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1. 发明申请

WO2019020594A1 ELEKTRONISCHES SCHALTGERÄT MIT EINER ZUGENTLASTUNG FÜR EIN ANSCHLUSSKABEL UND EIN PRÜFUNGSVERFAHREN 审中-公开
公开(公告)号：WO2019020594A1
公开(公告)日：2019-01-31
申请号：PCT/EP2018/069974
申请日：2018-07-24
申请人： IFM ELECTRONIC GMBH
发明人： WEBER, Michael , HÖSS, Heribert
IPC分类号： H05K3/34 , H02G15/007 , H05K1/02 , H05K1/11 , H05K5/00 , H05K5/02
CPC分类号： H05K3/3405 , G01D11/245 , H05K1/0271 , H05K1/111 , H05K1/117 , H05K2201/094 , H05K2201/09427 , H05K2201/09445 , H05K2201/09663 , H05K2201/09781 , H05K2201/10356 , H05K2201/10446 , H05K2203/173
摘要： Elektronisches Schaltgerät mit einem Gehäuse (1), einem Anschlusskabel (3) und einer Leiterplatte (2) mit einer elektronischen Schaltung, wobei die Litzen (4) des Anschlusskabels (3) jeweils mit einem auf der Leiterplatte (2) angeordneten und zur Versorgung der elektronischen Schaltung dienenden ersten Kontaktpad (5) verbunden sind, wobei die Litzen (4) des Anschlusskabels (3) erfindungsgemäß jeweils mit einem auf der Leiterplatte (2) angeordneten zweiten Kontaktpad (6) verbunden sind, das von der Elektronikeinheit isoliert ist, näher am Kabeleintritt angeordnet ist, und lediglich der Zugentlastung dient. Außerdem ist ein Verfahren zur Kabelauszugsprüfung angegeben.

2. 发明申请

WO2015077953A1 ROTARY JOINT OF ROBOT AND ROBOT INCLUDING 审中-公开
标题翻译：机器人和机器人的旋转接头包括
公开(公告)号：WO2015077953A1
公开(公告)日：2015-06-04
申请号：PCT/CN2013/088020
申请日：2013-11-28
申请人： ABB TECHNOLOGY LTD , FENG, Tao , CAO, Kaiyuan , HA, Yun
发明人： FENG, Tao , CAO, Kaiyuan , HA, Yun
IPC分类号： B25J17/00 , B25J19/00 , H05K1/02 , H02G11/00
CPC分类号： B25J19/0041 , H01R12/61 , H01R35/025 , H05K1/189 , H05K3/3405 , H05K2201/10287
摘要： A rotary joint of a robot and the robot including are disclosed. The rotary joint comprises a wiring unit (4) having a main portion (12) of a flexible printed circuit (FPC) board (1) therein. Said rotary joint further comprises a protective unit (3) fixed to said wiring unit (4), in which an end portion (11) of said FPC board (1) is connected to a group of cables (2). Compared with the existing prior arts, the proposed solutions prevent the damage of FPC during assembly and/or disassembly of robots, while not losing compactness.
摘要翻译：公开了一种机器人的旋转接头和机器人。旋转接头包括其中具有柔性印刷电路板（FPC）板（1）的主要部分（12）的布线单元（4）。所述旋转接头还包括固定到所述接线单元（4）的保护单元（3），其中所述FPC基板（1）的端部（11）连接到一组电缆（2）。与现有的现有技术相比，提出的解决方案可防止机器人组装和/或拆卸过程中FPC的损坏，同时不会损坏机器人的紧凑性。

