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21. 发明申请

WO1996015458A1 PROBE CARD ASSEMBLY AND KIT, AND METHODS OF USING SAME 审中-公开
标题翻译：探针卡组件和套件，以及使用它们的方法
公开(公告)号：WO1996015458A1
公开(公告)日：1996-05-23
申请号：PCT/US1995014844
申请日：1995-11-13
申请人： FORMFACTOR, INC.
发明人： FORMFACTOR, INC. , KHANDROS, Igor, Y. , MATHIEU, Gaetan, L. , ELDRIDGE, Benjamin, N. , GRUBE, Gary, W.
IPC分类号： G01R01/073
CPC分类号： H05K7/1069 , B23K1/0016 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/0466 , G01R1/0483 , G01R1/06711 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07371 , G01R1/07378 , G01R31/2884 , G01R31/2886 , G01R31/2889 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/67138 , H01L22/20 , H01L23/32 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/05124 , H01L2224/05166 , H01L2224/05599 , H01L2224/05647 , H01L2224/1134 , H01L2224/13099 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/16145 , H01L2224/29111 , H01L2224/45014 , H01L2224/45015 , H01L2224/45111 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/456 , H01L2224/48091 , H01L2224/48227 , H01L2224/48463 , H01L2224/48599 , H01L2224/48699 , H01L2224/48799 , H01L2224/49109 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/78301 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01037 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/0106 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15312 , H01L2924/1532 , H01L2924/15787 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H01R13/2407 , H01R13/2464 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , Y02P70/611 , H01L2924/00 , H01L2924/01013 , H01L2924/01026 , H01L2924/3512 , H01L2224/29099 , H01L2224/48 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/00012 , H01L2924/20751 , H01L2924/20756 , H01L2924/20757 , H01L2924/00015 , H01L2924/2075
摘要： A probe card assembly (500) includes a probe card (502), a space transformer (506) having resilient contact structures (probe elements) (524) mounted directly to and extending from terminals (522) on a surface thereof, and an interposer (504) disposed between the space transformer (506) and the probe card (502). The space transformer (506) and interposer are "stacked up" so that the orientation of the space transformer (506), hence the orientation of the tips of the probe elements (524), can be adjusted without changing the orientation of the probe card. Suitable mechanisms (532, 536, 538, 546) for adjusting the orientation of the space transformer (506), and for determining what adjustments to make, are disclosed. Multiple die sites on a semiconductor wafer (508) are readily probed using the disclosed techniques, and the probe elements (524) can be arranged to optimize probing of an entire wafer (508). Composite interconnection elements (200) having a relatively soft core (206) covercoated by a relatively hard shell (218, 220) as the resilient contact structures are described.
摘要翻译：探针卡组件（500）包括探针卡（502），具有弹性接触结构（探针元件）（524）的空间变换器（506），其直接安装在其表面上并从端子（522）延伸，（504），设置在所述空间变压器（506）和所述探针卡（502）之间。空间变换器（506）和插入器被“堆叠”，使得可以调节空间变换器（506）的取向，从而可以调节探针元件（524）的尖端的取向而不改变探针卡的取向。公开了用于调整空间变换器（506）的取向并用于确定要做出什么调整的适当的机构（532,536,538,546）。使用所公开的技术容易地探测半导体晶片（508）上的多个裸片位置，并且可以布置探针元件（524）以优化整个晶片（508）的探测。描述具有由相对较硬的外壳（218,220）作为弹性接触结构覆盖的相对软的芯（206）的复合互连元件（200）。

