专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

41. 发明申请

WO02084716A2 STACKED SEMICONDUCTOR DEVICE ASSEMBLY WITH MICROELECTRONIC SPRING CONTACTS 审中-公开
标题翻译：堆叠半导体器件组件与微电子弹簧联系
公开(公告)号：WO02084716A2
公开(公告)日：2002-10-24
申请号：PCT/US0211650
申请日：2002-04-11
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N
发明人： ELDRIDGE BENJAMIN N
IPC分类号： H01L25/065 , H01L25/10 , H01L21/00
CPC分类号： H01L25/0657 , H01L25/105 , H01L2225/06572 , H01L2225/06589 , H01L2225/06593 , H01L2225/1023 , H01L2225/1082 , H01L2225/1094 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A three-dimensional, stacked semiconductor device assembly with microelectronic spring contacts, and components thereof, is disclosed. The assembly comprises a plurality of stacked modules, which are capable of being readily mounted to, and demounted from, one another. Each module of the assembly comprises a semiconductor device, comprising a die, mounted to a stacking substrate. The die and the stacking substrate are optionally capable of being readily mounted to, and demounted from one another. A bottommost module in the assembly is suitable for attaching directly to a substrate or other component, such as a printed circuit board, and a topmost component in the assembly preferably comprises a decoupling and/or termination substrate. Each semiconductor device in the assembly has terminals on a surface thereof, at least selected ones of which are provided with a contact element. Each device preferably comprises one or more stop structures for the microelectronic springs on its terminal surface. Contact elements on the semiconductor device and between adjacent modules preferably comprise microelectronic lithographic-type molded spring contacts.
摘要翻译：公开了一种具有微电子弹簧触点的三维叠层半导体器件组件及其部件。组件包括多个堆叠的模块，其能够容易地彼此安装和拆卸。组件的每个模块包括半导体器件，其包括安装到堆叠衬底的裸片。模具和堆叠衬底可选地能够容易地彼此安装和拆卸。组件中的最底部的模块适合于直接附接到衬底或其它部件，例如印刷电路板，并且组件中的最上面的组件优选地包括去耦和/或终止衬底。组件中的每个半导体器件在其表面上具有端子，其中至少选定的一个具有接触元件。每个装置优选地包括用于其终端表面上的微电子弹簧的一个或多个止动结构。半导体器件和相邻模块之间的接触元件优选地包括微电子光刻型模制弹簧触点。

42. 发明申请

WO2002068321A2 FORMING TOOL FOR FORMING A CONTOURED MICROELECTRONIC SPRING MOLD 审中-公开
标题翻译：形成微电子弹簧模具的成型工具
公开(公告)号：WO2002068321A2
公开(公告)日：2002-09-06
申请号：PCT/US2002/003882
申请日：2002-02-06
申请人： FORMFACTOR, INC. , ELDRIDGE, Benjamin, N. , WENZEL, Stuart, W.
发明人： ELDRIDGE, Benjamin, N. , WENZEL, Stuart, W.
IPC分类号： B81C1/00
CPC分类号： G01R3/00 , B33Y80/00 , B81B2203/0118 , B81C1/00611 , B81C2201/0108 , B81C2201/0125 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/06733 , G01R1/07342 , H01L23/4822 , H01L24/72 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01057 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01R12/52 , H01R13/24 , H01R13/2407 , H05K3/4092 , H05K7/1069 , H01L2924/00
摘要： A forming tool with one or more embossing tooth, and preferably, a plurality of such embossing teeth, arranged on a substantially planar substrate, is disclosed. Each embossing tooth is configured for forming a sacrificial layer to provide a contoured surface for forming a microelectronic spring structure. Each embossing tooth has a protruding area corresponding to a base of a microelectronic spring, and a sloped portion corresponding to a beam contour of a microelectronic spring. Numerous methods for making a forming tool are also disclosed. The methods include a material removal method, a molding method, a repetitive-stamping method, tang-bending methods, and segment-assembly methods.
摘要翻译：公开了一种具有一个或多个压花齿的成形工具，优选地，布置在基本平坦的基底上的多个这样的压花齿。每个压花齿构造成用于形成牺牲层以提供用于形成微电子弹簧结构的轮廓表面。每个压花齿具有对应于微电子弹簧的基部的突出区域和对应于微电子弹簧的光束轮廓的倾斜部分。还公开了用于制造成形工具的许多方法。这些方法包括材料去除方法，成型方法，重复冲压方法，弯曲方法和段组装方法。