3. 发明申请

WO2015064637A1 回路基板、電子部品収納用パッケージおよび電子装置审中-公开
标题翻译：电路基板，电子元件封装和电子设备
公开(公告)号：WO2015064637A1
公开(公告)日：2015-05-07
申请号：PCT/JP2014/078756
申请日：2014-10-29
申请人：京セラ株式会社
发明人：川頭　芳規
IPC分类号： H05K1/11 , H01P3/04 , H05K1/02 , H05K1/14
CPC分类号： H05K1/0246 , H01P3/026 , H01P3/081 , H01P5/028 , H05K1/0245 , H05K1/025 , H05K1/0253 , H05K1/111 , H05K1/117 , H05K1/18 , H05K3/3405 , H05K3/363 , H05K5/0069 , H05K2201/09727 , H05K2201/10189
摘要：　回路基板（１０）は、誘電体から成り、表面および裏面を有する板状体（１）と、表面に形成された一対の信号線路（２，３）から成る差動信号線路（４）と、裏面に形成された接地導体（５）とを備える。信号線路（２，３）は、裏面の一端（１ａ）から所定距離（１ｂ）を隔てた端部内に接地導体（５）と距離を隔てて形成された端子（２ｂ，３ｂ）と、この端子（２ｂ，３ｂ）に接続され、端子（２ｂ，３ｂ）に対向させて表面の端部に設けられた接続パッド（２ｃ，３ｃ）と、接続パッド（２ｃ，３ｃ）から延びる伝送線路部（２ａ，３ａ）と、伝送線路部（２ａ，３ａ）の端子（２ｂ）と接地導体（５）との間に対応する位置に設けられた線幅を広くした拡幅部（２ｄ）とを有する。端子（２ｂ）によって、回路基板（１０）の裏面に接続用の端子（２ｂ）を有し、高周波特性に優れた回路基板（１０）とすることができる。
摘要翻译：该电路基板（10）设置有包括电介质体并具有前表面和后表面的板体（1），差分信号线（4）包括形成在一对信号线（2,3）上的一对信号线前表面和形成在背面上的接地导体（5）。信号线（2,3）具有：距离接地导体（5）一定距离形成的端子（2b，3b），远离背面的一端（1a）的规定距离（1b）的端部表面; 连接到所述端子（2b，3b）并且设置在前表面的端部和端子（2b，3b）的相对端的连接焊盘（2c，3c）从连接垫（2c，3c）延伸的传输线单元（2a，3a）; 以及其宽度被增加的加宽部分（2d），并且设置在与传输线单元（2a，3a）的接地导体（5）和端子（2b）之间的间隔相对应的位置，。通过端子（2b），可以实现在电路基板（10）的背面上具有连接端子（2b）并且具有优异的高频特性的电路基板（10）。

4. 发明申请

WO2015005982A1 PRINTED CIRCUIT BOARD WITH SIDE ACCESS TERMINATION PADS 审中-公开
标题翻译：具有侧面接线端子的印刷电路板
公开(公告)号：WO2015005982A1
公开(公告)日：2015-01-15
申请号：PCT/US2014/039448
申请日：2014-05-23
申请人： ILLINOIS TOOL WORKS INC.
发明人： WANG, Xianbo , HECKENKAMP, Mark R. , SMITH, Jerald J. , KIRBY, Maxwell J. , BARGHOLTZ, William E. , OSVATIC, Michael S.
IPC分类号： H05K1/11 , H05K3/32 , H01R12/75
CPC分类号： H05K1/119 , H01R12/728 , H01R12/75 , H05K1/09 , H05K1/117 , H05K1/181 , H05K3/007 , H05K3/325 , H05K3/3405 , H05K2201/09063 , H05K2201/09181 , H05K2201/10015 , H05K2201/10022 , H05K2201/10053 , H05K2201/10287 , H05K2201/1034 , H05K2201/10356 , H05K2201/10386 , H05K2203/0195 , H05K2203/167
摘要： A printed circuit board (10) provides lateral notches (22) for receiving wire conductors (30) in a lateral direction to be joined with printed circuit board traces by solder or an insulation displacement connector eliminating the need for laborious sequential insertion of conductors through printed circuit board holes.
摘要翻译：印刷电路板（10）提供横向凹口（22），用于在横向方向上接收导线（30），以通过焊料或绝缘位移连接器与印刷电路板迹线接合，从而消除了通过印刷电路板孔。

