专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2015083160A3 PROCESS FOR CONTROLLING WETTABILITY FEATURES 审中-公开
标题翻译：控制湿度特性的方法
公开(公告)号：WO2015083160A3
公开(公告)日：2015-10-08
申请号：PCT/IL2014051048
申请日：2014-12-02
申请人： CLEARJET LTD
发明人： GROUCHKO MICHAEL , MAGDASSI SHLOMO
IPC分类号： C09D11/52 , C09D11/033 , C23C4/18 , C23C26/00 , H01G9/20 , H01H49/00 , H01L27/01 , H01L27/28 , H01L33/42 , H01L51/00 , H05K1/09 , H05K3/12 , H05K3/24 , H05K3/46
CPC分类号： H05K3/1208 , C09D11/10 , C09D11/322 , C09D11/36 , C09D11/52 , C23C24/085 , H01L51/0005 , H01L51/0007 , H05K1/092 , H05K1/095 , H05K1/097 , H05K1/16 , H05K3/105 , H05K3/12 , H05K3/125 , H05K3/1283 , H05K3/227 , H05K3/245 , H05K3/4685 , H05K2201/0257 , H05K2201/026 , H05K2201/0323 , H05K2201/0329 , H05K2201/0338 , H05K2201/035 , H05K2201/0391 , H05K2201/09272 , H05K2201/09281 , H05K2201/09681 , H05K2201/09736 , H05K2201/098 , H05K2201/10053 , H05K2201/10106 , H05K2201/10121 , H05K2201/10128 , H05K2201/10143 , H05K2201/10151 , H05K2201/10166 , H05K2201/10174 , H05K2203/013 , H05K2203/0545 , H05K2203/0783 , H05K2203/081 , H05K2203/092 , H05K2203/095 , H05K2203/1105 , H05K2203/111 , H05K2203/1173 , H05K2203/1476 , H05K2203/1492 , H05K2203/173 , Y02E10/542 , Y02E10/549
摘要： The invention provides a process of forming a continuous pattern on a surface composed of two or more surface regions, each of the regions being of a different surface energy, the process utilizing a novel ink formulation for printing on such multi-region surfaces.
摘要翻译：本发明提供了一种在由两个或更多个表面区域组成的表面上形成连续图案的方法，每个区域具有不同的表面能，该方法利用新的油墨配方在这种多区域表面上印刷。

2. 发明申请

WO2015083160A2 PROCESS FOR CONTROLLING WETTABILITY FEATURES 审中-公开
标题翻译：控制可湿性特征的方法
公开(公告)号：WO2015083160A2
公开(公告)日：2015-06-11
申请号：PCT/IL2014/051048
申请日：2014-12-02
申请人： CLEARJET LTD
发明人： GROUCHKO, Michael , MAGDASSI, Shlomo
IPC分类号： C09D11/52
CPC分类号： H05K3/1208 , C09D11/10 , C09D11/322 , C09D11/36 , C09D11/52 , C23C24/085 , H01L51/0005 , H01L51/0007 , H05K1/092 , H05K1/095 , H05K1/097 , H05K1/16 , H05K3/105 , H05K3/12 , H05K3/125 , H05K3/1283 , H05K3/227 , H05K3/245 , H05K3/4685 , H05K2201/0257 , H05K2201/026 , H05K2201/0323 , H05K2201/0329 , H05K2201/0338 , H05K2201/035 , H05K2201/0391 , H05K2201/09272 , H05K2201/09281 , H05K2201/09681 , H05K2201/09736 , H05K2201/098 , H05K2201/10053 , H05K2201/10106 , H05K2201/10121 , H05K2201/10128 , H05K2201/10143 , H05K2201/10151 , H05K2201/10166 , H05K2201/10174 , H05K2203/013 , H05K2203/0545 , H05K2203/0783 , H05K2203/081 , H05K2203/092 , H05K2203/095 , H05K2203/1105 , H05K2203/111 , H05K2203/1173 , H05K2203/1476 , H05K2203/1492 , H05K2203/173 , Y02E10/542 , Y02E10/549
摘要： The invention provides a process of forming a continuous pattern on a surface composed of two or more surface regions, each of the regions being of a different surface energy, the process utilizing a novel ink formulation for printing on such multi-region surfaces.
摘要翻译：本发明提供了在由两个或更多个表面区域组成的表面上形成连续图案的过程，每个区域具有不同的表面能量，该过程利用新型油墨配方用于印刷这样的多区域表面。

