专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2011065817A1 METHOD AND APPARATUS FOR LAMINATING A FIRST AND A SECOND SHEET 审中-公开
标题翻译：用于层叠第一张和第二张纸的方法和装置
公开(公告)号：WO2011065817A1
公开(公告)日：2011-06-03
申请号：PCT/NL2010/050728
申请日：2010-11-01
申请人： NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO , VAN DEN BRAND, Jeroen , BROERS, Sander Christiaan , SAALMINK, Milan , DIETZEL, Andreas Heinrich
发明人： VAN DEN BRAND, Jeroen , BROERS, Sander Christiaan , SAALMINK, Milan , DIETZEL, Andreas Heinrich
IPC分类号： B32B37/10 , B32B38/18
CPC分类号： B32B37/0046 , B32B37/10 , B32B37/1009 , B32B38/1841 , B32B2309/68 , Y10T156/1028 , Y10T156/1304 , Y10T156/133 , Y10T156/1335 , Y10T156/1702 , Y10T156/1734
摘要： An apparatus is provided for laminating a first and a second sheet (1, 2) comprising - a chamber (10) having a first, a second and a third compartment (11, 12, 13 resp.) subsequently arranged along a first axis (Z), each compartment having a port (21, 22, 23 resp.) - a first sheet carrier (40) arranged transverse to said first axis (Z) and being displaceable along said first axis (Z), - a second sheet carrier (50) arranged in a plane aligned with and opposite the first sheet carrier (40), the second sheet carrier being displaceable and/or rotatable in said plane, - a first flexible membrane (42) extending laterally to a wall of the chamber, the first sheet carrier (40) and/or the first flexible membrane (42) separating the first and the second compartment (11, 12) of the chamber (10) from each other, - a second flexible membrane (52) extending laterally from the second sheet carrier (50) to the wall of the chamber, the second sheet carrier (50) and the second flexible membrane (52) separating the second and the third compartment (12, 13) of the chamber (10) from each other, - an alignment facility (60) for aligning the second sheet (2) relative to the first sheet (1) by moving the second sheet carrier (50) in a direction transverse to the first axis (Z) and/or rotating the second sheet carrier around an axis parallel to the first axis (Z).
摘要翻译：提供一种用于层压第一和第二片材（1,2）的装置，所述第一片材和第二片材（1,2）包括 - 腔室（10），其具有随后沿着第一轴线布置的第一，第二和第三隔室（11,12,13） Z），每个隔室具有端口（21,22,23） - 横向于所述第一轴线（Z）布置并可沿所述第一轴线（Z）移位的第一片材载体（40）， - 第二片材载体（50），布置在与所述第一片状载体（40）对准并相对的平面中，所述第二片状载体在所述平面内是可移动的和/或可旋转的; - 横向延伸到所述腔壁的第一柔性膜（42）将所述腔室（10）的第一和第二隔室（11,12）彼此分隔开的第一片状载体（40）和/或第一柔性膜（42）， - 第二柔性膜（52）第二片状载体（50）到室的壁，第二片状载体（50）和第二柔性膜（52）sep 将所述腔室（10）的第二和第三隔室（12,13）彼此相对; - 对准设备（60），用于通过移动所述第二片材（2）来相对于所述第一片材（1）对准所述第二片材（50）沿着与第一轴线（Z）横切的方向和/或使第二片材载体围绕平行于第一轴线（Z）的轴线旋转。

