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1. 发明申请

WO2012101521A3 LED LUMINESCENCE APPARATUS AND METHOD OF DRIVING THE SAME 审中-公开
标题翻译： LED发光装置及其驱动方法
公开(公告)号：WO2012101521A3
公开(公告)日：2012-11-15
申请号：PCT/IB2012000329
申请日：2012-01-27
申请人： SEOUL SEMICONDUCTOR CO LTD , JONG YOUNG DO , KANG HYUN GU , JUNG HYE MAN , LEE KANG NYUNG
发明人： JONG YOUNG DO , KANG HYUN GU , JUNG HYE MAN , LEE KANG NYUNG
IPC分类号： H05B37/02
CPC分类号： H05B33/083 , H01L2224/05554 , H01L2224/32225 , H01L2224/45139 , H01L2224/48091 , H01L2224/4813 , H01L2224/48137 , H01L2224/48227 , H01L2224/49113 , H01L2924/181 , H05B33/0803 , H05B33/0809 , H05B33/0818 , H05B33/0824 , Y02B20/347 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/00011
摘要： An LED luminescence apparatus includes a plurality of LED units connected in series which are configured to receive a unidirectional ripple voltage, a plurality of switch units, one end of each being connected to the cathode of one of the plurality of LED units, a plurality of constant current control circuit units, one end of each being connected to an another end of a respective switch unit to receive a current from the respective switch unit, each of the constant current control circuit units being configured to output a current control signal to the respective switch unit to control a magnitude of the received current to have a specific value, and a current comparison unit to receive currents flowing from the plurality of switching units, and generate a plurality of switching control signals for the respective switch units to sequentially drive the plurality of constant current control circuit units.
摘要翻译： LED发光装置包括串联连接的多个LED单元，其被配置为接收单向纹波电压;多个开关单元，其一端连接到所述多个LED单元之一的阴极，多个恒流控制电路单元，其一端连接到相应开关单元的另一端以接收来自相应开关单元的电流，每个恒流控制电路单元被配置为将电流控制信号输出到相应的开关单元开关单元以控制接收电流的大小以具有特定值;以及电流比较单元，用于接收从多个开关单元流出的电流，并且产生用于各个开关单元的多个开关控制信号以顺序地驱动多个开关单元的恒流控制电路单元。

2. 发明申请

WO2012101522A2 LED DRIVING CIRCUIT PACKAGE 审中-公开
标题翻译： LED驱动电路封装
公开(公告)号：WO2012101522A2
公开(公告)日：2012-08-02
申请号：PCT/IB2012/000337
申请日：2012-01-27
申请人： SEOUL SEMICONDUCTOR CO., LTD. , JONG, Young, Do , KANG, Hyun, Gu , JUNG, Hye, Man , LEE, Kang, Nyung
发明人： JONG, Young, Do , KANG, Hyun, Gu , JUNG, Hye, Man , LEE, Kang, Nyung
IPC分类号： H05B37/02
CPC分类号： H05B33/083 , H01L2224/05554 , H01L2224/32225 , H01L2224/45139 , H01L2224/48091 , H01L2224/4813 , H01L2224/48137 , H01L2224/48227 , H01L2224/49113 , H01L2924/181 , H05B33/0803 , H05B33/0809 , H05B33/0818 , H05B33/0824 , Y02B20/347 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/00011
摘要： An LED driving circuit package includes a rectification unit to receive an AC power voltage and rectify the AC power voltage to generate a ripple voltage, an LED driving switching unit including a plurality of switch units and a plurality of current control units. The LED driving circuit package further includes a low voltage control unit including a circuit power supply unit to generate low voltage power, a voltage detection unit to detect a magnitude of the ripple voltage, a reference frequency generation unit to generate a reference frequency, and a reference pulse generation unit to generate a reference pulse for controlling the operation of the LED driving switch unit according to the reference frequency and a magnitude of the voltage detected by the voltage detection unit.
摘要翻译： LED驱动电路组件包括：整流单元，用于接收交流电源电压并整流交流电源电压以产生纹波电压; LED驱动开关单元，包括多个开关单元和多个电流控制单元。 LED驱动电路封装还包括低电压控制单元，其包括用于产生低电压电力的电路电源单元，用于检测纹波电压幅度的电压检测单元，产生参考频率的基准频率产生单元，以及参考脉冲发生单元，用于产生用于根据参考频率控制LED驱动开关单元的操作的参考脉冲和由电压检测单元检测的电压的大小。

