专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2018132599A1 SHIELDING FOR VERTICAL PROBE HEADS 审中-公开
公开(公告)号：WO2018132599A1
公开(公告)日：2018-07-19
申请号：PCT/US2018/013365
申请日：2018-01-11
申请人： FORMFACTOR, INC.
发明人： ELDRIDGE, Benjamin, N.
IPC分类号： G01R1/02 , G01R1/04 , G01R1/067 , G01R1/073 , G01R1/18 , G01R31/26
摘要： Crosstalk between probes in a vertical probe array is reduced by providing a grounded metal carrier disposed between the guide plates of the probe array. The metal carrier includes pockets that are laterally separated from each other by the metal carrier. Probes in different pockets are thereby electrically shielded from each other.

2. 发明申请

WO2008024726A3 CARBON NANOTUBE CONTACT STRUCTURES 审中-公开
公开(公告)号：WO2008024726A3
公开(公告)日：2008-02-28
申请号：PCT/US2007/076345
申请日：2007-08-21
申请人： FORMFACTOR, INC. , ELDRIDGE, Benjamin, N. , GRITTERS, John K. , KHANDROS, Igor, K. , MARTENS, Rod , MATHIEU, Gaetan, L.
发明人： ELDRIDGE, Benjamin, N. , GRITTERS, John K. , KHANDROS, Igor, K. , MARTENS, Rod , MATHIEU, Gaetan, L.
IPC分类号： H01R12/00
摘要： A carbon nanotube contact structure (1400) can be used for making pressure connections to a DUT The contact structure can be formed using a carbon nanotube film (1100) or with carbon nanotubes in solution The carbon nanotube film can be grown in a trench in a sacrificial substrate in which a contact structure such as a beam or contact element (1403) is then formed by metal plating The film can also be formed on a contact element and have metal posts dispersed therein to provide rigidity and elasticity Contact structures or portions thereof can also be plated with a solution containing carbon nanotubes The resulting contact structure can be tough, and can provide good electrical conductivity.

3. 发明申请

WO2007035664A2 APPARATUS AND METHOD OF TESTING SINGULATED DIES 审中-公开
标题翻译：装置和测试方法
公开(公告)号：WO2007035664A2
公开(公告)日：2007-03-29
申请号：PCT/US2006/036336
申请日：2006-09-18
申请人： FORMFACTOR, INC. , DOZIER II, Thomas, H. , ELDRIDGE, Benjamin, N. , HSU, David S. , KHANDROS, Igor, Y. , MILLER, Charles, A.
发明人： DOZIER II, Thomas, H. , ELDRIDGE, Benjamin, N. , HSU, David S. , KHANDROS, Igor, Y. , MILLER, Charles, A.
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , G01R31/2893 , G01R31/31905
摘要： An exemplary die carrier is disclosed. In some embodiments, the die carrier can hold a plurality of singulated dies while the dies are tested. The dies can be arranged on the carrier in a pattern that facilities testing the dies. The carrier can be configured to allow interchangeable interfaces to different testers to be attached to and detached from the carrier. The carrier can also be configured as a shipping container for the dies.
摘要翻译：公开了一种示例性的模具载体。在一些实施例中，模具载体可以在测试模具的同时保持多个单个模具。模具可以以对模具进行测试的模式布置在载体上。载体可以被配置为允许不同的测试仪的可互换的接口被附接到载体上并与载体分离。载体也可以被配置为模具的运输容器。

