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1. 发明申请

WO2014172621A9 CORNEAL TOPOGRAPHY MEASUREMENT AND ALIGNMENT OF CORNEAL SURGICAL PROCEDURES 审中-公开
标题翻译：角膜地形图的测量和角膜手术的调整
公开(公告)号：WO2014172621A9
公开(公告)日：2014-10-23
申请号：PCT/US2014/034628
申请日：2014-04-18
申请人： OPTIMEDICA CORPORATION , SCOTT, David, D. , GONZALEZ, Javier , DEWEY, David , BAREKET, Noah , SCHUELE, Georg
发明人： SCOTT, David, D. , GONZALEZ, Javier , DEWEY, David , BAREKET, Noah , SCHUELE, Georg
IPC分类号： A61F9/009 , A61B3/107
摘要： Methods and apparatus are configures to measure an eye without contacting the eye with a patient interface, and these measurements are used to determine alignment and placement of the incisions when the patient interface contacts the eye. The pre-contact locations of one or more structures of the eye can be used to determine corresponding post-contact locations of the one or more optical structures of the eye when the patient interface has contacted the eye, such that the laser incisions are placed at locations that promote normal vision of the eye. The incisions are positioned in relation to the pre-contact optical structures of the eye, such as an astigmatic treatment axis, nodal points of the eye, and visual axis of the eye.
摘要翻译：方法和设备被配置成在患者接口不接触眼睛的情况下测量眼睛，并且这些测量被用于确定当患者接口接触眼睛时切口的对准和放置。当患者接口已经接触眼睛时，眼睛的一个或多个结构的预接触位置可以用于确定眼睛的一个或多个光学结构的相应的接触后位置，使得激光切口位于促进眼睛正常视力的位置。切口相对于眼睛的预接触光学结构定位，例如散光治疗轴，眼睛的节点以及眼睛的视轴。

2. 发明申请

WO2012170355A2 POTATO TRANSFORMATION COMPOSITIONS, SYSTEMS, METHODS, MICROORGANISMS, AND PLANTS 审中-公开
标题翻译： POTATO转化组合物，系统，方法，微生物和植物
公开(公告)号：WO2012170355A2
公开(公告)日：2012-12-13
申请号：PCT/US2012/040769
申请日：2012-06-04
申请人： THE TEXAS A&M UNIVERSITY SYSTEM , CURTIS, Ian S. , GONZALEZ, Javier , MIRKOV, T. Erik
发明人： CURTIS, Ian S. , GONZALEZ, Javier , MIRKOV, T. Erik
IPC分类号： A23L19/12 , A23L19/15 , A23L19/18 , A23L23/00
CPC分类号： C12N15/8205 , C12N15/8281
摘要： The present disclosure relates, in some embodiments, to potato transformation compositions, systems, methods, microorganisms, and plants (e.g., one or more potato chipping varieties). In some embodiments, a method of transforming and/or transfecting a plant (e.g., 'Atlantic' potato) may comprise (a) growing an 'Atlantic' potato plant (e.g., from a tuber) for from about 3 weeks to about 4 weeks, (b) removing one or more leaf sections (e.g., each section from about 0.5 cm to about 1 cm in its longest dimension) from the plant., (c) cultivating the one or more sections on a callus induction medium comprising zeatin for about 2 days, and/or (d) contacting the one or more sections with Agrobacterium comprising the exogenous nucleic acids under conditions that permit transfer of the exogenous nucleic acid to the one or more sections to produce at least one transformed and/or transfected plant cell.
摘要翻译：在一些实施方案中，本公开涉及马铃薯转化组合物，系统，方法，微生物和植物（例如，一种或多种马铃薯切片品种）。在一些实施方案中，转化和/或转染植物（例如，“大西洋”马铃薯）的方法可以包括（a）将“大西洋”马铃薯植物（例如，从块茎）生长约3周至约4周，（b）从植物中除去一个或多个叶片部分（例如，每个部分在其最长尺寸上从约0.5cm至约1cm），（c）在包含玉米素的愈伤组织诱导培养基上培养一个或多个切片，约2天，和/或（d）在允许外源核酸转移到一个或多个部分以产生至少一个转化和/或转染的植物的条件下，使一个或多个切片与包含外源核酸的农杆菌接触细胞。

