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1. 发明申请

WO2007058854A3 SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRIBUTED PADS 审中-公开
标题翻译：半导体封装，包括具有重新分配的焊盘的半导体器件
公开(公告)号：WO2007058854A3
公开(公告)日：2009-05-07
申请号：PCT/US2006043520
申请日：2006-11-10
申请人： INT RECTIFIER CORP , PAVIER MARK , SAWLE ANDREW M , STANDING MARTIN
发明人： PAVIER MARK , SAWLE ANDREW M , STANDING MARTIN
IPC分类号： H01L23/495 , H01L23/053 , H01L23/12 , H01L23/22 , H01L23/24 , H01L23/28 , H01L23/29
CPC分类号： H01L23/043 , H01L21/56 , H01L23/142 , H01L23/3128 , H01L23/3171 , H01L23/3675 , H01L23/3736 , H01L23/4334 , H01L23/492 , H01L23/49562 , H01L23/49582 , H01L23/49838 , H01L23/5389 , H01L24/03 , H01L24/05 , H01L24/19 , H01L24/24 , H01L24/32 , H01L24/37 , H01L24/83 , H01L24/97 , H01L25/07 , H01L2224/0346 , H01L2224/0508 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/24226 , H01L2224/24227 , H01L2224/2919 , H01L2224/32245 , H01L2224/32257 , H01L2224/33181 , H01L2224/37147 , H01L2224/73153 , H01L2224/73267 , H01L2224/83815 , H01L2224/92244 , H01L2224/97 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0106 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/13055 , H01L2924/13091 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15738 , H01L2924/15747 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/40252 , H01L2924/403 , H01L2924/40407 , H01L2224/82
摘要： A semiconductor package that includes a semiconductor die, an insulation around the die, and a conforming conductive pad coupled to an electrode of the die.
摘要翻译：一种半导体封装，其包括半导体管芯，管芯周围的绝缘体，以及耦合到管芯的电极的一致的导电焊盘。

2. 发明申请

WO2005041266A2 SEMICONDUCTOR DEVICE PACKAGE UTILIZING PROUD INTERCONNECT MATERIAL 审中-公开
标题翻译：半导体器件封装利用PROUD INTERCONNECT材料
公开(公告)号：WO2005041266A2
公开(公告)日：2005-05-06
申请号：PCT/US2004035308
申请日：2004-10-25
申请人： INT RECTIFIER CORP , STANDING MARTIN
发明人： STANDING MARTIN
IPC分类号： H01L20060101 , H01L21/44 , H01L21/60 , H01L23/02 , H01L23/48 , H01L23/485 , H01L23/52 , H01L
CPC分类号： H01L24/13 , B23K35/0244 , B23K35/262 , B23K35/268 , B23K35/3006 , B23K35/302 , B23K35/3613 , H01L21/4867 , H01L21/56 , H01L23/04 , H01L23/13 , H01L23/492 , H01L23/49811 , H01L23/49827 , H01L23/49844 , H01L23/49883 , H01L23/5389 , H01L24/11 , H01L24/14 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/37 , H01L24/40 , H01L24/81 , H01L24/83 , H01L25/072 , H01L25/50 , H01L2224/05568 , H01L2224/05571 , H01L2224/05573 , H01L2224/1181 , H01L2224/13099 , H01L2224/13111 , H01L2224/1403 , H01L2224/16 , H01L2224/274 , H01L2224/291 , H01L2224/29101 , H01L2224/29111 , H01L2224/29116 , H01L2224/2919 , H01L2224/2929 , H01L2224/29311 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/29439 , H01L2224/29455 , H01L2224/29499 , H01L2224/33181 , H01L2224/371 , H01L2224/37147 , H01L2224/37599 , H01L2224/40225 , H01L2224/73153 , H01L2224/73253 , H01L2224/81191 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2224/83191 , H01L2224/83801 , H01L2224/8385 , H01L2224/83851 , H01L2224/84801 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/157 , H01L2924/1579 , H01L2924/16152 , H01L2924/00011 , H01L2924/00 , H01L2924/01083 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/81205 , H01L2224/83205 , H01L2224/05599
摘要： A semiconductor package which includes a conductive can, a semiconductor die received in the interior of the can and connected to an interior portion thereof at one of its sides, at least one interconnect structure formed on the other side of the semiconductor die, and a passivation layer disposed on the other side of the semiconductor die around the interconnect structure and extending at least to the can.
摘要翻译：一种半导体封装，其包括导电罐，半导体管芯容纳在罐的内部并连接到其一侧的内部，形成在半导体管芯的另一侧上的至少一个互连结构以及钝化层层，设置在半导体管芯的另一侧，并且至少延伸至罐。

