/10158 , H01L2924/10253 , H01L2924/1027 , H01L2924/1032 , H01L2924/1037 , H01L2924/14 , H01L2924/1461 , H01L2924/3511 , H01L2224/83 , H01L2924/00
摘要： A method of bonding first and second microelectronic elements includes pressing together a first substrate 100 containing active circuit elements 108 therein with a second substrate 112, with a flowable dielectric material 102 between confronting surfaces of the respective substrates, each of the first and second substrates 100,112 having a coefficient of thermal expansion less than 10 parts per million/ °C, at least one of the confronting surfaces having a plurality of channels 118A-118F extending from an edge of such surface, such that the dielectric material 102 between planes defined by the confronting surfaces is at least substantially free of voids and has a thickness over one micron, and at least some of the dielectric material 102 flows into at least some of the channels.
摘要翻译：接合第一和第二微电子元件的方法包括将含有有源电路元件108的第一基板100与第二基板112压在一起，在相应基板的相对表面之间具有可流动介电材料102，第一和第二基板100,112中的每一个具有小于10ppm /℃的热膨胀系数，至少一个相对表面具有从该表面的边缘延伸的多个通道118A-118F，使得介电材料102在由面对的表面至少基本上没有空隙并且具有超过一微米的厚度，并且至少一些介电材料102流入至少一些通道。

9. 发明申请

WO2012011931A1 MICROELECTRONIC ELEMENTS HAVING METALLIC PADS OVERLYING VIAS 审中-公开
标题翻译：具有金属叠层的微电子元件
公开(公告)号：WO2012011931A1
公开(公告)日：2012-01-26
申请号：PCT/US2010/052783
申请日：2010-10-15
申请人： TESSERA, INC. , OGANESIAN, Vage , MOHAMMED, Ilyas , MITCHELL, Craig , HABA, Belgacem , SAVALIA, Piyush
发明人： OGANESIAN, Vage , MOHAMMED, Ilyas , MITCHELL, Craig , HABA, Belgacem , SAVALIA, Piyush
IPC分类号： H01L21/58 , H01L23/48
CPC分类号： H01L25/0657 , H01L23/3114 , H01L23/481 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L27/14618 , H01L27/14634 , H01L27/14636 , H01L2224/0401 , H01L2224/0557 , H01L2224/05571 , H01L2224/06181 , H01L2224/13009 , H01L2224/13025 , H01L2224/131 , H01L2224/13111 , H01L2224/13147 , H01L2224/1329 , H01L2224/133 , H01L2224/16146 , H01L2224/94 , H01L2225/06513 , H01L2225/06541 , H01L2225/06565 , H01L2924/00014 , H01L2924/0002 , H01L2924/01029 , H01L2924/01322 , H01L2924/07811 , H01L2924/12041 , H01L2924/14 , H01L2924/1461 , H01L2924/00012 , H01L2224/03 , H01L2924/00 , H01L2924/014 , H01L2224/05552
摘要： A microelectronic unit, an interconnection substrate, and a method of fabricating a microelectronic unit are disclosed The microelectronic unit can include a semiconductor element having a plurality of active semiconductor devices therein, the semiconductor element having a first opening extending from a rear surface partially through the semiconductor element towards a front surface and at least one second opening, and a dielectric region overlying a surface of the semiconductor element in the first opening The microelectronic unit can include at least one conductive interconnect electrically connected to a respective conductive via and extending away therefrom within an aperture In a particular embodiment, at least one conductive interconnect can extend within the first opening and at least one second opening, the conductive interconnect being electrically connected with a conductive pad having a top surface exposed at the front surface of the semiconductor element.
摘要翻译：公开了微电子单元，互连衬底和制造微电子单元的方法。微电子单元可以包括其中具有多个有源半导体器件的半导体元件，该半导体元件具有从后表面部分延伸穿过该第一开口的第一开口半导体元件朝向前表面和至少一个第二开口，以及覆盖在第一开口中的半导体元件的表面上的电介质区域。微电子单元可以包括电连接到相应的导电通孔并从其延伸的至少一个导电互连件孔在特定实施例中，至少一个导电互连可以在第一开口内和至少一个第二开口内延伸，导电互连件与具有暴露在半导体元件的前表面处的顶表面的导电焊盘电连接。

10. 发明申请

WO2009137022A1 CAMERA SYSTEM INCLUDING RADIATION SHIELD AND METHOD OF SHIELDING RADIATION 审中-公开
标题翻译：包括辐射屏蔽的相机系统和屏蔽辐射方法
公开(公告)号：WO2009137022A1
公开(公告)日：2009-11-12
申请号：PCT/US2009/002755
申请日：2009-05-05
申请人： TESSERA NORTH AMERICA, INC. , MORRIS, James , FELDMAN, Michael , KINTZ, Greg , HAN, Hongtao , BEREZIUK, Michael , OGANESIAN, Vage , OVRUTSKY, David
发明人： MORRIS, James , FELDMAN, Michael , KINTZ, Greg , HAN, Hongtao , BEREZIUK, Michael , OGANESIAN, Vage , OVRUTSKY, David
IPC分类号： H01L27/146
CPC分类号： H01L27/14685 , H01L27/14621 , H01L27/14625 , H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H04N5/2252 , H04N5/2257 , H01L2924/00014
摘要： A camera system includes an optics stack including first and second substrates secured together in a stacking direction, one of the first and seconds substrates including an optical element, a detector on a sensor substrate, and a feature (680) shielding the camera system, the feature being external to the optics stack and extending from a surface of the optics stack furthest from the sensor substrate
摘要翻译：相机系统包括光学堆叠，其包括在堆叠方向上固定在一起的第一和第二基板，第一和第二基板中的一个包括光学元件，传感器基板上的检测器和屏蔽相机系统的特征（680）特征在光学堆叠的外部并且从离传感器基板最远的光学堆叠的表面延伸

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