4. 发明申请

WO2007008790A2 PROBE CARD ASSEMBLY WITH AN INTERCHANGEABLE PROBE INSERT 审中-公开
标题翻译：探针卡组装与可交换的探头插入
公开(公告)号：WO2007008790A2
公开(公告)日：2007-01-18
申请号：PCT/US2006/026723
申请日：2006-07-07
申请人： FORMFACTOR, INC. , ELDRIDGE, Benjamin, N. , REYNOLDS, Carl, V. , KAWAMATA, Nobuhiro , SAEKI, Takao
发明人： ELDRIDGE, Benjamin, N. , REYNOLDS, Carl, V. , KAWAMATA, Nobuhiro , SAEKI, Takao
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , G01R31/31905
摘要： A probe card assembly can include an insert holder configured to hold a probe insert, which can include probes disposed in a particular configuration for probing a device to be tested. The probe card assembly can provide an electrical interface to a tester that can control testing of the device, and while attached to the probe card assembly, the insert holder can hold the probe insert such that the probe insert is electrically connected to electrical paths within the probe card assembly that are part of the interface to the tester. The probe insert of the probe card assembly can be replaced by detaching the insert holder, replacing the probe insert with a new probe insert, and then reattaching the insert holder to the probe card assembly. The probe insert and holder can be integrally formed and comprise a single structure that can be detached from a probe card assembly and replaced with a different probe insert and holder.
摘要翻译：探针卡组件可以包括构造成保持探针插入件的插入物保持器，其可以包括以特定构造设置的探针，用于探测待测试的装置。探针卡组件可以向测试器提供电接口，该接口可以控制设备的测试，并且在附接到探针卡组件时，插入物保持器可以保持探针插入件，使得探针插入件电连接到内部的电路径探针卡组件是测试仪接口的一部分。探针卡组件的探针插入可以通过拆卸插入物夹持器，用新的探针插入物代替探针插入物，然后将插入物夹持器重新连接到探针卡组件来代替。探针插入物和保持器可以一体地形成并且包括可以从探针卡组件分离并且用不同的探针插入物和保持器代替的单个结构。

5. 发明申请

WO2005101038A2 WIRELESS TEST CASSETTE 审中-公开
标题翻译：无线测试CASSETTE
公开(公告)号：WO2005101038A2
公开(公告)日：2005-10-27
申请号：PCT/US2005/011849
申请日：2005-04-08
申请人： FORMFACTOR, INC. , ELDRIDGE, Benjamin, N. , KHANDROS, Igor, Y. , MILLER, Charles, A. , SPORCK, Nicholas, A.
发明人： ELDRIDGE, Benjamin, N. , KHANDROS, Igor, Y. , MILLER, Charles, A. , SPORCK, Nicholas, A.
IPC分类号： G01R31/26
CPC分类号： G01R1/0491 , G01R1/073 , G01R31/3025
摘要： A base controller disposed in a test cassette receives test data for testing a plurality of electronic devices. The base controller wirelessly transmits the test data to a plurality of wireless test control chips, which write the test data to each of the electronic devices. The wireless test control chips then read response data generated by the electronic devices, and the wireless test control chips wirelessly transmit the response data to the base controller.
摘要翻译：设置在测试盒中的基本控制器接收用于测试多个电子设备的测试数据。基站控制器将测试数据无线传输到多个无线测试控制芯片，其将测试数据写入每个电子设备。然后，无线测试控制芯片读取由电子设备产生的响应数据，无线测试控制芯片将响应数据无线发送到基本控制器。

6. 发明申请

WO2005069914A3 PROBE CARD CONFIGURATION FOR LOW MECHANICAL FLEXURAL STRENGTH ELECTRICAL ROUTING SUBSTRATES 审中-公开
公开(公告)号：WO2005069914A3
公开(公告)日：2005-08-04
申请号：PCT/US2005/001551
申请日：2005-01-18
申请人： FORMFACTOR, INC. , SHINDE, Makarand, S. , LARDER, Richard, A. , COOPER, Timothy, E. , SHENOY, Ravindra, V. , ELDRIDGE, Benjamin, N.
发明人： SHINDE, Makarand, S. , LARDER, Richard, A. , COOPER, Timothy, E. , SHENOY, Ravindra, V. , ELDRIDGE, Benjamin, N.
IPC分类号： G01R31/02
摘要： A mechanical support configuration for a probe card of a wafer test system is provided to increase support for a very low flexural strength substrate that supports spring probes. Increased mechanical support is provided by: (1) a frame around the periphery of the substrate having an increased sized horizontal extension over the surface of the substrate; (2) leaf springs with a bend enabling the leaf springs to extend vertically and engage the inner frame closer to the spring probes; (3) an insulating flexible membrane, or load support member machined into the inner frame, to engage the low flexural strength substrate farther away from its edge; (4) a support structure, such as support pins, added to provide support to counteract probe loading near the center of the space transformer substrate; and/or (5) a highly rigid interface

