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31. 发明申请

WO2005074026A3 TIN-BASED COATING OF ELECTRONIC COMPONENT 审中-公开
标题翻译：电子元件的锡基涂层
公开(公告)号：WO2005074026A3
公开(公告)日：2005-10-06
申请号：PCT/US2005001999
申请日：2005-01-21
申请人： ENTHONE , XU CHEN , ZHANG YUN , FAN CHONGLUN , KHASELEV OSCAR , ABYS JOSEPH A , WALCH ERIC , KLEINFELD MARLIES , ECKERT HANS ULLRICH
发明人： XU CHEN , ZHANG YUN , FAN CHONGLUN , KHASELEV OSCAR , ABYS JOSEPH A , WALCH ERIC , KLEINFELD MARLIES , ECKERT HANS ULLRICH
IPC分类号： C25D5/12 , H01L23/495 , H01R4/02 , H01R13/03 , H05K3/34
CPC分类号： H01L23/49582 , C25D5/12 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2924/00014 , H01L2924/01327 , H01L2924/15747 , H01L2924/19041 , H01R4/02 , H01R13/03 , H05K3/3426 , H05K2201/10909 , Y02P70/613 , Y10T428/12722 , H01L2224/45099 , H01L2924/00
摘要： A method for reducing whisker formation and preserving solderability in tin coatings over metal features of electronic components. The tin coating has internal tensile stress and is between about 0.5 m and about 4.0 m in thickness. There is a nickel-based layer under the tin coating.
摘要翻译：一种减少电子部件的金属特征的方法，用于减少锡涂层中的晶须形成和保持锡涂层的可焊性。锡涂层具有内部拉伸应力，厚度在约0.5μm至约4.0μm之间。在锡涂层下面有一个镍基层。

32. 发明申请

WO98050954A1 STACKED SEMICONDUCTOR DEVICES, PARTICULARLY MEMORY CHIPS 审中-公开
标题翻译：堆叠式半导体器件，特殊存储器芯片
公开(公告)号：WO98050954A1
公开(公告)日：1998-11-12
申请号：PCT/US1998/009442
申请日：1998-05-08
IPC分类号： B23K20/00 , C25D7/12 , G01R1/067 , G01R1/073 , G01R31/28 , H01L21/00 , H01L21/48 , H01L21/56 , H01L21/60 , H01L21/603 , H01L21/66 , H01L23/48 , H01L23/485 , H01L23/49 , H01L23/498 , H01L25/065 , H01L25/16 , H05K1/14 , H05K3/20 , H05K3/32 , H05K3/34 , H05K3/36 , H05K3/40
CPC分类号： B23K20/004 , B23K2101/40 , C25D7/12 , G01R1/07378 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/48 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/0657 , H01L25/16 , H01L2224/1134 , H01L2224/13099 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13169 , H01L2224/13611 , H01L2224/13613 , H01L2224/13616 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/16 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06541 , H01L2225/06555 , H01L2225/06562 , H01L2225/06572 , H01L2924/00013 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K3/4015 , H05K2201/1031 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , H01L2924/00014
摘要： High density packaging of semiconductor devices on an interconnection substrate is achieved by stacking bare semiconductor devices (402, 404, 406, 408) atop one another so that an edge portion of a semiconductor device extends beyond the semiconductor device that it is stacked atop. Elongate interconnection elements (422, 424, 426, 428) extend from the bottommost one of the semiconductor devices, and from the exposed edge portions of the semiconductor devices stacked atop the bottommost semiconductor device. Free-ends of the elongate interconnection elements make electrical contact with terminals of an interconnection substrate (430), such as a PCB. The elongate interconnection elements extending from each of the semiconductor devices are sized so as to reach the terminals of the PCB, which may be plated through holes (432, 434, 436, 438). The elongate interconnection elements are suitably resilient contact structures, and may be composite interconnection elements comprising a relatively soft core (e.g., a gold wire) and a relatively hard overcoat (e.g., a nickel plating).
摘要翻译：通过将半导体器件（402,404,406,408）彼此顶起堆叠来实现半导体器件在互连衬底上的高密度封装，使得半导体器件的边缘部分延伸超过其顶部堆叠的半导体器件。细长的互连元件（422,424,426,428）从半导体器件的最底端延伸，并且从半导体器件的暴露的边缘部分堆叠在最底层的半导体器件的顶部。细长互连元件的自由端与诸如PCB的互连衬底（430）的端子电接触。从每个半导体器件延伸的细长互连元件的尺寸被设计成到达可以通过孔（432,434,436,438）电镀的PCB的端子。细长互连元件是合适的弹性接触结构，并且可以是包括相对软的芯（例如，金线）和相对硬的外涂层（例如镀镍）的复合互连元件。