22. 发明申请

WO2016037432A1 LED模组及显示器审中-公开
公开(公告)号：WO2016037432A1
公开(公告)日：2016-03-17
申请号：PCT/CN2014/093781
申请日：2014-12-13
申请人：深圳TCL新技术有限公司
发明人：林杰 , 强科文 , 钟燮和
IPC分类号： F21V29/70 , F21V29/80 , F21V23/00 , F21Y101/02
CPC分类号： F21V29/70 , F21V19/0025 , F21V23/00 , F21V29/80 , F21Y2115/10 , G02B6/0068 , G02B6/0073 , G02B6/0085 , H05K1/0203 , H05K3/308 , H05K3/325 , H05K2201/066 , H05K2201/10106 , H05K2201/10393 , H05K2201/10598 , H05K2201/10878
摘要：一种LED模组及显示器，LED模组包括LED灯（10）、散热器（20）以及PCB板（30），LED灯包括LED主体（11）以及设于LED主体上的导热块（12）和管脚（13），导热块设于LED主体的面向PCB板的底面（111）上，管脚的自由端贯通PCB板并与PCB板的焊盘（311）电连接，散热器夹持于导热块与PCB板之间，导热块抵触在散热器上。LED模组通过将散热器夹持于LED灯的导热块与PCB板之间，使得导热块紧贴在散热器上，从而使LED灯在工作时所产生的热量能直接通过导热块传导到散热器上进行散热，从而提高LED灯的散热效果。

23. 发明申请

WO2014058577A1 EYE-OF-THE NEEDLE PIN CONTACT 审中-公开
标题翻译：眼睛指针联系人
公开(公告)号：WO2014058577A1
公开(公告)日：2014-04-17
申请号：PCT/US2013/060258
申请日：2013-09-18
申请人： TYCO ELECTRONICS CORPORATION
发明人： TROUT, David Allison
IPC分类号： H01R12/58 , H05K3/30
CPC分类号： H01R4/26 , H01R12/585 , H05K3/308 , H05K2201/10189 , H05K2201/1059 , H05K2201/10878
摘要： An eye-of-the needle (EON) pin contact (32) is configured to be received within an electrical via (34) that includes conductive material (42). The EON pin contact comprises a compliant segment (60) including two opposing spring arms (64, 66) and an opening defined between the spring arms, the compliant segment being configured to be received within the electrical via such that the spring arms engage the conductive material. A tip segment (62) extending from the compliant segment is configured to be received into the electrical via before the compliant segment is received into the electrical via. The tip segment comprises broaches (82a, 82b) that are configured to displace the conductive material as the tip segment is received into the electrical via so as to plow respective paths (104a, 104b) through the conductive material for reception of the spring arms.
摘要翻译：针眼（EON）针式触头（32）被配置为被接纳在包括导电材料（42）的电通路（34）内。 EON针接触件包括柔性部分（60），包括两个相对的弹簧臂（64,66）和限定在弹簧臂之间的开口，柔性部分构造成容纳在电通孔内，使得弹簧臂接合导电材料。从柔性段延伸的尖端段（62）被构造成在柔性段被接收到电通路内之前被接收到电通路中。尖端部分包括拉头（82a，82b），其被配置成当尖端部分被接收到电通孔中时移动导电材料，以便通过用于接收弹簧臂的导电材料犁下相应的路径（104a，104b）。

24. 发明申请

WO2012069928A1 BOARD CONNECTOR ASSEMBLY 审中-公开
标题翻译：板连接器总成
公开(公告)号：WO2012069928A1
公开(公告)日：2012-05-31
申请号：PCT/IB2011/003125
申请日：2011-11-23
申请人： FCI , DROESBEKE, Gert , YAHYA, Ould
发明人： DROESBEKE, Gert , YAHYA, Ould
IPC分类号： H05K3/30 , H05K3/32
CPC分类号： H05K3/308 , H01R12/58 , H05K3/325 , H05K2201/10189 , H05K2201/1078 , H05K2201/1084 , H05K2201/10878
摘要： The present invention relates to a connector assembly comprising : a printed circuit board (PCB) having a through- hole; a connector mounted on a first surface of the PCB and having a mounting peg received in the through- hole. The connector assembly further comprises a locking member cooperating with the mounting peg thereby increasing the retention force of the peg in the through-hole.
摘要翻译：本发明涉及一种连接器组件，包括：具有通孔的印刷电路板（PCB）; 连接器，其安装在PCB的第一表面上，并且具有容纳在通孔中的安装钉。连接器组件还包括与安装钉配合的锁定构件，从而增加了钉在通孔中的保持力。