5. 发明申请

WO2007073085A3 COUPLING MECHANISM OF MOTOR COIL 审中-公开
标题翻译：电机线圈联轴器机构
公开(公告)号：WO2007073085A3
公开(公告)日：2009-05-22
申请号：PCT/KR2006005576
申请日：2006-12-19
申请人： DAEWOO ELECTRONICS CORP
发明人： CHO GYU-HONG
IPC分类号： H02K5/22
CPC分类号： H02K3/522 , H02K11/33 , H02K2203/03 , H02K2211/03 , H05K1/119 , H05K3/306 , H05K3/3405 , H05K2201/1003 , H05K2201/10287 , H05K2201/10303 , H05K2201/10863 , H05K2201/10962
摘要： The present invention relates to a coupling mechanism (100) for coupling a coil (130) wounded around a stator (150) of a motor assembly to a circuit pattern (111) of a printed circuit board (PCB) (110), includes a plurality of connecting pins (120) for electrically connecting the coil (130) to the circuit pattern (111) of the printed circuit board (110). The coil (130) is indirectly connected to the circuit pattern (111) through said one or more connecting pins (120). Further, the connecting pins (120) are fixed at the PCB (110) to be protruded outward.
摘要翻译：本发明涉及用于将缠绕在电动机组件的定子（150）周围的线圈（130）耦合到印刷电路板（PCB）（110）的电路图案（111）的耦合机构（100），包括多个用于将线圈（130）电连接到印刷电路板（110）的电路图案（111）的连接引脚（120）。线圈（130）通过所述一个或多个连接引脚（120）间接地连接到电路图案（111）。此外，连接销（120）固定在PCB（110）上以向外突出。

6. 发明申请

WO2008156200A2 METHOD OF BONDING CORE WIRES TO ELECTRODES AND ELECTRONIC UNIT FORMED BY BONDING ELECTRODES AND CORE WIRES 审中-公开
标题翻译：将芯线连接到电极和通过电极和芯线形成的电子单元的方法
公开(公告)号：WO2008156200A2
公开(公告)日：2008-12-24
申请号：PCT/JP2008/061508
申请日：2008-06-18
申请人： PANASONIC CORPORATION , SAKAI, Tadahiko
发明人： SAKAI, Tadahiko
IPC分类号： H05K3/34 , H05K3/32
CPC分类号： H05K3/323 , H01L24/45 , H01L24/46 , H01L24/48 , H01L24/85 , H01L2224/45565 , H01L2224/4847 , H01L2924/00011 , H01L2924/00014 , H01L2924/01047 , H05K3/3405 , H05K3/3484 , H05K3/3494 , H05K2201/10287 , H05K2201/10356 , H05K2203/0278 , H05K2203/0425 , Y10T156/10 , H01L2924/00 , H01L2224/45099 , H01L2924/01006
摘要： A method of bonding electrodes and core wires capable of shortening the operation time and improving the bonding strength and an electronic unit formed by bonding the electrodes and the core wires are intended to be provided. After supplying a thermosetting resin (8a) incorporated with solder particles (7a) so as to cover a plurality of electrodes (3) on a substrate (2), arranging each of core wires (6) while opposing vertically to each of the electrodes (3) above the substrate (2), locating a sheet member (11) above the core wires (6), hot pressing each of the core wires (6) and the thermosetting resin (8a) by way of the sheet member (11) by hot press bonding tool (12) from above the sheet member (11) to thermally cure the thermosetting resin (8a) and melt the solder particles (7a) contained in the thermosetting resin (8a), detaching the hot press bonding tool (12) from the thermally cured product (8) of the thermosetting resin (8a), bonding the core wires (6) and the electrodes (3) by the solidification product (7) of solder formed by solidification of a molten product of the solder particles (molten solder (7b)) and, finally, peeling the sheet member (11) from the thermally cured product (8).
摘要翻译：旨在提供一种能够缩短操作时间并提高接合强度的电极和芯线的接合方法以及通过接合电极和芯线而形成的电子单元。在供给包含焊料颗粒（7a）以便覆盖基板（2）上的多个电极（3）的热固性树脂（8a）之后，将每个芯线（6）设置成垂直于每个电极（6） 3）在基板（2）的上方，将片状部件（11）定位在芯线（6）的上方，通过片材（11）热压每个芯线（6）和热固性树脂（8a）通过热压接工具（12）从片材（11）的上方热固化热固性树脂（8a）并熔化包含在热固性树脂（8a）中的焊料颗粒（7a），分离热压接合工具（12））从热固性树脂（8a）的热固化产物（8）中，通过由焊料颗粒的熔融产物的固化而形成的焊料的凝固产物（7）将芯线（6）和电极（3）（熔融焊料（7b）），最后剥离片状部件（11）与热固化物（8）。

