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1. 发明申请

WO1996003772A2 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE FOR SURFACE MOUNTING, AND SEMICONDUCTOR DEVICE FOR SURFACE MOUNTING 审中-公开
标题翻译：制造用于表面安装的半导体器件的方法和用于表面安装的半导体器件
公开(公告)号：WO1996003772A2
公开(公告)日：1996-02-08
申请号：PCT/IB1995000539
申请日：1995-07-05
申请人： PHILIPS ELECTRONICS N.V. , PHILIPS NORDEN AB
发明人： PHILIPS ELECTRONICS N.V. , PHILIPS NORDEN AB , DEKKER, Ronald , MAAS, Henricus, Godefridus, Rafael , VERSLEIJEN, Martinus, Pieter, Johannes, Gerardus
IPC分类号： H01L21/768
CPC分类号： H01L21/76264 , H01L21/6835 , H01L21/76289 , H01L23/481 , H01L23/4822 , H01L24/11 , H01L24/13 , H01L2221/68359 , H01L2221/68363 , H01L2221/68377 , H01L2224/1308 , H01L2224/13099 , H01L2224/131 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01033 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12042 , H01L2924/1301 , H01L2924/14 , H01L2924/30105 , H01L2924/01014 , H01L2924/00
摘要： The invention relates to a method of manufacturing a semiconductor device (1) for surface mounting. According to the invention, the semiconductor devices are packaged while they are still on a slice of semiconductor material, while the package leads are formed from the semiconductor material. In the method according to the invention, the semiconductor devices are manufactured without the necessity of a lead frame, bonding wires, or metal package leads. Thanks to the IC technologies at the wafer level, such as photolithography, etching, etc., the method according to the invention renders possible semiconductor devices of very small dimensions. In addition, integrated circuits with very many package leads can be manufactured in a simple manner without additional steps being necessary. The method according to the invention is thus comparatively inexpensive.
摘要翻译：本发明涉及制造用于表面安装的半导体器件（1）的方法。根据本发明，半导体器件在它们仍然在半导体材料片上时封装，而封装引线由半导体材料形成。在根据本发明的方法中，半导体器件被制造而不需要引线框架，接合线或金属封装引线。由于晶片级的IC技术，例如光刻，蚀刻等，根据本发明的方法使得可能的尺寸非常小的半导体器件成为可能。此外，具有非常多的封装引线的集成电路可以以简单的方式制造而无需额外的步骤。因此，根据本发明的方法相对便宜。

2. 发明申请

WO2012037728A1 ELECTRIC DEVICE AND METHOD OF BONDING CHIP TO EXTERNAL ELECTRIC CIRCUIT 审中-公开
标题翻译：电气设备和将芯片连接到外部电路的方法
公开(公告)号：WO2012037728A1
公开(公告)日：2012-03-29
申请号：PCT/CN2010/077250
申请日：2010-09-25
申请人： HUAWEI TECHNOLOGIES CO.,LTD. , BERGSTEDT, Leif
发明人： BERGSTEDT, Leif
IPC分类号： H01L21/60 , H01L23/48
CPC分类号： H01L23/4822 , H01L23/5389 , H01L23/66 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/50 , H01L24/73 , H01L24/86 , H01L2223/6605 , H01L2224/2929 , H01L2224/29339 , H01L2224/32245 , H01L2224/45014 , H01L2224/48091 , H01L2224/48472 , H01L2224/50 , H01L2224/73269 , H01L2224/92248 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/15747 , H01L2924/15798 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A method of bonding a chip (32) to an external electric circuit is provided. The conductors (36) of the external electric circuit intended for connection to the chip are formed with physical extensions (37) and the chip is directly bonded to these extensions. An electric device comprising at least one chip (32) and an external electric circuit is also provided. The chip is directly bonded to the physical extensions (37) of the conductors (36) of the external electric circuit.
摘要翻译：提供了将芯片（32）接合到外部电路的方法。用于连接到芯片的外部电路的导体（36）形成有物理延伸部（37），并且芯片直接接合到这些延伸部分。还提供了包括至少一个芯片（32）和外部电路的电气设备。芯片直接接合到外部电路的导体（36）的物理延伸部（37）上。