43. 发明申请

WO0213261A2 HEAT SPREADING DIE COVER 审中-公开
标题翻译：热膨胀套管
公开(公告)号：WO0213261A2
公开(公告)日：2002-02-14
申请号：PCT/US0124186
申请日：2001-08-01
申请人： FORMFACTOR INC , ONDRICEK DOUGLAS S
发明人： ONDRICEK DOUGLAS S
IPC分类号： G01R1/04 , H01L23/367 , H01L23/00
CPC分类号： H01L23/367 , G01R1/0458 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2224/0401
摘要： A heat spreader for a heat generating component. The heat spreader includes a frame having a first top surface and a cover disposed on the first top surface. The cover is made from, at least in part, a thermally conductive material. The frame can be fixed relative to a substrate such that the frame and the cover enclose a heat generating component coupled to the substrate. The frame has non-curved inner walls which bound a space that is capable of accommodating a heat generating component.
摘要翻译：用于发热部件的散热器。散热器包括具有设置在第一顶表面上的第一顶表面和盖的框架。所述盖至少部分地由导热材料制成。框架可以相对于基板固定，使得框架和盖子包围耦合到基板的发热部件。框架具有非弯曲的内壁，其结合能够容纳发热部件的空间。

44. 发明申请

WO0035262A2 METHOD FOR MOUNTING AN ELECTRONIC COMPONENT 审中-公开
标题翻译：安装电子元件的方法
公开(公告)号：WO0035262A2
公开(公告)日：2000-06-15
申请号：PCT/US9928636
申请日：1999-12-03
申请人： FORMFACTOR INC
发明人： ONDRICEK DOUGLAS S , PEDERSEN DAVID V
IPC分类号： G01R31/26 , G01R1/04 , G01R31/00 , G01R31/01 , G01R31/28 , H01L23/04 , H01L23/13 , H01L23/32 , H01L23/48 , H01L23/538 , H05K3/32 , H05K13/00 , H05K13/02 , H05K13/04
CPC分类号： H01L24/72 , G01R1/0408 , G01R1/0433 , G01R31/01 , G01R31/2863 , G01R31/2867 , H01L23/04 , H01L23/13 , H01L23/32 , H01L23/5385 , H01L2223/54473 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01082 , H01L2924/10253 , H01L2924/14 , H05K3/325 , H05K2201/09472 , H01L2924/00
摘要： A method for mounting an electronic component. In one example of this method, the electronic component is an integrated circuit that is placed against an element of a carrier, such as a frame of a carrier. The electronic component has a plurality of elongate, resilient, electrical contact elements that are mounted on corresponding first electrical contact pads on the electronic component. The electronic component is secured to the carrier, and the carrier is pressed against a first substrate having a plurality of second electrical contacts adjacent a surface of the first substrate. In a typical example of this method, the electronic component is an integrated circuit that can be tested while being held in a carrier. The integrated circuit has been singulated from a wafer containing a plurality of integrated circuits.
摘要翻译：一种用于安装电子部件的方法。在该方法的一个示例中，电子部件是针对诸如载体的框架的载体的元件放置的集成电路。电子部件具有多个细长的，弹性的电接触元件，其被安装在电子部件上相应的第一电接触焊盘上。电子部件被固定到载体上，并且载体被压靠在具有与第一基板的表面相邻的多个第二电触头的第一基板上。在该方法的典型示例中，电子部件是可以在保持在载体中的同时进行测试的集成电路。集成电路已经从包含多个集成电路的晶片分离出来。

