专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2009140050A3 ELECTRONIC ASSEMBLIES WITHOUT SOLDER AND METHOD FOR THEIR DESIGN, PROTOTYPING, AND MANUFACTURE 审中-公开
标题翻译：没有焊接的电子组件及其设计，原型和制造方法
公开(公告)号：WO2009140050A3
公开(公告)日：2010-02-18
申请号：PCT/US2009041835
申请日：2009-04-27
申请人： OCCAM PORTFOLIO LLC , FJELSTAD JOSEPH C , GAMINI NADER , TICHANE DAVID
发明人： FJELSTAD JOSEPH C , GAMINI NADER , TICHANE DAVID
IPC分类号： H05K13/04 , H05K3/30
CPC分类号： H05K1/185 , H01L24/24 , H01L24/82 , H01L2224/24227 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/14 , H05K3/1241 , H05K2201/10515 , H05K2201/10628 , H05K2201/10689 , H05K2201/10719 , H05K2203/0173 , H05K2203/1469 , Y10T29/49117
摘要： A system for prototyping electrical circuits, as well as creating production circuits, without using solder. Stand-in electrical components 110a are placed on a carrier 100a and scanned 310. From the resulting data, a machine tool or laser ablation system 410 then creates a negative master 420a with aperture(s) 530 into which production components 810 are placed and secured. Component leads 820 or packages are encapsulated with electrically insulating material 910 with vias 1030a exposing the leads. Traces 1040 connect appropriate leads forming a circuit sub-assembly 1000 which can serve as a basis for a circuit assembly formed through a reverse-interconnection process.
摘要翻译：用于原型电路的系统，以及创建生产电路，而不使用焊料。待机电气元件110a被放置在载体100a上并扫描310.根据所得数据，机床或激光烧蚀系统410然后创建具有孔530的负主体420a，生产部件810被放置并固定到其中。元件引线820或封装被电绝缘材料910封装，通孔1030a暴露引线。迹线1040连接形成电路子组件1000的适当导线，其可以用作通过反向互连工艺形成的电路组件的基础。

2. 发明申请

WO2009117530A3 MONOLITHIC MOLDED FLEXIBLE ELECTRONIC ASSEMBLIES WITHOUT SOLDER AND METHODS FOR THEIR MANUFACTURE 审中-公开
标题翻译：不含焊料的单体模制柔性电子组件及其制造方法
公开(公告)号：WO2009117530A3
公开(公告)日：2009-12-23
申请号：PCT/US2009037581
申请日：2009-03-18
申请人： OCCAM PORTFOLIO LLC , FJELSTAD JOSEPH C
发明人： FJELSTAD JOSEPH C
IPC分类号： H05K13/04
CPC分类号： H05K1/185 , H01L2224/04105 , H01L2224/19 , H01L2224/24195 , H01L2224/73267 , H05K1/0278 , H05K3/1241 , H05K2201/0191 , H05K2201/09118 , H05K2203/1469
摘要： A method (10) for manufacturing a monolithic molded electronic assembly (12). A mold (14) having first and second mold potions (14a-b) that mate to form an interior chamber (16) is provided. The mold has an injection port (22) and channel (24) connecting into the chamber. Electronic parts (30) having electronic contacts (32) are populated onto the second mold portion, to be substantially contained in the chamber. The mold potions are mated together and a liquid insulating molding material (36) is injected through the injection port channel to fill the chamber. The molding material is hardened to a solid, thereby embedding the electronic parts in the molding material as a monolithic sub-assembly (40). The monolithic sub-assembly is removed from the mold and one or more solderless conductive circuits (50) are applied to the electronic contacts of the electronic parts, thereby providing the electronic assembly.
摘要翻译：一种用于制造单片模制电子组件（12）的方法（10）。提供具有配合以形成内部腔室（16）的第一和第二模具部分（14a-b）的模具（14）。模具具有连接到室中的注入口（22）和通道（24）。具有电子触点（32）的电子部件（30）填充到第二模具部分上，基本上容纳在腔室中。模具部分配合在一起，并通过注射口通道注入液体绝缘模制材料（36）以填充腔室。模制材料被硬化成固体，由此将电子部件作为整体子组件（40）嵌入模制材料中。将整体式子组件从模具中移除，并将一个或多个无焊接导电电路（50）施加到电子部件的电子触点上，由此提供电子组件。

