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1. 发明申请

WO2015000595A1 ELECTRONIC DEVICE HAVING A LEAD WITH SELECTIVELY MODIFIED ELECTRICAL PROPERTIES 审中-公开
标题翻译：具有选择性改进的电气特性的引线的电子器件
公开(公告)号：WO2015000595A1
公开(公告)日：2015-01-08
申请号：PCT/EP2014/001824
申请日：2014-07-02
申请人： ROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO. KG
发明人： CAHILL, Sean S. , SANJUAN, Eric A.
IPC分类号： H01L23/49 , H01L23/50 , H01L23/66
CPC分类号： H01L23/49541 , H01L21/4821 , H01L21/4846 , H01L23/49506 , H01L23/49827 , H01L23/49838 , H01L23/50 , H01L23/64 , H01L23/645 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2223/6611 , H01L2224/45541 , H01L2224/4555 , H01L2224/4556 , H01L2224/45565 , H01L2224/4569 , H01L2224/48011 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/4903 , H01L2224/49052 , H01L2224/85444 , H01L2224/8592 , H01L2224/8593 , H01L2224/85931 , H01L2224/85935 , H01L2224/85939 , H01L2224/85947 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/30111 , H01L2924/20654 , H01L2224/45099 , H01L2924/00
摘要： The present invention relates to a die package comprising a die having a plurality of connection pads, a die substrate supporting a plurality of connection elements, a first lead having a first metal core (10) with a first core diameter, and a dielectric layer (20,30) surrounding the first metal core (S1), the dielectric layer (20,30) having a first dielectric thickness that varies along its length and/ or the dielectric layer having an outer metal layer (40, S4) at least partially surrounding the dielectric layer (20,30), for selectively modifying the electrical characteristics of the lead
摘要翻译：本发明涉及包括具有多个连接焊盘的模具的模具封装，支撑多个连接元件的模具基板，具有第一芯直径的第一金属芯（10）的第一引线和介电层（ 20,30）围绕第一金属芯（S1），具有沿着其长度变化的第一电介质厚度的介电层（20,30）和/或具有至少部分地具有外部金属层（40,44）的电介质层围绕介电层（20,30），用于选择性地修改引线的电特性

