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    • 5. 发明公开
    • 반도체 디바이스 제조설비의 로봇 암
    • 机器人半导体器件制造设备
    • KR1020070023870A
    • 2007-03-02
    • KR1020050078168
    • 2005-08-25
    • 삼성전자주식회사
    • 허인욱
    • H01L21/68
    • H01L21/67742B25J11/0095B25J13/086B25J19/027H01L21/67259H01L21/67766Y10S414/137
    • A robot arm of semiconductor device manufacturing equipment is provided to prevent collision between the robot arm and a wafer and to minimize wafer loss by using sensors arranged at a tip unit of the robot arm. A robot arm(100) is comprised of a robot arm body and wafer detection sensors(102,104). The robot arm body transfers a wafer(106) mounted in a cassette to an inner of a process chamber and the wafer of the inner of the process chamber to an inner of the cassette. The wafer detection sensors are formed at a tip unit of the robot arm body to detect proximity of the wafer. The wafer detection sensors are a proximity magnetic sensor.
    • 提供半导体器件制造设备的机器人臂,以防止机器人臂与晶片之间的碰撞,并且通过使用设置在机器人手臂的尖端单元处的传感器来最小化晶片损耗。 机器人臂(100)由机器人臂体和晶片检测传感器(102,104)组成。 机器人臂体将安装在盒中的晶片(106)传送到处理室的内部,并将处理室内部的晶片传送到盒的内部。 晶片检测传感器形成在机器人臂主体的尖端单元处,以检测晶片的接近度。 晶片检测传感器是接近磁传感器。