3. 发明申请

WO2008102261A3 PROTECTING DIGITAL RIGHTS OF COPYRIGHT HOLDERS OF PUBLICLY DISTRIBUTED MULTIMEDIA FILES 审中-公开
标题翻译：保护公共分布式多媒体文件的版权所有人的数字权利
公开(公告)号：WO2008102261A3
公开(公告)日：2009-12-23
申请号：PCT/IB2008000571
申请日：2008-03-04
申请人： MICK COLIN K , SHEA RONALD R , FJELSTAD JOSEPH C , GRUNDY KEVIN P
发明人： MICK COLIN K , SHEA RONALD R , FJELSTAD JOSEPH C , GRUNDY KEVIN P
IPC分类号： H04L9/00 , H04N7/167
CPC分类号： G06F17/30849 , G06F17/30817 , G06F21/10 , G06F2221/0737 , G06F2221/0775 , G06F2221/2101 , G06F2221/2117 , G06F2221/2129 , G06F2221/2141 , G06F2221/2151 , H01L2224/49109 , H04L63/0428 , H04L63/062 , H04N7/1675 , H04N21/2223 , H04N21/2347 , H04N21/23473 , H04N21/2541 , H04N21/4126 , H04N21/42684 , H04N21/42692 , H04N21/43622 , H04N21/4408 , H04N21/4627 , H04N21/8358 , Y10S707/913 , Y10S707/914 , Y10S707/949
摘要： A video network includes public kiosks having digital storage capacity. Centralized inventory control manages the video files stored at individual kiosks or network LANs. A user requests a multimedia file for download, and selects various ancillary files and control features, such as languages, subtitles, control of nudity, etc. The requested file is encrypted according to an encryption key, watermarked, and downloaded from a high-speed port of a public kiosk to a hand-held proprietary high speed memory device of a user. Payment is received at the time of request or at the time of download, and royalties are distributed by the video network to copyright holders. Computer applications or playback devices allow users to store and/or play video files that have been downloaded to a hand-held device while managing and enforcing digital rights of content providers through the watermarking and/or encryption.
摘要翻译：视频网络包括具有数字存储容量的公共信息亭。集中的库存控制管理存储在个别信息亭或网络LAN的视频文件。用户请求下载多媒体文件，并选择各种辅助文件和控制功能，如语言，字幕，裸体控制等。所请求的文件根据加密密钥进行加密，加水印，并从高速下载公共电话亭的端口到用户的手持式专有高速存储设备。在请求时或在下载时收到付款，视频网络向版权所有者分发版税。计算机应用程序或播放设备允许用户存储和/或播放已经下载到手持设备的视频文件，同时通过水印和/或加密来管理和实施内容提供商的数字版权。

4. 发明申请

WO2009009639A2 ELECTRONIC ASSEMBLIES WITHOUT SOLDER AND METHODS FOR THEIR MANUFACTURE 审中-公开
标题翻译：没有焊接的电子组件及其制造方法
公开(公告)号：WO2009009639A2
公开(公告)日：2009-01-15
申请号：PCT/US2008/069600
申请日：2008-07-10
申请人： OCCAM PORTFOLIO LLC , FJELSTAD, Joseph C.
发明人： FJELSTAD, Joseph C.
IPC分类号： H01L21/60 , H05K3/32
CPC分类号： H05K1/188 , H01L23/5389 , H01L24/19 , H01L24/48 , H01L24/73 , H01L24/82 , H01L2224/04105 , H01L2224/24195 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/00014 , H01L2924/01029 , H01L2924/01055 , H01L2924/01078 , H01L2924/07811 , H01L2924/12041 , H01L2924/15311 , H01L2924/181 , H01L2924/19043 , H01L2924/19105 , H05K1/185 , H05K3/06 , H05K3/061 , H05K3/284 , H05K3/323 , H05K2201/0355 , H05K2203/1469 , Y10T29/4913 , Y10T29/49146 , Y10T29/49169 , Y10T428/24612 , H01L2924/00015 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for producing an assembly of electronic components and assemblies in accord with this, wherein the electronic components have component terminals. A conductive firmament having a first side and a second side is provided. Then the component terminals are connected to the first side of the firmament with an anisotropic conductor. A pattern is applied to the second side of said firmament. And portions of the firmament are removed based on the pattern, such that remaining portions of said firmament form the electrical circuit interconnecting the component terminals.
摘要翻译：一种用于制造与此相对应的电子部件和组件的组件的方法，其中电子部件具有部件端子。提供具有第一侧和第二侧的导电孔。然后组件端子用各向异性导体连接到穹顶的第一侧。一种模式适用于所述穹隆的第二面。并且基于图案去除穹隆的部分，使得所述穹形的剩余部分形成将元件端子互连的电路。

