专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2002103788A1 HIGH VOLTAGE SEMICONDUCTOR DEVICE HOUSING WITH INCREASED CLEARANCE BETWEEN HOUSING CAN AND DIE FOR IMPROVED FLUX FLUSHING 审中-公开
标题翻译：高电压半导体器件外壳在外壳和外壳之间具有增加的间隙，用于改进的流量冲洗
公开(公告)号：WO2002103788A1
公开(公告)日：2002-12-27
申请号：PCT/US2002/019109
申请日：2002-06-14
申请人： INTERNATIONAL RECTIFIER CORPORATION
发明人： STANDING, Martin
IPC分类号： H01L23/48
CPC分类号： H01L23/492 , H01L23/04 , H01L24/37 , H01L24/40 , H01L2224/32245 , H01L2224/371 , H01L2224/37147 , H01L2224/40225 , H01L2224/73153 , H01L2224/84801 , H01L2224/8485 , H01L2924/01004 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01078 , H01L2924/10253 , H01L2924/13091 , H01L2924/16152 , H01L2924/1616 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor device is shown and described which includes a metal can that receives a semiconductor die in an interior thereof. The metal can has a recess formed on a top portion thereof. The recess provides rigidity to the top portion of the metal can which allows the wall of the can to be spaced farther apart from the die, thereby providing a much larger open channel which allows for the easier cleaning of flux residue after soldering.
摘要翻译：示出并描述了包括在其内部接收半导体管芯的金属罐的半导体器件。金属罐的顶部形成有凹部。凹槽为金属罐的顶部提供刚性，这允许罐的壁与模具间隔更远，从而提供更大的开放通道，其允许在焊接之后更容易地清洁焊剂残留物。

2. 发明申请

WO2007028136A2 PROTECTIVE BARRIER LAYER FOR SEMICONDUCTOR DEVICE ELECTRODES 审中-公开
标题翻译：用于半导体器件电极的保护栅层
公开(公告)号：WO2007028136A2
公开(公告)日：2007-03-08
申请号：PCT/US2006/034448
申请日：2006-09-05
申请人： INTERNATIONAL RECTIFIER CORPORATION , CARROLL, Martin , JONES, David P. , SAWLE, Andrew N. , STANDING, Martin
发明人： CARROLL, Martin , JONES, David P. , SAWLE, Andrew N. , STANDING, Martin
IPC分类号： H01L23/52
CPC分类号： H01L23/485 , H01L21/76846 , H01L21/76852 , H01L21/76865 , H01L21/76897 , H01L23/3157 , H01L24/03 , H01L24/11 , H01L24/13 , H01L2224/0401 , H01L2224/05022 , H01L2224/05557 , H01L2224/05558 , H01L2224/0558 , H01L2224/05624 , H01L2224/05639 , H01L2224/114 , H01L2224/116 , H01L2224/13006 , H01L2224/13021 , H01L2224/85424 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01072 , H01L2924/01074 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/1306 , H01L2924/13091 , H01L2924/3025 , H01L2224/13099 , H01L2224/45099 , H01L2924/00
摘要： A semiconductor device includes a die with at least one electrode on a surface thereof, at least one solderable contact formed on the electrode, and a passivation layer formed over the electrode and including an opening that exposes the solderable contact. The passivation layer opening may be wider than the solderable contact such that a gap extends between the contact and the passivation layer. The device also includes a barrier layer disposed on the top surface of the electrode, and along the underside of the solderable contact and across the gap. The barrier layer may also extend under the passivation layer and may cover the entire top surface of the electrode. The barrier layer may also extend along the sidewalls of the electrode. The barrier layer may include a titanium layer or a titanium layer and nickel layer. The barrier layer protects the electrode and underlying die from acidic fluxes found in lead-free solders.
摘要翻译：半导体器件包括具有在其表面上的至少一个电极的模具，形成在电极上的至少一个可焊接触头，以及形成在电极上并包括暴露可焊接触点的开口的钝化层。钝化层开口可以比可焊接触点宽，使得间隙在触点和钝化层之间延伸。该装置还包括设置在电极的顶表面上并沿着可焊接触点的下侧并跨越间隙的阻挡层。阻挡层还可以在钝化层下方延伸并且可以覆盖电极的整个顶表面。阻挡层也可以沿着电极的侧壁延伸。阻挡层可以包括钛层或钛层和镍层。阻挡层保护电极和底层管芯免受在无铅焊料中发现的酸性焊剂的影响。