2. 发明申请

WO2011065819A1 APPARATUS AND METHOD FOR LAMINATING A FIRST AND A SECOND SHEET 审中-公开
标题翻译：第一和第二页的装置和方法
公开(公告)号：WO2011065819A1
公开(公告)日：2011-06-03
申请号：PCT/NL2010/050774
申请日：2010-11-19
申请人： NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO , VAN DEN BRAND, Jeroen , DIETZEL, Andreas, Heinrich , BROERS, Sander, Christiaan , SAALMINK, Milan
发明人： VAN DEN BRAND, Jeroen , DIETZEL, Andreas, Heinrich , BROERS, Sander, Christiaan , SAALMINK, Milan
IPC分类号： B32B38/18 , H01L51/00 , H01K13/00 , B65H37/04
CPC分类号： B32B38/1841 , H01L51/0024 , H01L51/56 , Y10T156/10
摘要： The invention relates to an apparatus for laminating a first and a second sheet with a plane carrier (10) and a drum shaped carrier (20) for carrying a respective sheet. The apparatus has a first main operational mode wherein the drum shaped carrier (20) is at distance from a first carrier surface (12) of the plane carrier (10) in said third direction (Z), and a second main operational mode wherein the drum shaped carrier (20) is close to first carrier surface to bring the first and the second sheet (1, 2) in contact with each other. In the first main operational mode the drum shaped carrier (20) is virtually rolled over the first carrier surface (12) and the sheets are mutually aligned. In the second operational mode the sheets are laminated.
摘要翻译：本发明涉及一种用于层压第一和第二片材的装置，其具有用于承载相应片材的平面载体（10）和鼓形载体（20）。所述设备具有第一主要操作模式，其中所述鼓形载体（20）在所述第三方向（Z）处距离所述平面载体（10）的第一载体表面（12）的距离处，以及第二主要操作模式，其中鼓形载体（20）靠近第一载体表面以使第一和第二片材（1,2）彼此接触。在第一主要操作模式中，鼓形托架（20）在第一载体表面（12）上虚拟地滚动，并且片材相互对准。在第二操作模式中，片材被层压。

3. 发明申请

WO2010008281A1 A METHOD OF FORMING A HIGH DENSITY STRUCTURE 审中-公开
标题翻译：形成高密度结构的方法
公开(公告)号：WO2010008281A1
公开(公告)日：2010-01-21
申请号：PCT/NL2009/050430
申请日：2009-07-14
申请人： NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO , VAN DEN BRAND, Jeroen , Dietzel, Andreas Heinrich, Dietzel, Andreas Heinrich
发明人： VAN DEN BRAND, Jeroen , Dietzel, Andreas Heinrich, Dietzel, Andreas Heinrich
IPC分类号： H05K3/10 , H05K3/12
CPC分类号： H05K3/107 , H05K1/183 , H05K3/0026 , H05K3/1258 , H05K2201/09036 , H05K2203/0264
摘要： The invention relates to a method of forming a high density structure comprising the steps of providing a substrate (2) wherein the high density structure is to be formed with a release liner (3), said release liner being self-removable; forming at least one cavity (5a, 5b) in the substrate through the release liner, said at least one cavity forming at least a part of the high density structure; at least partially filling the at least one cavity with a filler material (7a, 7b); sintering the thus formed structure; removing the release liner from the substrate (2).
摘要翻译：本发明涉及一种形成高密度结构的方法，包括以下步骤：提供其中高密度结构将与剥离衬垫（3）形成的基底（2），所述释放衬垫是可自行拆卸的; 通过所述释放衬垫在所述衬底中形成至少一个空腔（5a，5b），所述至少一个空腔形成所述高密度结构的至少一部分; 用填充材料（7a，7b）至少部分地填充所述至少一个空腔; 烧结由此形成的结构; 从衬底（2）上移除释放衬垫。