3. 发明申请

WO2012082431A3 FORMING DIE BACKSIDE COATING STRUCTURES WITH CORELESS PACKAGES 审中-公开
标题翻译：形成背面涂层结构与无缝包装
公开(公告)号：WO2012082431A3
公开(公告)日：2012-09-20
申请号：PCT/US2011063259
申请日：2011-12-05
申请人： INTEL CORP , MANEPALLI RAHUL N , MAMODIA MOHIT , XU DINGYING , SOTO-GONZALEZ JAVIER , PRACK EDWARD R
发明人： MANEPALLI RAHUL N , MAMODIA MOHIT , XU DINGYING , SOTO-GONZALEZ JAVIER , PRACK EDWARD R
IPC分类号： H01L23/28 , H01L23/10
CPC分类号： H01L25/50 , H01L23/49816 , H01L23/5389 , H01L24/24 , H01L25/0657 , H01L2225/06527 , H01L2924/10253 , H01L2924/10523 , H01L2924/12042 , H01L2924/14 , H01L2924/00
摘要： Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a patterned die backside film (DBF) on a backside of a die, wherein the patterned DBF comprises an opening surrounding at least one through silicon via (TSV) pad disposed on the backside of the die.
摘要翻译：描述了形成微电子封装结构的方法及由此形成的相关结构。这些方法可以包括将图案化的模具背面薄膜（DBF）附接到模具的背面，其中图案化的DBF包括围绕设置在模具背面的至少一个穿过硅通孔（TSV）垫的开口。

4. 发明申请

WO2012087475A3 SUBSTRATE WITH EMBEDDED STACKED THROUGH-SILICON VIA DIE 审中-公开
标题翻译：通过嵌入式堆叠穿过硅的衬底
公开(公告)号：WO2012087475A3
公开(公告)日：2012-09-07
申请号：PCT/US2011061628
申请日：2011-11-21
申请人： INTEL CORP , GONZALEZ JAVIER SOTO , JOMAA HOUSSAM
发明人： GONZALEZ JAVIER SOTO , JOMAA HOUSSAM
IPC分类号： H01L23/48 , H01L23/12
CPC分类号： H01L23/5384 , H01L21/56 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L23/147 , H01L23/31 , H01L23/3107 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L23/5389 , H01L24/06 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2221/68372 , H01L2224/02311 , H01L2224/02381 , H01L2224/0401 , H01L2224/04105 , H01L2224/0557 , H01L2224/06181 , H01L2224/06182 , H01L2224/12105 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/17181 , H01L2224/20 , H01L2224/2919 , H01L2224/73253 , H01L2224/81203 , H01L2224/81903 , H01L2224/8385 , H01L2224/92242 , H01L2225/06513 , H01L2225/06541 , H01L2225/06548 , H01L2225/1035 , H01L2924/00014 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/3511 , H01L2924/00 , H01L2224/05552
摘要： A substrate with an embedded stacked through-silicon via die is described. For example, an apparatus includes a first die and a second die. The second die has one or more through-silicon vias disposed therein (TSV die). The first die is electrically coupled to the TSV die through the one or more through-silicon vias. The apparatus also includes a coreless substrate. Both the first die and the TSV die are embedded in the coreless substrate.
摘要翻译：描述了具有嵌入式堆叠的通过硅通孔的衬底的衬底。例如，一种装置包括第一模具和第二模具。第二管芯具有设置在其中的一个或多个穿硅通孔（TSV管芯）。第一管芯通过一个或多个穿硅通孔电耦合到TSV管芯。该设备还包括无芯基板。第一芯片和TSV芯片都嵌入在无芯基板中。