3. 发明申请

WO2002064496A2 METHOD FOR FORMING MICROELECTRONIC SPRING STRUCTURES ON A SUBSTRATE 审中-公开
标题翻译：在基板上形成微电子弹簧结构的方法
公开(公告)号：WO2002064496A2
公开(公告)日：2002-08-22
申请号：PCT/US2002/003938
申请日：2002-02-06
申请人： FORMFACTOR, INC. , ELDRIDGE, Benjamin, N. , WENZEL, Stuart, W.
发明人： ELDRIDGE, Benjamin, N. , WENZEL, Stuart, W.
IPC分类号： B81B3/00
CPC分类号： G01R1/06716 , G01R1/0483 , G01R1/06727 , G01R1/06733 , G01R1/07342 , G01R3/00 , H01L23/4822 , H01L24/72 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/12036 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01R12/52 , H01R13/24 , H01R13/2407 , H05K3/4092 , H05K7/1069 , Y10T29/49147 , H01L2924/00
摘要： A layer of sacrificial material is formed over a substrate. Then, a contoured surface is developed in the sacrificial material, such as by molding the sacrificial material using a mold or stamp. The contoured surface provides a mold for at least one spring form, and preferably for an array of spring forms. If necessary, the sacrificial layer is then cured or hardened. A layer of spring material is deposited over the contoured surface of the sacrificial material, in a pattern to define at least one spring form, and preferably an array of spring forms. The sacrificial material is then at least partially removed from beneath the spring form to reveal at least one freestanding spring structure. A separate conducting tip is optionally attached to each resulting spring structure, and each structure is optionally plated or covered with an additional layer or layers of material, as desired. An alternative method for making a resilient contact structure using the properties of a fluid meniscus is additionally disclosed. In an initial step of the alternative method, a layer of material is provided over a substrate. Then, a recess is developed in the material, and fluid is provided in the recess to form a meniscus. The fluid is cured or hardened to stabilize the contoured shape of the meniscus. The stabilized meniscus is then used to define a spring form in the same manner as the molded surface in the sacrificial material.
摘要翻译：在衬底上形成牺牲材料层。然后，在牺牲材料中形成轮廓表面，例如通过使用模具或印模模制牺牲材料。轮廓表面提供用于至少一种弹簧形式的模具，并且优选地用于弹簧形式的阵列。如果需要，则牺牲层被固化或硬化。弹性材料层以牺牲材料的轮廓表面沉积在图案中以限定至少一种弹簧形式，并且优选地是弹簧形式的阵列。然后，牺牲材料至少部分地从弹簧形式的下方移除，以露出至少一个独立的弹簧结构。单独的导电尖端任选地附接到每个所得到的弹簧结构，并且根据需要，每个结构可选地被电镀或覆盖有附加的一层或多层材料。还公开了使用流体弯液面的性质制造弹性接触结构的替代方法。在替代方法的初始步骤中，在衬底上提供一层材料。然后，在该材料中形成凹部，并且在凹部中设置流体以形成弯液面。流体被固化或硬化以稳定弯液面的轮廓形状。然后将稳定的弯液面用于与牺牲材料中的模制表面相同的方式限定弹簧形式。

