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1. 发明申请

WO2015084164A1 METHOD AND APPARATUS FOR ASSEMBLING A COMPONENT WITH A FLEXIBLE FOIL, AS WELL AS THE ASSEMBLED PRODUCT 审中-公开
标题翻译：用于组装具有柔性箔的组件的方法和装置，作为组装的产品
公开(公告)号：WO2015084164A1
公开(公告)日：2015-06-11
申请号：PCT/NL2014/050815
申请日：2014-11-28
申请人： NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO
发明人： ARUTINOV, Gari , VAN HECK, Gerardus Titus , SMITS, Edsger Constant Pieter
IPC分类号： H01L21/68 , H01L21/58 , G06K19/077 , H01L29/06
CPC分类号： H05K3/305 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/83 , H01L24/97 , H01L2224/27013 , H01L2224/2732 , H01L2224/2929 , H01L2224/29339 , H01L2224/32225 , H01L2224/32245 , H01L2224/743 , H01L2224/757 , H01L2224/75701 , H01L2224/7598 , H01L2224/83002 , H01L2224/83143 , H01L2224/83192 , H01L2224/83855 , H01L2224/9205 , H01L2224/95102 , H01L2224/95115 , H01L2224/95146 , H01L2924/12042 , H05K1/16 , H05K1/189 , H05K13/0015 , H05K13/0469 , H05K2203/166 , H01L2924/07811 , H01L2924/0665 , H01L2924/00014 , H01L2924/00
摘要： Method and apparatus for assembling a component with a flexible foil, as well as assembled product A method is provided for assembling a component (20) with a flexible foil (10). The method comprising the steps of • - providing (SI) a flexible foil (10) having a first side (11) with at least one liquid confinement zone (12) and at least one liquid confinement subzone (13) enclosed by the liquid confinement zone, • - depositing (S2) an alignment liquid (30) in the at least one liquid confinement subzone (13), • - moving (S3) the component (20) towards the liquid confinement zone, and bringing (S4) a surface (21) of the component facing the flexible foil into contact with the alignment liquid in the at least one liquid confinement subzone and releasing (S5) the component (20). The step of moving (S3) the component (20) towards the flexible foil, and the step of bringing (S4) a surface (21) of the component facing the flexible foil into contact with the alignment liquid, is realized with a gripping tool (130) that includes one or more capillary tubes (131) ending in a downward facing opening (132). At least a portion of the capillary tubes that ends in the downward facing opening (132) is filled with a carrier liquid (135). A first, adhesive force (Fal) exerted by the carrier liquid on the component is larger than a second force (Fg), that is exerted by gravity on the component and wherein said first adhesive force (Fal) is smaller than the sum (Fg + Fa2) of said second force (Fg) and a third, adhesive force (Fa2) exerted by the alignment liquid on the component when the component comes into contact with the alignment liquid. The alignment liquid (30) in contact with the component (20) exerts adhesive forces on the component that align the released component with the flexible foil.
摘要翻译：用于组装具有柔性箔的组件的方法和装置以及组装产品提供了用于将组件（20）与柔性箔（10）组装的方法。该方法包括以下步骤： - 提供（SI）具有至少一个液体限制区（12）的第一侧（11）的柔性箔（10）和由液体限制包围的至少一个液体限制子区（13）区域，•在所述至少一个液体限制子区域（13）中沉积（S2）对准液体（30）; - 将所述部件（20）移动（S3）朝向液体限制区域，并且使（S4）表面（21）与所述至少一个液体限制子区域中的对准液接触并释放（S5）所述部件（20）。将组件（20）朝着柔性箔移动（S3）的步骤和使面向柔性箔的部件的表面（21）与对准液体接触的步骤（S4）通过夹持工具（130），其包括以向下的开口（132）结束的一个或多个毛细管（131）。在向下的开口（132）中终止的毛细管的至少一部分被载液（135）填充。首先，由载液施加在部件上的粘合力（Fal）大于通过重力施加在部件上的第二力（Fg），并且其中所述第一粘附力（Fal）小于总和（Fg + Fa2）和第三粘合力（Fa2），当所述部件与所述取向液体接触时，所述对准液体对所述部件施加的粘合力（Fa2）。与部件（20）接触的对准液体（30）对被释放的部件与柔性箔片对准的部件施加粘合力。

