发明申请
WO2009140050A3 ELECTRONIC ASSEMBLIES WITHOUT SOLDER AND METHOD FOR THEIR DESIGN, PROTOTYPING, AND MANUFACTURE
审中-公开
基本信息:
- 专利标题： ELECTRONIC ASSEMBLIES WITHOUT SOLDER AND METHOD FOR THEIR DESIGN, PROTOTYPING, AND MANUFACTURE
- 专利标题（中）：没有焊接的电子组件及其设计，原型和制造方法
- 申请号：PCT/US2009041835 申请日：2009-04-27
- 公开(公告)号：WO2009140050A3 公开(公告)日：2010-02-18
- 发明人： FJELSTAD JOSEPH C , GAMINI NADER , TICHANE DAVID
- 申请人： OCCAM PORTFOLIO LLC , FJELSTAD JOSEPH C , GAMINI NADER , TICHANE DAVID
- 专利权人： OCCAM PORTFOLIO LLC,FJELSTAD JOSEPH C,GAMINI NADER,TICHANE DAVID
- 当前专利权人： OCCAM PORTFOLIO LLC,FJELSTAD JOSEPH C,GAMINI NADER,TICHANE DAVID
- 优先权： US7523808 2008-06-24; US18204308 2008-07-29; US18408608 2008-07-31; US18732308 2008-08-06; US20074908 2008-08-28; US41036209 2009-03-24; US40577309 2009-03-17; US42998809 2009-04-24
- 主分类号： H05K13/04
- IPC分类号： H05K13/04 ; H05K3/30
摘要：
A system for prototyping electrical circuits, as well as creating production circuits, without using solder. Stand-in electrical components 110a are placed on a carrier 100a and scanned 310. From the resulting data, a machine tool or laser ablation system 410 then creates a negative master 420a with aperture(s) 530 into which production components 810 are placed and secured. Component leads 820 or packages are encapsulated with electrically insulating material 910 with vias 1030a exposing the leads. Traces 1040 connect appropriate leads forming a circuit sub-assembly 1000 which can serve as a basis for a circuit assembly formed through a reverse-interconnection process.
摘要（中）：
用于原型电路的系统，以及创建生产电路，而不使用焊料。 待机电气元件110a被放置在载体100a上并扫描310.根据所得数据，机床或激光烧蚀系统410然后创建具有孔530的负主体420a，生产部件810被放置并固定到其中 。 元件引线820或封装被电绝缘材料910封装，通孔1030a暴露引线。 迹线1040连接形成电路子组件1000的适当导线，其可以用作通过反向互连工艺形成的电路组件的基础。
IPC结构图谱:
| H | 电学 |
| --H05 | 其他类目不包含的电技术 |
| ----H05K | 印刷电路；电设备的外壳或结构零部件；电气元件组件的制造 |
| ------H05K13/00 | 专门适用于制造或调节电元件组装件的设备或方法 |
| --------H05K13/04 | .元件的安装 |