33. 发明申请

WO1996015459A1 MOUNTING SPRING ELEMENTS ON SEMICONDUCTOR DEVICES, AND WAFER-LEVEL TESTING METHODOLOGY 审中-公开
标题翻译：半导体器件的安装弹簧元件和水平测试方法
公开(公告)号：WO1996015459A1
公开(公告)日：1996-05-23
申请号：PCT/US1995014885
申请日：1995-11-15
申请人： FORMFACTOR, INC.
发明人： FORMFACTOR, INC. , KHANDROS, Igor, Y. , MATHIEU, Gaetan, L. , ELDRIDGE, Benjamin, N. , GRUBE, Gary, W.
IPC分类号： G01R01/073
CPC分类号： H05K7/1069 , B23K1/0016 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/0483 , G01R31/2863 , H01L21/288 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/67138 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/05082 , H01L2224/05644 , H01L2224/1134 , H01L2224/1147 , H01L2224/13099 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13582 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/16145 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/45644 , H01L2224/4824 , H01L2224/48465 , H01L2224/48644 , H01L2224/48699 , H01L2224/48844 , H01L2224/49109 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2224/85205 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , H01L2924/00 , H01L2224/48 , H01L2924/20752 , H01L2924/20753 , H01L2224/48744 , H01L2924/20751 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/00015 , H01L2924/2075 , H01L2924/20754
摘要： Resilient contact structures (430) are mounted directly to bond pads (410) on semiconductor dies (402a, 402b), prior to the dies (402a, 402b) being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies (402a, 402b) to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies (702, 704) with a circuit board (710) or the like having a plurality of terminals (712) disposed on a surface thereof. Subsequently, the semiconductor dies (402a, 402b) may be singulated from the semiconductor wafer, whereupon the same resilient contact structures (430) can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements (430) of the present invention as the resilient contact structures, burn-in (792) can be performed at temperatures of at least 150 DEG C, and can be completed in less than 60 minutes.
摘要翻译：在将模具（402a，402b）与半导体晶片分离（分离）之前，将弹性接触结构（430）直接安装在半导体管芯（402a，402b）上的接合焊盘（410）上。这使得半导体管芯（402a，402b）能够通过用具有多个端子的电路板（710）等连接到半导体管芯（702,704）来实现（例如，测试和/或烧入）半导体管芯（402a，402b）（712）设置在其表面上。随后，半导体管芯（402a，402b）可以从半导体晶片分离，于是可以使用相同的弹性接触结构（430）来实现半导体管芯和其它电子部件（例如布线基板，半导体封装，等等。）。使用本发明的全金属复合互连元件（430）作为弹性接触结构，老化（792）可以在至少150℃的温度下进行，并且可以在少于60分钟内完成。

34. 发明申请

WO1995014312A1 SOLDERABLE CONNECTOR FOR HIGH DENSITY ELECTRONIC ASSEMBLIES 审中-公开
标题翻译：高密度电子组件的可焊接连接器
公开(公告)号：WO1995014312A1
公开(公告)日：1995-05-26
申请号：PCT/US1994013051
申请日：1994-11-14
申请人： BERG TECHNOLOGY, INC.
发明人： BERG TECHNOLOGY, INC. , BELOPOLSKY, Yakov
IPC分类号： H01R04/02
CPC分类号： H05K3/3426 , H01R4/028 , H05K2201/10325 , H05K2201/1084 , H05K2201/10909 , H05K2201/2081 , Y02P70/613
摘要： An improved connector (10) for an electronic module (16) or the like includes a housing (22, 24) having a socket opening that is sized and configured to accept an electronic module, and a plurality of terminals mounted to the housing. Each of the terminals (26) has a foot portion (28) having a layer of non-solderable material coated on one side of the foot portion to prevent solder from adhering to that side. A capillary nest (54) is formed by a channel surface on the underside of the foot portion when the terminal is mounted on a conductor pad such that solder flows through the capillary nest under the influence of capillary forces from the side of the terminal having a non-solderable coating thereon to the other side for forming a solder joint on that other side. A ring (50) of non-solderable material is coated around a middle portion of the terminal to prevent solder from flowing to the electrical contact surfaces located above the ring. As a result, the connector terminals can be soldered to a printed circuit board or the like in a simple and inexpensive manner and without the formation of known solder defects.
摘要翻译：用于电子模块（16）等的改进的连接器（10）包括具有插座开口的壳体（22,24），该插座开口的尺寸和构造适于接纳电子模块，以及安装到壳体的多个端子。每个端子（26）具有足部（28），其具有涂覆在脚部的一侧上的不可焊接材料层，以防止焊料粘附到该侧。当端子安装在导体焊盘上时，毛细管座（54）由底部的下侧上的通道表面形成，使得焊剂在毛细管力的影响下从具有不可焊接的涂层到另一侧，用于在另一侧形成焊接接头。围绕端子的中间部分涂覆不可焊接材料的环（50），以防止焊料流到位于环上方的电接触表面。结果，可以以简单且廉价的方式将连接器端子焊接到印刷电路板等上，并且不形成已知的焊料缺陷。