3. 发明申请

WO2012071003A1 METHOD FOR THE WAFER-LEVEL INTEGRATION OF SHAPE MEMORY ALLOY WIRES 审中-公开
标题翻译：用于形状记忆合金线的水平集成的方法
公开(公告)号：WO2012071003A1
公开(公告)日：2012-05-31
申请号：PCT/SE2011/051404
申请日：2011-11-22
申请人： SENSEAIR AB , BRAUN, Stefan , NIKLAUS, Frank , FISCHER, Andreas , GRADIN, Henrik
发明人： BRAUN, Stefan , NIKLAUS, Frank , FISCHER, Andreas , GRADIN, Henrik
IPC分类号： B81B3/00 , B23K20/00 , B81C1/00 , H01L23/49
CPC分类号： H01L24/85 , B23K20/007 , C22C19/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/94 , H01L2224/04042 , H01L2224/05571 , H01L2224/05599 , H01L2224/45 , H01L2224/45015 , H01L2224/45139 , H01L2224/45155 , H01L2224/4813 , H01L2224/48453 , H01L2224/48463 , H01L2224/78301 , H01L2224/85045 , H01L2224/85099 , H01L2224/85205 , H01L2224/85345 , H01L2224/85375 , H01L2224/85385 , H01L2224/85399 , H01L2224/858 , H01L2224/85855 , H01L2224/85899 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01033 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2224/45099 , H01L2924/00 , H01L2224/05552 , H01L2924/01049 , H01L2924/00015 , H01L2924/20753 , H01L2924/01022
摘要： The present invention relates to a method to attach a shape memory alloy wire to a substrate, where the wire is mechanically attached into a 3D structure on the substrate. The present invention also relates to a device comprising a shape memory alloy wire attached to a substrate, where the wire is mechanically attached into a 3D structure on the substrate.
摘要翻译：本发明涉及一种将形状记忆合金线附着到基底上的方法，其中线被机械连接到基底上的3D结构中。本发明还涉及一种装置，其包括附接到基底的形状记忆合金丝，其中线被机械地附接到基底上的3D结构中。

4. 发明申请

WO2010090778A2 CUTTING BLADE FOR A WIRE BONDING SYSTEM 审中-公开
标题翻译：用于线束接合系统的切割刀片
公开(公告)号：WO2010090778A2
公开(公告)日：2010-08-12
申请号：PCT/US2010/020024
申请日：2010-01-04
申请人： ORTHODYNE ELECTRONICS CORPORATION , COPPERTHITE, Theodore, J.
发明人： COPPERTHITE, Theodore, J.
IPC分类号： H01L21/60
CPC分类号： H01L24/85 , B23K20/004 , B23K20/26 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/45014 , H01L2224/48091 , H01L2224/4813 , H01L2224/48247 , H01L2224/4846 , H01L2224/48472 , H01L2224/49175 , H01L2224/78313 , H01L2224/78314 , H01L2224/7855 , H01L2224/85 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/15747 , Y10T83/0237 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A cutting blade for a wire bonding system is provided. The cutting blade comprises a body portion having an end portion. The end portion includes a blade tip configured to penetrate into a conductive material The end portion further includes a stepped portion proximate the blade tip that is configured to limit penetration of the blade tip during use thereof.
摘要翻译：提供了一种用于引线接合系统的切割刀片。切割刀片包括具有端部的主体部分。端部包括构造成穿透导电材料的叶片尖端。端部部分还包括邻近叶片尖端的台阶部分，其构造成在使用时限制叶片尖端的穿透。