3. 发明申请

WO2015045348A1 METHOD FOR FORMING A PATTERNED FILM, METHOD FOR MANUFACTURING OPTICAL COMPONENT, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT 审中-公开
标题翻译：形成图案薄膜的方法，制造光学部件的方法，制造电路板的方法和制造电子部件的方法
公开(公告)号：WO2015045348A1
公开(公告)日：2015-04-02
申请号：PCT/JP2014/004839
申请日：2014-09-22
申请人： CANON KABUSHIKI KAISHA
发明人： ITO, Toshiki , ISHIDA, Shingo , KAWASAKI, Youji , SAKAI, Keita
IPC分类号： H01L21/027 , B29C59/02
CPC分类号： H05K3/245 , G03F7/0002 , G03F7/027 , G03F7/038 , H01L21/0274
摘要： A method is provided which allows the alignment marks of a mold and a substrate to be accurately and simply detected, and accordingly provides a method for forming a patterned film with a high throughput, and also provides a method for manufacturing an optical component, a method for manufacturing a circuit board, and a method for manufacturing an electronic component. A patterned film is formed by photo-nanoimprinting. In the method, a gas satisfies the following Inequality (1): In the Inequality (1), n R represents the refractive index of a composition not containing a gas at the wavelength of light, n R' represents the refractive index of the photo-curable composition containing the gas at the wavelength of the light, and n M represents the refractive index of a mold at the wavelength of the light.
摘要翻译：提供一种允许准确且简单地检测模具和基板的对准标记的方法，因此提供了一种用于形成高生产率的图案化膜的方法，并且还提供了一种用于制造光学部件的方法，一种方法用于制造电路板的方法和电子部件的制造方法。通过光 - 纳米印刷法形成图案化膜。在该方法中，气体满足以下不等式（1）：在不等式（1）中，nR表示在光波长处不含气体的组合物的折射率，nR'表示光固化型在光的波长处含有气体的组成，nM表示在波长的模具的折射率。

4. 发明申请

WO2011026892A1 PRINTING METHOD FOR PRINTING ELECTRONIC DEVICES AND RELATIVE CONTROL APPARATUS 审中-公开
标题翻译：打印电子设备和相关控制装置的打印方法
公开(公告)号：WO2011026892A1
公开(公告)日：2011-03-10
申请号：PCT/EP2010/062861
申请日：2010-09-02
申请人： APPLIED MATERIALS, INC. , GALIAZZO, Marco , BACCINI, Andrea , CELLERE, Giorgio , DE SANTI, Luigi , PASQUALIN, Gianfranco , VERCESI, Tommaso
发明人： GALIAZZO, Marco , BACCINI, Andrea , CELLERE, Giorgio , DE SANTI, Luigi , PASQUALIN, Gianfranco , VERCESI, Tommaso
IPC分类号： H05K1/02 , H05K3/12 , H01L31/0224
CPC分类号： H05K3/12 , H01L31/022425 , H01L31/1876 , H05K1/0269 , H05K3/0008 , H05K3/245 , H05K2203/1476 , H05K2203/163 , Y02E10/50 , Y02P70/521
摘要： Printing method to print one or more print tracks on a print support, or substrate, comprising two or more printing steps in each of which, by means of printing means, a layer of material is deposited on the print support according to a predetermined print profile. In each printing step, subsequent to the first, each layer of material is deposited at least partially on top of the layer of material printed in the preceding printing step, so that each layer of printed material has an identical print profile or different with respect to at least a layer of material underneath so as to achieve an area of contact equal to or different from at least an area previously printed, the material deposited in each printing step being equal to or different from the material deposited in at least one of the prints underneath.
摘要翻译：打印方法，用于在包括两个或多个打印步骤的打印支持件或基底上打印一个或多个打印轨迹，每个打印步骤通过打印装置根据预定的打印配置文件沉积在打印支持体上。在每个印刷步骤中，在第一层之后，每层材料至少部分地沉积在印刷在先前印刷步骤中的材料层的顶部上，使得每一层印刷材料具有相同的印刷轮廓或相对于至少一层材料，以便实现等于或不同于至少预先打印的区域的接触区域，在每个印刷步骤中沉积的材料等于或不同于沉积在至少一个印刷品中的材料下。