2. 发明申请

WO2013188712A1 POWER AMPLIFIER MODULES INCLUDING RELATED SYSTEMS, DEVICES, AND METHODS 审中-公开
标题翻译：功率放大器模块，包括相关系统，器件和方法
公开(公告)号：WO2013188712A1
公开(公告)日：2013-12-19
申请号：PCT/US2013/045742
申请日：2013-06-13
申请人： SKYWORKS SOLUTIONS, INC.
发明人： CHEN, Howard, E. , GUO, Yifan , HOANG, Dinhphuoc, Vu , JANANI, Mehran , KO, Tin, Myint , LEHTOLA, Philip, John , LOBIANCO, Anthony, James , MODI, Hardik, Bhupendra , NGUYEN, Hoang, Mong , OZALAS, Matthew, Thomas , PETTY-WEEKS, Sandra, Louise , READ, Matthew, Sean , RIEGE, Jens, Albrecht , RIPLEY, David, Steven , SHAO, Hongxiao , SHEN, Hong , SUN, Weimin , SUN, Hsiang-Chih , WELCH, Patrick, Lawrence , ZAMPARDI, Peter, J., Jr. , ZHANG, Guohao
IPC分类号： H03F1/30 , H03F3/189
CPC分类号： H03F1/0205 , H01L21/485 , H01L21/4853 , H01L21/4864 , H01L21/565 , H01L21/76898 , H01L21/78 , H01L21/8249 , H01L21/8252 , H01L22/14 , H01L23/3114 , H01L23/481 , H01L23/49811 , H01L23/49827 , H01L23/49838 , H01L23/49844 , H01L23/49861 , H01L23/49866 , H01L23/49894 , H01L23/50 , H01L23/522 , H01L23/552 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L24/97 , H01L27/0605 , H01L27/0623 , H01L27/092 , H01L29/0684 , H01L29/0821 , H01L29/0826 , H01L29/1004 , H01L29/20 , H01L29/205 , H01L29/36 , H01L29/66242 , H01L29/66863 , H01L29/737 , H01L29/7371 , H01L29/812 , H01L29/8605 , H01L2223/6611 , H01L2223/6616 , H01L2223/6644 , H01L2223/665 , H01L2223/6655 , H01L2224/05155 , H01L2224/05164 , H01L2224/05554 , H01L2224/05644 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48177 , H01L2224/48227 , H01L2224/48465 , H01L2224/48611 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/48811 , H01L2224/48816 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/4903 , H01L2224/49111 , H01L2224/49176 , H01L2224/85205 , H01L2224/85207 , H01L2224/85411 , H01L2224/85416 , H01L2224/85444 , H01L2224/85455 , H01L2224/85464 , H01L2924/00011 , H01L2924/10253 , H01L2924/10329 , H01L2924/12033 , H01L2924/12042 , H01L2924/1305 , H01L2924/13051 , H01L2924/1306 , H01L2924/13091 , H01L2924/1421 , H01L2924/15747 , H01L2924/181 , H01L2924/19105 , H01L2924/19107 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H03F1/565 , H03F3/187 , H03F3/19 , H03F3/195 , H03F3/21 , H03F3/213 , H03F3/245 , H03F3/347 , H03F3/45 , H03F3/60 , H03F2200/387 , H03F2200/451 , H03F2200/48 , H03F2200/555 , H01L2924/00 , H01L2924/00014
摘要： A power amplifier module includes a power amplifier including a GaAs bipolar transistor having a collector, a base abutting the collector, and an emitter, the collector having a doping concentration of at least about 3x10 16 cm -3 at a junction with the base, the collector also having at least a first grading in which doping concentration increases away from the base; and an RF transmission line driven by the power amplifier, the RF transmission line including a conductive layer and finish plating on the conductive layer, the finish plating including a gold layer, a palladium layer proximate the gold layer, and a diffusion barrier layer proximate the palladium layer, the diffusion barrier layer including nickel and having a thickness that is less than about the skin depth of nickel at 0.9 GHz. Other embodiments of the module are provided along with related methods and components thereof.
摘要翻译：功率放大器模块包括功率放大器，其包括具有集电极的GaAs双极晶体管，邻接集电极的基极和发射极，该集电极在与基极的接合处具有至少约3×10 16 cm -3的掺杂浓度，集电极还具有至少一种其中掺杂浓度从基底增加的第一分级; 以及由功率放大器驱动的RF传输线，RF传输线包括在导电层上的导电层和精整电镀，精加工镀层包括金层，接近金层的钯层和靠近金层的扩散阻挡层钯层，扩散阻挡层包括镍，并且其厚度小于0.9GHz处的镍的趋肤深度。模块的其他实施例与其相关方法和组件一起提供。

3. 发明申请

WO2012155135A2 SCALABLE HIGH-BANDWIDTH CONNECTIVITY 审中-公开
标题翻译：可扩展的高带宽连接性
公开(公告)号：WO2012155135A2
公开(公告)日：2012-11-15
申请号：PCT/US2012/037795
申请日：2012-05-14
申请人： WAVECONNEX, INC. , MCCORMACK, Gary, D. , KYLES, Ian, A.
发明人： MCCORMACK, Gary, D. , KYLES, Ian, A.
IPC分类号： H04B5/00 , H01L25/065 , G06K19/07 , G06K19/077 , H05K1/14
CPC分类号： H04B5/0031 , H01L23/3128 , H01L23/66 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2223/6677 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48195 , H01L2224/48227 , H01L2224/48247 , H01L2224/49111 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/15173 , H01L2924/15311 , H01L2924/181 , H01L2924/3011 , H01L2924/30111 , H01Q1/2275 , H01Q7/00 , H01Q23/00 , H02J5/005 , H02J7/025 , H02J50/10 , H04B5/0037 , H05K1/0239 , H05K1/144 , H05K1/165 , H05K2201/09618 , H05K2201/0969 , H05K2201/10098 , H05K2201/10159 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A scalable, high-bandwidth connectivity architecture for portable storage devices and memory modules may utilize EHF communication link chip packages mounted in various two-dimensional and three-dimensional configurations on planar surfaces such as printed circuit boards. Multiple electromagnetic communication links between devices distributed on major faces of card-like devices may be provided with respectively aligned pairs of communication units on each device. Adjacent communication units on a printed circuit board may transmit or receive electromagnetic radiation having different polarization, such as linear or elliptical polarization. Power and communication between communication devices may both be provided wirelessly.
摘要翻译：用于便携式存储设备和存储器模块的可扩展的高带宽连接架构可以利用安装在诸如印刷电路板的平面表面上的各种二维和三维配置中的EHF通信链路芯片封装。分布在卡状设备的主面上的设备之间的多个电磁通信链路可以在每个设备上分别配置有对准的通信单元对。印刷电路板上的相邻通信单元可以发送或接收具有不同极化的电磁辐射，例如线性或椭圆偏振。通信设备之间的电力和通信可以无线地提供。