5. 发明申请

WO2012040682A3 DIE-STACKING USING THROUGH-SILICON VIAS ON BUMPLESS BUILD-UP LAYER SUBSTRATES INCLUDING EMBEDDED-DICE, AND PROCESSES OF FORMING SAME 审中-公开
标题翻译：使用硅橡胶在不包括嵌入层的基础上进行堆叠的堆叠，以及其形成过程
公开(公告)号：WO2012040682A3
公开(公告)日：2012-07-05
申请号：PCT/US2011053175
申请日：2011-09-24
申请人： INTEL CORP , GUZEK JOHN , NALLA RAVI K , SOTO GONZALEZ JAVIER , DELANEY DREW , POTHUKUCHI SURESH , MAMODIA MOHIT , ZARBOCK EDWARD , SWAN JOHANNA
发明人： GUZEK JOHN , NALLA RAVI K , SOTO GONZALEZ JAVIER , DELANEY DREW , POTHUKUCHI SURESH , MAMODIA MOHIT , ZARBOCK EDWARD , SWAN JOHANNA
IPC分类号： H01L23/48 , H01L21/60
CPC分类号： H01L23/5384 , H01L23/481 , H01L23/49816 , H01L23/49827 , H01L23/5389 , H01L24/24 , H01L24/48 , H01L24/73 , H01L24/82 , H01L25/03 , H01L25/0657 , H01L25/18 , H01L2224/16145 , H01L2224/16225 , H01L2224/24226 , H01L2224/48137 , H01L2224/48472 , H01L2224/73259 , H01L2225/06513 , H01L2225/06541 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/014 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An apparatus includes a coreless substrate with a through-silicon via (TSV) embedded die that is integral to the coreless substrate. The apparatus includes a subsequent die that is coupled to the TSV die and that is disposed above the coreless substrate.
摘要翻译：一种装置包括具有与无芯基板成一体的贯通硅通孔（TSV）嵌入管芯的无芯基板。该设备包括连接到TSV管芯并且设置在无芯基板之上的后续管芯。

6. 发明申请

WO2012087474A2 A MULTI-CHIP PACKAGE HAVING A SUBSTRATE WITH A PLURALITY OF VERTICALLY EMBEDDED DIE AND A PROCESS OF FORMING THE SAME 审中-公开
标题翻译：具有多个垂直嵌入式模具的基板的多芯片封装以及形成该芯片的工艺
公开(公告)号：WO2012087474A2
公开(公告)日：2012-06-28
申请号：PCT/US2011/061623
申请日：2011-11-21
申请人： INTEL CORPORATION , GONZALEZ, Javier Soto , JOMAA, Houssam
发明人： GONZALEZ, Javier Soto , JOMAA, Houssam
IPC分类号： H01L23/12 , H01L23/48
CPC分类号： H01L25/50 , H01L21/568 , H01L23/49816 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/25 , H01L24/82 , H01L24/95 , H01L2224/12105 , H01L2224/19 , H01L2224/221 , H01L2224/2402 , H01L2224/24105 , H01L2224/24137 , H01L2224/24147 , H01L2224/245 , H01L2224/251 , H01L2224/32145 , H01L2224/32225 , H01L2224/73267 , H01L2224/82005 , H01L2224/82039 , H01L2224/82101 , H01L2224/92244 , H01L2224/95 , H01L2224/95001 , H01L2924/00013 , H01L2924/01006 , H01L2924/01029 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1815 , H01L2924/18162 , H01L2224/82 , H01L2224/13099 , H01L2224/05099 , H01L2224/13599 , H01L2224/05599 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： An apparatus includes a substrate having a land side having a plurality of contact pads and a die side opposite the land side. The apparatus includes a first die and a second die wherein the first die and second die are embedded within the substrate such that the second die is located between the first die and the land side of the substrate.
摘要翻译：一种装置包括衬底，衬底具有包括多个接触焊盘的焊盘侧和与焊盘侧相对的管芯侧。该装置包括第一管芯和第二管芯，其中第一管芯和第二管芯嵌入在衬底内，使得第二管芯位于第一管芯和衬底的焊盘侧之间。