5. 发明申请

WO2008036512A3 CONDUCTIVE PATTERN AND METHOD OF MAKING 审中-公开
标题翻译：导电图案及制作方法
公开(公告)号：WO2008036512A3
公开(公告)日：2008-07-24
申请号：PCT/US2007077835
申请日：2007-09-07
申请人： AVERY DENNISON CORP , COLEMAN JAMES P , EDWARDS DAVID N , FORSTER IAN J , IYER PRADEEP S , LICON MARK A
发明人： COLEMAN JAMES P , EDWARDS DAVID N , FORSTER IAN J , IYER PRADEEP S , LICON MARK A
IPC分类号： G06K19/077
CPC分类号： G06K19/0776 , G06K19/07718 , G06K19/07749 , G06K19/07752 , G06K19/07779 , G06K19/07783 , H05K3/00 , H05K3/205 , H05K3/245 , H05K3/386 , H05K2203/0117 , Y10T29/49016 , Y10T29/49018 , Y10T29/4902 , Y10T29/49117 , Y10T29/49155 , Y10T29/49224
摘要： A method of making an RFID device includes printing graphics on a front surface of a dielectric substrate, forming a conductive pattern on a conductive substrate, and after the printing, adhesively transferring the conductive pattern to a back surface of the dielectric substrate. An RFID device includes a dielectric layer, a conductive pattern antenna, a chip operatively coupled to the antenna, and an adhesive on the substrate. The adhesive both attaches the antenna to the dielectric layer, and is configured for attaching the RFID device to an object that is not part of the RFID device.
摘要翻译：制造RFID装置的方法包括在电介质基板的前表面上印刷图形，在导电基板上形成导电图案，并且在印刷之后，将导电图案粘合地转印到电介质基板的背面。 RFID器件包括电介质层，导电图案天线，可操作地耦合到天线的芯片以及衬底上的粘合剂。粘合剂将天线连接到电介质层，并且被配置为将RFID装置附接到不是RFID装置的一部分的物体。

6. 发明申请

WO2008036512A2 CONDUCTIVE PATTERN AND METHOD OF MAKING 审中-公开
标题翻译：导电模式和制造方法
公开(公告)号：WO2008036512A2
公开(公告)日：2008-03-27
申请号：PCT/US2007/077835
申请日：2007-09-07
申请人： AVERY DENNISON CORPORATION , COLEMAN, James, P. , EDWARDS, David, N. , FORSTER, Ian, J. , IYER, Pradeep, S. , LICON, Mark, A.
发明人： COLEMAN, James, P. , EDWARDS, David, N. , FORSTER, Ian, J. , IYER, Pradeep, S. , LICON, Mark, A.
IPC分类号： G06K19/077
CPC分类号： G06K19/0776 , G06K19/07718 , G06K19/07749 , G06K19/07752 , G06K19/07779 , G06K19/07783 , H05K3/00 , H05K3/205 , H05K3/245 , H05K3/386 , H05K2203/0117 , Y10T29/49016 , Y10T29/49018 , Y10T29/4902 , Y10T29/49117 , Y10T29/49155 , Y10T29/49224
摘要： A method of making an RFID device includes printing graphics on a front surface of a dielectric substrate, forming a conductive pattern on a conductive substrate, and after the printing, adhesively transferring the conductive pattern to a back surface of the dielectric substrate. An RFID device includes a dielectric layer, a conductive pattern antenna, a chip operatively coupled to the antenna, and an adhesive on the substrate. The adhesive both attaches the antenna to the dielectric layer, and is configured for attaching the RFID device to an object that is not part of the RFID device.
摘要翻译：制造RFID器件的方法包括：在电介质基板的前表面上印刷图形，在导电基板上形成导电图案，并且在印刷之后，将导电图案粘附转移到背表面的介电基板。 RFID设备包括介电层，导电图案天线，可操作地耦合到天线的芯片以及衬底上的粘合剂。粘合剂都将天线连接到介电层，并被配置为将RFID设备附着到不属于RFID设备一部分的物体。