4. 发明申请

WO2009001170A3 FILTER HAVING IMPEDANCE MATCHING CIRCUITS 审中-公开
标题翻译：滤波器具有阻抗匹配电路
公开(公告)号：WO2009001170A3
公开(公告)日：2011-03-03
申请号：PCT/IB2007004670
申请日：2007-11-16
申请人： NORTEL NETWORKS LTD , GAGNON ERIC , JIAN CHUN-YUN
发明人： GAGNON ERIC , JIAN CHUN-YUN
IPC分类号： H03H1/00 , H01L23/495 , H03H7/38 , H04W88/02
CPC分类号： H03H9/0542 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H03H9/0552 , Y10T29/49016 , Y10T29/49117 , H01L2924/00014 , H01L2924/00
摘要： A filter package is provided with a support structure, a filter device having terminals, impedance matching circuits formed on the support structure and electrically connected to at least some of the terminals of the filter device, and at least one electrical ground structure electrically connected to the impedance matching circuits. Moreover, the filter package has an outer housing to contain the support structure, filter device, impedance matching circuits, and at least one ground structure.
摘要翻译：滤波器封装设置有支撑结构，具有端子的滤波器装置，形成在支撑结构上并电连接到过滤器装置的至少一些端子的阻抗匹配电路，以及至少一个电接地结构，电连接到阻抗匹配电路。此外，过滤器封装具有外壳以容纳支撑结构，过滤器装置，阻抗匹配电路以及至少一个接地结构。

5. 发明申请

WO2010098393A1 高周波モジュール审中-公开
标题翻译：无线电频率模块
公开(公告)号：WO2010098393A1
公开(公告)日：2010-09-02
申请号：PCT/JP2010/052984
申请日：2010-02-25
申请人：京セラ株式会社 , 内村弘志 , 平松信樹 , 早田和樹
发明人：内村　弘志 , 平松　信樹 , 早田　和樹
IPC分类号： H01P5/08 , H01L23/12 , H01P5/107 , H01Q13/10 , H01Q23/00
CPC分类号： H01P5/107 , H01L23/13 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2223/6611 , H01L2223/6627 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48227 , H01L2224/49175 , H01L2224/49433 , H01L2924/01005 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/1423 , H01L2924/16152 , H01L2924/181 , H01L2924/1903 , H01L2924/19051 , H01L2924/20752 , H01L2924/20758 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H01P3/121 , H01P5/1015 , H01Q13/10 , H01Q23/00 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要：　本実施形態の高周波モジュール１０は、高周波回路を含む高周波部品３０と、導体としての導体板２１と、第１導線４１と、２つの第２導線４２，４３と、を備える。高周波部品３０は、信号端子３１および２つの基準電位端子３２を有する。信号端子３１は、高周波信号の入力および出力の少なくとも一方に用いる。２つの基準電位端子３２は、基準電位に接続されている。導体板２１は、スロット２０ａを有する。第１導線４１は、信号端子３１に高周波的に接続される。この第１導線４１は、スロット２０ａの上方を横切る。２つの第２導線４２，４３は、２つの基準電位端子３２に高周波的に接続される。２つの第２導線４２，４３は、第２導線４２，４３に沿って配置される。２つの第２導線４２，４３は、スロット２０ａの上方を横切らないように設けられる。第１導線４１と、２つの第２導線４２，４３とが対をなして、スロット２０ａと電磁的に結合している。
摘要翻译：所公开的射频模块（10）配备有射频分量（30），其包括射频电路，用作导体的导体板（21），第一导线（41）和两个第二导线 42，43）。射频成分（30）具有信号端子（31）和两个基准电位端子（32）。信号端子（31）至少用于射频信号的输入或输出。两个参考电位端子（32）连接到参考电位。导体板（21）具有槽（20a）。第一导线（41）具有到信号端子（31）的射频连接。第一导线（41）穿过槽（20a）的上方。两个第二导线（42,43）具有到两个参考电位端子（32）的射频连接。两条第二导线（42,43）沿第二导体线（42,43）设置。两个第二导体线（42,43）被设置成不与槽（20a）上方交叉。第一导线（41）和两个第二导体线（42,43）形成一对，并与槽（20a）电磁耦合。

