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1. 发明申请

WO2017171869A1 TEXTURE BREAKING LAYER TO DECOUPLE BOTTOM ELECTRODE FROM PMTJ DEVICE 审中-公开
标题翻译：纹理断层以从PMTJ装置中分离底部电极
公开(公告)号：WO2017171869A1
公开(公告)日：2017-10-05
申请号：PCT/US2016/025709
申请日：2016-04-01
申请人： INTEL CORPORATION
发明人： MAERTZ, Brian , WIEGAND, Christopher, J. , OEULLETTE, Daniel, G. , RAHMAN, MD Tofizur , GOLONZKA, Oleg , BROCKMAN, Justin, S. , GHANI, Tahir , DOYLE, Brian, S. , O'BRIEN, Kevin, P. , DOCZY, Mark, L. , OGUZ, Kaan
IPC分类号： H01L43/02 , H01L43/08 , H01L43/10 , H01L43/12
摘要： An apparatus including an array of memory cells arranged in a grid defined by word lines and bit lines in a generally orthogonal orientation relative to one another, a memory cell including a resistive memory component and an access transistor, wherein the access transistor includes a diffusion region disposed at an acute angle relative to an associated word line. A method including etching a substrate to form a plurality of fins each including a body having a length dimension including a plurality of first junction regions and a plurality of second junction regions that are generally parallel to one another and offset by angled channel regions displacing in the length dimension an end of a first junction region from the beginning of a second junction region; removing the spacer material; and introducing a gate electrode on the channel region of each of the plurality of fins.
摘要翻译：一种装置，包括：布置在由字线和位线限定的栅格中的存储器单元阵列，存储器单元包括电阻存储器组件和存取晶体管，其中所述存取晶体管包括相对于相关字线以锐角设置的扩散区。一种方法包括蚀刻基板以形成多个鳍片，每个鳍片包括具有长度尺寸的主体，所述主体包括多个第一结区域和多个第二结区域，所述多个第一结区域和多个第二结区域彼此大致平行并且被成角度的沟道区域从第二结区的起始处开始第一结区的末端; 去除间隔物材料; 并在多个鳍片中的每个鳍片的沟道区域上引入栅电极。

2. 发明申请

WO2017111822A1 PITCH DIVISION USING DIRECTED SELF-ASSEMBLY 审中-公开
标题翻译：使用直接自组装的PITCH部门
公开(公告)号：WO2017111822A1
公开(公告)日：2017-06-29
申请号：PCT/US2015/000380
申请日：2015-12-24
申请人： INTEL CORPORATION
发明人： BOJARSKI, Stephanie, A. , CHANDHOK, Manish , YOUNKIN, Todd, R. , HAN, Eungnak , ELINENI, Kranthi , GAIKWAD, Ashish, N. , NYHUS, Paul, A. , WALLACE, Charles, H. , YOO, Hui, Jae
IPC分类号： H01L21/027
CPC分类号： H01L21/31144 , G03F7/0002 , H01L21/0337
摘要： A method including forming a target pattern of a target material on a surface of a substrate; depositing a block copolymer on the surface of the substrate, wherein one of two blocks of the block copolymer preferentially aligns to the target material and the two blocks self assemble after deposition into repeating lamellar bodies on the surface of the substrate; selectively retaining one of the two blocks of the block copolymer over the other as a polymer pattern; and patterning the substrate with the polymer pattern. An apparatus including an integrated circuit substrate including a plurality of contact points and a dielectric layer on the contact points; a target pattern formed in a surface of the dielectric layer; and a self-assembled layer of repeating alternating bodies of a block copolymer, wherein one of two blocks of the block copolymer is preferentially aligned to the target pattern.
摘要翻译：一种方法，包括：在基板的表面上形成目标材料的目标图案; 将嵌段共聚物沉积在基材的表面上，其中嵌段共聚物的两个嵌段之一优先与靶材料对齐，并且两个嵌段在沉积到基材表面上的重复的层状体之后自组装; 选择性地将嵌段共聚物的两个嵌段之一作为聚合物图案保留在另一个之上; 并用该聚合物图案图案化该衬底。一种装置，包括集成电路衬底，所述集成电路衬底包括在所述接触点上的多个接触点和电介质层; 目标图案，形成在介电层的表面中; 和重复嵌段共聚物交替体的自组装层，其中嵌段共聚物的两个嵌段之一优先与目标图案对齐。