25. 发明申请

WO2006111421A1 SCHMELZSICHERUNG FÜR LEITERPLATTENMONTAGE 审中-公开
标题翻译：保险丝电路板组装
公开(公告)号：WO2006111421A1
公开(公告)日：2006-10-26
申请号：PCT/EP2006/003755
申请日：2006-04-24
申请人： DBK DAVID + BAADER GMBH , GSCHWIND, Thomas , BAUER, Hans-Peter
发明人： GSCHWIND, Thomas , BAUER, Hans-Peter
IPC分类号： H01H85/10
CPC分类号： H05K1/0201 , H01H37/761 , H01H85/10 , H01H2085/0275 , H01H2085/0555 , H05K3/308 , H05K2201/10181 , H05K2201/10878 , H05K2201/10909
摘要： Eine Schmelzsicherung für Leiterplattenmontage besitzt Anschlüsse, die mit Leiterbahnen auf der Leiterplatte elektrisch verbindbar sind, sowie mindestens eine leitfähige und schmelzbare Verbindung zwischen den Anschlüssen. Sie ist so gestaltet, dass sie kostengünstig einstückig aus Blech oder leitfähigem Kunststoff gefertigt werden kann. Die Schmelzsicherung kann eine Überhitzung einer Heizvorrichtung, in der sie eingesetzt wird, verhindern, indem sie angepasst ist, die mindestens eine leitfähige und schmelzbare Verbindung bei thermischer Überlast zu trennen.
摘要翻译：一种用于电路板组件保险丝具有电连接到电路迹线在印刷电路板上的端子，和至少一个导电可熔链路和端子之间。它被设计成使得它可以在由金属板或导电塑料单件被廉价地制造。熔丝可以防止在其被使用由适于以分离至少一个导电可熔链路和下热过载的加热器的过热。

26. 发明申请

WO98050954A1 STACKED SEMICONDUCTOR DEVICES, PARTICULARLY MEMORY CHIPS 审中-公开
标题翻译：堆叠式半导体器件，特殊存储器芯片
公开(公告)号：WO98050954A1
公开(公告)日：1998-11-12
申请号：PCT/US1998/009442
申请日：1998-05-08
IPC分类号： B23K20/00 , C25D7/12 , G01R1/067 , G01R1/073 , G01R31/28 , H01L21/00 , H01L21/48 , H01L21/56 , H01L21/60 , H01L21/603 , H01L21/66 , H01L23/48 , H01L23/485 , H01L23/49 , H01L23/498 , H01L25/065 , H01L25/16 , H05K1/14 , H05K3/20 , H05K3/32 , H05K3/34 , H05K3/36 , H05K3/40
CPC分类号： B23K20/004 , B23K2101/40 , C25D7/12 , G01R1/07378 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/48 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/0657 , H01L25/16 , H01L2224/1134 , H01L2224/13099 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13169 , H01L2224/13611 , H01L2224/13613 , H01L2224/13616 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/16 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06541 , H01L2225/06555 , H01L2225/06562 , H01L2225/06572 , H01L2924/00013 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K3/4015 , H05K2201/1031 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , H01L2924/00014
摘要： High density packaging of semiconductor devices on an interconnection substrate is achieved by stacking bare semiconductor devices (402, 404, 406, 408) atop one another so that an edge portion of a semiconductor device extends beyond the semiconductor device that it is stacked atop. Elongate interconnection elements (422, 424, 426, 428) extend from the bottommost one of the semiconductor devices, and from the exposed edge portions of the semiconductor devices stacked atop the bottommost semiconductor device. Free-ends of the elongate interconnection elements make electrical contact with terminals of an interconnection substrate (430), such as a PCB. The elongate interconnection elements extending from each of the semiconductor devices are sized so as to reach the terminals of the PCB, which may be plated through holes (432, 434, 436, 438). The elongate interconnection elements are suitably resilient contact structures, and may be composite interconnection elements comprising a relatively soft core (e.g., a gold wire) and a relatively hard overcoat (e.g., a nickel plating).
摘要翻译：通过将半导体器件（402,404,406,408）彼此顶起堆叠来实现半导体器件在互连衬底上的高密度封装，使得半导体器件的边缘部分延伸超过其顶部堆叠的半导体器件。细长的互连元件（422,424,426,428）从半导体器件的最底端延伸，并且从半导体器件的暴露的边缘部分堆叠在最底层的半导体器件的顶部。细长互连元件的自由端与诸如PCB的互连衬底（430）的端子电接触。从每个半导体器件延伸的细长互连元件的尺寸被设计成到达可以通过孔（432,434,436,438）电镀的PCB的端子。细长互连元件是合适的弹性接触结构，并且可以是包括相对软的芯（例如，金线）和相对硬的外涂层（例如镀镍）的复合互连元件。