6. 发明申请

WO2010020836A1 IMPEDANCE CONTROLLED ELECTRICAL INTERCONNECTION EMPLOYING META-MATERIALS 审中-公开
标题翻译：阻抗控制电气互连使用元素材料
公开(公告)号：WO2010020836A1
公开(公告)日：2010-02-25
申请号：PCT/IB2008/053390
申请日：2008-08-22
申请人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD , WYLAND, Christopher
发明人： WYLAND, Christopher
IPC分类号： H01L23/66 , H01L23/538
CPC分类号： H01L23/5383 , H01L23/5226 , H01L23/5387 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/50 , H01L24/91 , H01L2223/6611 , H01L2223/6627 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4805 , H01L2224/48091 , H01L2224/48135 , H01L2224/48472 , H01L2224/48599 , H01L2224/48699 , H01L2224/49052 , H01L2224/49111 , H01L2224/49174 , H01L2224/49175 , H01L2224/73265 , H01L2224/85207 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/1903 , H01L2924/19032 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H01P1/047 , H05K1/0243 , H05K2203/049 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
摘要： A method of improving electrical interconnections between two electrical elements (510,550) is made available by providing a meta-material overlay (700) in conjunction with the electrical interconnection (530) The meta-material overlay is designed to make the electrical signal propagating via the electrical interconnection to act as though the permittivity and permeability of the dielectric medium within which the electrical interconnection is formed are different than the real component permittivity and permeability of the dielectric medium surrounding the electrical interconnection. In some instances the permittivity and permeability resulting from the meta-material cause the signal to propagate as if the permittivity and permeability have negative values. Accordingly the method provides for electrical interconnections possessing enhanced control and stability of impedance, reduced noise, and reduced loss. Alternative embodiments of the meta- material overlay provide, the enhancements for conventional discrete wire bonds whilst also facilitating single integrated designs compatible with tape implementation.
摘要翻译：通过提供与电互连（530）结合的超材料覆层（700），改善了改善两个电气元件（510,550）之间的电互连的方法。超材料覆层被设计成使电信号经由电互连用作形成电互连的电介质的介电常数和导磁率不同于围绕电互连的电介质的实分量介电常数和磁导率。在某些情况下，由超常材料产生的介电常数和磁导率会导致信号传播，就好像介电常数和磁导率具有负值一样。因此，该方法提供具有增强的阻抗的稳定性，降低的噪声和减少的损耗的电互连。元材料覆盖层的替代实施例提供了常规分立线接合的增强，同时还促进与磁带实现兼容的单一集成设计。