3. 发明申请

WO2017048219A1 ADVANCED NODE COST REDUCTION BY ESD INTERPOSER 审中-公开
标题翻译：先进的节点降低ESD插件
公开(公告)号：WO2017048219A1
公开(公告)日：2017-03-23
申请号：PCT/US2015/049923
申请日：2015-09-14
申请人： INTEL IP CORPORATION
发明人： SEIDEMANN, Georg , GEISSLER, Christian , REINGRUBER, Klaus
IPC分类号： H01L23/60 , H01L27/02
CPC分类号： H01L27/0296 , H01L23/147 , H01L23/481 , H01L23/49816 , H01L23/49827 , H01L23/60 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L25/0655 , H01L25/105 , H01L25/18 , H01L27/0255 , H01L28/00 , H01L2224/02166 , H01L2224/02372 , H01L2224/0401 , H01L2224/04042 , H01L2224/05548 , H01L2224/0557 , H01L2224/12105 , H01L2224/13007 , H01L2224/13024 , H01L2224/131 , H01L2224/16145 , H01L2224/16146 , H01L2224/16235 , H01L2224/16237 , H01L2224/16238 , H01L2224/17181 , H01L2224/24137 , H01L2224/32245 , H01L2224/48091 , H01L2224/48106 , H01L2224/48108 , H01L2224/48137 , H01L2224/48145 , H01L2224/48157 , H01L2224/73253 , H01L2224/73265 , H01L2224/81815 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/10253 , H01L2924/10271 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/15321 , H01L2924/15331 , H01L2924/19107 , H01L2924/014 , H01L2224/45099
摘要： An apparatus including an electrostatic discharge circuit including a first circuit portion coupled beneath a die contact pad of an integrated circuit die and a second circuit portion in an interposer separate from the integrated circuit die, the interposer including a first contact point coupled to the contact pad of the integrated circuit die and a second contact point operable for connection to an external source. A method including forming an integrated circuit die including a first electrostatic discharge structure beneath a contact pad of the die; and coupling the die to an interposer including an interposer contact and a second electrostatic discharge structure, wherein a signal at the contact pad of the die is operable to be routed through the interposer.
摘要翻译：一种包括静电放电电路的装置，包括耦合在集成电路管芯的管芯接触焊盘下方的第一电路部分和与集成电路管芯分开的插入器中的第二电路部分，所述插入器包括耦合到接触焊盘的第一接触点并且可操作用于连接到外部源的第二接触点。一种包括在芯片的接触焊盘下方形成包括第一静电放电结构的集成电路管芯的方法; 以及将所述管芯耦合到包括插入器接触件和第二静电放电结构的插入器，其中所述管芯的接触焊盘处的信号可操作地穿过所述插入件。

4. 发明申请

WO2015195082A1 METHOD FOR DIRECT INTEGRATION OF MEMORY DIE TO LOGIC DIE WITHOUT USE OF THROUGH SILICON VIAS (TSV) 审中-公开
标题翻译：无需使用硅胶（TSV）将存储器直接集成到逻辑芯片的方法
公开(公告)号：WO2015195082A1
公开(公告)日：2015-12-23
申请号：PCT/US2014/042574
申请日：2014-06-16
申请人： INTEL CORPORATION
发明人： NELSON, Donald W. , WEBB, M Clair , MORROW, Patrick , JUN, Kimin
IPC分类号： H01L23/12 , H01L21/60
CPC分类号： H01L25/0652 , H01L23/5383 , H01L23/5384 , H01L23/5389 , H01L24/03 , H01L24/06 , H01L24/17 , H01L25/50 , H01L2224/16225 , H01L2924/0002 , H01L2924/1436 , H01L2924/00
摘要： A method including forming a first substrate including an integrated circuit device layer disposed between a plurality of first interconnects and a plurality of second interconnects; coupling a second substrate including a memory device layer to the first substrate so that the memory device layer is juxtaposed to one of the plurality of first interconnects and the plurality of second interconnects; and removing a portion of the first substrate. An apparatus including a device layer including a plurality of circuit devices disposed between a plurality of first interconnects and a plurality of second interconnects on a substrate; a memory device layer including a plurality of memory devices juxtaposed and coupled to one of the plurality of first interconnects and the plurality of second interconnects; and contacts points coupled to one of ones of the first plurality of interconnects and ones of the second plurality of interconnects.
摘要翻译：一种包括形成包括设置在多个第一互连和多个第二互连之间的集成电路器件层的第一衬底的方法; 将包括存储器件层的第二衬底耦合到所述第一衬底，使得所述存储器件层与所述多个第一互连和所述多个第二互连中的一个并置; 以及去除所述第一基板的一部分。一种装置，包括：器件层，包括设置在基板上的多个第一互连和多个第二互连之间的多个电路器件; 存储器件层，包括并置并耦合到所述多个第一互连和所述多个第二互连中的一个的多个存储器件; 以及联接到所述第一多个互连中的一个和所述第二多个互连中的一个的接触点。