5. 发明申请

WO2010061244A1 POWER MOS TRANSISTOR DEVICE AND SWITCH APPARATUS COMPRISING THE SAME 审中-公开
标题翻译：功率MOS晶体管器件和包括其的开关装置
公开(公告)号：WO2010061244A1
公开(公告)日：2010-06-03
申请号：PCT/IB2008/055655
申请日：2008-11-27
申请人： FREESCALE SEMICONDUCTOR, INC. , REYNES, Jean Michel , BERNOUX, Beatrice , ESCOFFIER, Rene , JALBAUD, Pierre , DERAM, Ivana
发明人： REYNES, Jean Michel , BERNOUX, Beatrice , ESCOFFIER, Rene , JALBAUD, Pierre , DERAM, Ivana
IPC分类号： H01L29/78 , H01L29/10 , H01L29/06 , H01L23/485
CPC分类号： H01L29/7808 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/49 , H01L29/0696 , H01L29/1095 , H01L29/7802 , H01L2224/04042 , H01L2224/05553 , H01L2224/05556 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/45014 , H01L2224/45124 , H01L2224/4813 , H01L2224/48137 , H01L2224/4847 , H01L2224/49171 , H01L2924/01005 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/12036 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2924/00014
摘要： A transistor power switch device (700) comprising an array of vertical transistor elements (108) for carrying current between the first and second faces (104, 106) of a semiconductor body, the array of transistor elements (108) comprising at the first face (104) an array of source regions (114) of a first semiconductor type, at least one p region (122, 124, 126) of a second semiconductor type opposite to the first type interposed between the source regions (114) and the second face (106), and at least one control electrode (116) for switchably controlling flow of the current through the p region (122, 124, 126), and a conductive layer (110) contacting the source regions (114) and insulated from the control electrode (116) by at least one insulating layer (120). The switch device also comprises at least one reverse biased vertical avalanche diode (702) electrically in parallel with the array of transistors (108) for conducting breakdown current between the first and second faces (104, 106) in the off state of the device and having a first current carrying diode region (704) of the second semiconductor type in contact with the first face (104) and with the conductive layer (110) and a second semiconductor region (706) of the first semiconductor type electrically connected with the second face (106). The switch device also comprises electrical connection leads (128) bonded to the conductive layer (110) over each avalanche diode.
摘要翻译：一种晶体管功率开关装置（700），包括用于在半导体主体的第一和第二面（104,106）之间承载电流的垂直晶体管元件阵列（108），所述晶体管元件阵列（108）包括在第一面（104）第一半导体类型的源极区域（114）的阵列，插入在源极区域（114）和第二半导体区域（114）之间的与第一类型相反的第二半导体类型的至少一个p区域（122,124,126）面（106）和至少一个控制电极（116），用于可转换地控制通过该p区（122,124,126）的电流的流动，以及与该源极区（114）接触的导电层（110）所述控制电极（116）由至少一个绝缘层（120）构成。开关装置还包括与晶体管阵列（108）电并联的至少一个反向偏置垂直雪崩二极管（702），用于在器件的断开状态下在第一和第二面（104,106）之间传导击穿电流，以及具有与第一面（104）接触的第二半导体类型的第一载流二极管区域（704）和导电层（110）以及与第二半导体类型的第二半导体类型电连接的第二半导体区域（706）脸（106）。开关装置还包括在每个雪崩二极管上结合到导电层（110）的电连接引线（128）。