4. 发明申请

WO01009952A2 INTERCONNECT ASSEMBLIES AND METHODS 审中-公开
标题翻译：互连组件和方法
公开(公告)号：WO01009952A2
公开(公告)日：2001-02-08
申请号：PCT/US2000/020530
申请日：2000-07-28
IPC分类号： H01L23/52 , H01L21/3205 , H01L21/60 , H01L21/768 , H01L23/482 , H05K3/40 , H01L23/48
CPC分类号： H01L23/4822 , H01L24/01 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/14 , H01L2924/181 , H05K3/4092 , H01L2924/00
摘要： An interconnect assembly and methods for making and using the assembly. An exemplary embodiment of an aspect of the invention includes a contact element which includes a base portion adapted to be adhered to a substrate and a beam portion conencted to and extending from the base portion. The beam portion is designed to have a geometry which substantially optimizes stress across the beam portion when deflected (e.g. it is triangular in shape) and is adapted to be freestanding. An exemplary embodiment of another aspect of the invention involves a method for forming a contact element. This method includes forming a base portion to adhere to a substrate of an electrical assembly and forming a beam portion connected to the base portion. The beam portion extends from the base portion and is designed to have a geometry which substantially evenly distributes stress across the beam portion when deflected and is adapted to be freestanding. It will be appreciated that in certain embodiments of the invention, a plurality of contact elements are used together to create an interconnect assembly. Interconnect assemblies having resilient contact elements and methods for making these assemblies. In one aspect, the interconnect assembly includes a substrate and a resilient electrical contact element disposed on the substrate. A first portion of the resilient contact structure is disposed on the substrate and a second portion extends away from the substrate and is capable of moving from a first position to a second position under the application of a force. A stop structure is disposed on the surface of the substrate and on a surface of the first portion of the resilient contact structure. According to another aspect of the present invention, a beam portion of the resilient contact structure has a substantially triangular shape.
摘要翻译：本发明涉及互连组件以及制造和使用所述组件的方法。在一个实施例中，接触元件具有粘附到基底的基底部分和连接到基底部分并从其延伸的梁部分。梁部分具有几何形状，其在弯曲时（例如，它是三角形的）基本上优化电压并且是独立的。另一个实施例涉及用于形成接触元件的方法。其特别在于形成附接到电气组件的基底的基部和连接到基部的梁部。从基部延伸的梁部分具有几何形状，该几何形状在弯曲并且独立时基本上均匀分布电压。应该理解，在一些实施例中，使用多个接触元件来形成互连组件。本发明涉及具有弹性接触元件的互连组件及其制造方法。在一个实施例中，互连组件包括衬底和设置在所述衬底上的弹性电接触构件。弹性接触结构的第一部分放置在基底上，并且远离基底延伸的第二部分在力的作用下从第一位置移动到第二位置。止挡结构放置在衬底的表面上和弹性接触结构的第一部分的表面上。在另一个实施例中，弹性接触结构的梁部分是大致三角形的。

5. 发明申请

WO1990015438A1 BEAM LEAD AND SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FABRICATING INTEGRATED STRUCTURE 审中-公开
标题翻译：光束引线和半导体器件结构及其制造方法
公开(公告)号：WO1990015438A1
公开(公告)日：1990-12-13
申请号：PCT/US1989002514
申请日：1989-06-08
申请人： UNISTRUCTURE, INC.
发明人： UNISTRUCTURE, INC. , BUSBY, Michael, W. , POMMER, Richard, J. , JOHNSON, Tony, K. , WAXWEILER, Jeffrey, J. , CAMEN, Martin
IPC分类号： H01L23/48
CPC分类号： H01L24/50 , H01L22/32 , H01L23/4822 , H01L23/49572 , H01L23/49827 , H01L24/19 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14
摘要： Beams leads (10) are epitaxially grown on a semiconductor chip (12) separated from a wafer, forming an integral structure. The beam leads (10) are embedded within a dielectric material (20) for protection and strength. The dielectric material (20) covers the active circuit side (14) as well as edges (16) of the semiconductor chip (12), and extend beyond the area of the semiconductor chip while enclosing the leads, to provide means within the integral structure for supporting the semiconductor chip. The semiconductor chip (12) has its active circuit side hermetically sealed. A method for fabricating the integral semiconductor chip and beam lead structure is also disclosed.
摘要翻译：光束引线（10）在与晶片分离的半导体芯片（12）上外延生长，形成一体结构。光束引线（10）嵌入在电介质材料（20）内，用于保护和强度。介电材料（20）覆盖有源电路侧（14）以及半导体芯片（12）的边缘（16），并且在封装引线的同时延伸超出半导体芯片的区域，以提供整体结构内的装置用于支持半导体芯片。半导体芯片（12）的有源电路侧被密封。还公开了一体化半导体芯片和光束引线结构的制造方法。