35. 发明申请

WO1995009437A1 METHOD FOR ASSEMBLING AN ELECTRONIC PACKAGE 审中-公开
标题翻译：组装电子封装的方法
公开(公告)号：WO1995009437A1
公开(公告)日：1995-04-06
申请号：PCT/US1994010439
申请日：1994-09-16
申请人： OLIN CORPORATION
发明人： OLIN CORPORATION , MAHULIKAR, Deepak , PARTHASARATHI, Arvind
IPC分类号： H01L21/56
CPC分类号： H01L24/32 , H01L23/49579 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/48599 , H01L2224/48624 , H01L2224/48639 , H01L2224/48699 , H01L2224/48724 , H01L2224/48739 , H01L2224/48824 , H01L2224/48839 , H01L2224/73265 , H01L2224/85424 , H01L2224/85439 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H05K3/3426 , H05K2201/10689 , H05K2201/10909 , H05K2201/2081 , Y02P70/613 , H01L2924/00014 , H01L2924/00012 , H01L2924/3512 , H01L2924/00
摘要： There is disclosed a process for the assembly of an electronic package (30) in which the outer lead ends (14) of a leadframe (50) are solderable (38) to external circuitry (36) without the necessity of a tin or solder coat. An oxidation resistant layer (44) is deposited on the leadframe (50) prior to package (30) assembly. The oxidation resistant layer (44) is removed prior to outer lead (14) soldering (38) providing a clean, oxide free metallic surface (46) for soldering (38).
摘要翻译：公开了一种用于组装电子封装（30）的方法，其中引线框架（50）的外部引线端（14）可焊接（38）到外部电路（36），而不需要锡或焊料涂层。在封装（30）组装之前，在引线框架（50）上沉积抗氧化层（44）。在外引线（14）焊接（38）之前去除抗氧化层（44），提供用于焊接（38）的清洁的，无氧化物的金属表面（46）。