45. 发明申请

WO1997043656A2 WAFER-LEVEL BURN-IN AND TEST 审中-公开
标题翻译： WAFER-LEVEL BURN-IN和TEST
公开(公告)号：WO1997043656A2
公开(公告)日：1997-11-20
申请号：PCT/US1997008604
申请日：1997-05-15
申请人： FORMFACTOR, INC.
发明人： FORMFACTOR, INC. , KHANDROS, Igor, Y. , PEDERSEN, David, V.
IPC分类号： G01R01/073
CPC分类号： H01L23/49811 , G01R1/06716 , G01R1/06744 , G01R1/07342 , G01R3/00 , G01R31/287 , G01R31/2884 , G01R31/2889 , H01H1/0036 , H01L24/11 , H01L24/13 , H01L2224/0401 , H01L2224/04042 , H01L2224/06136 , H01L2224/11003 , H01L2224/11334 , H01L2224/13016 , H01L2224/1308 , H01L2224/13144 , H01L2224/13155 , H01L2224/13173 , H01L2224/45144 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01037 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/3011 , H01L2924/3025 , H01L2924/351 , H05K3/20 , H05K3/3421 , H05K3/4015 , H01L2224/13099 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： Techniques for performing wafer-level burn-in and test of semiconductor devices include a test substrate having active electronic components such as ASICs mounted to an interconnection substrate or incorporated therein, metallic spring contact element effecting interconnections between the ASICs and a plurality of devices-under-test (DUTs) on a wafer-under-test (WUT), all disposed in a vacuum vessel so that the ASICs can be operated at temperatures independent from and significantly lower than the burn-in temperature of the DUTs. The spring contact elements may be mounted to either the DUTs or to the ASICs, and may fan out to relax tolerance constraints on aligning and interconnecting the ASICs and the DUTs. A significant reduction in interconnect count and consequent simplification of the interconnection substrate is realized because the ASICs are capable of receiving a plurality of signals for testing the DUTs over relatively few signal lines from a host controller and promulgating these signals over the relatively many interconnections between the ASICs and the DUTs. The ASICs can also generate at least a portion of these signals in response to control signals from the host controller. Physical alignment techniques are also described. Micromachined indentations on the front surface of the ASICs ensure capturing free ends of the spring contact elements. Micromachined features on the back surface of the ASICs and the front surface of the interconnection substrate to which they are mounted facilitate precise alignment of a plurality of ASICs on the support substrate.
摘要翻译：用于执行半导体器件的晶片级老化和测试的技术包括具有有源电子部件（例如安装到互连衬底或并入其中的ASIC）的测试衬底，金属弹簧接触元件实现ASIC和多个器件之间的互连在测试晶片（WUT）上的测试（DUT）都被置于真空容器中，使得ASIC可以在与DUT的老化温度无关并且显着低于DUT的老化温度的温度下工作。弹簧接触元件可以被安装到DUT或ASIC上，并且可以扇出来放松对ASIC和DUT的对准和互连的容限约束。由于ASIC能够通过相对较少的来自主机控制器的信号线接收用于测试DUT的多个信号，并且在这些信号之间的相对多的互连上发布这些信号，因此实现了互连计数的显着减少和互连基板的随后简化。 ASIC和DUT。 ASIC还可以响应于来自主机控制器的控制信号而产生这些信号的至少一部分。还描述了物理对准技术。 ASIC的前表面上的微加工凹口确保捕获弹簧接触元件的自由端。 ASIC的后表面上的微加工特征和它们所安装的互连衬底的前表面有助于精确地对准支撑衬底上的多个ASIC。