7. 发明申请

WO2006099571A3 MICRO SOLDER POT 审中-公开
公开(公告)号：WO2006099571A3
公开(公告)日：2007-12-06
申请号：PCT/US2006009669
申请日：2006-03-15
申请人： MEDCONX INC , KENT HAROLD B , LEVANTE JAMES J , FINE AARON T , LAYTON JOSEPH R
发明人： KENT HAROLD B , LEVANTE JAMES J , FINE AARON T , LAYTON JOSEPH R
IPC分类号： A21B1/00
CPC分类号： H05K3/3494 , H01L23/13 , H01L24/02 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/04042 , H01L2224/45015 , H01L2224/45139 , H01L2224/45147 , H01L2224/48 , H01L2224/78 , H01L2224/85 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/19043 , H01R43/0256 , H05K1/116 , H05K1/184 , H05K3/3405 , H05K3/3442 , H05K3/3447 , H05K3/403 , H05K2201/09181 , H05K2201/0949 , H05K2201/09781 , H05K2201/09845 , H05K2201/10446 , H05K2201/10636 , H05K2203/0195 , Y02P70/611 , Y02P70/613 , H01L2924/2075 , H01L2924/00014 , H01L2924/20754 , H01L2924/20755 , H01L2924/00015
摘要： A micro solder pot includes a dielectric substrate having at least one hole formed therein, a conductive coating coupled to the interior of the hole, and at least one heat transfer pad spaced from the hole in thermal communication with the conductive coating of the hole. When the heat transfer pad is exposed to a heat source, the conductive coating inside the hole is heated. The micro solder pot may also include a thermally activated conductive material disposed within the hole. When the heat transfer pad is exposed to a heat source, the thermally activated conductive material becomes liquidus such that a component can be inserted into the liquidus material. When the heat source is removed, the thermally activated conductive material cools to couple the component to the conductive coating in the hole.
摘要翻译：微焊料罐包括具有形成在其中的至少一个孔的电介质衬底，耦合到孔的内部的导电涂层以及与孔间隔开的与孔的导电涂层热连通的至少一个传热垫。当传热垫暴露于热源时，孔内的导电涂层被加热。微焊料罐还可以包括设置在孔内的热活化导电材料。当传热垫暴露于热源时，热活化的导电材料变成液相线，使得部件可以插入液相线材料中。当热源被去除时，热活化的导电材料冷却以将部件耦合到孔中的导电涂层。

8. 发明申请

WO2006075794A3 STRUCTURE AND METHOD FOR ATTACHING SHIELD CASE TO CIRCUIT BOARD, ELECTRONIC COMPONENT MODULE AND PORTABLE TELEPHONE 审中-公开
标题翻译：将电路板，电子元件和便携式电话连接到外壳的结构和方法
公开(公告)号：WO2006075794A3
公开(公告)日：2007-02-01
申请号：PCT/JP2006300787
申请日：2006-01-13
申请人： FUJIFILM CORP , IMAMURA TAKASHI
发明人： IMAMURA TAKASHI
IPC分类号： H05K9/00 , H05K3/34
CPC分类号： H05K9/0028 , H05K3/3405 , H05K3/3447 , H05K2201/10371 , H05K2201/10916 , Y10T29/49142
摘要： A structure for attachment of a shield case to a circuit board. Electronic components are mounted at one face of the circuit board. The shield case is for covering the electronic components and blocking electromagnetic waves. The attachment structure includes toe portions, formed to protrude from the shield case, and holes formed in the circuit board, at which the toe portions can be inserted. The toe portions are fixed to the circuit board by being inserted into the holes and soldered to soldering lands at the other face of the circuit board. Thus, it is possible to prevent solder balls and solder flux entering the shield case, it is further possible to reserve space for soldering lands, with sizes that are required for fixing of the shield case, at a rear face of the circuit board, and it is possible to attach the shield case to the circuit board strongly.
摘要翻译：用于将屏蔽壳附接到电路板的结构。电子部件安装在电路板的一个面上。屏蔽盒用于覆盖电子元件并阻塞电磁波。安装结构包括形成为从屏蔽壳突出的趾部和形成在电路板中的孔，趾部可插入该趾部。脚趾部分通过插入孔中固定到电路板上，并焊接到电路板另一面的焊接区域。因此，可以防止焊球和焊剂进入屏蔽壳体，进一步可能在电路板的背面保留用于固定屏蔽壳体所需的尺寸的焊盘的空间，以及可以将屏蔽盒牢固地连接到电路板。