5. 发明申请

WO2015077527A2 ALLOY MELTING AND HOLDING FURNACE 审中-公开
标题翻译：合金熔炼和保温炉
公开(公告)号：WO2015077527A2
公开(公告)日：2015-05-28
申请号：PCT/US2014/066755
申请日：2014-11-21
申请人： ALMEX USA, INC.
发明人： TILAK, Ravindra V.
IPC分类号： F27B14/06
CPC分类号： H05B6/42 , B22D11/003 , B22D11/0403 , B22D11/10 , B22D11/119 , B22D11/14 , B22D25/06 , C22B9/003 , C22C21/00 , C22C21/06 , C22C21/16 , F27B14/06 , F27B14/061 , F27B14/20 , F27D7/06 , H05B6/26 , H05B6/28 , H05B6/367 , Y02P10/253
摘要： An induction furnace comprising a furnace vessel; an induction coil positioned below the upper furnace vessel; and a melt-containing vessel positioned inside the induction coil and communicably connected to the furnace vessel, wherein the positioning of the melt-containing vessel inside the induction coil defines a gap between an outside surface of the melt-containing vessel and an inside surface of the induction coil. A system for direct-chill casting comprising at least one an induction furnace; at least one in-line filter operable to remove impurities in molten metal; at least one gas source coupled to a feed port associated with the gas; and at least one device for solidifying metal by casting. A method of cooling an induction furnace comprising introducing a gas into a gap between an induction coil and a melt-containing vessel positioned inside the induction coil; and circulating the gas through the gap.
摘要翻译：一种感应炉，包括炉容器; 位于上部炉容器下方的感应线圈; 以及位于感应线圈内部并且可连通地连接到炉容器的熔体容纳容器，其中将含熔融容器的位置定位在感应线圈内部，在熔融物容器的外表面和内侧表面之间形成间隙感应线圈。一种用于直接冷却铸造的系统，包括至少一个感应炉; 至少一个在线过滤器可操作以去除熔融金属中的杂质; 耦合到与气体相关联的进料口的至少一个气体源; 和用于通过铸造固化金属的至少一个装置。一种感应炉的冷却方法，包括将气体引入位于感应线圈内部的感应线圈与含熔体容器之间的间隙中; 并使气体循环通过间隙。

6. 发明申请

WO2014172530A1 METHOD FOR GENERATING A COMPOSITE IMAGE OF AN OBJECT COMPOSED OF MULTIPLE SUB-IMAGES 审中-公开
标题翻译：用于生成由多个子图像组成的对象的复合图像的方法
公开(公告)号：WO2014172530A1
公开(公告)日：2014-10-23
申请号：PCT/US2014/034477
申请日：2014-04-17
申请人： SAKURA FINETEK U.S.A., INC.
发明人： FUCHS, Frank
IPC分类号： G02B21/00
CPC分类号： G06T3/4038 , G02B21/16 , G02B21/367 , G06K9/342 , G06T5/50 , G06T2207/10024 , G06T2207/10056 , G06T2207/20221 , G06T2207/30004
摘要： The invention relates to a method for combining a composite image (4) of an object (8) composed of multiple sub-images (6) by means of so-called stitching. Multiple adjacent sub-images (6) of the object (8) are captured and are stitched by means of an image processing operation together to form a coherent composite image (4). In order to make it possible to stitch the sub-images (6) together in the correct position even in the case of little information about the image, it is proposed that the stitching of the sub-images (6) together to form the composite image in the image processing operation be performed using an optical pattern (30, 74) that is generated by means of a pattern means (44).
摘要翻译：本发明涉及一种通过所谓拼接来组合由多个子图像（6）构成的物体（8）的合成图像（4）的方法。拍摄对象（8）的多个相邻子图像（6），并通过图像处理操作将其缝合以形成相干合成图像（4）。为了使得即使在关于图像的信息很少的情况下，也可以将子图像（6）拼接在正确的位置，因此提出将子图像（6）的拼接在一起以形成复合物使用通过图案装置（44）产生的光学图案（30,74）来执行图像处理操作中的图像。

