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    • 2. 发明申请
    • POWER MOS TRANSISTOR DEVICE
    • 功率MOS晶体管器件
    • WO2010061245A1
    • 2010-06-03
    • PCT/IB2008/055656
    • 2008-11-27
    • FREESCALE SEMICONDUCTOR, INC.REYNES, Jean MichelBERNOUX, BeatriceESCOFFIER, ReneJALBAUD, PierreDERAM, Ivana
    • REYNES, Jean MichelBERNOUX, BeatriceESCOFFIER, ReneJALBAUD, PierreDERAM, Ivana
    • H01L29/78H01L29/10H01L29/06H01L23/485
    • H01L29/7808H01L24/02H01L24/05H01L29/0696H01L29/1095H01L29/7802H01L2224/04042H01L2224/05553H01L2224/05556H01L2224/4813H01L2224/4847H01L2224/49171H01L2924/01079H01L2924/12036H01L2924/1305H01L2924/1306H01L2924/13091H01L2924/14H01L2924/30107H01L2924/3011H01L2924/00015H01L2924/00
    • A transistor power switch device (400, 700) comprising a semiconductor body (101 ) presenting opposite first and second faces (104, 106), the switch device comprising an array of vertical field-effect transistor elements (108) for carrying current between the first and second faces (104, 106), the array of transistor elements (108) comprising at the first face (104) an array of source regions (114) of a first semiconductor type, at least one body region (122, 124, 126) of a second semiconductor type opposite to the first type interposed between the source regions (114) and the second face (106), and at least one control electrode (116) for switchably controlling flow of the current through the second transistor region (122, 124, 126), and a conductive layer (1 10) contacting the source regions (114) and insulated from the control electrode (116) by at least one insulating layer (120, 121 ). The source region (114) of each of the vertical transistor elements (108) contacting the conductive layer (1 10) comprises a plurality of arms extending radially at the first face (104) towards an arm of a source region (114) of an adjacent vertical transistor element (108) of the array, the at least one body region (122, 124, 126) extending around and under the arms of the source regions (114) and extending up within each of the source regions to contact the conductive layer (110) at the first face (104) at a contact position (402) adjacent an end of each of the arms of the source regions (114).
    • 一种晶体管功率开关装置(400,700),包括呈现相对的第一和第二面(104,106)的半导体本体(101),所述开关装置包括一组垂直场效应晶体管元件(108),用于承载 第一和第二面(104,106),所述晶体管元件阵列(108)在所述第一面(104)处包括第一半导体类型的源极区域(114)的阵列,至少一个体区(122,124, 126)与插入在源区(114)和第二面(106)之间的第一类型相反的第二半导体类型,以及用于可切换地控制流过第二晶体管区域的电流的至少一个控制电极(116) 122,124,126)和通过至少一个绝缘层(120,121)与源极区域(114)接触并与控制电极(116)绝缘的导电层(110)。 每个垂直晶体管元件(108)的与导电层(110)接触的源极区域(114)包括多个臂,其在第一面(104)处径向延伸朝向源极区域(114)的臂 所述阵列的相邻的垂直晶体管元件(108),所述至少一个主体区域(122,124,126)在所述源极区域(114)的臂周围和下方延伸并且在每个源极区域内向上延伸以接触所述导电 在与源区域(114)的每个臂的端部相邻的接触位置(402)处在第一面(104)处的层(110)。
    • 3. 发明申请
    • POWER SEMICONDUCTOR DEVICE
    • 功率半导体器件
    • WO2006024322A1
    • 2006-03-09
    • PCT/EP2004/011074
    • 2004-08-31
    • FREESCALE SEMICONDUCTOR, INC.REYNES, Jean-MichelALVES, StéphaneDERAM, IvanaLOPES, BlandinoMARGHERITTA, JoëlMORANCHO, Frédéric
    • REYNES, Jean-MichelALVES, StéphaneDERAM, IvanaLOPES, BlandinoMARGHERITTA, JoëlMORANCHO, Frédéric
    • H01L29/78
    • H01L29/7802H01L29/0623H01L29/0634H01L29/0696H01L29/0878
    • A power semiconductor device comprising an array of cells distributed over a surface of a substrate (62), the source regions (37) of the individual cells of the array comprising a plurality of source region branches (80) each extending laterally outwards towards at least one source region branch (80) of an adjacent cell and presenting juxtaposed ends, the base regions (36) of the individual cells of the array comprising a corresponding plurality of base region branches merging together adjacent and between the juxtaposed ends of the source region branches (80) to form a single base region surrounding the source regions (37) of the individual cells of the array in the substrate. The junctions between the merged base region (36) and the drain region are solely concave laterally and define rounded current conduction path areas (39) for the on-state of the device between adjacent cells that are depleted in the off-state of the device to block flow of current from the source regions (37) to the drain electrode (83). Floating voltage regions (102) of opposite conductivity type to the drain region are buried in the substrate (62) beneath the merged base region (36) and present features (104) corresponding to and juxtaposed with features of the merged base region (36) in each cell so that the voltage of the floating voltage regions (102) tends to the voltage of the source regions (37) when depletion layers blocking the current conduction paths reach the floating voltage regions (102), whereby to enhance the development of the depletion layers. The features (104) of the floating voltage regions define rings of the opposite conductivity type to the drain region that surround the current conduction paths (39) of respective cells. The floating voltage regions (102) include respective islands (106) situated within the current conduction paths (39).