9. 发明申请

WO2006099571A9 MICRO SOLDER POT 审中-公开
公开(公告)号：WO2006099571A9
公开(公告)日：2006-11-09
申请号：PCT/US2006009669
申请日：2006-03-15
申请人： MEDCONX INC , KENT HAROLD B , LEVANTE JAMES J , FINE AARON T , LAYTON JOSEPH R
发明人： KENT HAROLD B , LEVANTE JAMES J , FINE AARON T , LAYTON JOSEPH R
IPC分类号： H01L23/28
CPC分类号： H05K3/3494 , H01L23/13 , H01L24/02 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/04042 , H01L2224/45015 , H01L2224/45139 , H01L2224/45147 , H01L2224/48 , H01L2224/78 , H01L2224/85 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/19043 , H01R43/0256 , H05K1/116 , H05K1/184 , H05K3/3405 , H05K3/3442 , H05K3/3447 , H05K3/403 , H05K2201/09181 , H05K2201/0949 , H05K2201/09781 , H05K2201/09845 , H05K2201/10446 , H05K2201/10636 , H05K2203/0195 , Y02P70/611 , Y02P70/613 , H01L2924/2075 , H01L2924/00014 , H01L2924/20754 , H01L2924/20755 , H01L2924/00015
摘要： A micro solder pot includes a dielectric substrate having at least one hole formed therein, a conductive coating coupled to the interior of the hole, and at least one heat transfer pad spaced from the hole in thermal communication with the conductive coating of the hole. When the heat transfer pad is exposed to a heat source, the conductive coating inside the hole is heated. The micro solder pot may also include a thermally activated conductive material disposed within the hole. When the heat transfer pad is exposed to a heat source, the thermally activated conductive material becomes liquidus such that a component can be inserted into the liquidus material. When the heat source is removed, the thermally activated conductive material cools to couple the component to the conductive coating in the hole.
摘要翻译：微型焊料坩埚包括其中形成有至少一个孔的电介质基底，与孔的内部连接的导电涂层，以及至少一个传热焊盘，该传热焊盘与孔间隔开，并与孔的导电涂层热连通。当传热垫暴露于热源时，孔内的导电涂层被加热。微型焊料罐也可以包括设置在孔内的热活化导电材料。当传热垫暴露于热源时，热激活的导电材料变成液态，使得可将组分插入液相线材料中。当去除热源时，热激活的导电材料冷却以将组件耦合到孔中的导电涂层。

10. 发明申请

WO2006089171A2 STACKED BALL GRID ARRAY PACKAGE MODULE UTILIZING ONE OR MORE INTERPOSER LAYERS 审中-公开
标题翻译：堆叠的球网阵列模块可以使用一个或更多的间隔层
公开(公告)号：WO2006089171A2
公开(公告)日：2006-08-24
申请号：PCT/US2006005754
申请日：2006-02-14
申请人： IRVINE SENSORS CORP , MICHAELS DANIEL , BOYD WILLIAM E
发明人： MICHAELS DANIEL , BOYD WILLIAM E
IPC分类号： H01L23/02
CPC分类号： H05K1/147 , H01L25/105 , H01L2225/0652 , H01L2225/1058 , H01L2225/107 , H01L2225/1094 , H01L2924/0002 , H01L2924/3011 , H05K1/141 , H05K1/144 , H05K3/3405 , H05K3/403 , H05K2201/0397 , H05K2201/09181 , H05K2201/10515 , H05K2201/10734 , H01L2924/00
摘要： A multilayer module comprised of stacked IC package layers is disclosed. A plurality of layers preferably having ball grid array I/O are stacked and interconnected using one or more interposer layers for the routing of electronic signals to appropriate locations in the module through angularly depending leads. The stack is further comprised of an interface PCB for the routing of electronics signals to and from the layers in the module and for connection to an external circuit.
摘要翻译：公开了一种由堆叠的IC封装层组成的多层模块。优选地具有球栅阵列I / O的多个层被堆叠并使用一个或多个插入层相互连接，用于通过角度依赖的引线将电子信号路由到模块中的适当位置。堆叠还包括用于将电子信号路由到模块中的层和从模块中的层和用于连接到外部电路的接口PCB。

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