7. 发明申请

WO2004059331A2 APPARATUS AND METHOD FOR LIMITING OVER TRAVEL IN A PROBE CARD ASSEMBLY 审中-公开
标题翻译：用于限制探针卡组件中的旅行的装置和方法
公开(公告)号：WO2004059331A2
公开(公告)日：2004-07-15
申请号：PCT/US2003/040316
申请日：2003-12-15
申请人： FORMFACTOR, INC.
发明人： COOPER, Timothy, E. , ELDRIDGE, Benjamin, N. , REYNOLDS, Carl, V. , SHENOY, Ravindra, V.
IPC分类号： G01R1/073
CPC分类号： G01R31/2887 , G01R3/00 , G01R31/2886
摘要： Methods and apparatuses for testing semiconductor devices are disclosed. Over travel stops limit over travel of a device to be tested with respect to probes of a probe card assembly. Feedback control techniques are employed to control relative movement of the device and the probe card assembly. A probe card assembly includes flexible base for absorbing excessive over travel of the device to be tested with respect to the probe card assembly.
摘要翻译：公开了用于测试半导体器件的方法和设备。超程停止限制待测设备相对于探针卡组件的探针的行程。采用反馈控制技术来控制装置和探针卡组件的相对运动。探针卡组件包括柔性基座，用于吸收被测装置相对于探针卡组件的过度行进。

8. 发明申请

WO2003062322A1 APPARATUS AND METHOD FOR CLEANING TEST PROBES 审中-公开
标题翻译：清洁测试探针的装置和方法
公开(公告)号：WO2003062322A1
公开(公告)日：2003-07-31
申请号：PCT/US2003/001577
申请日：2003-01-16
申请人： FORMFACTOR, INC.
发明人： KHANDROS, Igor, K. , ELDRIDGE, Benjamin, N. , FANG, Treliant , MATHIEU, Gaetan, L. , GRUBE, Gary, W. , DRUSH, Michael, A. , BUCKHOLTZ, Christopher, C.
IPC分类号： C08L83/04
CPC分类号： C08G77/48 , B08B1/00 , B08B7/0028 , G01R1/06711 , G01R3/00 , Y10T428/24388 , Y10T428/31663
摘要： A probe cleaning apparatus for cleaning a probe tip use to test semiconductors dies having an abrasive substrate layer an a tacky gel layer on top of the abrasive surface of the abrasive substrate layer. The probe tip is cleaned by passing it through the tacky gel layer so that it comes in contact with the abrasive surface of the abrasive substrate, moving the probe tip across the abrasive surface of the substrate layer, and then removing the probe tip from the successive layers of the cleaning apparatus. The probe tip emerges from the cleaning apparatus free from debris associated with testing the semiconductor dies.
摘要翻译：用于清洁探针头的探针清洁装置用于测试在磨料基底层的研磨表面的顶部上具有磨料基底层和粘性凝胶层的半导体模具。通过将探针尖端通过粘性凝胶层进行清洁，使其与磨料基材的研磨表面接触，使探针尖端跨过基底层的研磨表面，然后从连续的层的清洁装置。探针尖端从清洁设备中出来，没有与测试半导体管芯相关的碎片。