7. 发明申请

WO2014093531A1 MODULATION OF MYOFIBER REPAIR BY ANTI-MYOSTATIN IN STRATEGIES WITH STEM CELLS 审中-公开
标题翻译：用干细胞在抗肿瘤药物中的肌纤维蛋白酶修复调节
公开(公告)号：WO2014093531A1
公开(公告)日：2014-06-19
申请号：PCT/US2013/074467
申请日：2013-12-11
申请人： LOS ANGELES BIOMEDICAL RESEARCH INSTITUTE AT HARBOR-UCLA MEDICAL CENTER
发明人： GONZALEZ-CADAVID, Nestor F. , WHITE, Rodney A.
IPC分类号： A61K31/425 , A61K39/395 , A61K48/00 , A01N43/78 , C07D277/00 , C12N5/071 , C07K16/18 , C07K2/00
CPC分类号： A61K31/7105 , A61K31/425 , A61K31/4439 , A61K31/713 , A61K35/545 , A61K38/1709 , A61K38/39 , A61K45/06 , C07K16/22 , C12N15/1136 , C12N2310/11 , C12N2310/141 , C12N2320/31
摘要： Treating or inhibiting an ischemic condition affecting the skeletal muscle comprising administering an agent having a property to inhibit an activity or a protein expression of myostatin or growth differentiation factor 8 (GDF-8) according to a regimen to treat or inhibit the ischemic condition. Treating or inhibiting an ischemic condition affecting the skeletal muscle including administering an effective amount of a thiazolidenedione or other PPAR gamma agonist at a dosage that do not exert glycemic control or induce overweight. A kit for use in treating or inhibiting an ischemic condition affecting the skeletal muscle comprising a quantity of an agent having a property to inhibit an activity or a protein expression of myostatin or growth differentiation factor 8 (GDF-8) and/or a quantity of a thiazolidenedione or other PPAR gamma agonist and instructions for administration of a dosage of that quantity according to a long term continuous regimen.
摘要翻译：治疗或抑制影响骨骼肌的缺血状况，包括根据治疗或抑制缺血状况的方案，施用具有抑制肌生成抑制素或生长分化因子8（GDF-8）的活性或蛋白质表达的性质的药剂。治疗或抑制影响骨骼肌的缺血状况，包括以不施用血糖控制或诱发超重的剂量施用有效量的噻唑烷二酮或其它PPARγ激动剂。用于治疗或抑制影响骨骼肌的缺血状况的试剂盒，其包含一定量的具有抑制肌生成抑制素或生长分化因子8（GDF-8）的活性或蛋白质表达的性质的试剂和/或一定量的噻唑烷二酮或其它PPARγ激动剂，以及根据长期连续方案施用该剂量的说明书。

8. 发明申请

WO2013176662A1 MULTI-STACKED BBUL PACKAGE 审中-公开
标题翻译：多层BBUL包装
公开(公告)号：WO2013176662A1
公开(公告)日：2013-11-28
申请号：PCT/US2012/039062
申请日：2012-05-23
申请人： INTEL CORPORATION , GOH, Eng Huat , TEOH, Hoay Tien
发明人： GOH, Eng Huat , TEOH, Hoay Tien
IPC分类号： H01L23/48 , H01L23/12
CPC分类号： H01L21/50 , H01L23/48 , H01L23/49816 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/82 , H01L2223/6677 , H01L2224/04105 , H01L2224/12105 , H01L2224/24011 , H01L2224/24105 , H01L2224/24226 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2924/10253 , H01L2924/18162 , H05K1/185 , H05K3/4682 , H01L2924/00
摘要： A method including forming a first portion of a build-up carrier on at least one first die, the at least one first die; coupling at least one second die to the first portion of the build-up carrier, the at least one second die separated from the first die by the at least one layer of conductive material disposed between layers of dielectric material; and after coupling the at least one second die to the first portion of the build-up carrier, forming a second portion of the build-up carrier on the at least one second die. An apparatus including a build-up carrier including including alternating layers of conductive material and dielectric material and at least two dice therein in different planes of the build-up carrier.
摘要翻译：一种方法，包括在至少一个第一管芯上形成积聚载体的第一部分，所述至少一个第一管芯; 将至少一个第二管芯耦合到所述堆积载体的第一部分，所述至少一个第二管芯通过设置在介电材料层之间的所述至少一个导电材料层与所述第一管芯分离; 并且在将所述至少一个第二管芯耦合到所述堆积载体的第一部分之后，在所述至少一个第二管芯上形成所述堆积载体的第二部分。一种包括积聚载体的装置，包括在积层载体的不同平面中包括交替的导电材料和介电材料层和至少两个骰子。