46. 发明申请

WO1997043654A1 MICROELECTRONIC SPRING CONTACT ELEMENTS 审中-公开
标题翻译：微电子弹簧接触元件
公开(公告)号：WO1997043654A1
公开(公告)日：1997-11-20
申请号：PCT/US1997008634
申请日：1997-05-15
申请人： FORMFACTOR, INC.
发明人： FORMFACTOR, INC. , KHANDROS, Igor, Y. , ELDRIDGE, Benjamin, N. , MATHIEU, Gaetan, L. , PEDERSEN, David, V.
IPC分类号： G01R01/067
CPC分类号： H01L23/49811 , G01R1/06716 , G01R1/06744 , G01R1/07342 , G01R3/00 , G01R31/287 , G01R31/2884 , G01R31/2889 , H01H1/0036 , H01L24/11 , H01L24/13 , H01L2224/0401 , H01L2224/04042 , H01L2224/06136 , H01L2224/11003 , H01L2224/11334 , H01L2224/13016 , H01L2224/1308 , H01L2224/13144 , H01L2224/13155 , H01L2224/13173 , H01L2224/45144 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01037 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/3011 , H01L2924/3025 , H01L2924/351 , H05K3/20 , H05K3/3421 , H05K3/4015 , H01L2224/13099 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined in masking layers deposited on a surface of a substrate which may be an electronic component such as an active semiconductor device. Each spring contact element has a base end, a contact end, and a central body portion. The contact end is offset in the z-axis (at a different height) and in at least one of the x and y directions from the base end. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the substrate. The spring contact elements make temporary (i.e., pressure) or permanent (e.g., joined by soldering or brazing or with a conductive adhesive) connections with terminals of another electronic component to effect electrical connections therebetween. In an exemplary application, the spring contact elements are disposed on semiconductor devices resident on a semiconductor wafer so that temporary connections can be made with the semiconductor devices to burn-in and/or test the semiconductor devices.
摘要翻译：弹性接触元件通过将至少一层金属材料沉积到沉积在可以是诸如有源半导体器件的电子部件的基板的表面上的掩模层中限定的开口中来制造。每个弹簧接触元件具有基端，接触端和中心主体部分。接触端在z轴（在不同的高度）和从基端到x和y方向中的至少一个偏移。以这种方式，在衬底上以规定的空间关系制造多个弹簧接触元件。弹簧接触元件使另一个电子元件的端子与其间的电连接暂时（即压力）或永久（例如通过焊接或钎焊或与导电粘合剂连接）连接。在示例性应用中，弹簧接触元件设置在驻留在半导体晶片上的半导体器件上，使得可以利用半导体器件进行临时连接来老化和/或测试半导体器件。

47. 发明申请

WO9716866A3 CHIP INTERCONNECTION CARRIER AND METHODS OF MOUNTING SPRING CONTACTS TO SEMICONDUCTOR DEVICES 审中-公开
标题翻译：芯片互连载体和安装弹簧触点到半导体器件的方法
公开(公告)号：WO9716866A3
公开(公告)日：1997-06-19
申请号：PCT/US9608328
申请日：1996-05-28
申请人： FORMFACTOR INC , KHANDROS IGOR Y , CHANG SUNG CHUL , SMITH WILLIAM D
发明人： KHANDROS IGOR Y , CHANG SUNG CHUL , SMITH WILLIAM D
IPC分类号： H01L21/60 , B23K20/00 , C23C18/16 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , H01L21/00 , H01L21/48 , H01L21/603 , H01L21/66 , H01L23/32 , H01L23/48 , H01L23/485 , H01L23/49 , H01L23/498 , H01L25/16 , H05K3/32 , H01R
CPC分类号： B23K20/004 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , H01L21/4853 , H01L21/4889 , H01L22/20 , H01L23/49811 , H01L24/10 , H01L24/13 , H01L24/45 , H01L24/72 , H01L24/81 , H01L25/16 , H01L2224/13 , H01L2224/13099 , H01L2224/16145 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/81801 , H01L2224/85201 , H01L2224/85205 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K3/326 , H01L2924/00 , H01L2224/48
摘要： A plurality of free-standing spring elements (512) are mounted to a surface (510a) of a carrier substrate (510). The carrier substrate (510) is mounted to a surface (502a) of a semiconductor device (502). Bond pads (504) of the semiconductor device are connected to the spring elements (512) by bond wires (520) extending between the bond pads (504) and terminals (516) associated with the spring elements. Alternatively, the carrier is flip-chip reflow soldered to the semiconductor device. The carrier substrate (510) is suitably mounted to one or more semiconductor devices (532, 534) prior to the semiconductor devices being singulated from a semiconductor wafer upon which they are formed. Resilience and compliance to effect pressure connections to the semiconductor device (502) are provided by the spring elements (512) extending from the carrier substrate (510), per se. Hence, the carrier substrate (510) suitably remains rigid with respect to the semiconductor device (502). The carrier substrate (510) is advantageously pre-fabricated, by mounting the spring elements (512) thereto prior to mounting the carrier substrate to the semiconductor device(s).