2. 发明申请

WO2013024837A1 部品の製造方法及び部品审中-公开
标题翻译：组件制造方法和组件
公开(公告)号：WO2013024837A1
公开(公告)日：2013-02-21
申请号：PCT/JP2012/070609
申请日：2012-08-13
申请人：株式会社アルバック , 中牟田雄 , 松本昌弘 , 稲垣貴之 , 平松大典 , 谷典明
发明人：中牟田　雄 , 松本　昌弘 , 稲垣　貴之 , 平松　大典 , 谷　典明
IPC分类号： H01L21/60 , C23C14/06 , C23C14/34
CPC分类号： C23C14/165 , H01L24/03 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/74 , H01L24/741 , H01L24/743 , H01L24/77 , H01L24/83 , H01L24/84 , H01L2224/0345 , H01L2224/04026 , H01L2224/04034 , H01L2224/05655 , H01L2224/2745 , H01L2224/291 , H01L2224/29111 , H01L2224/32013 , H01L2224/32106 , H01L2224/32245 , H01L2224/32503 , H01L2224/37124 , H01L2224/37147 , H01L2224/37565 , H01L2224/37655 , H01L2224/40499 , H01L2224/40507 , H01L2224/4051 , H01L2224/4052 , H01L2224/4111 , H01L2224/74 , H01L2224/741 , H01L2224/83002 , H01L2224/83011 , H01L2224/8302 , H01L2224/83447 , H01L2224/83455 , H01L2224/8381 , H01L2224/83815 , H01L2224/84002 , H01L2224/84011 , H01L2224/8402 , H01L2224/8481 , H01L2224/84815 , H01L2224/03 , H01L2924/00014 , H01L2924/014 , H01L2924/01047 , H01L2924/01029 , H01L2924/0103 , H01L2924/01083 , H01L2924/01049 , H01L2924/01051 , H01L2924/01028 , H01L2924/0105 , H01L2224/743 , H01L2224/404 , H01L2224/77
摘要：　この部品の製造方法は、一方の面がニッケルからなる基板を用い、前記一方の面上に、錫を主成分とする合金膜をスパッタ法により形成する工程Ａ１と、前記合金膜上に、少なくとも前記合金膜との接触部位が、銅、及び、ニッケル被覆されたアルミニウムの何れか一方からなる部品を載置する工程Ａ３と、前記基板と前記合金膜との間、及び、前記合金膜と前記部品との間を各々接合するために、熱処理を施す工程Ａ４と、を少なくとも順に備える、部品の製造方法であって、前記工程Ａ１において、減圧雰囲気とした空間内に、錫を主成分とする合金ターゲットを設けたカソード電極と、前記基板を設けたアノード電極とを対向して配置し、前記基板の前記一方の面上に、前記合金膜を形成する際に、前記カソード電極にＤＣ電圧を印加する。
摘要翻译：该部件制造方法至少依次包括：使用其中一个表面包含镍的基板通过溅射形成在基板的一个表面上具有锡作为主要成分的合金膜的步骤（A1）在合金膜上放置与合金膜接触的至少一部分包含铜或包含镍涂覆的铝的部件的步骤（A3）; 以及为了将基板和合金膜彼此接合并且合金膜和部件彼此粘合而进行热处理的步骤（A4）。在步骤（A1）中，阴极电极和阳极电极在具有减压气氛的空间中相对地布置，阴极设置有以锡为主要成分的合金靶，并且设置阳极电极与基材; 并且当在基板的上述一个表面上形成合金膜时，向阴极施加DC电压。