9. 发明申请

WO2002068321A2 FORMING TOOL FOR FORMING A CONTOURED MICROELECTRONIC SPRING MOLD 审中-公开
标题翻译：形成微电子弹簧模具的成型工具
公开(公告)号：WO2002068321A2
公开(公告)日：2002-09-06
申请号：PCT/US2002/003882
申请日：2002-02-06
申请人： FORMFACTOR, INC. , ELDRIDGE, Benjamin, N. , WENZEL, Stuart, W.
发明人： ELDRIDGE, Benjamin, N. , WENZEL, Stuart, W.
IPC分类号： B81C1/00
CPC分类号： G01R3/00 , B33Y80/00 , B81B2203/0118 , B81C1/00611 , B81C2201/0108 , B81C2201/0125 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/06733 , G01R1/07342 , H01L23/4822 , H01L24/72 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01057 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01R12/52 , H01R13/24 , H01R13/2407 , H05K3/4092 , H05K7/1069 , H01L2924/00
摘要： A forming tool with one or more embossing tooth, and preferably, a plurality of such embossing teeth, arranged on a substantially planar substrate, is disclosed. Each embossing tooth is configured for forming a sacrificial layer to provide a contoured surface for forming a microelectronic spring structure. Each embossing tooth has a protruding area corresponding to a base of a microelectronic spring, and a sloped portion corresponding to a beam contour of a microelectronic spring. Numerous methods for making a forming tool are also disclosed. The methods include a material removal method, a molding method, a repetitive-stamping method, tang-bending methods, and segment-assembly methods.
摘要翻译：公开了一种具有一个或多个压花齿的成形工具，优选地，布置在基本平坦的基底上的多个这样的压花齿。每个压花齿构造成用于形成牺牲层以提供用于形成微电子弹簧结构的轮廓表面。每个压花齿具有对应于微电子弹簧的基部的突出区域和对应于微电子弹簧的光束轮廓的倾斜部分。还公开了用于制造成形工具的许多方法。这些方法包括材料去除方法，成型方法，重复冲压方法，弯曲方法和段组装方法。

10. 发明申请

WO1997043654A1 MICROELECTRONIC SPRING CONTACT ELEMENTS 审中-公开
标题翻译：微电子弹簧接触元件
公开(公告)号：WO1997043654A1
公开(公告)日：1997-11-20
申请号：PCT/US1997008634
申请日：1997-05-15
申请人： FORMFACTOR, INC.
发明人： FORMFACTOR, INC. , KHANDROS, Igor, Y. , ELDRIDGE, Benjamin, N. , MATHIEU, Gaetan, L. , PEDERSEN, David, V.
IPC分类号： G01R01/067
CPC分类号： H01L23/49811 , G01R1/06716 , G01R1/06744 , G01R1/07342 , G01R3/00 , G01R31/287 , G01R31/2884 , G01R31/2889 , H01H1/0036 , H01L24/11 , H01L24/13 , H01L2224/0401 , H01L2224/04042 , H01L2224/06136 , H01L2224/11003 , H01L2224/11334 , H01L2224/13016 , H01L2224/1308 , H01L2224/13144 , H01L2224/13155 , H01L2224/13173 , H01L2224/45144 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01037 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01057 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/3011 , H01L2924/3025 , H01L2924/351 , H05K3/20 , H05K3/3421 , H05K3/4015 , H01L2224/13099 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined in masking layers deposited on a surface of a substrate which may be an electronic component such as an active semiconductor device. Each spring contact element has a base end, a contact end, and a central body portion. The contact end is offset in the z-axis (at a different height) and in at least one of the x and y directions from the base end. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the substrate. The spring contact elements make temporary (i.e., pressure) or permanent (e.g., joined by soldering or brazing or with a conductive adhesive) connections with terminals of another electronic component to effect electrical connections therebetween. In an exemplary application, the spring contact elements are disposed on semiconductor devices resident on a semiconductor wafer so that temporary connections can be made with the semiconductor devices to burn-in and/or test the semiconductor devices.
摘要翻译：弹性接触元件通过将至少一层金属材料沉积到沉积在可以是诸如有源半导体器件的电子部件的基板的表面上的掩模层中限定的开口中来制造。每个弹簧接触元件具有基端，接触端和中心主体部分。接触端在z轴（在不同的高度）和从基端到x和y方向中的至少一个偏移。以这种方式，在衬底上以规定的空间关系制造多个弹簧接触元件。弹簧接触元件使另一个电子元件的端子与其间的电连接暂时（即压力）或永久（例如通过焊接或钎焊或与导电粘合剂连接）连接。在示例性应用中，弹簧接触元件设置在驻留在半导体晶片上的半导体器件上，使得可以利用半导体器件进行临时连接来老化和/或测试半导体器件。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式