7. 发明申请

WO2005087497A2 3D-INKJET-STRUKTURIERUNG VON HOCHTOPOGRAFISCHEN OBERFLÄCHEN 审中-公开
标题翻译：三维喷墨结构HOCHTOPOGRAFISCHEN SURFACES
公开(公告)号：WO2005087497A2
公开(公告)日：2005-09-22
申请号：PCT/EP2005/051053
申请日：2005-03-09
申请人： SIEMENS AKTIENGESELLSCHAFT , KASPER, Michael , REBHAN, Matthias , WEIDNER, Karl , WEINKE, Robert
发明人： KASPER, Michael , REBHAN, Matthias , WEIDNER, Karl , WEINKE, Robert
IPC分类号： B41M
CPC分类号： H01L51/0005 , B41F17/24 , H01L51/0016 , H05K1/0284 , H05K3/0079 , H05K3/108 , H05K3/125 , H05K3/245 , H05K2201/09036 , H05K2203/013 , H05K2203/1476
摘要： Die hochtopografische Oberfläche eines elektronischen Bauteils wird in einem Tintenstrahl-Druckverfahren mit einer Schicht versehen. Dabei werden einige Bereiche verstärkt bedruckt.
摘要翻译：的电子部件的hochtopografische表面与层的喷墨印刷过程中提供的。做一些区域印刷加强。

8. 发明申请

WO02096168A2 METHOD FOR THE MANUFACTURE OF A PRINTED CIRCUIT AND PLANAR ANTENNA MANUFACTURED WITH THIS PRINTED CIRCUIT 审中-公开
标题翻译：用这种印刷电路制造的印刷电路和平面天线的制造方法
公开(公告)号：WO02096168A2
公开(公告)日：2002-11-28
申请号：PCT/EP0206921
申请日：2002-05-23
申请人： FRAMATOME CONNECTORS INC , MATHIEU CHRISTOPHE
发明人： MATHIEU CHRISTOPHE
IPC分类号： G06K19/07 , G06K19/077 , H05K1/09 , H05K1/16 , H05K3/06 , H05K3/12 , H05K3/24 , H05K3/42
CPC分类号： H05K3/246 , G06K19/07779 , G06K19/07783 , H05K1/095 , H05K1/165 , H05K3/1275 , H05K3/245 , H05K2201/0347 , H05K2203/0113 , H05K2203/0143 , H05K2203/0534 , H05K2203/1545 , H05K2203/1572
摘要： In a method for the manufacture of a printed circuit on a dielectric carrier (2), in a first step a circuit pattern (1) is applied with an electrically conductive ink and, in a second step, the circuit model is plated, the electrically conductive ink being applied by means of a method of gravure printing and the plating being done by electrolytic or chemical means.
摘要翻译：在用于在电介质载体（2）上制造印刷电路的方法中，在第一步骤中，对电路图案（1）施加导电油墨，并且在第二步中，电路模型被电镀，电通过凹版印刷的方法施加导电油墨，并且通过电解或化学方法进行电镀。

9. 发明申请

WO02035289A3 METHOD AND MATERIALS FOR PRINTING PARTICLE-ENHANCED ELECTRICAL CONTACTS 审中-公开
标题翻译：打印颗粒增强电气接触的方法和材料
公开(公告)号：WO02035289A3
公开(公告)日：2002-07-04
申请号：PCT/US2001/049997
申请日：2001-10-24
IPC分类号： H01B1/16 , H01B1/22 , H01L21/48 , H01L21/60 , H01L23/485 , H01L23/498 , H05K1/09 , H05K3/24 , H05K3/32 , H05K3/40 , B23K31/00 , C22C24/00
CPC分类号： H01L24/83 , H01B1/16 , H01B1/22 , H01L21/4853 , H01L23/49883 , H01L24/11 , H01L24/13 , H01L24/29 , H01L2224/11505 , H01L2224/13099 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29305 , H01L2224/29309 , H01L2224/29311 , H01L2224/29313 , H01L2224/29323 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29369 , H01L2224/29411 , H01L2224/29444 , H01L2224/29455 , H01L2224/29464 , H01L2224/29469 , H01L2224/8319 , H01L2224/838 , H01L2924/0001 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01037 , H01L2924/01038 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01055 , H01L2924/01056 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/15747 , H05K1/095 , H05K3/245 , H05K3/247 , H05K3/325 , H05K3/4007 , H05K2201/023 , H05K2201/035 , H05K2201/0367 , H01L2924/00 , H01L2924/00014 , H01L2924/01028 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： The disclosed invention relates to materials and processes for creating particle-enhanced bumps on electrical contact surfaces through stencil or screen printing processes. The materials are mixtures of conductive ink, conductive paste, or conductive adhesive and conductive hard particles (104). The process involves depositing the mixture (108) onto electrical contact surfaces by stencil printing, screen printing, or other dispensing techniques (110). In another embodiment, the ink, paste, or adhesive deposit. Once cured (114), the deposition provides a hard, electrical contact bump on the contact surface with a rough, conductive, sandpaper-like surface that can be easily connected to an opposing contact surface without any further surface preparation of either surface.
摘要翻译：所公开的发明涉及通过模板或丝网印刷工艺在电接触表面上产生颗粒增强的凸块的材料和工艺。这些材料是导电油墨，导电浆料或导电粘合剂和导电硬颗粒（104）的混合物。该方法包括通过模板印刷，丝网印刷或其它分配技术（110）将混合物（108）沉积到电接触表面上。在另一个实施方案中，油墨，糊剂或粘合剂沉积物。一旦固化（114），沉积在接触表面上形成硬的电接触凸块，其具有粗糙的，导电的砂纸状表面，其可以容易地连接到相对的接触表面，而无需任何表面的任何进一步的表面制备。