3. 发明申请

WO2008133865A1 DIE-CUT AND METHOD OF MANUFACTURING OR ASSEMBLING DIE-CUTS FROM THE COMPONENTS THEREOF 审中-公开
标题翻译： DIE-CUT及其组件的制造或组装方法
公开(公告)号：WO2008133865A1
公开(公告)日：2008-11-06
申请号：PCT/US2008/005153
申请日：2008-04-22
申请人： KO, Kwangwoo, Michael
发明人： KO, Kwangwoo, Michael
IPC分类号： H01L21/78 , H01L21/82
CPC分类号： B29C65/5057 , B29C65/4825 , B29C65/5092 , B29C66/1122 , B29C66/1142 , B29C66/43421 , B29C66/4722 , B29C66/52431 , B29C66/8322 , B29C66/863 , H01L24/27 , H01L24/30 , H01L24/743 , H01L2224/271 , H01L2224/3003 , H01L2224/30505 , H01L2224/743 , H01L2924/3025 , Y10T156/10 , Y10T428/19 , B29C65/00
摘要： Methods are provided for assembling desired die-cuts from individual die- cut components. Each individual die-cut component may consist of films of various materials, diverse adhesive tapes, diverse foam materials, fabrics, metals and others. Individual die-cut components are assembled onto liners that function as carriers or platforms. The liners may be in individual panels or continuous rolls. Individual die-cut components are assembled onto the liner using computer controlled pick and place equipment with a high degree of accuracy and speed. The liner may consist of a film with controlled adhesive strength to maintain the x-y position of placed individual die-cut components. The die-cut comprising the liner and assembled die-cut components is then used for various purposes, such as holding two parts together, in the assembly of various products, such as cell phones.
摘要翻译：提供了用于组装来自各个模切部件的期望的模切的方法。每个单独的模切部件可以由各种材料的膜，各种胶带，不同的泡沫材料，织物，金属等组成。单独的模切部件组装到作为载体或平台的衬垫上。衬垫可以在单独的面板或连续的卷筒中。使用计算机控制的拾取和放置设备以高精度和高速度将单个模切部件组装到衬管上。衬里可以由具有受控粘合强度的膜组成，以保持放置的单个模切部件的x-y位置。然后，包括衬垫和组装的模切部件的冲切件用于各种产品（例如手机）的组装中的各种目的，例如将两个部件保持在一起。

4. 发明申请

WO2007142175A1 接合方法审中-公开
标题翻译：结合方法
公开(公告)号：WO2007142175A1
公开(公告)日：2007-12-13
申请号：PCT/JP2007/061266
申请日：2007-06-04
申请人：田中貴金属工業株式会社 , 小柏俊典 , 宮入正幸
发明人：小柏俊典 , 宮入正幸
IPC分类号： H01L21/52 , H01L21/60 , H05K3/32 , H01B1/22
CPC分类号： H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/0558 , H01L2224/05669 , H01L2224/1132 , H01L2224/11416 , H01L2224/11505 , H01L2224/1155 , H01L2224/1329 , H01L2224/13339 , H01L2224/13344 , H01L2224/13364 , H01L2224/13369 , H01L2224/16245 , H01L2224/27505 , H01L2224/29339 , H01L2224/29344 , H01L2224/29364 , H01L2224/29369 , H01L2224/75252 , H01L2224/81048 , H01L2224/81097 , H01L2224/81191 , H01L2224/81203 , H01L2224/81207 , H01L2224/81464 , H01L2224/8184 , H01L2224/83048 , H01L2224/83191 , H01L2224/83207 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01022 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10329 , H01L2924/351 , H01L2224/05644 , H01L2224/13099 , H01L2224/743 , H01L2924/00 , H01L2924/00014 , H01L2924/00012 , H01L2924/01203 , H01L2224/80097 , H01L2924/20108 , H01L2924/20103
摘要： A method by which, in semiconductor chip die bonding or the like, a bonded part having sufficient bond strength can be obtained at a relatively low temperature. A metallic paste (20) comprising one or more metal powders selected among a gold powder, silver powder, platinum powder, and palladium powder having a purity of 99.9 wt.% or higher and an average particle diameter of 0.005-1.0 µm and an organic solvent was applied to a semiconductor chip (10). The metallic paste (20) applied was vacuum-dried in a drying vessel. This chip was heated at 230°C for 30 minutes to sinter the metallic paste and obtain a metal-powder sinter (21). Subsequently, a nickel sheet (30) is put on the semiconductor chip (10) and bonded thereto by heating and pressing.
摘要翻译：在半导体芯片芯片接合等中，可以在较低的温度下获得具有足够的接合强度的接合部分的方法。一种金属膏（20），其包含选自金粉末，银粉，铂粉末和纯度为99.9重量％以上，平均粒径为0.005〜1.0微米的钯粉末的一种或多种金属粉末和有机物溶剂施加到半导体芯片（10）。将所施加的金属膏（20）在干燥容器中真空干燥。将该芯片在230℃下加热30分钟以烧结金属膏，得到金属粉末烧结体（21）。随后，将镍片（30）放在半导体芯片（10）上，通过加热和加压将其接合。