48. 发明申请

WO1996038858A2 CONTACT CARRIERS (TILES) FOR POPULATING LARGER SUBSTRATES WITH SPRING CONTACTS 审中-公开
标题翻译：联系人（TILES）用于具有弹簧触点的人口大型基底
公开(公告)号：WO1996038858A2
公开(公告)日：1996-12-05
申请号：PCT/US1996008117
申请日：1996-05-24
申请人： FORMFACTOR, INC. , KHANDROS, Igor, Y. , ELDRIDGE, Benjamin, N. , MATHIEU, Gaetean, L. , DOZIER, Thomas, H. , SMITH, William, D.
发明人： FORMFACTOR, INC.
IPC分类号： H01L00/00
CPC分类号： B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/06711 , G01R1/06716 , G01R1/06744 , G01R1/07342 , G01R3/00 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/13099 , H01L2224/131 , H01L2224/16145 , H01L2224/45144 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1532 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/4015 , H01L2924/00
摘要： A plurality of contact elements, such as contact bumps or free-standing spring contacts including both monolithic and composite interconnection elements, are mounted to relatively small tile substrates which, in turn, are mounted and connected to a relatively large electronic component substrate, thereby populating the electronic component with a plurality of contact elements while avoiding the necessity of yielding the contact elements directly upon the electronic component. The relatively large electronic component is suitably a space transformer component of a probe card assembly. In this manner, pressure connections can be made to an entire semiconductor wafer, at once, to provide for wafer-level burn-in, and the like. Solder balls, z-axis conductive adhesive, or compliant connections are suitably employed for making electrical connections between the tile substrates and the electronic component. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the tiles can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described. Techniques for maintaining a prescribed x-y and z-axis alignment of the tiles to the relatively large substrate are disclosed.
摘要翻译：多个接触元件，例如接触凸起或包括单片和复合互连元件的独立弹簧触点安装到相对较小的瓦片衬底上，该衬底依次安装并连接到相对较大的电子部件衬底，由此填充电子部件具有多个接触元件，同时避免了必须直接在电子部件上产生接触元件。相对较大的电子部件适当地是探针卡组件的空间变压器部件。以这种方式，可以一次对整个半导体晶片进行压力连接，以提供晶片级老化等。焊接球，z轴导电粘合剂或柔性连接适用于在瓦片基片和电子部件之间进行电连接。使用所公开的技术容易地探测半导体晶片上的多个芯片位置，并且可以布置瓦片以优化整个晶片的探测。作为弹性接触结构的描述，具有由相对硬的外壳覆盖的相对软的芯的复合互连元件。公开了用于将瓷砖的规定的x-y和z轴对准维持在相对较大的衬底上的技术。