7. 发明申请

WO2011090570A2 SEMICONDUCTOR PACKAGE WITH EMBEDDED DIE AND ITS METHODS OF FABRICATION 审中-公开
标题翻译：具有嵌入式DIE的半导体封装及其制造方法
公开(公告)号：WO2011090570A2
公开(公告)日：2011-07-28
申请号：PCT/US2010/059237
申请日：2010-12-07
申请人： INTEL CORPORATION , GUZEK, John, Stephen , GONZALEZ, Javier, Soto , WATTS, Nicholas, R. , NALLA, Ravi, K.
发明人： GUZEK, John, Stephen , GONZALEZ, Javier, Soto , WATTS, Nicholas, R. , NALLA, Ravi, K.
IPC分类号： H01L23/12 , H01L23/48
CPC分类号： H01L24/11 , H01L21/56 , H01L21/568 , H01L21/6835 , H01L21/768 , H01L23/315 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L24/19 , H01L24/26 , H01L24/27 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/03 , H01L25/074 , H01L25/105 , H01L25/117 , H01L2221/68345 , H01L2224/03462 , H01L2224/0401 , H01L2224/11831 , H01L2224/12105 , H01L2224/13025 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/24145 , H01L2224/24227 , H01L2224/26 , H01L2224/27312 , H01L2224/2732 , H01L2224/32145 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/73267 , H01L2224/821 , H01L2224/83192 , H01L2224/83874 , H01L2224/92132 , H01L2225/1035 , H01L2225/1058 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/181 , H01L2924/18162 , H01L2924/3511 , H01L2924/40252 , H01L2924/40407 , H01L2924/40501 , H05K1/185 , H05K3/4682 , H05K2201/10477 , H05K2203/0152 , H01L2924/00012 , H01L2924/00 , H01L2224/45099
摘要： Embodiments of the present invention describe a semiconductor package having an embedded die. The semiconductor package comprises a coreless substrate that contains the embedded die. The semiconductor package provides die stacking or package stacking capabilities. Furthermore, embodiments of the present invention describe a method of fabricating the semiconductor package that minimizes assembly costs.
摘要翻译：本发明的实施例描述了具有嵌入式管芯的半导体封装。该半导体封装包括一个包含嵌入式裸片的无芯基板。半导体封装提供管芯堆叠或封装堆叠功能。此外，本发明的实施例描述了一种制造半导体封装的方法，其使组装成本最小化。

8. 发明申请

WO2011005375A2 FABRICATION OF BISCROLLED FIBER USING CARBON NANOTUBE SHEET 审中-公开
标题翻译：使用碳纳米管片的双晶硅纤维的制造
公开(公告)号：WO2011005375A2
公开(公告)日：2011-01-13
申请号：PCT/US2010/036378
申请日：2010-05-27
申请人： BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM , BAUGHMAN, Ray, H. , FANG, Shaoli , LIMA, Marcio, Dias , OVALLE-ROBLES, Raquel , LEPRO-CHAVEZ, Xavier, N. , HAQUE, Mohammad, H. , ZAKHIDOV, Anvar, A. , KOZLOV, Mikhail , LEWIS-AZAD, Chihye , NOVITSKI, David, Michael , CASTILLO-MARTINEZ, Elizabeth , CARRETERO-GONZALEZ, Javier , HAINES, Carter, Sebastian
发明人： BAUGHMAN, Ray, H. , FANG, Shaoli , LIMA, Marcio, Dias , OVALLE-ROBLES, Raquel , LEPRO-CHAVEZ, Xavier, N. , HAQUE, Mohammad, H. , ZAKHIDOV, Anvar, A. , KOZLOV, Mikhail , LEWIS-AZAD, Chihye , NOVITSKI, David, Michael , CASTILLO-MARTINEZ, Elizabeth , CARRETERO-GONZALEZ, Javier , HAINES, Carter, Sebastian
IPC分类号： H01L31/0264
CPC分类号： H01M4/04 , A61K9/7007 , A61L15/18 , A61L17/04 , A61L31/024 , A61L31/16 , A61L2300/108 , A61L2300/414 , A61L2300/418 , A61L2400/12 , B01J21/063 , B01J21/18 , B01J21/185 , B01J23/42 , B01J35/0006 , B01J35/004 , B01J35/06 , B01J37/0215 , B01J37/0238 , B05D3/12 , B05D5/00 , C23C14/04 , C23C14/58 , C23C16/04 , C23C16/56 , D01F9/12 , D02G3/16 , D10B2101/122 , H01B12/06 , H01G11/86 , H01M4/0402 , H01M4/131 , H01M4/133 , H01M4/1391 , H01M4/1393 , H01M4/5825 , H01M4/587 , H01M4/96 , H01M8/00 , H01M10/0525 , Y02E60/122 , Y02E60/50 , Y10T428/2918 , Y10T428/2929
摘要： Fabrication of yarns or other shaped articles from materials in powder form (or nanoparticles or nanofibers) using carbon nanotube/nanofiber sheet as a platform (template). This includes methods for fabricating biscrolled yarns using carbon nanotube/nanofiber sheets and biscrolled fibers fabricated thereby.
摘要翻译：使用碳纳米管/纳米纤维片作为平台（模板）从粉末形式的材料（或纳米颗粒或纳米纤维）制造纱线或其他成形制品。这包括使用碳纳米管/纳米纤维片材制造双向卷线纱的方法和由此制造的双曲线纤维。