5. 发明申请

WO0103186A9 SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND STRUCTURE FOR MOUNTING SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件，其制造方法和用于安装半导体器件的结构
公开(公告)号：WO0103186A9
公开(公告)日：2001-04-19
申请号：PCT/JP0004340
申请日：2000-06-30
申请人： HITACHI LTD , HITACHI YONEZAWA ELECTRONICS , SHIMANUKI YOSHIHIKO
发明人： SHIMANUKI YOSHIHIKO
IPC分类号： H01L21/56 , H01L23/31 , H01L23/495 , H01L23/50
CPC分类号： H01L23/49503 , H01L21/4825 , H01L21/4842 , H01L21/565 , H01L23/3107 , H01L23/3114 , H01L23/49513 , H01L23/4952 , H01L23/49541 , H01L23/49548 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/743 , H01L24/78 , H01L24/83 , H01L24/85 , H01L2224/05554 , H01L2224/29 , H01L2224/29007 , H01L2224/29111 , H01L2224/29139 , H01L2224/2919 , H01L2224/29298 , H01L2224/32014 , H01L2224/32055 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/49171 , H01L2224/73265 , H01L2224/743 , H01L2224/78301 , H01L2224/83192 , H01L2224/8385 , H01L2224/85181 , H01L2224/85205 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2924/00013 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10162 , H01L2924/14 , H01L2924/1433 , H01L2924/15747 , H01L2924/1576 , H01L2924/181 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/0103 , H01L2924/0105 , H01L2924/01047 , H01L2924/01082 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2924/00012
摘要： A semiconductor device comprising a tab (5) supporting a semiconductor chip (8), a sealing part (12) formed by encapsulating the semiconductor chip (8) with resin, tab suspension leads (4) supporting the tab (5), a plurality of leads (2) having parts to be connected and exposed in the periphery of the back of the sealing part (12), and thin parts thinner than the parts to be connected and provided in the edge area of the tab side, and each having an inner dent (2e) and an outer dent (2f) in the wire bonding face (2d) arranged in each of the parts to be connected in the inside of the sealing part (12), wires (10) connecting the pads (7) of the semiconductor chip (8) to the leads (2), wherein the thin parts of the leads (2) are covered with the resin for the sealing, the wires (10) are connected to the parts to be connected respectively at positions between the outer dents (2f) and the inner dents (2e), and the outer dents (2f) and the inner dents (2e) in the thin parts of the leads (2) serve to prevent the leads from coming off.
摘要翻译：一种半导体器件，包括支撑半导体芯片（8）的突片（5），通过用树脂封装半导体芯片（8）形成的密封部分（12），支撑突片（5）的突片悬挂引线（4），多个的引线（2）具有要连接和暴露在密封部分（12）的背面的周边的部分，并且薄的部分比要连接并设置在突片侧边缘区域的部分更薄，并且每个具有布置在要连接在密封部分（12）内部的每个部分中的引线接合面（2d）中的内凹部（2e）和外凹部（2f），连接焊盘）到引线（2），其中引线（2）的薄部分被用于密封的树脂覆盖，导线（10）分别连接到要连接的部件在引线（2）的薄部分中的外凹部（2f）和内凹部（2e）之间以及外凹部（2f）和内凹部（2e）之间，用于防止潜在客户脱落。