27. 发明申请

WO1998018168A1 PHOTOINTERRUPTOR 审中-公开
标题翻译：光遮断器
公开(公告)号：WO1998018168A1
公开(公告)日：1998-04-30
申请号：PCT/JP1997003834
申请日：1997-10-22
申请人： ROHM CO., LTD. , SANO, Masashi , BAMBA, Yasue , SUZUKI, Shinichi , NAKAI, Kenichi
发明人： ROHM CO., LTD.
IPC分类号： H01L31/12
CPC分类号： H01L31/167 , H05K3/308 , H05K2201/10757 , H05K2201/10878
摘要： A light emitting device (1) and a photodetector (2) face each other with a space therebetween in such a way that the light emitting device (1) emits light and the photodetector (2) receives the light. They are fixed with a package made of an opaque material. The leads of the light emitting device and the photodetector are led out of the bottom surface (A) of the package (3), inserted into the through-holes of a substrate and soldered. Axial movement preventive bent parts (11g and 21g) which have at least 1st bending points at the positions on the leads apart from the bottom surface of the package by a distance smaller than the thickness of the substrate are formed. As a result, when the leads of the photointerruptor are inserted into, e.g., a printed board and soldered, no inclination nor misalignment occurs.
摘要翻译：发光器件（1）和光电检测器（2）以这样的方式彼此面对，使得发光器件（1）发光并且光电检测器（2）接收光。它们用不透明材料制成的包装件固定。将发光器件和光电检测器的引线从插入到基板的通孔中的封装（3）的底表面（A）引出并进行焊接。形成了轴向运动防止弯曲部分（11g和21g），其在从包装的底表面离开的位置处的至少第一弯曲点距离小于衬底厚度的距离。结果，当光中断器的引线插入例如印刷电路板并焊接时，不会发生倾斜或不对准。

28. 发明申请

WO1996037331A1 WIRE BONDING, SEVERING, AND BALL FORMING 审中-公开
标题翻译：电线连接，密封和球形
公开(公告)号：WO1996037331A1
公开(公告)日：1996-11-28
申请号：PCT/US1996007924
申请日：1996-05-24
申请人： FORMFACTOR, INC. , ELDRIDGE, Benjamin, N. , MATHIEU, Gaetan, L.
发明人： FORMFACTOR, INC.
IPC分类号： B23K09/067
CPC分类号： H05K3/4015 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/07314 , G01R1/07357 , G01R3/00 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/13 , H01L24/45 , H01L24/72 , H01L24/78 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/1134 , H01L2224/13099 , H01L2224/16145 , H01L2224/45015 , H01L2224/45144 , H01L2224/73203 , H01L2224/78301 , H01L2224/786 , H01L2224/81801 , H01L2224/85045 , H01L2224/851 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/0001 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01039 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/1532 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K2201/1031 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , Y02P70/611 , H01L2224/48 , H01L2924/00 , H01L2924/00015 , H01L2224/81205
摘要： The efficacy of electrical discharges for severing bond wires (102, 202) and/or for forming balls (234, 236) at the ends of bond wires (including bond wires (202) already severed by alternative mechanisms) is improved by performing the electrical discharges in the presence of ultraviolet light (130). A "spark gap" is formed between an EFO electrode (118, 232) and the wire (102, 202), one of which serves as the cathode of the spark gap. Preferably, the ultraviolet light (130) is directed at the element serving as the cathode of the spark gap. Providing photoemission at the cathode element of the spark gap stabilizes arc/plasma formation and produces more reliable and predictable results. This technique may be used in conjunction with negative EFO systems or with positive EFO systems, and may benefit from either direct or field-assisted photoemission.
摘要翻译：在接合线（包括已经被替代机制切断的接合线（202））的端部处用于切断接合线（102,202）和/或形成球（234,236）的放电的功效通过执行电在有紫外光的情况下放电（130）。在EFO电极（118,232）和线（102,202）之间形成“火花隙”，其中一个用作火花隙的阴极。优选地，紫外线（130）指向用作火花隙的阴极的元件。在火花间隙的阴极元件处提供光电发射使电弧/等离子体形成稳定，并产生更可靠和可预测的结果。这种技术可以与负EFO系统或正EFO系统结合使用，并可从直接或场辅助光电发射中受益。