10. 发明申请

WO01032964A1 AQUEOUS DISPERSION FOR FORMING CONDUCTIVE LAYER, CONDUCTIVE LAYER, ELECTRONIC COMPONENT, CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME, AND MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：用于形成导电层，导电层，电子部件，电路板及其制造方法的水性分散体和多层布线板及其制造方法
公开(公告)号：WO01032964A1
公开(公告)日：2001-05-10
申请号：PCT/JP2000/007683
申请日：2000-11-01
IPC分类号： C25D9/00 , C25D13/00 , H05K1/09 , H05K3/24 , H05K3/40 , H05K3/46 , C01B13/14
CPC分类号： C25D9/00 , C25D13/00 , H05K1/095 , H05K3/06 , H05K3/245 , H05K3/4069 , H05K3/4602 , H05K3/4664 , H05K2201/0355 , H05K2201/0394 , H05K2203/135 , H05K2203/1461
摘要： An aqueous dispersion of the invention in which conductive particles and organic particles are dispersed in an aqueous medium is used for forming a conductive layer having a volume resistivity of, for example, 10 OMEGA =.cm or less by electrodeposition. A circuit board of the invention comprises an insulating layer and a conductive layer including a through conductive part extending through the conductive layer and is manufactured preferably by a method of the invention. The method comprises the steps of closing one mouth of a through hole made in the insulating layer with a piece of conductive foil and electrodepositing a conductive layer using a dispersion of the invention as the electrodeposition liquid and the conductive foil as one electrode. A multilayer wiring board of the invention comprises a core wiring sheet having sheet wiring layers connected to each other and formed on both sides of the sheet, an insulating layer formed on at least one of the sides of the sheet, a wiring layer formed thereon, and an interlayer short-circuiting part electrically connecting the wiring layer to the sheet wiring layer and extending through the insulating layer. The interlayer short-circuiting part is a conductor formed by electrodeposition using the dispersion as the electrolyte. Since the conductive layer or conductor is formed by electrodeposition, the productivity and connection reliability are high.
摘要翻译：将导电粒子和有机粒子分散在水性介质中的本发明的水性分散体用于通过电沉积形成体积电阻率例如为10 -4Ω·cm -1以下的导电层。本发明的电路板包括绝缘层和导电层，导电层包括延伸穿过导电层的贯通导电部分，并且优选地通过本发明的方法制造。该方法包括以一片导电箔封闭在绝缘层中形成的通孔的一个口，并使用本发明的分散体作为电沉积液和导电箔作为一个电极来电沉积导电层的步骤。本发明的多层布线基板包括具有彼此连接并形成在片材的两面上的片状布线层的芯布线片，形成在片材的至少一个侧面上的绝缘层，形成在其上的布线层，以及将所述布线层与所述片状布线层电连接并延伸穿过所述绝缘层的层间短路部。层间短路部分是通过使用分散体作为电解质的电沉积形成的导体。由于通过电沉积形成导电层或导体，因此生产率和连接可靠性高。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式