3. 发明申请

WO2005119766A3 PREPARATION OF FRONT CONTACT FOR SURFACE MOUNTING 审中-公开
标题翻译：用于表面安装的前接触件的制备
公开(公告)号：WO2005119766A3
公开(公告)日：2007-04-19
申请号：PCT/US2005018932
申请日：2005-05-27
申请人： INT RECTIFIER CORP , STANDING MARTIN , SAWLE ANDREW , JONES DAVID P , CARROLL MARTIN , ELWIN MATTHEW
发明人： STANDING MARTIN , SAWLE ANDREW , JONES DAVID P , CARROLL MARTIN , ELWIN MATTHEW
IPC分类号： H01L23/02 , H01L23/48 , H01L23/485 , H01L23/492 , H01L23/52 , H01L29/40
CPC分类号： H01L24/10 , H01L23/3171 , H01L23/492 , H01L24/13 , H01L2224/05573 , H01L2224/05624 , H01L2224/13 , H01L2224/13099 , H01L2224/73153 , H01L2224/73253 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/1306 , H01L2924/13091 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor device which includes a power electrode (12) on a surface thereof, a solderable body (16) on the power electrode and a passivation body (18) spaced from but surrounding the solderable body.
摘要翻译：一种半导体器件，其包括在其表面上的功率电极（12），在所述电源电极上的可焊接体（16）和与所述可焊接体相隔开但包围的钝化体（18）。

4. 发明申请

WO2007109133B1 IMPROVED CHIP-SCALE PACKAGE 审中-公开
标题翻译：改进的芯片尺寸包装
公开(公告)号：WO2007109133B1
公开(公告)日：2008-07-31
申请号：PCT/US2007006633
申请日：2007-03-16
申请人： INT RECTIFIER CORP , STANDING MARTIN
发明人： STANDING MARTIN
IPC分类号： H01L23/02
CPC分类号： H01L23/13 , H01L23/492 , H01L24/37 , H01L24/40 , H01L2224/32245 , H01L2224/371 , H01L2224/37147 , H01L2224/3754 , H01L2224/40225 , H01L2224/73153 , H01L2224/73253 , H01L2224/83801 , H01L2224/84801 , H01L2224/8485 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01047 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/00 , H01L2924/00014
摘要： A power semiconductor package that includes a die having one electrode thereof electrically and mechanically attached to a web portion of a conductive clip.
摘要翻译：一种功率半导体封装，其包括具有一个电极的芯片，其电极和机械地附接到导电夹子的腹板部分。

5. 发明申请

WO2006096639A3 SEMICONDUCTOR PACKAGE FABRICATION 审中-公开
标题翻译：半导体封装制造
公开(公告)号：WO2006096639A3
公开(公告)日：2008-05-02
申请号：PCT/US2006007915
申请日：2006-03-06
申请人： INT RECTIFIER CORP , STANDING MARTIN , PAVIER MARK , CLARKE ROBERT J , SAWLE ANDREW , MCCARTNEY KENNETH
发明人： STANDING MARTIN , PAVIER MARK , CLARKE ROBERT J , SAWLE ANDREW , MCCARTNEY KENNETH
IPC分类号： H01L21/50 , H01L21/20 , H01L21/31
CPC分类号： H01L21/4825 , H01L21/4867 , H01L23/544 , H01L24/06 , H01L24/13 , H01L24/14 , H01L24/27 , H01L24/29 , H01L24/33 , H01L24/40 , H01L24/743 , H01L24/83 , H01L25/16 , H01L25/50 , H01L2223/54433 , H01L2223/54486 , H01L2224/0401 , H01L2224/05553 , H01L2224/05554 , H01L2224/0603 , H01L2224/13099 , H01L2224/16 , H01L2224/274 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/743 , H01L2224/83192 , H01L2224/83194 , H01L2224/838 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/1033 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13064 , H01L2924/13091 , H01L2924/14 , H01L2924/157 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H05K1/0266 , H05K3/1241 , H05K3/245 , H01L2924/00 , H01L2924/00014 , H01L2224/29099
摘要： A semiconductor package fabrication method in which drop on demand deposition of a drop on demand depositable material is used to prepare one component or a plurality of components of a semiconductor package (32) or multi-chip module
摘要翻译：一种半导体封装制造方法，其中使用按需存放材料的按需分散沉积来制备半导体封装（32）或多芯片模块（32）的一个部件或多个部件