36. 发明申请

WO1991000619A1 FLYING LEADS FOR INTEGRATED CIRCUITS 审中-公开
标题翻译：集成电路飞行领先
公开(公告)号：WO1991000619A1
公开(公告)日：1991-01-10
申请号：PCT/US1990003572
申请日：1990-06-22
申请人： RAYCHEM CORPORATION
发明人： RAYCHEM CORPORATION , CRAY, Seymour, R. , KRAJEWSKI, Nicholas, J.
IPC分类号： H01L23/538
CPC分类号： H01L23/5385 , H01L23/5384 , H01L24/45 , H01L24/49 , H01L25/0655 , H01L25/0657 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/16 , H01L2224/45015 , H01L2224/45144 , H01L2224/4943 , H01L2225/06517 , H01L2225/0652 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2225/06572 , H01L2225/06589 , H01L2225/06593 , H01L2225/06596 , H01L2924/00013 , H01L2924/00014 , H01L2924/01014 , H01L2924/01039 , H01L2924/01079 , H01L2924/14 , H05K2201/1059 , H05K2201/10825 , H05K2201/10909 , H05K2203/0495 , H01L2224/48 , H01L2924/00 , H01L2924/20757 , H01L2924/01204 , H01L2224/05599
摘要： A method and apparatus for interconnecting electronic circuits using nearly pure soft annealed gold mechanically compressed within through-plated holes. The invention has its application in attaching integrated circuit dice (104) directly to circuit boards (110) by ball bonding gold wires (101) to the bonding pads of the integrated circuit dice in a substantially perpendicular relationship to the surfaces of the dice and inserting the gold leads into through-plated holes (111) of circuit boards (110) which provide an electrical and a mechanical connection once the leads are compressed within the through-plated holes. The present invention also finds its application in the interconnection of sandwiched circuit board assemblies where soft gold lead wires are inserted into axially aligned through-plated holes of the circuit boards and compressed so that the gold lead wires compress and buckle within the through-plated holes, forming an electrical connection between the circuit boards.
摘要翻译：一种使用在纯通孔内机械压缩的几乎纯软的退火金的互连电子电路的方法和装置。本发明的应用是将集成电路芯片（104）直接连接到电路板（110）上，通过将金线（101）以与芯片表面基本垂直的方式与集成电路晶片的接合焊盘接合并插入一旦引线在通孔内被压缩，金会导致电路板（110）的通孔（111），其提供电和机械连接。本发明还将其应用于夹层电路板组件的互连中，其中软金导线插入到电路板的轴向对齐的通孔中并被压缩，使得金引线在穿透孔内压缩和弯曲在电路板之间形成电连接。

37. 发明申请

WO2016134804A1 ELEKTRISCHES BAUELEMENT UND VERFAHREN ZUR HERSTELLUNG EINES ELEKTRISCHEN BAUELEMENTS 审中-公开
标题翻译：电子器材及其制造方法电气元件
公开(公告)号：WO2016134804A1
公开(公告)日：2016-09-01
申请号：PCT/EP2015/080853
申请日：2015-12-21
申请人： EPCOS AG
发明人： KOINI, Markus , KONRAD, Jürgen , RINNER, Franz , PUFF, Markus , STADLOBER, Monika , KÜGERL, Georg , WIPPEL, Thomas
IPC分类号： H01G4/232 , H01G4/38 , H01G2/06 , H05K1/18
CPC分类号： H01G4/228 , H01G2/06 , H01G4/232 , H01G4/2325 , H01G4/30 , H01G4/38 , H05K1/181 , H05K3/3426 , H05K2201/10015 , H05K2201/10757 , H05K2201/10818 , H05K2201/10909 , Y02P70/613
摘要： Es wird ein elektrisches Bauelement (1) angeben, das mehrere Teilkörper (2), einen Sockel (3), auf dem die Teilkörper (2) angeordnet sind, und wenigstens einen Anschlusskontakt (4, 5) zum elektrischen Anschluss der Teilkörper (2) an einem Träger (13) aufweist. Weiterhin wird ein Verfahren zur Herstellung eines elektrischen Bauelements (1) aufweisend ein oder mehrere Teilkörper (2) angegeben.
摘要翻译：它是指定的电子组件（1），所述多个子体（2），基座（3）在其上部分本体（2）被布置，并且至少一个端子触头（4，5），用于局部机构的电连接（2）在载体（13）。此外，用于制造电气部件（1）的方法，提供了包含一个或多个部分主体（2）。

38. 发明申请

WO2013094922A1 PRINTED CIRCUIT BOARD FOR MEMORY CARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：用于记忆卡的印刷电路板及其制造方法
公开(公告)号：WO2013094922A1
公开(公告)日：2013-06-27
申请号：PCT/KR2012/010789
申请日：2012-12-12
申请人： LG INNOTEK CO., LTD.
发明人： LIM, Seol Hee , JO, Yun Kyoung , KIM, Ae Rim , EOM, Sai Ran , PARK, Chang Hwa
IPC分类号： H05K1/02 , G06K19/07
CPC分类号： H05K3/301 , C23C18/1653 , C25D3/12 , C25D3/16 , C25D3/48 , C25D3/50 , C25D3/562 , C25D3/567 , C25D3/62 , C25D5/12 , H05K1/092 , H05K1/117 , H05K1/18 , H05K3/185 , H05K3/244 , H05K2201/10159 , H05K2201/10909 , H05K2203/049 , H05K2203/1572 , Y10T29/49128
摘要： Provided is a printed circuit board for a memory card, including: an insulating layer; a mounting unit which is formed on a first surface of the insulating layer and is electrically connected to a memory device; and a terminal unit which is formed on a second surface of the insulating layer and is electrically connected to electronic apparatuses of an outside, wherein the mounting unit and the terminal unit are formed of metal layers composed of the same materials as each other.
摘要翻译：提供一种用于存储卡的印刷电路板，包括：绝缘层; 安装单元，其形成在所述绝缘层的第一表面上并电连接到存储器件; 以及端子单元，其形成在所述绝缘层的第二表面上并且电连接到外部的电子设备，其中所述安装单元和所述端子单元由彼此相同的材料构成的金属层形成。