9. 发明申请

WO2010105000A1 MAT AND DEVICES WITH THE SAME 审中-公开
标题翻译：具有相同的MAT和设备
公开(公告)号：WO2010105000A1
公开(公告)日：2010-09-16
申请号：PCT/US2010/026893
申请日：2010-03-11
申请人： 3M INNOVATIVE PROPERTIES COMPANY , GONZALEZ, Javier, E. , HORNBACK, Loyd, R., III , SACHS, Kim, C. , SUPINA, Andrew, B.
发明人： GONZALEZ, Javier, E. , HORNBACK, Loyd, R., III , SACHS, Kim, C. , SUPINA, Andrew, B.
IPC分类号： B32B19/00 , B32B27/12 , B32B27/32 , F01N3/021 , F01N3/28
CPC分类号： F01N13/148 , B32B3/04 , B32B3/266 , B32B5/022 , B32B5/22 , B32B5/26 , B32B7/06 , B32B7/12 , B32B27/12 , B32B27/302 , B32B27/32 , B32B27/34 , B32B27/36 , B32B27/365 , B32B27/40 , B32B2262/10 , B32B2270/00 , B32B2307/102 , B32B2307/30 , B32B2307/304 , B32B2307/58 , B32B2307/718 , B32B2605/00 , F01N3/2857 , F01N3/2864 , Y10T156/1056 , Y10T428/1366 , Y10T428/24298 , Y10T428/24322
摘要： Mats comprising a non-woven layer and a first polymeric layer on a major surface thereof. The mats are useful, for example, a mounting mats for pollution control devices, as well as thermal and acoustic insulation for pollution control devices and exhaust systems.
摘要翻译：在其主表面上包含无纺层和第一聚合物层的垫。垫子是有用的，例如用于污染控制装置的安装垫，以及用于污染控制装置和排气系统的热和隔音。

10. 发明申请

WO2006067253A1 CONJUNTO DE OCULTACION INTERIOR PARA TECHOS TRANSPARENTES DE VEHICULOS AUTOMOVILES 审中-公开
标题翻译：汽车透明车内饰
公开(公告)号：WO2006067253A1
公开(公告)日：2006-06-29
申请号：PCT/ES2005/070024
申请日：2005-03-08
申请人： GRUPO ANTOLIN-INGENIERIA, S.A. , GONZALEZ MERINO, Ricardo , IGLESIAS SEDANO, Ricardo , SADORNIL SANTAMARIA, Juan Carlos , MARCOS GONZALEZ, Cesar , GONZALEZ SAIZ, Jose Ignacio , PEREZ OCA, Ricardo , MANZANEDO GONZALEZ, Javier , SAIZ AUSIN, Pedro , SELGAS CACERES, Carlos
发明人： GONZALEZ MERINO, Ricardo , IGLESIAS SEDANO, Ricardo , SADORNIL SANTAMARIA, Juan Carlos , MARCOS GONZALEZ, Cesar , GONZALEZ SAIZ, Jose Ignacio , PEREZ OCA, Ricardo , MANZANEDO GONZALEZ, Javier , SAIZ AUSIN, Pedro , SELGAS CACERES, Carlos
IPC分类号： B60J3/02
CPC分类号： B60J7/003
摘要： Conjunto de ocultación interior para techos transparentes de 5 vehículos automóviles, constituido por una cubierta (1) dimensionada para cubrir la zona transparente del techo, la cual va montada y puede desplazarse entre dos carriles longitudinales (2) que discurren a lo largo de los laterales del techo del vehículo. La cubierta esta constituida por al menos 10 un panel (3) que lleva fijado traviesas (5, 6, 7) dotadas en sus extremos de patines de deslizamiento acoplables en los carriles (2). La traviesa anterior (5) es portadora de parasoles abatibles y de un mecanismo central (10) de control de desplazamiento de la cubierta (1).
摘要翻译：本发明涉及一种用于汽车透明屋顶的内部遮阳罩，包括盖子（1），该盖子的尺寸设置成覆盖屋顶的透明区域，并且可以在两个纵向轨道（2）之间安装并移动，其沿着车顶的侧面的长度延伸。所述盖包括至少一个镶板（3），所述板（3）配备有固定横梁（5,6,7），所述固定横梁（5,6,7）设置有可与所述履带（2）连接的滑动鞋。前端横梁（5）支撑铰接的遮阳板和用于控制盖（1）的运动的中心机构（10）。

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