7. 发明申请

WO2009099912A2 DIFFERENTIAL INTERNALLY MATCHED WIRE-BOND INTERFACE 审中-公开
标题翻译：差异内部匹配的线接口
公开(公告)号：WO2009099912A2
公开(公告)日：2009-08-13
申请号：PCT/US2009/032531
申请日：2009-01-30
申请人： VIASAT, INC. , MENON, Gaurav
发明人： MENON, Gaurav
IPC分类号： H01L23/49 , H03H7/38
CPC分类号： H03H7/38 , H01L23/3121 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2223/6611 , H01L2223/6627 , H01L2223/6638 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49111 , H01L2224/49171 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/1423 , H01L2924/19032 , H01L2924/19051 , H01L2924/20752 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/00014 , H01L2924/00
摘要： In wireless communication devices, internally matching impedance in millimeter wave packaging enables better signal retention at high frequencies in the range of 15 GHz and above. Through the use of differential wire bond signal transmission, the inherent inductance of a millimeter wave package can be matched by the capacitance of the package wire bonds if the capacitance is tailored. The capacitance can be tailored by calculating a suitable distance between wire bonds and tuning the dielectric constant of the over-mold material. A differential set of wire bonds act like a differential transmission line whose characteristic impedance can be tuned by configuring the dielectric constant of the over- mold of the millimeter wave package.
摘要翻译：在无线通信设备中，毫米波封装中的内部匹配阻抗可在15 GHz及以上的高频下实现更好的信号保持。通过使用差分接线信号传输，如果电容被定制，则毫米波封装的固有电感可以通过封装引线接合的电容来匹配。可以通过计算引线键合之间的合适距离并调整外模材料的介电常数来调整电容。差分组合引线的作用就像差分传输线，其特性阻抗可以通过配置毫米波封装的覆盖模的介电常数进行调节。

8. 发明申请

WO2009002392A2 RF TRANSISTOR PACKAGES WITH INTERNAL STABILITY NETWORK AND METHODS OF FORMING RF TRANSISTOR PACKAGES WITH INTERNAL STABILITY NETWORKS 审中-公开
标题翻译：具有内部稳定性网络的射频晶体管封装和形成具有内部稳定性网络的射频晶体管封装的方法
公开(公告)号：WO2009002392A2
公开(公告)日：2008-12-31
申请号：PCT/US2008/006948
申请日：2008-06-02
申请人： CREE, INC. , FARRELL, Donald , WOOD, Simon
发明人： FARRELL, Donald , WOOD, Simon
IPC分类号： H01L23/66
CPC分类号： H01L23/66 , H01L23/642 , H01L24/48 , H01L24/49 , H01L2223/6611 , H01L2223/6655 , H01L2224/48091 , H01L2224/48195 , H01L2224/49175 , H01L2924/00014 , H01L2924/01006 , H01L2924/01014 , H01L2924/01023 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/1305 , H01L2924/13063 , H01L2924/13064 , H01L2924/13091 , H01L2924/19041 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A packaged RF transistor device includes an RF transistor die including a plurality of RF transistor cells. Each of the plurality of RF transistor cells includes a control terminal and an output terminal. The RF transistor device further includes an RF input lead, and an input matching network coupled between the RF input lead and the RF transistor die. The input matching network includes a plurality of capacitors having respective input terminals. The input terminals of the capacitors are coupled to the control terminals of respective ones of the RF transistor cells.
摘要翻译：封装的RF晶体管器件包括包括多个RF晶体管单元的RF晶体管管芯。多个RF晶体管单元中的每一个包括控制端子和输出端子。 RF晶体管器件还包括RF输入引线和耦合在RF输入引线和RF晶体管管芯之间的输入匹配网络。输入匹配网络包括具有相应输入端的多个电容器。电容器的输入端子耦合到相应的RF晶体管单元的控制端子。