5. 发明申请

WO2005050708A3 STAIR STEP PRINTED CIRCUIT BOARD STRUCTURES FOR HIGH SPEED SIGNAL TRANSMISSIONS 审中-公开
标题翻译：用于高速信号传输的平台电路板印刷电路板结构
公开(公告)号：WO2005050708A3
公开(公告)日：2007-04-05
申请号：PCT/US2004038286
申请日：2004-11-15
申请人： SILICON PIPE INC , GRUNDY KEVIN P , WIEDEMANN WILLIAM F , FJELSTAD JOSEPH C
发明人： GRUNDY KEVIN P , WIEDEMANN WILLIAM F , FJELSTAD JOSEPH C
IPC分类号： H05K1/03 , H05K1/16 , H05K1/18 , H05K3/30 , H05K3/34 , H05K3/46
CPC分类号： H05K3/3405 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/48465 , H01L2224/49109 , H01L2224/73204 , H01L2924/15311 , H01L2924/19107 , H01L2924/3011 , H05K1/183 , H05K3/308 , H05K3/3421 , H05K3/3447 , H05K3/4602 , H05K3/4697 , H05K2201/0919 , H05K2201/092 , H05K2201/09845 , H05K2201/10189 , H05K2201/1059 , H05K2201/10689 , H05K2201/10704 , H05K2201/10727 , H05K2201/10734 , H01L2924/00
摘要： Disclosed are stair stepped PCB structures which provide high performance, direct path, via-less interconnections between various elements of an electronic interconnection structure including, among others, IC packages and connectors.
摘要翻译：公开了楼梯级PCB结构，其提供包括IC封装和连接器在内的电子互连结构的各种元件之间的高性能，直接路径，无通孔互连。

6. 发明申请

WO2005067684A3 INSULATING SUBSTRATE FOR IC PACKAGES HAVING INTEGRAL ESD PROTECTION 审中-公开
公开(公告)号：WO2005067684A3
公开(公告)日：2005-07-28
申请号：PCT/US2005/000775
申请日：2005-01-07
申请人： SILICON PIPE, INC. , FJELSTAD, Joseph, C. , GRUNDY, Kevin, P.
发明人： FJELSTAD, Joseph, C. , GRUNDY, Kevin, P.
IPC分类号： H01L23/02
摘要： An IC package substrate having integral ESD protection features and elements and a method for construction of the same are disclosed

7. 发明申请

WO2010129423A3 ESD PROTECTION UTILIZING RADIATED THERMAL RELIEF 审中-公开
标题翻译： ESD保护利用辐射热解决方案
公开(公告)号：WO2010129423A3
公开(公告)日：2010-11-11
申请号：PCT/US2010/033224
申请日：2010-04-30
申请人： INTERCONNECT PORTFOLIO LLC , GRUNDY, Kevin P. , FJELSTAD, Joseph C.
发明人： GRUNDY, Kevin P. , FJELSTAD, Joseph C.
IPC分类号： H01L27/04 , H01L23/60
摘要： An ESD device with a protection structure utilizing radiated heat dissipation to prevent or reduce thermal failures. The device includes a voltage switchable polymer 10 between electrodes 11 and 12, which is configured to provide a heat radiating surface 40 for radiating heat when an ESD condition occurs. A radiation transmission material 19 is disposed between the heat radiating surface and the environment for radiating heat 20 when an ESD event occurs. One embodiment adds a spacer 50 for accurately spacing electrodes. A method for fabricating the device is further illustrated.
摘要翻译：
具有保护结构的ESD器件，利用辐射散热来防止或减少热失效。该装置包括电极11和12之间的电压可切换聚合物10，其被配置为提供用于在发生ESD状况时散热的散热表面40。当发生ESD事件时，辐射传输材料19设置在散热表面与用于散热的环境20之间。一个实施例增加了用于精确地分隔电极的隔离物50 进一步说明制造该器件的方法。