6. 发明申请

WO2009108300A2 APPARATUS AND METHODS OF ATTACHING HYBRID VLSI CHIPS TO PRINTED WIRING BOARDS 审中-公开
标题翻译：将混合超大容量接头连接到印刷线路板的装置和方法
公开(公告)号：WO2009108300A2
公开(公告)日：2009-09-03
申请号：PCT/US2009/001161
申请日：2009-02-25
申请人： GENERAL DYNAMICS ADVANCED INFORMATION SYSTEMS, INC. , PAI, Deepak, Keshav
发明人： PAI, Deepak, Keshav
IPC分类号： H01L23/488 , H01L23/49 , H05K1/18
CPC分类号： H05K3/341 , H01L23/4822 , H01L24/13 , H01L24/73 , H01L2224/16225 , H01L2924/01006 , H01L2924/01029 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/351 , H05K3/3421 , H05K3/3436 , H05K2201/10659 , H05K2201/10734 , Y02P70/613 , H01L2924/00
摘要： A method for preparing an integrated circuit for connection to a surface, the integrated circuit including lead contacts and leadless contacts, is provided. The method includes providing the integrated circuit, applying a first solder paste to the leadless contacts, forming solder balls on the applied solder paste, heating the solder balls, thereby removing at least a portion of the first solder paste and bringing the solder balls into electrical contact with the leadless contacts, the base of the solder balls being generally aligned in a plane, and bending the lead contacts into gull wings, with the base of the gull wings being substantially coplanar with the plane. The base of the gull wings and the base of the at least one of the solder balls collectively generally define a contact plane for potential future contact with the surface.
摘要翻译：提供了一种用于制备用于连接到表面的集成电路的方法，所述集成电路包括引线触点和无引线触点。该方法包括提供集成电路，将第一焊膏施加到无引线触点，在所施加的焊膏上形成焊球，加热焊球，从而去除至少一部分第一焊膏并使焊球进入电与无引线触点接触，焊球的基部通常在平面中对准，并且将引线触点弯曲成鸥翼，鸥翼的基部与平面基本上共面。鸥翼的基部和至少一个焊球的基部通常限定接触平面，以便将来与表面接触。

7. 发明申请

WO2008113994A1 ELECTRICAL CONNECTION OF COMPONENTS 审中-公开
标题翻译：组件的电气连接
公开(公告)号：WO2008113994A1
公开(公告)日：2008-09-25
申请号：PCT/GB2008/000935
申请日：2008-03-17
申请人： CONDUCTIVE INKJET TECHNOLOGY LIMITED , BENTLEY, Philip, Gareth
发明人： BENTLEY, Philip, Gareth
IPC分类号： H05K1/18 , G06K19/077 , H01L21/48
CPC分类号： H05K1/188 , G06K19/07745 , G06K19/07747 , G06K19/07749 , G06K19/0775 , H01L21/56 , H01L23/4822 , H01L24/12 , H01L24/81 , H01L24/83 , H01L24/90 , H01L24/97 , H01L25/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/2929 , H01L2224/293 , H01L2224/73204 , H01L2224/81121 , H01L2224/81801 , H01L2224/83121 , H01L2224/83851 , H01L2224/90 , H01L2224/97 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01072 , H01L2924/01078 , H01L2924/014 , H01L2924/07802 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H05K1/189 , H05K3/061 , H05K3/202 , H05K2201/0355 , H05K2201/09118 , H05K2201/10674 , H05K2203/1469 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , Y10T29/49147 , H01L2224/81 , H01L2924/00014 , H01L2924/00
摘要： A component is electrically connected to an electrical circuit by a method that comprises forming an intermediate product in which the component (3) is disposed on one side of an electrically conducting sheet (1) so that at least one pair of contacts (4) of the component are electrically connected by the sheet and in which a patterned etch resist layer (2) is disposed on the other side of the sheet in registration with the component on said one side of the sheet, and then exposing the other side of the sheet to an etching agent and thereby removing areas of the sheet to leave the electrical circuit and also to remove the electrical interconnection between the contacts.
摘要翻译：组件通过包括形成中间产品的方法电连接到电路，其中组件（3）设置在导电片（1）的一侧上，使得至少一对触点（4）的该部件通过片材电连接，并且其中图案化的抗蚀剂层（2）设置在片材的另一侧上，与片材的所述一侧上的部件对准，然后暴露片材的另一侧到蚀刻剂，从而去除片材的区域以离开电路，并且还去除接触件之间的电互连。