9. 发明申请

WO0101451A3 MICROWAVE CIRCUIT PACKAGES HAVING A REDUCED NUMBER OF VIAS IN THE SUBSTRATE 审中-公开
标题翻译： MICROWAVE电路包装在基板中有一个减少数量的VIAS
公开(公告)号：WO0101451A3
公开(公告)日：2008-02-28
申请号：PCT/US0016102
申请日：2000-06-13
申请人： MICROSUBSTRATES CORP
发明人： DOURIET DANIEL F , HERNANDEZ JORGE M , PANICKER M P RAMACHANDRA
IPC分类号： H01P1/04 , H01L23/66 , H05K1/02 , H05K3/34
CPC分类号： H01L24/49 , H01L23/66 , H01L24/45 , H01L24/48 , H01L2223/6611 , H01L2223/6627 , H01L2224/45014 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/49111 , H01L2224/49175 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1423 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15174 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H01L2924/16152 , H01L2924/1903 , H01L2924/19107 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H05K1/0243 , H05K3/3436 , H01L2924/00014 , H01L2924/05432 , H01L2924/00 , H01L2924/00012
摘要： A circuit package for a microwave signal comprises a substrate (56) defining a MMIC surface (62) of the substrate (56) and an opposing non-MMIC surface (64) of the substrate (56). The substrate (56) is devoid of signal carrying vias. A waveguide is disposed on the MMIC surface (62). A MMIC (60) is disposed on the MMIC surface (62), and the MMIC (60) is in electrical communication with the waveguide wherein a transmission path for the signal is provided from the I/O port, through the waveguide and to the MMIC. In an alternative exemplary embodiment of the invention, the I/O port of the circuit package is electrically connectable to a PC board (52). The MMIC surface (62) faces the PC board (52) when the I/O port is electrically connected to the PC board (52).
摘要翻译：用于微波信号的电路封装包括限定衬底（56）的MMIC表面（62）和衬底（56）的相对非MMIC表面（64）的衬底（56）。衬底（56）没有信号承载通孔。波导管设置在MMIC表面（62）上。 MMIC（60）设置在MMIC表面（62）上，并且MMIC（60）与波导电连通，其中用于信号的传输路径从I / O端口通过波导提供到 MMIC。在本发明的替代示例性实施例中，电路封装的I / O端口可电连接到PC板（52）。当I / O端口电连接到PC板（52）时，MMIC表面（62）面向PC板（52）。

10. 发明申请

WO2007145049A1 弾性波分波器审中-公开
标题翻译：波分复用器
公开(公告)号：WO2007145049A1
公开(公告)日：2007-12-21
申请号：PCT/JP2007/060189
申请日：2007-05-18
申请人：株式会社村田製作所 , 高田俊明 , 横倉修
发明人：高田俊明 , 横倉修
IPC分类号： H03H9/72 , H01L23/12 , H03H9/25 , H03H9/64
CPC分类号： H03H9/0576 , H01L2224/16 , H01L2224/48227 , H01L2224/49171 , H01L2924/30111 , H03H9/725 , H01L2924/00
摘要：　送信側フィルタチップ及び受信側フィルタチップが積層基板に搭載されており、積層基板内にインピーダンス整合回路が構成されている弾性波分波器において、送信帯域及び受信帯域のアイソレーション特性が改善されており、両者のバランスが高められており、小型の分波器を提供する。　積層基板４３上に、弾性波フィルタチップからなる送信側フィルタチップ６及び受信側フィルタチップ７がフリップチップボンディングされており、積層基板４３内にインピーダンス整合回路を構成するためのコイル状線路パターン５２，５４，５６を含むコイル状線路が構成されており、平面視した場合に、積層基板４３の中心を通り、第１の端部４３Ａと第２の端部４３Ｂとを結ぶ中心線Ｘに対し、一方側に送信側フィルタチップ６が、他方側に受信側フィルタチップ７が配置されており、該受信側フィルタチップ７が配置されている側に上記コイル状線路が配置されている、弾性波分波器１。
摘要翻译：在层压板上制造其中在叠层板上安装发射滤波器芯片和接收滤波器芯片的阻抗匹配电路的弹性波解复用器。提高发送和接收频带的隔离特性，增强平衡，从而提供小型解复用器。每个由弹性波滤波器芯片构成的发送滤波器芯片（6）和接收滤波器芯片（7）通过倒装芯片接合安装在层压板（43）上。在层压板（43）中，形成包括构成阻抗匹配电路的线圈状路径图案（52,54,56）的线圈状路径。当从上方观察时，相对于通过层压板（43）的中心并且将第一端部（43A）连接到第二端部（43B）的中心线X，布置了透射滤光片（6）并且接收滤波器芯片（7）设置在另一侧。线圈状路径设置在与接收滤波器芯片（7）相同的一侧。提供这样的弹性波解复用器（1）。

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