3. 发明申请

WO2006031886A3 POWER SEMICONDUCTOR PACKAGE 审中-公开
公开(公告)号：WO2006031886A3
公开(公告)日：2006-03-23
申请号：PCT/US2005/032743
申请日：2005-09-13
申请人： INTERNATIONAL RECTIFIER CORPORATION , STANDING, Martin , CLARKE, Robert, J.
发明人： STANDING, Martin , CLARKE, Robert, J.
IPC分类号： H01L23/48 , H01L23/52 , H01L23/34
摘要： A power semiconductor package that includes a semiconductor die having at least two power electrodes and a conductive clip electrically and mechanically coupled to each power electrode.

4. 发明申请

WO2007109133A3 IMPROVED CHIP-SCALE PACKAGE 审中-公开
公开(公告)号：WO2007109133A3
公开(公告)日：2007-09-27
申请号：PCT/US2007/006633
申请日：2007-03-16
申请人： INTERNATIONAL RECTIFIER CORPORATION , STANDING, Martin
发明人： STANDING, Martin
IPC分类号： H01L23/02
摘要： A power semiconductor package that includes a die having one electrode thereof electrically and mechanically attached to a web portion of a conductive clip.

5. 发明申请

WO2007058854A2 SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRIBUTED PADS 审中-公开
标题翻译：半导体封装，包括具有重新分配的焊盘的半导体器件
公开(公告)号：WO2007058854A2
公开(公告)日：2007-05-24
申请号：PCT/US2006/043520
申请日：2006-11-10
申请人： INTERNATIONAL RECTIFIER CORPORATION , PAVIER, Mark , SAWLE, Andrew M. , STANDING, Martin
发明人： PAVIER, Mark , SAWLE, Andrew M. , STANDING, Martin
IPC分类号： H01L23/48
CPC分类号： H01L23/043 , H01L21/56 , H01L23/142 , H01L23/3128 , H01L23/3171 , H01L23/3675 , H01L23/3736 , H01L23/4334 , H01L23/492 , H01L23/49562 , H01L23/49582 , H01L23/49838 , H01L23/5389 , H01L24/03 , H01L24/05 , H01L24/19 , H01L24/24 , H01L24/32 , H01L24/37 , H01L24/83 , H01L24/97 , H01L25/07 , H01L2224/0346 , H01L2224/0508 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/24226 , H01L2224/24227 , H01L2224/2919 , H01L2224/32245 , H01L2224/32257 , H01L2224/33181 , H01L2224/37147 , H01L2224/73153 , H01L2224/73267 , H01L2224/83815 , H01L2224/92244 , H01L2224/97 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0106 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/13055 , H01L2924/13091 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15738 , H01L2924/15747 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/40252 , H01L2924/403 , H01L2924/40407 , H01L2224/82
摘要： A semiconductor package that includes a semiconductor die, an insulation around the die, and a conforming conductive pad coupled to an electrode of the die.
摘要翻译：一种半导体封装，其包括半导体管芯，管芯周围的绝缘体，以及耦合到管芯的电极的一致的导电焊盘。

