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    • 2. 发明申请
    • ELECTROSYNTHESIS OF NANOFIBERS AND NANO-COMPOSITE FILMS
    • 纳米纤维和纳米复合薄膜的电合成
    • WO2004048644A2
    • 2004-06-10
    • PCT/US2003/016273
    • 2003-05-21
    • BATTELLE MEMORIAL INSTITUTE
    • LIN, YueheLIANG, LiangLIU, Jun
    • C25D
    • B82Y30/00C09D5/4476C25D9/00
    • A method of producing an array of oriented nanofibers that involves forming a solution that includes at least one electroactive species. An electrode substrate is brought into contact with the solution. A current density is applied to the electrode substrate that includes at least a first step of applying a first substantially constant current density for a first time period and a second step of applying a second substantially constant current density for a second time period. The first and second time periods are of sufficient duration to electrically deposit on the electrode substrate an array of oriented nanofibers produced from the electroactive species. Also disclosed are films that include arrays or networks of oriented nanofibers and a method for amperometrically detecting or measuring at least one analyte in a sample.
    • 生产取向纳米纤维阵列的方法,其涉及形成包含至少一种电活性物质的溶液。 使电极基板与溶液接触。 向电极基板施加电流密度,该电流密度至少包括在第一时间段施加第一基本上恒定的电流密度的第一步骤和在第二时间段施加第二基本上恒定的电流密度的第二步骤。 第一和第二时间段具有足够的持续时间以在电极基板上电沉积由电活性物质产生的取向纳米纤维的阵列。 还公开了包含取向纳米纤维的阵列或网络的膜以及用于安培检测或测量样品中的至少一种分析物的方法。
    • 3. 发明申请
    • ACTIVE CARBON ELECTRO-DEPOSITED WITH Ag-I SYSTEM HAVING STERILIZING EFFECT
    • 活性炭电沉积Ag-I系统具有灭菌效果
    • WO00063465A1
    • 2000-10-26
    • PCT/KR1999/000386
    • 1999-07-21
    • A61K33/44A01N25/26A61P31/00B01J20/20C25D3/46C25D3/56C25D5/26C25D5/54C25D7/00C25D9/00
    • C25D3/46C25D9/00
    • This invention is to provide environmentally functional active carbon and its method of manufacturing having improved adsorption capability against disease-source bacteria and microbes with prominent anti-bacterial and sterilizing effect as well as against organic and inorganic contaminants throughout process of electro-deposited with Ag-I system to the surface of active carbon and active carbon fiber. Therefore, this invention is to create functional active carbon having outstanding sterilizing effect and its manufacturing process for disease-source bacteria from known bacteria such as positive Gram bacteria including Staphylococcus, Bacillus subtillis and negative Gram bacteria including Escherichia coli, Pseudomonas Aeruginosa, Klebsiella Pneumonie, Candida Albicans causing albicans as yeast fungus, Trichophyton interdigital causing athlete's foot as a kind of mold.
    • 本发明提供具有改善的针对病源细菌和微生物的吸附能力的环境功能活性炭及其制备方法,具有显着的抗细菌和灭菌效果,并且在Ag- 我系统以表面活性炭和活性炭纤维为主。 因此,本发明是为了制造具有优异灭菌效果的功能性活性炭及其制造方法,所述活性炭来自已知细菌,例如包括葡萄球菌,枯草芽孢杆菌和阴性革兰氏阳性细菌在内的已知细菌,包括大肠杆菌,铜绿假单胞菌,肺炎克雷伯菌, 白色念珠菌引起白色念珠菌作为酵母真菌,发癣引发运动员脚作为一种霉菌。
    • 5. 发明申请
    • AQUEOUS DISPERSION FOR FORMING CONDUCTIVE LAYER, CONDUCTIVE LAYER, ELECTRONIC COMPONENT, CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME, AND MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    • 用于形成导电层,导电层,电子部件,电路板及其制造方法的水性分散体和多层布线板及其制造方法
    • WO01032964A1
    • 2001-05-10
    • PCT/JP2000/007683
    • 2000-11-01
    • C25D9/00C25D13/00H05K1/09H05K3/24H05K3/40H05K3/46C01B13/14
    • C25D9/00C25D13/00H05K1/095H05K3/06H05K3/245H05K3/4069H05K3/4602H05K3/4664H05K2201/0355H05K2201/0394H05K2203/135H05K2203/1461
    • An aqueous dispersion of the invention in which conductive particles and organic particles are dispersed in an aqueous medium is used for forming a conductive layer having a volume resistivity of, for example, 10 OMEGA =.cm or less by electrodeposition. A circuit board of the invention comprises an insulating layer and a conductive layer including a through conductive part extending through the conductive layer and is manufactured preferably by a method of the invention. The method comprises the steps of closing one mouth of a through hole made in the insulating layer with a piece of conductive foil and electrodepositing a conductive layer using a dispersion of the invention as the electrodeposition liquid and the conductive foil as one electrode. A multilayer wiring board of the invention comprises a core wiring sheet having sheet wiring layers connected to each other and formed on both sides of the sheet, an insulating layer formed on at least one of the sides of the sheet, a wiring layer formed thereon, and an interlayer short-circuiting part electrically connecting the wiring layer to the sheet wiring layer and extending through the insulating layer. The interlayer short-circuiting part is a conductor formed by electrodeposition using the dispersion as the electrolyte. Since the conductive layer or conductor is formed by electrodeposition, the productivity and connection reliability are high.