6. 发明申请

WO2007050774B1 UNIVERSAL PAD ARRANGEMENT FOR SURFACE MOUNTED SEMICONDUCTOR DEVICES 审中-公开
标题翻译：表面安装半导体器件的通用焊盘排列
公开(公告)号：WO2007050774B1
公开(公告)日：2008-03-27
申请号：PCT/US2006041813
申请日：2006-10-24
申请人： INT RECTIFIER CORP , STANDING MARTIN , SAWLE ANDREW N
发明人： STANDING MARTIN , SAWLE ANDREW N
IPC分类号： H01L23/495
CPC分类号： H05K1/111 , H01L2924/0002 , H05K1/0295 , H05K2201/09954 , H05K2201/10166 , Y02P70/611 , H01L2924/00
摘要： An apparatus for coupling a plurality of surface mounted semiconductor device packages to a circuit board is provided. Each package including a semiconductor device die and a metal clip including a flat web portion having a bottom surface and at least one peripheral rim portion extending from an edge of said flat web portion, said bottom surface having solderable planar metal electrodes or pads on its bottom surface, the contact pads being formed in plurality of layouts having one or more columns and one or more rows. The apparatus including a circuit board contact pattern including one or more columns and one or more rows of contacts, a number of rows being equal to a largest number of contact pad rows in the plurality of contact pad layouts, a number of columns being equal to a largest number of contact pad columns in the plurality of contact pad layouts. The circuit board contact pattern is usable by all of the plurality of the contact pad layouts of the plurality of semiconductor device packages.
摘要翻译：提供了一种用于将多个表面安装的半导体器件封装耦合到电路板的装置。每个封装包括半导体器件管芯和金属夹，所述金属夹包括具有底表面和从所述平坦腹板部分的边缘延伸的至少一个外围边缘部分的平坦腹板部分，所述底表面在其底部具有可焊接的平面金属电极或焊盘表面，接触垫以具有一列或多列和一列或多列的多个布局形成。所述设备包括电路板接触图案，所述电路板接触图案包括一列或多列和一行或多行触点，行数等于所述多个接触焊盘布局中的最大数量的接触焊盘行，多个列等于多个接触焊盘布局中的最大数量的接触焊盘列。电路板接触图案可由多个半导体器件封装的所有多个接触焊盘布局使用。

7. 发明申请

WO2006031886A2 POWER SEMICONDUCTOR PACKAGE 审中-公开
标题翻译：功率半导体封装
公开(公告)号：WO2006031886A2
公开(公告)日：2006-03-23
申请号：PCT/US2005032743
申请日：2005-09-13
申请人： INT RECTIFIER CORP , STANDING MARTIN , CLARKE ROBERT J
发明人： STANDING MARTIN , CLARKE ROBERT J
IPC分类号： H01L23/02
CPC分类号： H01L24/33 , H01L23/296 , H01L23/3107 , H01L23/4824 , H01L23/4951 , H01L23/49562 , H01L24/81 , H01L24/83 , H01L24/97 , H01L29/2003 , H01L29/201 , H01L29/41725 , H01L29/4232 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/2929 , H01L2224/293 , H01L2224/29611 , H01L2224/29644 , H01L2224/2969 , H01L2224/81054 , H01L2224/8121 , H01L2224/81224 , H01L2224/81815 , H01L2224/83815 , H01L2224/8384 , H01L2224/83851 , H01L2924/00011 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0715 , H01L2924/1032 , H01L2924/12032 , H01L2924/12042 , H01L2924/12044 , H01L2924/1306 , H01L2924/13062 , H01L2924/13064 , H01L2924/13091 , H01L2924/181 , H01L2924/186 , H01L2924/30101 , H01L2924/00 , H01L2224/29075 , H01L2924/00014
摘要： A power semiconductor package that includes a semiconductor die having at least two power electrodes and a conductive clip electrically and mechanically coupled to each power electrode.
摘要翻译：一种功率半导体封装，其包括具有至少两个功率电极的半导体管芯以及电连接和机械连接到每个功率电极的导电夹。

8. 发明申请

WO2005041265A3 PASTE FOR FORMING AN INTERCONNECT AND INTERCONNECT FORMED FROM THE PASTE 审中-公开
标题翻译：用于形成从粘土形成的互连和互连的物质
公开(公告)号：WO2005041265A3
公开(公告)日：2005-10-06
申请号：PCT/US2004035307
申请日：2004-10-25
申请人： INT RECTIFIER CORP , STANDING MARTIN
发明人： STANDING MARTIN
IPC分类号： H01B1/02 , H01L20060101 , H01L23/48 , H01L23/532 , H01R12/04 , H05K3/34
CPC分类号： H01B1/02 , H01L2224/73153 , H01L2924/01057 , H01L2924/01079 , H01L2924/13055 , H01L2924/13091 , H05K3/3484 , H05K2201/0215 , H01L2924/00
摘要： A paste forming an interconnect includes a mixture of binder particles (18) filler particles (16) and flux materials, binder particles having a melting temperature that is lower than that of the filler particles, and the proportion of the binder particles and the filler particles being selected such when heat is applied to melt the binder particles the shape of the paste as deposited is substantially retained thereby allowing for the paste to be used for forming interconnect structures.
摘要翻译：形成互连的糊状物包括粘合剂颗粒（18），填料颗粒（16）和焊剂材料的混合物，熔融温度低于填料颗粒的熔融温度，粘合剂颗粒和填料颗粒的比例被选择使得当施加热量以熔化粘合剂颗粒时，沉积的糊料的形状基本保持，从而允许将糊料用于形成互连结构。