4. 发明申请

WO2009070018A1 METHOD OF PROVIDING CONDUCTIVE STRUCTURES IN A MULTI-FOIL SYSTEM AND MULTI-FOIL SYSTEM COMPRISING SAME 审中-公开
标题翻译：在多层系统中提供导电结构的方法和包含其的多层系统
公开(公告)号：WO2009070018A1
公开(公告)日：2009-06-04
申请号：PCT/NL2008/050750
申请日：2008-11-26
申请人： NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO , DIETZEL, Andreas Heinrich , MICHELS, Jasper Joost , VAN DEN BRAND, Jeroen , MEINDERS, Erwin Rinaldo
发明人： DIETZEL, Andreas Heinrich , MICHELS, Jasper Joost , VAN DEN BRAND, Jeroen , MEINDERS, Erwin Rinaldo
IPC分类号： H05K3/10 , H05K3/40
CPC分类号： H05K3/4038 , H05K3/105 , H05K3/321 , H05K3/4626 , H05K2201/0108 , H05K2203/107 , H05K2203/1136 , H05K2203/1142 , H05K2203/1545
摘要： According to one aspect, the invention provides a method of providing conductive structures in a multi-foil system comprising at least two foils (1), at least one foil comprising an electrical circuit with a terminal (2), comprising, in any successive order the steps of providing an adhesive (3) on at least one of the foils for bonding the foils, the adhesive at least provided on and around the terminal; and converting the conductivity properties of said adhesive within a conversion zone, so as to form the conductive structure (4); and bonding the at least two foils.
摘要翻译：根据一个方面，本发明提供了一种在多箔系统中提供导电结构的方法，所述多箔系统包括至少两个箔（1），至少一个箔，其包括具有端子（2）的电路，所述箔包括任何连续的顺序在至少一个箔上提供用于粘合箔的粘合剂（3），至少设置在端子上和周围的粘合剂的步骤; 并在转化区内转化所述粘合剂的导电性，从而形成导电结构（4）; 以及接合所述至少两个箔。

5. 发明申请

WO2010002252A1 METHOD OF PROVIDING CONDUCTIVE STRUCTURES IN A MULTI-FOIL SYSTEM AND MULTIFOIL SYSTEM COMPRISING SAME 审中-公开
标题翻译：在多层系统中提供导电结构的方法和包含其中的多层系统
公开(公告)号：WO2010002252A1
公开(公告)日：2010-01-07
申请号：PCT/NL2009/050389
申请日：2009-07-01
申请人： NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO , DIETZEL, Andreas Heinrich , VAN DEN BRAND, Jeroen
发明人： DIETZEL, Andreas Heinrich , VAN DEN BRAND, Jeroen
IPC分类号： H05K3/46
CPC分类号： H05K3/361 , H05K3/0035 , H05K3/321 , H05K3/4069 , H05K3/4614 , H05K3/4617 , H05K3/462 , H05K2201/058 , H05K2201/09727 , H05K2201/09845 , H05K2201/10977 , H05K2203/063 , Y10T156/1056
摘要： According to one aspect, the invention provides a method of providing conductive structures between two foils in a multi-foil system. The system comprises at least two foils, from which at least one foil comprises a terminal. The method comprises the steps of (in any order) providing at least one solid state adhesive layer, patterning adhesive layer with through-holes; filling the through-holes with conductive material, so as to form the conductive structure, connected to the terminal; and bonding the at least two foils. One advantage of the invention is that it may be used in a manufacturing process for multi-foil systems.
摘要翻译：根据一个方面，本发明提供了一种在多箔系统中在两个箔之间提供导电结构的方法。该系统包括至少两个箔，至少一个箔包括一个端子。该方法包括以下步骤（以任何顺序）提供至少一个固态粘合剂层，图案化具有通孔的粘合剂层; 用导电材料填充通孔，以形成连接到端子的导电结构; 以及接合所述至少两个箔。本发明的一个优点是可以用于多箔系统的制造过程中。