6. 发明申请

WO2007050774A2 UNIVERSAL PAD ARRANGEMENT FOR SURFACE MOUNTED SEMICONDUCTOR DEVICES 审中-公开
标题翻译：表面安装半导体器件的通用焊盘布置
公开(公告)号：WO2007050774A2
公开(公告)日：2007-05-03
申请号：PCT/US2006/041813
申请日：2006-10-24
申请人： INTERNATIONAL RECTIFIER CORPORATION , STANDING, Martin , SAWLE, Andrew N.
发明人： STANDING, Martin , SAWLE, Andrew N.
IPC分类号： H02B1/00
CPC分类号： H05K1/111 , H01L2924/0002 , H05K1/0295 , H05K2201/09954 , H05K2201/10166 , Y02P70/611 , H01L2924/00
摘要： An apparatus for coupling a plurality of surface mounted semiconductor device packages to a circuit board is provided. Each package including a semiconductor device die and a metal clip including a flat web portion having a bottom surface and at least one peripheral rim portion extending from an edge of said flat web portion, said bottom surface having solderable planar metal electrodes or pads on its bottom surface, the contact pads being formed in plurality of layouts having one or more columns and one or more rows. The apparatus including a circuit board contact pattern including one or more columns and one or more rows of contacts, a number of rows being equal to a largest number of contact pad rows in the plurality of contact pad layouts, a number of columns being equal to a largest number of contact pad columns in the plurality of contact pad layouts. The circuit board contact pattern is usable by all of the plurality of the contact pad layouts of the plurality of semiconductor device packages.
摘要翻译：提供了一种用于将多个表面安装的半导体器件封装耦合到电路板的装置。每个包装包括半导体器件芯片和金属夹子，其包括具有底表面的平坦腹板部分和从所述扁平腹板部分的边缘延伸的至少一个周边边缘部分，所述底部表面具有可焊接的平面金属电极或其底部的焊盘表面，接触垫形成为具有一个或多个列和一行或多行的多个布局。该装置包括包括一个或多个列和一行或多行触点的电路板触点图案，多个行等于多个接触焊盘布局中的最大数量的接触焊盘行，多个列等于多个接触垫布局中的最大数量的接触垫列。电路板接触图案可由多个半导体器件封装的多个接触焊盘布局中的全部可用。

7. 发明申请

WO2002080261A1 WAFER LEVEL INSULATION UNDERFILL FOR DIE ATTACH 审中-公开
公开(公告)号：WO2002080261A1
公开(公告)日：2002-10-10
申请号：PCT/US2002/010068
申请日：2002-03-27
申请人： INTERNATIONAL RECTIFIER CORPORATION
发明人： STANDING, Martin
IPC分类号： H01L21/44
CPC分类号： H01L24/27 , H01L21/563 , H01L24/29 , H01L2224/16 , H01L2224/16225 , H01L2224/274 , H01L2224/29078 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83191 , H01L2924/00014 , H01L2924/01006 , H01L2924/01057 , H01L2924/01058 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/10253 , H01L2924/13091 , H05K3/305 , H05K3/3436 , H01L2924/00 , H01L2224/0401
摘要： A process for forming an insulation underfill for soldering semiconductor die solder balls (12) by a solder paste on conductive traces on a support surface. The process comprises the screen printing or deposition from a syringe (60) of thermoplastic or thermosetting epoxy columns (14) between the solder balls, to a height equal to the standoff height of the die from the support surface. The assembly is first heated to a temperature at which the plastic becomes semifluid and before the area over which it will spread becomes contaminated with flux residue; and is next heated to the solder paste reflow temperature.
摘要翻译：用于通过焊膏在支撑表面上的导电迹线上形成绝缘底部填充物以焊接半导体焊料球（12）的工艺。该方法包括从焊料球之间的热塑性或热固性环氧树脂柱（14）的注射器（60）的丝网印刷或沉积到与模具从支撑表面的间隔高度相等的高度。首先将组件加热到塑料变成半流体的温度，并且在其将被扩散的区域被熔剂残渣污染之前; 并接着加热到焊膏回流温度。

8. 发明申请

WO2007050774A3 UNIVERSAL PAD ARRANGEMENT FOR SURFACE MOUNTED SEMICONDUCTOR DEVICES 审中-公开
公开(公告)号：WO2007050774A3
公开(公告)日：2007-05-03
申请号：PCT/US2006/041813
申请日：2006-10-24
申请人： INTERNATIONAL RECTIFIER CORPORATION , STANDING, Martin , SAWLE, Andrew N.
发明人： STANDING, Martin , SAWLE, Andrew N.
IPC分类号： H01L23/495
摘要： An apparatus for coupling a plurality of surface mounted semiconductor device packages to a circuit board is provided. Each package including a semiconductor device die and a metal clip including a flat web portion having a bottom surface and at least one peripheral rim portion extending from an edge of said flat web portion, said bottom surface having solderable planar metal electrodes or pads on its bottom surface, the contact pads being formed in plurality of layouts having one or more columns and one or more rows. The apparatus including a circuit board contact pattern including one or more columns and one or more rows of contacts, a number of rows being equal to a largest number of contact pad rows in the plurality of contact pad layouts, a number of columns being equal to a largest number of contact pad columns in the plurality of contact pad layouts. The circuit board contact pattern is usable by all of the plurality of the contact pad layouts of the plurality of semiconductor device packages.