39. 发明申请

WO2008056725A1 表面実装用の電子部品审中-公开
标题翻译：电子元件表面安装
公开(公告)号：WO2008056725A1
公开(公告)日：2008-05-15
申请号：PCT/JP2007/071685
申请日：2007-11-08
申请人：日本電波工業株式会社 , 山田博章
发明人：山田博章
IPC分类号： H01L23/12 , H03H9/02
CPC分类号： H05K3/3442 , B81B7/0051 , B81B2207/07 , H01L23/49838 , H01L2224/16225 , H03H9/02102 , H03H9/02133 , H03H9/1021 , H05K1/0243 , H05K2201/068 , H05K2201/10068 , H05K2201/10909 , Y02P70/613
摘要：半田付けによって配線基板に表面実装され、表面実装後における半田での亀裂発生が抑制された電子部品は、容器の少なくとも一部を構成しセラミックからなる部材と、部材の外表面に設けられてその電子部品を配線基板上に半田によって表面実装する際に用いられる外部端子と、を備える。部材を構成するセラミックの熱膨張率をα １として、部材と外部端子とによる合成膨張率α ｋが、１．０２９≦α ｋ／α １ ≦１．２１６の関係を満たすように、外部端子を構成する層の膜厚を設計する。外部端子は、好ましくは、電極本体としてのニッケル層を備える。
摘要翻译：通过焊接安装在布线板上的电子部件表面，其中在表面安装之后抑制了焊料中的裂纹的发生。电子部件包括构成容器的至少一部分的陶瓷构件和设置在构件的外表面上的外部端子，并且当电子部件通过焊料表面安装在布线板上时使用。假设构成构件的陶瓷的热膨胀系数为1，并且构件和外部端子的组合膨胀系数为N 2，则层的厚度构成外部端子被设计为满足以下关系：1.029 = 1/2/1 <1> = 1.216。优选地，外部端子具有镍层作为电极主体。

40. 发明申请

WO2008014157A2 INTUMESCENT PAINT COATINGS FOR INHIBITING TIN WHISKER GROWTH AND METHODS OF MAKING AND USING THE SAME 审中-公开
标题翻译：用于抑制锡罐生长的无色油漆涂料及其制造方法和使用方法
公开(公告)号：WO2008014157A2
公开(公告)日：2008-01-31
申请号：PCT/US2007/073746
申请日：2007-07-18
申请人： HONEYWELL INTERNATIONAL INC. , JACKSON, Merrill M. , HUMPHREY, David
发明人： JACKSON, Merrill M. , HUMPHREY, David
CPC分类号： C22C13/00 , C09D5/185 , H01L23/49582 , H01L23/49586 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/01057 , H01L2924/01078 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H05K3/244 , H05K3/3436 , H05K2201/10689 , H05K2201/10909 , Y02P70/613 , Y10T428/12556 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： An electrical component includes a conductive substrate (18), a tin layer (19) formed on the substrate, and a coating (22) of a foam formed on the tin layer to impede tin whisker growth, the coating comprising a foam (28) having voids (30) dispersed therethrough. A method for impeding tin whisker growth from a tin plating or finish formed over an electrical component includes covering the tin plating or finish with a coating of intumescent paint, and thereafter expanding the intumescent paint into a foam having voids dispersed therethrough.
摘要翻译：电气部件包括导电基板（18），形成在基板上的锡层（19）和形成在锡层上以阻止锡晶须生长的泡沫的涂层（22），该涂层包括泡沫（28）具有分散在其中的空隙（30）。阻止在电气部件上形成的锡电镀或精加工的锡晶须生长的方法包括用膨胀型涂料的涂层覆盖锡镀层或表面，然后将膨胀型涂料膨胀成具有分散在其中的空隙的泡沫。

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