6. 发明申请

WO2007016088A3 PACKAGED INTEGRATED CIRCUIT WITH ENHANCED THERMAL DISSIPATION 审中-公开
标题翻译：包装集成电路，具有增强的热量消耗
公开(公告)号：WO2007016088A3
公开(公告)日：2009-04-30
申请号：PCT/US2006028837
申请日：2006-07-25
申请人： FREESCALE SEMICONDUCTOR INC , HESS KEVIN J , LEE CHU-CHUNG
发明人： HESS KEVIN J , LEE CHU-CHUNG
IPC分类号： H01L23/28
CPC分类号： H01L23/50 , H01L23/3677 , H01L23/4334 , H01L23/552 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/4813 , H01L2224/48227 , H01L2224/48465 , H01L2224/48472 , H01L2224/4903 , H01L2224/49051 , H01L2224/73207 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01057 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/18161 , H01L2924/19043 , H01L2924/19107 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor package (10) uses a plurality of thermal conductors (56-64) that extend upward within an encapsulant (16) from one or more thermal bond pads (22, 24, 26) on a die (14) to disperse heat. The thermal conductors may be bond wires or conductive stud bumps and do not extend beyond a lateral edge of the die. One or more of the thermal conductors may be looped within the encapsulant and exposed at an upper surface of the encapsulant. In one form a heat spreader (68) is placed overlying the encapsulant for further heat removal. In another form the heat spreader functions as a power or ground terminal directly to points interior to the die via the thermal conductors. Active bond pads may be placed exclusively along the die's periphery or also included within the interior of the die.
摘要翻译：半导体封装（10）使用从模具（14）上的一个或多个热粘合垫（22,24,26）在密封剂（16）内向上延伸的多个热导体（56-64）以分散热量。热导体可以是接合线或导电柱状凸起，并且不延伸超过模具的侧边缘。一个或多个热导体可以环绕在密封剂内并暴露在密封剂的上表面。在一种形式中，将散热器（68）放置在所述密封剂上方以进一步除热。在另一种形式中，散热器用作电源或接地端子，直接通过热导体指向芯片的内部。主动键合焊盘可以沿模具的周边排列，也可以包括在模具的内部。

7. 发明申请

WO2009002381A2 MOLD COMPOUND CIRCUIT STRUCTURE FOR ENHANCED ELECTRICAL AND THERMAL PERFORMANCE 审中-公开
标题翻译：用于增强电气和热性能的模具化合物电路结构
公开(公告)号：WO2009002381A2
公开(公告)日：2008-12-31
申请号：PCT/US2008/006063
申请日：2008-05-12
申请人： SKYWORKS SOLUTIONS, INC. , KUHLMAN, Mark, A. , AGARWAL, Anil, K.
发明人： KUHLMAN, Mark, A. , AGARWAL, Anil, K.
IPC分类号： H01L23/36
CPC分类号： H01L23/3121 , H01L23/3677 , H01L23/4334 , H01L23/49822 , H01L23/5389 , H01L24/24 , H01L24/45 , H01L24/48 , H01L24/82 , H01L24/91 , H01L25/0655 , H01L25/105 , H01L25/165 , H01L2224/24226 , H01L2224/451 , H01L2224/48091 , H01L2224/4813 , H01L2224/48227 , H01L2224/92 , H01L2224/92247 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H05K1/0206 , H05K1/16 , H05K1/185 , H05K1/186 , H05K3/361 , H05K3/4046 , H05K3/4644 , H05K2201/10287 , H05K2203/1316 , H01L2224/83 , H01L2224/85 , H01L2224/82 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： According to an exemplary embodiment, an overmolded semiconductor package includes at least one semiconductor die situated over a package substrate. The overmolded semiconductor package further includes a mold compound overlying the at least one semiconductor die and the package substrate and having a top surface. The overmolded semiconductor package further includes a first patterned conductive layer situated on the top surface of the mold compound. The overmolded semiconductor package can further include at least one conductive interconnect situated in the mold compound, where the at least one conductive interconnect is electrically connected to the first patterned conductive layer. The first patterned conductive layer can include at least one passive component.
摘要翻译：根据示例性实施例，包覆成型的半导体封装包括位于封装衬底上的至少一个半导体管芯。包覆模制的半导体封装还包括覆盖至少一个半导体管芯和封装衬底并具有顶表面的模制化合物。包覆成型的半导体封装还包括位于模具化合物的顶表面上的第一图案化导电层。包覆模制的半导体封装还可以包括位于模具化合物中的至少一个导电互连，其中至少一个导电互连电连接到第一图案化导电层。第一图案化导电层可以包括至少一个无源部件。