    • 一种功率半导体器件,包括分布在衬底(62)的表面上的电池阵​​列,所述阵列的各个单元的源极区(37)包括多个源极区分支(80),每个源极区分支(80)至少横向向外延伸 相邻单元的一个源区域分支(80)并且呈现并置端,阵列的各个单元的基区(36)包括相邻的多个基本区域分支,所述多个基本区域分支在源区域分支的并置端 (80)以形成围绕衬底中的阵列的各个单元的源极区域(37)的单个基极区域。 合并的基极区域(36)和漏极区域之间的结点仅仅是侧向凹入的,并且限定用于在器件截止状态下耗尽的相邻单元之间的器件导通状态的圆形电流传导路径区域(39) 阻止从源极区域(37)到漏电极(83)的电流。 与漏极区相反的导电类型的浮动电压区域(102)被埋在合并的基极区域(36)下面的衬底(62)中,并且呈现与合并的基极区域(36)的特征对应并并置的特征(104) 在每个单元中,当阻挡电流传导路径的耗尽层到达浮动电压区域(102)时,浮动电压区域(102)的电压趋向于源极区域(37)的电压,由此, 耗尽层。 浮动电压区域的特征(104)限定环绕相应电池的电流传导路径(39)的漏极区域的相反导电类型的环。 浮动电压区域(102)包括位于电流传导路径(39)内的各自的岛(106)。
    • 4. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD OF FORMING A SEMICONDUCTOR DEVICE
    • 半导体器件及形成半导体器件的方法
    • WO2008084278A1
    • 2008-07-17
    • PCT/IB2007/000582
    • 2007-01-10
    • FREESCALE SEMICONDUCTOR, INC.EVGUENIY, Stefanov NDERAM, IvanaREYNES, Jean-Michel
    • EVGUENIY, Stefanov NDERAM, IvanaREYNES, Jean-Michel
    • H01L29/78H01L21/336H01L29/06H01L29/423
    • H01L29/66719H01L29/0623H01L29/0634H01L29/42372H01L29/66712H01L29/7395H01L29/7811H01L29/8083
    • A method of forming a semiconductor device having an active area (2) and a termination area (3) surrounding the active area comprises providing a semiconductor substrate (4), providing a semiconductor layer (6) of a first conductivity type over the semiconductor substrate and forming a mask layer (52) over the semiconductor layer. The mask layer (52) outlines at least two portions (54, 56) of a surface of the semiconductor layer: a first outlined portion (54) outlining a floating region (8) in the active area (2) and a second outlined portion (56) outlining a termination region (12) in the termination area (3). Dopants of a second conductivity type are provided to the first (54) and second (56) outlined portions so as to provide a floating region (8) of the second conductivity type buried in the semiconductor layer (6) in the active area (2) and a first termination region (12) of the second conductivity type buried in the semiconductor layer (6) in the termination area (3) of the semiconductor device.
    • 形成具有有源区域(2)和围绕有源区域的端接区域(3)的半导体器件的方法包括提供半导体衬底(4),在半导体衬底上提供第一导电类型的半导体层(6) 以及在所述半导体层上形成掩模层(52)。 掩模层(52)概述半导体层的表面的至少两个部分(54,56):概述有源区域(2)中的浮动区域(8)的第一轮廓部分(54)和第二轮廓部分 (56)概述了终止区域(3)中的终止区域(12)。 第二导电类型的掺杂剂被提供给第一(54)和第二(56)轮廓部分,以便提供掩埋在有源区域(2)中的半导体层(6)中的第二导电类型的浮动区域(8) )和埋在半导体器件的端接区域(3)中的半导体层(6)中的第二导电类型的第一端接区域(12)。