9. 发明申请

WO2013130844A2 RADIAL COAL ASH-BASED MICRO-ARCHITECTURES AND METHOD OF SYNTHESIS 审中-公开
标题翻译：径向煤灰基微结构和合成方法
公开(公告)号：WO2013130844A2
公开(公告)日：2013-09-06
申请号：PCT/US2013/028374
申请日：2013-02-28
申请人： MACAEL, INC.
发明人： BESCHER, Eric, P. , STREMFEL, Jacob, W. , KAO, Grant, M. , SALKOWSKI, John, T. , HOYLE, Walter, J. , VALLENS, John, Kenneth , RICE, Edward, K.
IPC分类号： C04B28/02
CPC分类号： C04B7/323 , B82Y30/00 , C04B18/08 , C04B28/065 , C04B2103/0067 , C04B2111/00008 , C04B2111/0025 , Y02W30/92 , Y10T428/2982 , C04B20/1077 , C04B20/0004
摘要： Microparticles having crystalline needle or rod-shaped structures of, for example, an ettringite mineral grown and attached radially from their surface. A method including nucleating and growing crystalline needles/rods from the surface of a particle in the presence of a solution of calcium, sulfur, and aluminum such as calcium sulfoaluminate, lime and calcium sulfate is described. One example is the radial growth of ettringite needles on the surface of fly ash particles in calcium sulfoaluminate-based cement paste and concrete. A particle including a substrate comprising a plurality of crystalline needle or rod-shaped structures of an ettringite mineral attached radially to a surface of the substrate, wherein the substrate includes one of an approximately spherical shape, a rod, a ring or a platelet.
摘要翻译：具有晶体针状或棒状结构的微粒，例如从其表面径向生长和附着的钙矾石矿物。描述了在钙，硫和铝的溶液（例如磺铝酸钙，石灰和硫酸钙）存在下从颗粒表面成核和生长结晶针/棒的方法。一个例子是在基于硫铝酸钙的水泥浆和混凝土中的飞灰颗粒表面上的钙矾石针的径向生长。一种包含基材的颗粒，该基材包含多个沿着基材表面径向附着的钙矾石矿物的结晶针状或棒状结构，其中所述基材包括大致球形，棒状，环状或血小板中的一种。

10. 发明申请

WO2013101226A1 APPARATUS AND METHOD FOR AUTOMATED SORT PROBE ASSEMBLY AND REPAIR 审中-公开
标题翻译：自动排序探头组装和维修的装置和方法
公开(公告)号：WO2013101226A1
公开(公告)日：2013-07-04
申请号：PCT/US2011/068229
申请日：2011-12-30
申请人： INTEL CORPORATION , ALBERTSON, Todd, P. , CRAIG, David, M. , KAZA, Anil , SHIA, David
发明人： ALBERTSON, Todd, P. , CRAIG, David, M. , KAZA, Anil , SHIA, David
IPC分类号： H01L21/66 , G01R1/073
CPC分类号： G01R3/00 , G01R1/06705 , G01R1/07314 , Y10S901/02 , Y10T29/49002 , Y10T29/49004 , Y10T29/53022 , Y10T29/5313
摘要： An apparatus comprising a robot; an end effector coupled to the robot and configured to grasp or transfer a probe of a size for use in a probe card; and instructions stored on a machine readable medium coupled to the robot, the instructions comprising to configure the robot to transfer a probe to a probe card substrate or, where the probe is attached to a probe card substrate, to move the probe. A method comprising automatically transferring a probe to a probe card substrate in an assembly process or, where the probe is attached to a probe card substrate, moving the probe in a repair process; and after transferring or moving the probe, heating the probe with a heat source.
摘要翻译：一种包括机器人的装置; 耦合到所述机器人并被配置为抓住或传送尺寸用于探针卡的探针的端部执行器; 以及存储在耦合到所述机器人的机器可读介质上的指令，所述指令包括构造所述机器人以将探针传送到探针卡基板，或者所述探针附接到探针卡基板上以移动所述探针。一种方法，包括在组装过程中自动将探针转移到探针卡基底，或者其中探针连接到探针卡基底上，在修复过程中移动探针; 在传送或移动探头之后，用热源加热探头。

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