9. 发明申请

WO2007028136A3 PROTECTIVE BARRIER LAYER FOR SEMICONDUCTOR DEVICE ELECTRODES 审中-公开
标题翻译：用于半导体器件电极的保护栅层
公开(公告)号：WO2007028136A3
公开(公告)日：2009-04-16
申请号：PCT/US2006034448
申请日：2006-09-05
申请人： INT RECTIFIER CORP , CARROLL MARTIN , JONES DAVID P , SAWLE ANDREW N , STANDING MARTIN
发明人： CARROLL MARTIN , JONES DAVID P , SAWLE ANDREW N , STANDING MARTIN
IPC分类号： H01L21/44 , H01L23/48
CPC分类号： H01L23/485 , H01L21/76846 , H01L21/76852 , H01L21/76865 , H01L21/76897 , H01L23/3157 , H01L24/03 , H01L24/11 , H01L24/13 , H01L2224/0401 , H01L2224/05022 , H01L2224/05557 , H01L2224/05558 , H01L2224/0558 , H01L2224/05624 , H01L2224/05639 , H01L2224/114 , H01L2224/116 , H01L2224/13006 , H01L2224/13021 , H01L2224/85424 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01072 , H01L2924/01074 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/1306 , H01L2924/13091 , H01L2924/3025 , H01L2224/13099 , H01L2224/45099 , H01L2924/00
摘要： A semiconductor device includes a die with at least one electrode on a surface thereof, at least one solderable contact formed on the electrode, and a passivation layer formed over the electrode and including an opening that exposes the solderable contact. The passivation layer opening may be wider than the solderable contact such that a gap extends between the contact and the passivation layer. The device also includes a barrier layer disposed on the top surface of the electrode, and along the underside of the solderable contact and across the gap. The barrier layer may also extend under the passivation layer and may cover the entire top surface of the electrode. The barrier layer may also extend along the sidewalls of the electrode. The barrier layer may include a titanium layer or a titanium layer and nickel layer. The barrier layer protects the electrode and underlying die from acidic fluxes found in lead-free solders.
摘要翻译：半导体器件包括具有在其表面上的至少一个电极的模具，形成在电极上的至少一个可焊接触头，以及形成在电极上并包括暴露可焊接触点的开口的钝化层。钝化层开口可以比可焊接触点宽，使得间隙在触点和钝化层之间延伸。该装置还包括设置在电极的顶表面上并沿着可焊接触点的下侧并跨越间隙的阻挡层。阻挡层还可以在钝化层下方延伸并且可以覆盖电极的整个顶表面。阻挡层也可以沿着电极的侧壁延伸。阻挡层可以包括钛层或钛层和镍层。阻挡层保护电极和底层管芯免受在无铅焊料中发现的酸性焊剂的影响。

10. 发明申请

WO2006113932A3 CHIP-SCALE PACKAGE 审中-公开
标题翻译： CHIP-SCALE包装
公开(公告)号：WO2006113932A3
公开(公告)日：2007-11-01
申请号：PCT/US2006015330
申请日：2006-04-20
申请人： INT RECTIFIER CORP , STANDING MARTIN , CLARKE ROBERT J
发明人： STANDING MARTIN , CLARKE ROBERT J
IPC分类号： H01L23/02
CPC分类号： H01L21/50 , H01L23/10 , H01L23/492 , H01L24/33 , H01L24/83 , H01L2224/26175 , H01L2224/291 , H01L2224/2919 , H01L2224/32245 , H01L2224/73153 , H01L2224/73253 , H01L2224/83191 , H01L2224/83192 , H01L2224/83194 , H01L2224/83801 , H01L2224/83851 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/13055 , H01L2924/13091 , H01L2924/16152 , H01L2924/00
摘要： A method for manufacturing a semiconductor package that includes forming a frame inside a conductive can, the frame being unwettable by liquid solder.
摘要翻译：一种制造半导体封装的方法，包括在导电罐内部形成框架，所述框架由液体焊料不可控制。

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