8. 发明申请

WO2009140050A2 ELECTRONIC ASSEMBLIES WITHOUT SOLDER AND METHOD FOR THEIR DESIGN, PROTOTYPING, AND MANUFACTURE 审中-公开
标题翻译：没有焊接的电子组件及其设计，原型和制造方法
公开(公告)号：WO2009140050A2
公开(公告)日：2009-11-19
申请号：PCT/US2009/041835
申请日：2009-04-27
申请人： OCCAM PORTFOLIO LLC , FJELSTAD, Joseph, C. , GAMINI, Nader , TICHANE, David
发明人： FJELSTAD, Joseph, C. , GAMINI, Nader , TICHANE, David
IPC分类号： H05K13/04 , H05K3/30
CPC分类号： H05K1/185 , H01L24/24 , H01L24/82 , H01L2224/24227 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/14 , H05K3/1241 , H05K2201/10515 , H05K2201/10628 , H05K2201/10689 , H05K2201/10719 , H05K2203/0173 , H05K2203/1469 , Y10T29/49117
摘要： A system for prototyping electrical circuits, as well as creating production circuits, without using solder. Stand-in electrical components 110a are placed on a carrier 100a and scanned 310. From the resulting data, a machine tool or laser ablation system 410 then creates a negative master 420a with aperture(s) 530 into which production components 810 are placed and secured. Component leads 820 or packages are encapsulated with electrically insulating material 910 with vias 1030a exposing the leads. Traces 1040 connect appropriate leads forming a circuit sub-assembly 1000 which can serve as a basis for a circuit assembly formed through a reverse-interconnection process.
摘要翻译：用于原型电路的系统，以及创建生产电路，而不使用焊料。待机电气元件110a被放置在载体100a上并扫描310.根据所得数据，机床或激光烧蚀系统410然后创建具有孔530的负主体420a，生产部件810被放置并固定到其中。元件引线820或封装被电绝缘材料910封装，通孔1030a暴露引线。迹线1040连接形成电路子组件1000的适当导线，其可以用作通过反向互连工艺形成的电路组件的基础。

9. 发明申请

WO2009139787A1 LIGHT-EMITTING DIODE PACKAGE ASSEMBLY 审中-公开
标题翻译：发光二极管封装组件
公开(公告)号：WO2009139787A1
公开(公告)日：2009-11-19
申请号：PCT/US2008/072990
申请日：2008-08-13
申请人： OCCAM PORTFOLIO LLC , FJELSTAD, Joseph, C.
发明人： FJELSTAD, Joseph, C.
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , F21K9/00 , H01L24/24 , H01L24/73 , H01L24/82 , H01L33/62 , H01L33/641 , H01L33/647 , H01L2224/32245 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2924/01029 , H01L2924/12036 , H01L2924/12041 , H01L2924/351 , H01L2224/48091 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： An electrical device containing multiple light emitting diode (LED) dies each having respective first and second connectors suitable to receive current through the LED die. A common base layer of a first electrically conductive material has cavities into which at least one LED die is mounted with its second connector electrically connected by a conductive non-solder bonding material to the first conductive material of the base layer. One or more over-layer sections of a second electrically conductive material each are electrically connected by a bond to at least one of the first connector of a LED die. And an insulator electrically separates the first conductive material of the base layer from the second conductive material of over-layer sections.
摘要翻译：每个具有相应的第一和第二连接器的多个发光二极管（LED）管芯的电气设备适于接收通过LED管芯的电流。第一导电材料的公共底层具有空腔，至少一个LED管芯被安装在其中，其第二连接器通过导电非焊料接合材料电连接到基层的第一导电材料。第二导电材料的一个或多个超层部分各自通过结合电连接到LED管芯的第一连接器中的至少一个。并且绝缘体将基底层的第一导电材料与上层部分的第二导电材料电隔离。

10. 发明申请

WO2009117027A1 ELECTRONIC ASSEMBLIES WITHOUT SOLDER HAVING OVERLAPPING COMPONENTS 审中-公开
标题翻译：没有焊接组件的电子组件
公开(公告)号：WO2009117027A1
公开(公告)日：2009-09-24
申请号：PCT/US2008/086479
申请日：2008-12-11
申请人： OCCAM PORTFOLIO LLC , FJELSTAD, Joseph C. , GAMINI, Nader
发明人： FJELSTAD, Joseph C. , GAMINI, Nader
IPC分类号： H01L21/60 , H05K3/30
CPC分类号： H05K1/185 , H01L25/105 , H01L25/16 , H01L2225/1005 , H01L2225/1029 , H01L2225/107 , H01L2924/0002 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/3025 , H05K1/023 , H05K3/284 , H05K3/4664 , H05K2201/10515 , H05K2201/10628 , H05K2201/10636 , H05K2201/10689 , H05K2201/10704 , H05K2201/10719 , H05K2201/10734 , H05K2203/1469 , Y02P70/611 , H01L2924/00
摘要： An apparatus is disclosed that improves density of electrical components in a circuit assembly. Electrical components 202, 204 are stacked so that they overlap each other and are encapsulated in an electronic insulating material 104. The resulting subassembly may be integrated onto a printed circuit board or into a reverse-interconnection process assembly.
摘要翻译：公开了一种提高电路组件中的电气部件的密度的装置。电气部件202,204被堆叠成使得它们彼此重叠并且被封装在电子绝缘材料104中。所得到的子组件可以集成到印刷电路板或反向互连工艺组件中。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式