6. 发明申请

WO00051748A1 DEVICE AND METHOD FOR APPLYING ADHESIVE MATERIAL ONTO PLANAR COMPONENTS AND THE USE THEREOF 审中-公开
标题翻译： DEVICE AND METHOD FOR施胶材料对表面组分及其用途
公开(公告)号：WO00051748A1
公开(公告)日：2000-09-08
申请号：PCT/DE2000/000550
申请日：2000-02-25
IPC分类号： B05C1/02 , B05C9/02 , B05D1/28 , B05D5/10 , H01L21/58 , B05C3/20
CPC分类号： H01L24/27 , B05C1/02 , B05C9/025 , B05D1/28 , B05D5/10 , H01L24/743 , H01L24/83 , H01L2224/743 , H01L2224/83194 , H01L2224/8385 , H01L2924/01005 , H01L2924/01027 , H01L2924/01057 , H01L2924/01082 , H01L2924/07802
摘要： The invention relates to a device and a method for applying adhesive material onto planar components such as substrates, semiconductor chips or the like. The invention is characterised in that a sieve element (3) is arranged in the area of the adhesive bed surface. The openings of said sieve element (3) allow the adhesive material to pass through. The adhesive bed (2) and the sieve element are configured or co-operate in such a way that only a limited amount of adhesive passes the sieve element before, during or after the component is placed in order to moisten the supporting surface thereof. The invention also relates to methods for applying adhesive material onto planar components. When a component is placed, the sieve element is dug into the adhesive bed in such a way that the adhesive material is transported through the openings of the sieve element (3) and that the supporting surface (7) of the placed component is moistened or that the sieve element is arranged in the adhesive bed in such a way that adhesive material is transported onto the surface of the sieve element. Said adhesive material moistens the supporting surfaces of the components which are situated on the surface of the sieve element (3) or are to be placed onto said sieve element (3).
摘要翻译：提供了一种用于将粘合材料到平面部件，如基片，半导体芯片等的装置和方法被提出，其中本发明的核心在于如下事实：一个屏蔽元件（3）被布置在粘合剂床面，开口，其中粘合剂材料的一个通道允许，其中，所述粘合剂床（2）和屏蔽元件被设计以这样的方式和相互匹配，而在此之前只有有限量的粘合材料，期间或装置的润湿接触表面装配操作之后通过屏元件。在用于施加粘合剂材料的另一种方法，提出了在平坦的组件，其中放置一个组件时，屏幕元素被压入粘合剂床，从而使粘合剂材料通过筛件的开口（3）并润湿所述支撑表面（7）的安装部件输送或屏幕元件被这样布置在所述粘合剂床，该遮蔽元件（3）的部件的支承面放置在其中屏幕元件部分的表面上（3）位于在其支撑表面上或润湿筛元件粘接材料润湿的表面上输送是。

7. 发明申请

WO2014148770A1 전도성 기판의 접착제 도포방법 审中-公开
标题翻译：用粘合剂涂覆导电基材的方法
公开(公告)号：WO2014148770A1
公开(公告)日：2014-09-25
申请号：PCT/KR2014/002111
申请日：2014-03-13
申请人： 지스마트 주식회사
发明人： 신학열 , 이호준
IPC分类号： H01L21/60 , B05C5/00 , H05K3/32 , H01L33/00
CPC分类号： H01L33/62 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/743 , H01L24/83 , H01L2224/27312 , H01L2224/29006 , H01L2224/29007 , H01L2224/29012 , H01L2224/29014 , H01L2224/29027 , H01L2224/29036 , H01L2224/30131 , H01L2224/30135 , H01L2224/30136 , H01L2224/30151 , H01L2224/30155 , H01L2224/30179 , H01L2224/30505 , H01L2224/32225 , H01L2224/33135 , H01L2224/33179 , H01L2224/33505 , H01L2224/743 , H01L2224/83192 , H01L2224/83194 , H01L2224/8385 , H01L2224/83851 , H01L2224/83874 , H01L2924/12041 , H01L2933/0066 , H05K3/305 , H05K3/321 , H05K2201/0108 , H05K2201/10106 , H05K2203/0126 , H05K2203/166 , Y02P70/613 , H01L2924/00014 , H01L2924/00012
摘要： 본 발명은 전도성 기판의 접착제 도포방법에 관한 것으로, 상세하게는 전도성 기판에서 다수개의 회로소자를 접착시키도록 도포되는 접착제의 양과 위치를 설정하여 접착제의 퍼짐에 의한 심미감의 저하, 전기 전도도의 저하 및 쇼트와 같은 불량을 방지할 수 있는 전도성 기판의 접착제 도포방법에 관한 것이다.
摘要翻译：本发明涉及一种用粘合剂涂覆导电性基材的方法，具体地涉及一种用粘合剂涂布导电性基材的方法，由于粘合剂的扩散，美观性的劣化，可以通过设定待涂布的粘合剂的量和位置来将多个电路元件粘附到导电基板上来防止导电性和诸如短路的缺陷。