8. 发明申请

WO2002068321A2 FORMING TOOL FOR FORMING A CONTOURED MICROELECTRONIC SPRING MOLD 审中-公开
标题翻译：形成微电子弹簧模具的成型工具
公开(公告)号：WO2002068321A2
公开(公告)日：2002-09-06
申请号：PCT/US2002/003882
申请日：2002-02-06
申请人： FORMFACTOR, INC. , ELDRIDGE, Benjamin, N. , WENZEL, Stuart, W.
发明人： ELDRIDGE, Benjamin, N. , WENZEL, Stuart, W.
IPC分类号： B81C1/00
CPC分类号： G01R3/00 , B33Y80/00 , B81B2203/0118 , B81C1/00611 , B81C2201/0108 , B81C2201/0125 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/06733 , G01R1/07342 , H01L23/4822 , H01L24/72 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01057 , H01L2924/01072 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01R12/52 , H01R13/24 , H01R13/2407 , H05K3/4092 , H05K7/1069 , H01L2924/00
摘要： A forming tool with one or more embossing tooth, and preferably, a plurality of such embossing teeth, arranged on a substantially planar substrate, is disclosed. Each embossing tooth is configured for forming a sacrificial layer to provide a contoured surface for forming a microelectronic spring structure. Each embossing tooth has a protruding area corresponding to a base of a microelectronic spring, and a sloped portion corresponding to a beam contour of a microelectronic spring. Numerous methods for making a forming tool are also disclosed. The methods include a material removal method, a molding method, a repetitive-stamping method, tang-bending methods, and segment-assembly methods.
摘要翻译：公开了一种具有一个或多个压花齿的成形工具，优选地，布置在基本平坦的基底上的多个这样的压花齿。每个压花齿构造成用于形成牺牲层以提供用于形成微电子弹簧结构的轮廓表面。每个压花齿具有对应于微电子弹簧的基部的突出区域和对应于微电子弹簧的光束轮廓的倾斜部分。还公开了用于制造成形工具的许多方法。这些方法包括材料去除方法，成型方法，重复冲压方法，弯曲方法和段组装方法。

9. 发明申请

WO9603772A3 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE FOR SURFACE MOUNTING, AND SEMICONDUCTOR DEVICE FOR SURFACE MOUNTING 审中-公开
标题翻译：用于表面安装的半导体器件的制造方法和用于表面安装的半导体器件
公开(公告)号：WO9603772A3
公开(公告)日：1996-04-18
申请号：PCT/IB9500539
申请日：1995-07-05
申请人： PHILIPS ELECTRONICS NV , PHILIPS NORDEN AB
发明人： DEKKER RONALD , MAAS HENRICUS GODEFRIDUS RAFAE , VERSLEIJEN MARTINUS PIETER JOH
IPC分类号： H01L21/60 , H01L21/68 , H01L21/762 , H01L23/48 , H01L23/482 , H01L21/768
CPC分类号： H01L21/76264 , H01L21/6835 , H01L21/76289 , H01L23/481 , H01L23/4822 , H01L24/11 , H01L24/13 , H01L2221/68359 , H01L2221/68363 , H01L2221/68377 , H01L2224/1308 , H01L2224/13099 , H01L2224/131 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01033 , H01L2924/01061 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12042 , H01L2924/1301 , H01L2924/14 , H01L2924/30105 , H01L2924/01014 , H01L2924/00
摘要： The invention relates to a method of manufacturing a semiconductor device (1) for surface mounting. According to the invention, the semiconductor devices are packaged while they are still on a slice of semiconductor material, while the package leads are formed from the semiconductor material. In the method according to the invention, the semiconductor devices are manufactured without the necessity of a lead frame, bonding wires, or metal package leads. Thanks to the IC technologies at the wafer level, such as photolithography, etching, etc., the method according to the invention renders possible semiconductor devices of very small dimensions. In addition, integrated circuits with very many package leads can be manufactured in a simple manner without additional steps being necessary. The method according to the invention is thus comparatively inexpensive.