6. 发明申请

WO2009113860A1 LAMINATING DEVICE AND LAMINATING METHOD 审中-公开
标题翻译：层压装置和层压方法
公开(公告)号：WO2009113860A1
公开(公告)日：2009-09-17
申请号：PCT/NL2009/050123
申请日：2009-03-13
申请人： NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO , VAN DEN BRAND, Jeroen , DIETZEL, Andreas Heinrich , DE VRIES, Ike
发明人： VAN DEN BRAND, Jeroen , DIETZEL, Andreas Heinrich , DE VRIES, Ike
IPC分类号： B32B38/18
CPC分类号： B32B38/1841 , B32B37/203 , B32B2457/00
摘要： A laminating apparatus (200) for laminating a substrate foil (SF) with a laminating foil (LF) comprises -a first and a second facility (210, 214) for providing the substrate foil and the laminating foil respectively, -a recognition facility (224, 225) for determining a location of at least one feature of at least one (LF) of the laminating foil and the substrate foil and -an alignment facility (252, 253) for aligning the at least one (LF) of the foils, -a separation facility (240) for separating a portion (SF1; LF1) of the at least one of the foils after it is controlled by the alignment facility, -a laminating facility (250, 252) for laminating the separated portion of the at least one of the foil against the other one of the foils.
摘要翻译：用于层压衬底箔（SF）与层压箔（LF）的层压装置（200）包括分别用于提供衬底箔和层压箔的第一和第二设备（210,214）， - 识别设备用于确定所述层压箔和所述衬底箔的至少一个（LF）的至少一个特征的位置以及用于对准所述至少一个（LF）箔的对准设备（252,253）的对准设备， - 分离设备（240），用于在被所述对准设备控制之后分离所述至少一个所述箔的部分（SF1; LF1）; - 层压设备（250,252），用于层压所述至少一个箔中的至少一个箔对着另一个箔。

7. 发明申请

WO2012074405A1 METHOD AND APPARATUS FOR ASSEMBLING ELECTRIC COMPONENTS ON A FLEXIBLE SUBSTRATE AS WELL AS ASSEMBLY OF AN ELECTRIC COMPONENT WITH A FLEXIBLE SUBSTRATE 审中-公开
标题翻译：用于组装柔性基板上的电气部件的方法和装置，以便组装具有柔性基板的电气部件
公开(公告)号：WO2012074405A1
公开(公告)日：2012-06-07
申请号：PCT/NL2011/050830
申请日：2011-12-02
申请人： NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO , VAN DEN BRAND, Jeroen , KUSTERS, Roel Henry Louis , DIETZEL, Andreas Heinrich
发明人： VAN DEN BRAND, Jeroen , KUSTERS, Roel Henry Louis , DIETZEL, Andreas Heinrich
IPC分类号： H05K3/32 , H01L23/00
CPC分类号： H05K3/32 , H01L23/4985 , H01L24/24 , H01L24/76 , H01L24/82 , H01L2224/2405 , H01L2224/24051 , H01L2224/24226 , H01L2224/25171 , H01L2224/25175 , H01L2224/76155 , H01L2224/76261 , H01L2224/766 , H01L2224/767 , H01L2224/82102 , H01L2224/82104 , H01L2224/82106 , H01L2224/82874 , H01L2224/9202 , H01L2224/92144 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0106 , H01L2924/01079 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H05K1/0283 , H05K1/189 , H05K3/12 , H05K3/305 , H05K2201/10674 , H05K2203/107 , H05K2203/1469 , H05K2203/1545 , H05K2203/175 , Y10T29/49133 , Y10T29/53178 , H01L2924/00
摘要： A method is presented for assembling a component (30) with a flexible substrate (10), the component having electric contacts (31). The method comprises the steps of - placing the component (30) on a first main side (11) of the substrate, - applying a machine vision step to estimate a position of the electric contacts, - depositing one or more layers (32) of an electrically conductive material or a precursor thereof, said layer extending over an area of the substrate defined by the component to laterally beyond said area, - calculating partitioning lines depending on the estimated position of the electric contacts, - partitioning the layer into mutually insulated areas (32d) by locally removing material from said layer along said partitioning lines. Also an apparatus is presented that is suitable for carrying out the method. In addition an assembly is present that can be obtained by the method and the apparatus according to the invention.
摘要翻译：提出了一种用于将组件（30）与柔性基板（10）组装的方法，该部件具有电触点（31）。该方法包括以下步骤：将部件（30）放置在基板的第一主侧（11）上， - 施加机器视觉步骤以估计电触点的位置， - 沉积一个或多个导电材料或其前体，所述层在由所述部件限定的衬底的区域上延伸到横向超过所述区域， - 根据所述电触点的估计位置计算划分线， - 将所述层划分成相互绝缘的区域（32d），通过沿着所述分隔线从所述层中去除材料。还提出了适合于执行该方法的装置。此外，存在可以通过根据本发明的方法和装置获得的组件。