49. 发明申请

WO1996015458A1 PROBE CARD ASSEMBLY AND KIT, AND METHODS OF USING SAME 审中-公开
标题翻译：探针卡组件和套件，以及使用它们的方法
公开(公告)号：WO1996015458A1
公开(公告)日：1996-05-23
申请号：PCT/US1995014844
申请日：1995-11-13
申请人： FORMFACTOR, INC.
发明人： FORMFACTOR, INC. , KHANDROS, Igor, Y. , MATHIEU, Gaetan, L. , ELDRIDGE, Benjamin, N. , GRUBE, Gary, W.
IPC分类号： G01R01/073
CPC分类号： H05K7/1069 , B23K1/0016 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/0466 , G01R1/0483 , G01R1/06711 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07371 , G01R1/07378 , G01R31/2884 , G01R31/2886 , G01R31/2889 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/67138 , H01L22/20 , H01L23/32 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/05124 , H01L2224/05166 , H01L2224/05599 , H01L2224/05647 , H01L2224/1134 , H01L2224/13099 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/16145 , H01L2224/29111 , H01L2224/45014 , H01L2224/45015 , H01L2224/45111 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/456 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/48599 , H01L2224/48699 , H01L2224/48799 , H01L2224/49109 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/78301 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01037 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/0106 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15312 , H01L2924/1532 , H01L2924/15787 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H01R13/2407 , H01R13/2464 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , Y02P70/611 , H01L2924/00 , H01L2924/01013 , H01L2924/01026 , H01L2924/3512 , H01L2224/29099 , H01L2224/48 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/00012 , H01L2924/20751 , H01L2924/20756 , H01L2924/20757 , H01L2924/00015 , H01L2924/2075
摘要： A probe card assembly (500) includes a probe card (502), a space transformer (506) having resilient contact structures (probe elements) (524) mounted directly to and extending from terminals (522) on a surface thereof, and an interposer (504) disposed between the space transformer (506) and the probe card (502). The space transformer (506) and interposer are "stacked up" so that the orientation of the space transformer (506), hence the orientation of the tips of the probe elements (524), can be adjusted without changing the orientation of the probe card. Suitable mechanisms (532, 536, 538, 546) for adjusting the orientation of the space transformer (506), and for determining what adjustments to make, are disclosed. Multiple die sites on a semiconductor wafer (508) are readily probed using the disclosed techniques, and the probe elements (524) can be arranged to optimize probing of an entire wafer (508). Composite interconnection elements (200) having a relatively soft core (206) covercoated by a relatively hard shell (218, 220) as the resilient contact structures are described.
摘要翻译：探针卡组件（500）包括探针卡（502），具有弹性接触结构（探针元件）（524）的空间变换器（506），其直接安装在其表面上并从端子（522）延伸，（504），设置在所述空间变压器（506）和所述探针卡（502）之间。空间变换器（506）和插入器被“堆叠”，使得可以调节空间变换器（506）的取向，从而可以调节探针元件（524）的尖端的取向而不改变探针卡的取向。公开了用于调整空间变换器（506）的取向并用于确定要做出什么调整的适当的机构（532,536,538,546）。使用所公开的技术容易地探测半导体晶片（508）上的多个裸片位置，并且可以布置探针元件（524）以优化整个晶片（508）的探测。描述具有由相对较硬的外壳（218,220）作为弹性接触结构覆盖的相对软的芯（206）的复合互连元件（200）。

50. 发明申请

WO2023069240A1 PROBES THAT DEFINE RETROREFLECTORS, PROBE SYSTEMS THAT INCLUDE THE PROBES, AND METHODS OF UTILIZING THE PROBES 审中-公开
公开(公告)号：WO2023069240A1
公开(公告)日：2023-04-27
申请号：PCT/US2022/045073
申请日：2022-09-28
申请人： FORMFACTOR, INC.
发明人： YUAN, Quan , FRANKEL, Joseph, George
IPC分类号： G01R31/26 , H01L21/66 , G02B5/122 , G01R1/067 , G01R1/07 , G01R31/308
摘要： Probes that define retroreflectors, probe systems that include the probes, and methods of utilizing the probes. The probes include the retroreflector, which is defined by a retroreflector body. The retroreflector body includes a first side, an opposed second side, a tapered region that extends from the first side, and a light-receiving region that is defined on the second side. The probes also include a probe tip, which is configured to provide a test signal to a device under test (DUT) and/or to receive a resultant signal from the DUT. The retroreflector is configured to receive light, via the light-receiving region, at a light angle of incidence. The retroreflector also is configured to emit at least an emitted fraction of the light, from the retroreflector body and via the light-receiving region, at a light angle of emission that is at least substantially equal to the light angle of incidence.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式