9. 发明申请

WO2006116162A2 SEMICONDUCTOR PACKAGE 审中-公开
标题翻译：半导体封装
公开(公告)号：WO2006116162A2
公开(公告)日：2006-11-02
申请号：PCT/US2006/015205
申请日：2006-04-21
申请人： INTERNATIONAL RECTIFIER CORPORATION , STANDING, Martin
发明人： STANDING, Martin
IPC分类号： H01L23/34
CPC分类号： H01L24/40 , H01L23/04 , H01L23/06 , H01L23/13 , H01L23/14 , H01L23/492 , H01L23/4924 , H01L23/49548 , H01L23/49558 , H01L23/49582 , H01L23/4985 , H01L24/24 , H01L24/34 , H01L24/36 , H01L24/37 , H01L24/82 , H01L24/83 , H01L24/84 , H01L25/165 , H01L2224/24227 , H01L2224/32245 , H01L2224/37012 , H01L2224/37147 , H01L2224/37639 , H01L2224/37644 , H01L2224/40225 , H01L2224/73153 , H01L2224/73253 , H01L2224/76155 , H01L2224/82102 , H01L2224/8385 , H01L2224/84801 , H01L2224/8485 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/05432 , H01L2924/0635 , H01L2924/0665 , H01L2924/07025 , H01L2924/0715 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49147 , Y10T29/49155 , Y10T29/49174 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor package that includes a conductive can, a power semiconductor device electrically and mechanically attached to the inside surface of the can, and an IC semiconductor device copackaged with the power semiconductor device inside the can.
摘要翻译：包括导电罐的半导体封装，电气和机械地附接到罐的内表面的功率半导体器件，以及与罐内的功率半导体器件复合封装的IC半导体器件。

10. 发明申请

WO2006096639A2 SEMICONDUCTOR PACKAGE FABRICATION 审中-公开
标题翻译：半导体封装制造
公开(公告)号：WO2006096639A2
公开(公告)日：2006-09-14
申请号：PCT/US2006/007915
申请日：2006-03-06
申请人： INTERNATIONAL RECTIFIER CORPORATION , STANDING, Martin , PAVIER, Mark , CLARKE, Robert, J. , SAWLE, Andrew , MCCARTNEY, Kenneth
发明人： STANDING, Martin , PAVIER, Mark , CLARKE, Robert, J. , SAWLE, Andrew , MCCARTNEY, Kenneth
IPC分类号： H01L21/00
CPC分类号： H01L21/4825 , H01L21/4867 , H01L23/544 , H01L24/06 , H01L24/13 , H01L24/14 , H01L24/27 , H01L24/29 , H01L24/33 , H01L24/40 , H01L24/743 , H01L24/83 , H01L25/16 , H01L25/50 , H01L2223/54433 , H01L2223/54486 , H01L2224/0401 , H01L2224/05553 , H01L2224/05554 , H01L2224/0603 , H01L2224/13099 , H01L2224/16 , H01L2224/274 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/743 , H01L2224/83192 , H01L2224/83194 , H01L2224/838 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/1033 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13064 , H01L2924/13091 , H01L2924/14 , H01L2924/157 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H05K1/0266 , H05K3/1241 , H05K3/245 , H01L2924/00 , H01L2924/00014 , H01L2224/29099
摘要： A semiconductor package fabrication method in which drop on demand deposition of a drop on demand depositable material is used to prepare one component or a plurality of components of a semiconductor package or multi-chip module.
摘要翻译：一种半导体封装制造方法，其中使用按需存放材料的按需投入沉积来制备半导体封装或多芯片模块的一个组件或多个组件。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式