8. 发明申请

WO2009147828A1 半導体装置の製造方法および半導体装置审中-公开
标题翻译：半导体器件和半导体器件的制造方法
公开(公告)号：WO2009147828A1
公开(公告)日：2009-12-10
申请号：PCT/JP2009/002447
申请日：2009-06-02
申请人：住友ベークライト株式会社 , 桂山悟
发明人：桂山悟
IPC分类号： H01L21/60
CPC分类号： H01L24/27 , C09D163/00 , H01L21/563 , H01L23/293 , H01L23/49816 , H01L24/13 , H01L24/29 , H01L24/743 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/16225 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/29388 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/743 , H01L2224/75 , H01L2224/75301 , H01L2224/81191 , H01L2224/81192 , H01L2224/81193 , H01L2224/81211 , H01L2224/81801 , H01L2224/83191 , H01L2224/83192 , H01L2224/83855 , H01L2224/83862 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/0103 , H01L2924/01033 , H01L2924/01043 , H01L2924/0105 , H01L2924/01056 , H01L2924/01059 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/15311 , H01L2924/181 , H01L2924/3511 , H05K1/0271 , H05K1/0373 , H05K2201/0209 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2924/05341 , H01L2924/05432 , H01L2924/05442 , H01L2924/05032 , H01L2924/0503 , H01L2924/05042 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要：　本発明の半導体装置の製造方法は、基板または半導体素子の少なくとも一方に、フラックス活性を有するペースト状の熱硬化性樹脂組成物を塗布する塗布工程と、上記基板と上記半導体素子とを上記ペースト状の熱硬化性樹脂組成物を介して電気的に接合する接合工程と、上記ペースト状の熱硬化性樹脂組成物を加熱して硬化する硬化工程と、上記硬化工程後に、１０［℃／ｈｏｕｒ］以上、５０［℃／ｈｏｕｒ］以下の冷却速度で冷却する冷却工程を有することを特徴とする。
摘要翻译：本发明提供一种半导体装置的制造方法，其中，所述方法包括涂布步骤，其中具有助焊剂活性的热固性树脂组合物的浆料涂覆在基板或半导体元件中的至少一个上，其中连接步骤基板和半导体元件通过热固化性树脂组合物的糊料进行电连接，固化步骤，其中加热和固化热固性树脂组合物的糊料;以及冷却步骤，其中在固化步骤后的冷却速度在10℃/小时至50℃/小时之间。