29. 发明申请

WO1996015459A1 MOUNTING SPRING ELEMENTS ON SEMICONDUCTOR DEVICES, AND WAFER-LEVEL TESTING METHODOLOGY 审中-公开
标题翻译：半导体器件的安装弹簧元件和水平测试方法
公开(公告)号：WO1996015459A1
公开(公告)日：1996-05-23
申请号：PCT/US1995014885
申请日：1995-11-15
申请人： FORMFACTOR, INC.
发明人： FORMFACTOR, INC. , KHANDROS, Igor, Y. , MATHIEU, Gaetan, L. , ELDRIDGE, Benjamin, N. , GRUBE, Gary, W.
IPC分类号： G01R01/073
CPC分类号： H05K7/1069 , B23K1/0016 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/0483 , G01R31/2863 , H01L21/288 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/67138 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/05082 , H01L2224/05644 , H01L2224/1134 , H01L2224/1147 , H01L2224/13099 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13582 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/16145 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/45644 , H01L2224/4824 , H01L2224/48465 , H01L2224/48644 , H01L2224/48699 , H01L2224/48844 , H01L2224/49109 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2224/85205 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , H01L2924/00 , H01L2224/48 , H01L2924/20752 , H01L2924/20753 , H01L2224/48744 , H01L2924/20751 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/00015 , H01L2924/2075 , H01L2924/20754
摘要： Resilient contact structures (430) are mounted directly to bond pads (410) on semiconductor dies (402a, 402b), prior to the dies (402a, 402b) being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies (402a, 402b) to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies (702, 704) with a circuit board (710) or the like having a plurality of terminals (712) disposed on a surface thereof. Subsequently, the semiconductor dies (402a, 402b) may be singulated from the semiconductor wafer, whereupon the same resilient contact structures (430) can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements (430) of the present invention as the resilient contact structures, burn-in (792) can be performed at temperatures of at least 150 DEG C, and can be completed in less than 60 minutes.
摘要翻译：在将模具（402a，402b）与半导体晶片分离（分离）之前，将弹性接触结构（430）直接安装在半导体管芯（402a，402b）上的接合焊盘（410）上。这使得半导体管芯（402a，402b）能够通过用具有多个端子的电路板（710）等连接到半导体管芯（702,704）来实现（例如，测试和/或烧入）半导体管芯（402a，402b）（712）设置在其表面上。随后，半导体管芯（402a，402b）可以从半导体晶片分离，于是可以使用相同的弹性接触结构（430）来实现半导体管芯和其它电子部件（例如布线基板，半导体封装，等等。）。使用本发明的全金属复合互连元件（430）作为弹性接触结构，老化（792）可以在至少150℃的温度下进行，并且可以在少于60分钟内完成。

30. 发明申请

WO1991005369A1 HEATSINK FOR SEMICONDUCTOR DEVICES 审中-公开
标题翻译：用于半导体器件的HEATSINK
公开(公告)号：WO1991005369A1
公开(公告)日：1991-04-18
申请号：PCT/GB1990001482
申请日：1990-09-27
申请人： REDPOINT LIMITED , JOHNSON, Robin, Douglas
发明人： REDPOINT LIMITED
IPC分类号： H01L23/40
CPC分类号： H05K3/3447 , H01L23/4093 , H01L2924/0002 , H05K3/301 , H05K2201/10166 , H05K2201/10454 , H05K2201/10598 , H05K2201/10878 , H05K2201/10969 , H05K2201/10984 , H01L2924/00
摘要： An aluminium heatsink (15) for semiconducting devices (16) includes at least one portion, and preferably two portions (21), formed so as to be solderable into a circuit board. The portions are coated with aluminium solder (22) which, may itself, not melt during the securing process, but allows the portions to be soldered using conventional tin/lead solder. In an alternative embodiment, portions extending from said heatsink have a tine (29) which is secured by a hole in the circuit board.

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