8. 发明申请

WO2011099848A2 PRESSURE ASSISTED SELF TARGETING ASSEMBLY 审中-公开
标题翻译：压力自助定位组件
公开(公告)号：WO2011099848A2
公开(公告)日：2011-08-18
申请号：PCT/NL2011/050089
申请日：2011-02-08
申请人： NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO , DIETZEL, Andreas, Heinrich , VAN DEN BRAND, Jeroen
发明人： DIETZEL, Andreas, Heinrich , VAN DEN BRAND, Jeroen
IPC分类号： H01L21/98 , H01L21/60 , H05K13/02
CPC分类号： H01L24/95 , B81C3/005 , B81C99/002 , H01L21/67721 , H01L21/68 , H01L23/13 , H01L23/4985 , H01L23/5387 , H01L24/80 , H01L24/83 , H01L25/0655 , H01L25/50 , H01L2224/80001 , H01L2224/80003 , H01L2224/80121 , H01L2224/804 , H01L2224/83121 , H01L2224/834 , H01L2224/8349 , H01L2224/95001 , H01L2224/95093 , H01L2224/95115 , H01L2224/95122 , H01L2224/95123 , H01L2224/95136 , H01L2224/95148 , H01L2924/01015 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/15151 , H01L2924/15153 , H01L2924/15165 , H01L2924/0001
摘要： The invention relates to a placement method for placement of a chip component (10) on a flexible substrate (20), comprising: providing a support face (21) comprised of by the flexible substrate (20) or by a support structure to be aligned with the flexible substrate (20); administering a chip (10) to the support face (21); generating with a pressure chamber (60) an air flow in an out of plane orientation relative to the support face (21); and directing the chip to a placement position (30) by means of a directional structure (40) provided on the support face (21). In particular the chip (10) is levitated from the support face (21) by said air flow or by vibrational contact between the support face (21) and the chip (10) induced by said air flow; and wherein, when the support face is comprised by a support structure distinct from the flexible substrate, the support face is aligned with the flexible substrate. Accordingly, air cushion or intermittent contact forces (modulated in time and space using modulated micro- features) can be used to provide local interactions with the micro-part so as to position micro-parts with reference to micro-features arranged on the flexible substrate.
摘要翻译：本发明涉及一种用于将芯片部件（10）放置在柔性基板（20）上的放置方法，包括：提供由柔性基板（20）构成的支撑面（21）或由对准的支撑结构与所述柔性基板（20）接合; 向所述支撑面（21）施加芯片（10）; 用压力室（60）产生相对于支撑面（21）的面外取向的空气流; 以及通过设置在所述支撑面（21）上的定向结构（40）将所述芯片引导到放置位置（30）。特别地，芯片（10）通过所述空气流从支撑面（21）悬浮或通过由所述空气流引起的支撑面（21）和芯片（10）之间的振动接触; 并且其中当所述支撑面由与所述柔性基板不同的支撑结构构成时，所述支撑面与所述柔性基板对准。因此，可以使用气垫或间歇接触力（使用调制的微特征在时间和空间上调制）以提供与微部件的局部相互作用，以便参考布置在柔性基板上的微特征来定位微零件。