    • 将导电粒子和有机粒子分散在水性介质中的本发明的水性分散体用于通过电沉积形成体积电阻率例如为10 -4Ω·cm -1以下的导电层。 本发明的电路板包括绝缘层和导电层,导电层包括延伸穿过导电层的贯通导电部分,并且优选地通过本发明的方法制造。 该方法包括以一片导电箔封闭在绝缘层中形成的通孔的一个口,并使用本发明的分散体作为电沉积液和导电箔作为一个电极来电沉积导电层的步骤。 本发明的多层布线基板包括具有彼此连接并形成在片材的两面上的片状布线层的芯布线片,形成在片材的至少一个侧面上的绝缘层,形成在其上的布线层, 以及将所述布线层与所述片状布线层电连接并延伸穿过所述绝缘层的层间短路部。 层间短路部分是通过使用分散体作为电解质的电沉积形成的导体。 由于通过电沉积形成导电层或导体,因此生产率和连接可靠性高。
    • 9. 发明申请
    • DEVICE AND METHOD TO CONDUCT AN ELECTROCHEMICAL REACTION ON A SURFACE OF A SEMICONDUCTOR SUBSTRATE
    • 在半导体衬底的表面上导电化反应的装置和方法
    • WO2010108996A1
    • 2010-09-30
    • PCT/EP2010/053955
    • 2010-03-25
    • ALCHIMERZAHRAOUI, SaidDESCOURS, FrancisRAYNAL, Frédéric
    • ZAHRAOUI, SaidDESCOURS, FrancisRAYNAL, Frédéric
    • C25D5/02C25D17/00H01L21/288C25D7/12
    • C25D5/006C25D7/12C25D7/123C25D9/00C25D9/02C25D13/22C25D17/001H01L21/2885Y10S204/07
    • The invention concerns a device to conduct an electrochemical reaction on the surface of a semiconductor substrate (S), characterized in that the device comprises: - a container (10) intended to contain an electrolyte (E), - a support (20) arranged in the container, said support being adapted for attachment of the semiconductor substrate (S) on said support (20), - a counter-electrode (30) arranged in the container (10), - illumination means (50) comprising a source (51 ) emitting light rays and means (52) to homogenize the light rays on all of said surface of the semiconductor substrate (S), so as to activate the surface of the semiconductor substrate (S), and - an electric supply (40) comprising connection means for connection to the semiconductor substrate and to the counter-electrode in order to polarize said surface of said semiconductor substrate (S) at an electric potential permitting the electrochemical reaction. The invention also concerns the method to conduct an electrochemical reaction on a surface of a corresponding semiconductor substrate.
    • 本发明涉及一种在半导体衬底(S)的表面上进行电化学反应的装置,其特征在于,所述装置包括: - 用于容纳电解质(E)的容器(10), - 布置成 在所述容器中,所述支撑件适于将所述半导体衬底(S)附接在所述支撑件(20)上, - 配置在所述容器(10)中的对电极(30), - 照明装置(50),包括源 51)和使所述半导体衬底(S)的所有表面的光线均匀化的装置(52),以激活所述半导体衬底(S)的表面,以及 - 电源(40) 包括用于连接到半导体衬底和对电极的连接装置,以便在允许电化学反应的电势下使所述半导体衬底(S)的所述表面极化。 本发明还涉及在对应的半导体衬底的表面上进行电化学反应的方法。
    • 10. 发明申请
    • METHOD AND APPARATUS FOR COATING A MEDICAL DEVICE BY ELECTROPLATING
    • 用于通过电镀涂覆医疗装置的方法和装置
    • WO2006062627A1
    • 2006-06-15
    • PCT/US2005/039461
    • 2005-11-01
    • BOSTON SCIENTIFIC SCIMED, INC,XU, YixinHELMUS, Michael N.
    • XU, YixinHELMUS, Michael N.
    • C25D7/00C25D15/00A61L31/16C09D5/44C25D9/02
    • A61L31/10A61L31/082A61L31/16A61L2300/606A61L2420/02C09D5/4492C25D9/00C25D9/02C25D15/00
    • Methods and apparatuses for coating surfaces of medical devices by electroplating are disclosed. In one embodiment, the invention includes a coating method in which a mixture of a therapeutic agent, and a plating material are electroplated onto the surface of the medical device. The electroplating method may be performed at a relatively low temperature to avoid destruction of the therapeutic agent. In another embodiment, a coating method is disclosed in which the coating is formed by suspending a therapeutic agent in an electrolytic solution and electroplating a plating material onto the medical device wherein the plating material carries the supended therapeutic agent. Thus, the coating of plating material contains the suspended therapeutic agent. These methods and apparatuses are used to apply one or more coating materials, simultaneously or in sequence by varying the electroplating voltage. In certain embodiments of the invention, the coating materials include therapeutic agents and cationic drugs.
    • 公开了通过电镀来涂覆医疗装置的表面的方法和装置。 在一个实施方案中,本发明包括将治疗剂和电镀材料的混合物电镀在医疗装置的表面上的涂布方法。 电镀方法可以在相对低的温度下进行以避免治疗剂的破坏。 在另一个实施方案中,公开了一种涂覆方法,其中通过将治疗剂悬浮在电解溶液中并将电镀材料电镀到医疗装置上而形成涂层,其中电镀材料携带上述治疗剂。 因此,电镀材料的涂层含有悬浮治疗剂。 这些方法和装置用于通过改变电镀电压同时或依次施加一种或多种涂层材料。 在本发明的某些实施方案中,涂层材料包括治疗剂和阳离子药物。