9. 发明申请

WO2009104383A1 液体材料の塗布方法、その装置およびそのプログラム审中-公开
标题翻译：液体材料的应用方法及其设备及其程序
公开(公告)号：WO2009104383A1
公开(公告)日：2009-08-27
申请号：PCT/JP2009/000649
申请日：2009-02-18
申请人：武蔵エンジニアリング株式会社 , 生島和正
发明人：生島和正
IPC分类号： B05D1/26 , B05C5/00 , B05C11/10 , B05D3/00
CPC分类号： B05B12/008 , B05B1/083 , H01L21/563 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/16225 , H01L2224/16238 , H01L2224/27312 , H01L2224/2919 , H01L2224/32052 , H01L2224/32225 , H01L2224/73204 , H01L2224/743 , H01L2224/83104 , H01L2224/83192 , H01L2224/92125 , H01L2924/00011 , H01L2924/00014 , H01L2924/12042 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要：課題：複雑なパラメータの計算が不要であり、吐出部の移動速度に影響を及ぼすことがない液体材料の塗布方法、その装置およびそのプログラムの提供。解決手段：ノズルとワークとを相対移動しながら液体材料をノズルから吐出し、ワークに対し規定した塗布量の液体材料を塗布する塗布方法において、吐出パルス信号および休止パルス信号を送信する回数を総パルス数として規定し、総パルス数のうち塗布量を達成するために必要な吐出パルス信号の数を規定し、残りを休止パルス信号として規定する初期パラメータ設定工程、予め設定した補正周期で、補正周期の時点におけるノズルからの吐出量を計測し、吐出量の補正量を算出する補正量算出工程、および、補正量算出工程で算出した補正量に基づき吐出パルス信号の数と休止パルス信号の数を調整する吐出量補正工程、とを含むことを特徴とする塗布方法、その装置並びにそのプログラム。
摘要翻译：提供了一种用于施加液体材料的方法，其中不需要计算复杂参数，并且不影响喷射部件的移动速度，其装置及其程序。一种涂布方法，其中，当喷嘴和工件相对于彼此移动并且工件涂覆有特定量的液体材料时，液体材料从喷嘴喷射，所述涂布方法包括以下步骤：初始参数指定喷出脉冲信号和暂停脉冲信号的发送次数的设定步骤作为总脉冲数，规定为了达到施加量而在总脉冲数之外所需的喷出脉冲信号的数量，余数被指定为暂停脉冲信号; 校正量计算步骤，其中在预设的校正周期中，测量在校正周期时从喷嘴的喷射量并计算校正喷射量; 以及喷射量校正步骤，其中基于在校正量计算步骤中计算的校正量来调整喷射脉冲信号的数量和暂停脉冲信号的数量。一种设备及其程序。

10. 发明申请

WO2006096639A2 SEMICONDUCTOR PACKAGE FABRICATION 审中-公开
标题翻译：半导体封装制造
公开(公告)号：WO2006096639A2
公开(公告)日：2006-09-14
申请号：PCT/US2006/007915
申请日：2006-03-06
申请人： INTERNATIONAL RECTIFIER CORPORATION , STANDING, Martin , PAVIER, Mark , CLARKE, Robert, J. , SAWLE, Andrew , MCCARTNEY, Kenneth
发明人： STANDING, Martin , PAVIER, Mark , CLARKE, Robert, J. , SAWLE, Andrew , MCCARTNEY, Kenneth
IPC分类号： H01L21/00
CPC分类号： H01L21/4825 , H01L21/4867 , H01L23/544 , H01L24/06 , H01L24/13 , H01L24/14 , H01L24/27 , H01L24/29 , H01L24/33 , H01L24/40 , H01L24/743 , H01L24/83 , H01L25/16 , H01L25/50 , H01L2223/54433 , H01L2223/54486 , H01L2224/0401 , H01L2224/05553 , H01L2224/05554 , H01L2224/0603 , H01L2224/13099 , H01L2224/16 , H01L2224/274 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/743 , H01L2224/83192 , H01L2224/83194 , H01L2224/838 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/1033 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13064 , H01L2924/13091 , H01L2924/14 , H01L2924/157 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H05K1/0266 , H05K3/1241 , H05K3/245 , H01L2924/00 , H01L2924/00014 , H01L2224/29099
摘要： A semiconductor package fabrication method in which drop on demand deposition of a drop on demand depositable material is used to prepare one component or a plurality of components of a semiconductor package or multi-chip module.
摘要翻译：一种半导体封装制造方法，其中使用按需存放材料的按需投入沉积来制备半导体封装或多芯片模块的一个组件或多个组件。

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