8. 发明申请

WO2008011459A3 POWER SEMICONDUCTOR DEVICES HAVING INTEGRATED INDUCTOR 审中-公开
标题翻译：具有集成电感器的功率半导体器件
公开(公告)号：WO2008011459A3
公开(公告)日：2008-09-25
申请号：PCT/US2007073778
申请日：2007-07-18
申请人： TEXAS INTRUMENTS INC , KODURI SREENIVANSAN K
发明人： KODURI SREENIVANSAN K
IPC分类号： H01L23/52 , H01L23/48 , H01L23/495 , H01L29/40
CPC分类号： H01L23/495 , H01F17/045 , H01F27/027 , H01F27/40 , H01L23/3121 , H01L23/49575 , H01L23/645 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L25/16 , H01L2224/13099 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/4809 , H01L2224/48091 , H01L2224/48092 , H01L2224/4813 , H01L2224/48137 , H01L2224/48227 , H01L2224/48235 , H01L2224/48247 , H01L2224/48464 , H01L2224/48465 , H01L2224/48472 , H01L2224/48599 , H01L2224/49 , H01L2224/73253 , H01L2224/73265 , H01L2224/85 , H01L2924/00014 , H01L2924/01006 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19104 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , H01L2224/78 , H01L2924/00 , H01L2924/00012
摘要： An electronic device (100) with one or more semiconductor chips (102) has an inductor (101) assembled on or under the chips. The inductor includes a ferromagnetic body (111) and a wire (104) wrapped around the body to form at least a portion of a loop; the wire ends (104a) are connected to the chips. The assembly is attached to a substrate (103), which may be a leadframe. The device may be encapsulated in molding compound (140) so that the inductor can double as a heat spreader (111c), enhancing the thermal device characteristics.
摘要翻译：具有一个或多个半导体芯片（102）的电子设备（100）具有组装在芯片上或芯片下方的电感器（101）。所述电感器包括铁磁体（111）和围绕所述主体缠绕以形成环的至少一部分的线（104）; 电线端部（104a）连接到芯片。组件附接到可以是引线框架的基板（103）。该装置可以封装在模制化合物（140）中，使得电感器可以作为散热器（111c）加倍，从而增强热装置特性。

9. 发明申请

WO2007046031A3 DEVICE COMPRISING AN ELEMENT WITH ELECTRODES COUPLED TO CONNECTIONS 审中-公开
标题翻译：包含与连接的电极的元件的装置
公开(公告)号：WO2007046031A3
公开(公告)日：2007-10-18
申请号：PCT/IB2006053719
申请日：2006-10-10
申请人： NXP BV , HARM LEX
发明人： HARM LEX
IPC分类号： H01L23/66 , H01L25/16
CPC分类号： H01L23/66 , H01L24/48 , H01L24/49 , H01L2223/6611 , H01L2223/6644 , H01L2224/4809 , H01L2224/48091 , H01L2224/4813 , H01L2224/48137 , H01L2224/49 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2224/45099 , H01L2224/05599
摘要： Devices (1) comprising elements (5) with electrodes coupled to connections (11,12), one or more connections (11,12) forming part of an impedance transforming network, get reduced electromagnetic couplings between the connections (11,12) by locating largest parts of the connections (11,12) in non-parallel planes. This also reduces unwanted feedback and deteriorations of transfer characteristics of the elements (5) and allows the electrodes of the elements (5) to be located closer to each other resulting in reduced sizes. The largest parts of the connections (11,12) do not form part of each other?s plane and do not form part of one and the same plane. The planes make an angle between 45 degrees and 135 degrees. One connection (11,12) has a shape such as a loop for further reducing the electromagnetic coupling. One or more of the connections (11,12) that form part of the impedance transforming network comprise an inductance and one or more of the connections (11,12) are coupled to element-external capacitors (13,14).
摘要翻译：包括耦合到连接（11,12）的电极的元件（5），构成阻抗变换网络的一部分的一个或多个连接（11,12）的装置（1）通过连接（11,12）之间的电磁耦合减小将连接（11,12）的最大部分定位在非平行平面中。这也减少了元件（5）的不需要的反馈和传输特性的恶化，并允许元件（5）的电极彼此更靠近，导致尺寸减小。连接件（11,12）的最大部分不构成彼此平面的一部分，并且不构成同一平面的一部分。飞机在45度到135度之间形成一个角度。一个连接（11,12）具有诸如环路的形状，用于进一步减小电磁耦合。构成阻抗变换网络一部分的一个或多个连接（11,12）包括一个电感，一个或多个连接（11,12）耦合到元件外部电容器（13,14）。