9. 发明申请

WO2010071426A1 FLEXIBLE ELECTRONIC PRODUCT AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：柔性电子产品及其制造方法
公开(公告)号：WO2010071426A1
公开(公告)日：2010-06-24
申请号：PCT/NL2009/050770
申请日：2009-12-16
申请人： NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO , VAN DEN BRAND, Jeroen , DIETZEL, Andreas Heinrich
发明人： VAN DEN BRAND, Jeroen , DIETZEL, Andreas Heinrich
IPC分类号： H05K1/18 , H01L23/538 , H05K3/10
CPC分类号： H05K1/185 , H01L21/486 , H01L23/49827 , H01L23/4985 , H01L23/5389 , H01L24/19 , H01L24/76 , H01L24/97 , H01L2224/04105 , H01L2224/32245 , H01L2224/73267 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01082 , H01L2924/07811 , H01L2924/12042 , H01L2924/14 , H05K1/0269 , H05K1/186 , H05K1/189 , H05K3/0032 , H05K3/0035 , H05K3/105 , H05K3/107 , H05K3/1258 , H05K3/32 , H05K2201/0108 , H05K2201/10674 , H05K2203/107 , H05K2203/1469 , H05K2203/1545 , H05K2203/1581 , Y10T29/49117 , Y10T29/49126 , Y10T29/49144 , H01L2924/00
摘要： P86798EP00 Abstract A method is described for manufacturing a flexible electronic product, the method comprising the steps of - providing (S1) a flexible foil (10; 110) with a first and a second, mutually opposite main side (11, 12; 111, 112), - placing (S2) a component (30; 130) at the first foil at the first main side (11; 111), the component having at least one electrical terminal (31; 131) facing towards the second main side (12; 112) - estimating (S3) a position of the at least one electrical terminal (131), - adaptively forming (S4) a conductive path (40A, 40B, 40C) to the at least one electrical terminal, based on said estimated position. [Figure 1]
摘要翻译： P86798EP00摘要描述了一种用于制造柔性电子产品的方法，该方法包括以下步骤：提供（S1）柔性箔（10; 110），其具有第一和第二相互相对的主侧（11,12; 111， 112）， - 在第一主侧（11; 111）的第一箔处放置（S2）部件（30; 130），所述部件具有面向第二主侧的至少一个电端子（31; 131）基于所述估计的（S3）确定所述至少一个电气终端（131）的位置， - 基于所述估计（S1），估计（S3）所述至少一个电气终端（131）的位置， - 自动地将所述导电路径（40A，40B，位置。 [图1]

10. 发明申请

WO2010005301A1 ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：电子设备及其制造方法
公开(公告)号：WO2010005301A1
公开(公告)日：2010-01-14
申请号：PCT/NL2009/050407
申请日：2009-07-07
申请人： NEDERLANDSE ORGANISATIE VOOR TOEGEPAST NATUURWETENSCHAPPELIJK ONDERZOEK TNO , KONINKLIJKE PHILIPS ELECTRONICS N.V. , VAN DEN BRAND, Jeroen , DIETZEL, Andreas Heinrich , YOUNG, Edward Willem Albert , LIFKA, Herbert , DEKEMPENAAR, Erik
发明人： VAN DEN BRAND, Jeroen , DIETZEL, Andreas Heinrich , YOUNG, Edward Willem Albert , LIFKA, Herbert , DEKEMPENAAR, Erik
IPC分类号： H01L27/32
CPC分类号： H01L27/3202 , H01L27/3204 , H01L51/0024 , H01L51/448 , H01L51/5203 , H01L51/524 , H01L2251/5361
摘要： An electronic device comprises a functional stack (10) and a cover (50) coupled thereto byan insulating adhesive layer (30). The functional stack (10) comprisesa first transparent and electrically conductive layer (22), a second electrically conductive layer (24) and a functional structure (26), comprising at least one layer, sandwiched between said first and second conductive layer. The cover (50) includes a substrate (52) and at least a first conductive structure (66, 68) that is arranged in a first plane between the adhesive layer (28) and the substrate (52). First and second transverse electrical conductors (32, 34) transverse to the first plane (61) electricallyinterconnect the first and the second electrically conductive layer (22, 24) with the first and the second conductive structure (66, 68) in the first plane (61).
摘要翻译：电子设备包括功能堆叠（10）和通过绝缘粘合剂层（30）与其耦合的盖（50）。功能堆叠（10）包括第一透明和导电层（22），第二导电层（24）和功能结构（26），其包括夹在所述第一和第二导电层之间的至少一层。盖（50）包括衬底（52）和布置在粘合剂层（28）和衬底（52）之间的第一平面中的至少第一导电结构（66,68）。横向于第一平面（61）的第一和第二横向电导体（32,34）将第一和第二导电层（22,24）与第一和第二导电结构（66,68）在第一平面（61）。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式