10. 发明申请

WO2013087101A8 SUBSTRATE-SUPPORTED CIRCUIT PARTS WITH FREE-STANDING THREE-DIMENSIONAL STRUCTURES 审中-公开
标题翻译：具有自由立体三维结构的基板支持电路部件
公开(公告)号：WO2013087101A8
公开(公告)日：2013-08-29
申请号：PCT/EP2011072753
申请日：2011-12-14
申请人： REINHARDT MICROTECH GMBH , RUESS KARIN , KAISER ALEXANDER , FEURER ERNST , HOLL BRUNO
发明人： RUESS KARIN , KAISER ALEXANDER , FEURER ERNST , HOLL BRUNO
IPC分类号： H01L23/482 , H01L21/48 , H01L21/60 , H01L23/538 , H01L25/065 , H05K3/40
CPC分类号： H01L23/4822 , B81C1/00095 , H01L23/5385 , H01L25/0652 , H01L25/0655 , H01L2225/06524 , H01L2924/0002 , H01L2924/19107 , H05K1/0306 , H05K1/148 , H05K3/4092 , H05K2201/0397 , H01L2924/00
摘要： In a method of manufacturing a substrate-supported circuit part (1) with a freestanding three-dimensional structure (2), the manufacturing method comprises the steps of: providing a pre-cleaned substrate plate (3); structuring at least one low-adhesion-strength layer (9) on an upper surface (4) of the substrate plate (3); depositing an adhesion layer (10) onto the upper surface (4) of the substrate plate (3) and onto the at least one low-adhesion-strength layer (9); depositing a conducting layer (11) onto the adhesion layer (10); structuring of conductive path material (15) on the conducting layer (11); forming a separating gap (19) between at least one resting substrate portion (20) and at least one removable substrate portion (21) that carries the later free-standing three-dimensional structure (2); and removing the at least one removable substrate portion (21) below the later free-standing three-dimensional structure (2) in the area of the low-adhesion strength layer (9). Manufacturing combinations (23) of substrate-supported circuit parts (1) with a free-standing three-dimensional structure (2) that have been produced with the inventive method and manufacturing 3D stacking assemblies (24) from such combinations (23) of substrate-supported circuit parts (1) with freestanding three-dimensional structures (2) is disclosed as well.
摘要翻译：在制造具有独立三维结构（2）的基板支撑电路部分（1）的方法中，所述制造方法包括以下步骤：提供预清洁的基板（3）; 在所述基板（3）的上表面（4）上构造至少一个低粘附强度层（9）; 在所述基板（3）的上表面（4）上沉积粘附层（10）并且至少一个低粘附强度层（9）上; 在所述粘合层（10）上沉积导电层（11）; 在导电层（11）上构造导电路径材料（15）; 在至少一个搁置的基底部分（20）和至少一个可移除的基底部分（21）之间形成分离间隙（19），所述至少一个可移除的基底部分（21）承载后来独立的三维结构（2）; 以及在所述低粘附强度层（9）的区域中移除所述随后独立的三维结构（2）下方的所述至少一个可移除基板部分（21）。使用本发明方法制造的具有独立三维结构（2）的基板支撑电路部件（1）的制造组合（23）和从基板的这种组合（23）制造3D堆叠组件（24）还公开了具有独立三维结构（2）的支撑电路部件（1）。

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