10. 发明申请

WO2007089366A2 WARPAGE-REDUCING PACKAGING DESIGN 审中-公开
标题翻译：保温包装设计
公开(公告)号：WO2007089366A2
公开(公告)日：2007-08-09
申请号：PCT/US2006061849
申请日：2006-12-11
申请人： FREESCALE SEMICONDUCTOR INC , YEUNG BETTY H , DOUGHERTY DAVID J
发明人： YEUNG BETTY H , DOUGHERTY DAVID J
CPC分类号： H01L25/072 , H01L23/492 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/4813 , H01L2224/48137 , H01L2224/48247 , H01L2224/48472 , H01L2224/49 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01042 , H01L2924/01043 , H01L2924/01058 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A flange and packaging assembly (100) characterized by a structural lip (200) configured to impart resistance to thermal-induced deformation (i.e. "stiffness") to the flange during elevated temperature die attachment processes. The stiffness is achieved through appropriate configuration of the lip (height, width and shape) and is sufficient to at least partially counteract the stresses generated from coefficient of thermal expansion differentials between the flange and a die (400) attached to it. The lip may be molded or otherwise formed with the flange as a unitary lip-stiffened flange, or may be a separate structure that is affixed to the flange. The flange has a lip-stiffened region for die attachment. This region may be raised above the first surface of the substrate base for enhanced stiffening, and may be in the form of a single pedestal (300) supporting a single or multiple die, or may be a series of raised pedestals (330), each supporting one or more die. The leads (500) may be embedded in a polymetric material that is attached to the flange that is of sufficient thickess to provide the required stiffness. The embedded leads may be shaped and formed so that the desired seating plane height is achieved. The lead form placement can be either on the interior or exterior of the embedded polymetric material. The polymetric material can be supported along the edge of the flange or be seated on a part of an extrusion from the flange.
摘要翻译：一种凸缘和包装组件（100），其特征在于结构唇缘（200），其构造成在高温模具附着过程期间赋予对所述凸缘的热诱导变形（即“刚度”）的抵抗。刚度通过唇缘的适当构造（高度，宽度和形状）来实现，并且足以至少部分地抵消由法兰和附接到其的模具（400）之间的热膨胀差异系数产生的应力。唇缘可以模制或以其它方式形成，凸缘作为整体唇缘加强的凸缘，或者可以是固定到凸缘的单独的结构。凸缘具有用于模具附接的唇缘加强区域。该区域可以升高到基板基底的第一表面之上，以增强加强硬度，并且可以是支撑单个或多个模头的单个基座（300）的形式，或者可以是一系列凸起的基座（330），每个支持一个或多个模具。引线（500）可以嵌入到具有足够厚度的凸缘附接到提供所需刚度的多尺度材料中。嵌入的引线可以被成形和形成，使得实现期望的座面高度。引线形式放置可以在嵌入式多功能材料的内部或外部。多边形材料可以沿着凸缘的边缘支撑，或者从凸缘位于挤压件的一部分上。

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