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1. 发明申请

WO2010020836A1 IMPEDANCE CONTROLLED ELECTRICAL INTERCONNECTION EMPLOYING META-MATERIALS 审中-公开
标题翻译：阻抗控制电气互连使用元素材料
公开(公告)号：WO2010020836A1
公开(公告)日：2010-02-25
申请号：PCT/IB2008/053390
申请日：2008-08-22
申请人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD , WYLAND, Christopher
发明人： WYLAND, Christopher
IPC分类号： H01L23/66 , H01L23/538
CPC分类号： H01L23/5383 , H01L23/5226 , H01L23/5387 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/50 , H01L24/91 , H01L2223/6611 , H01L2223/6627 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4805 , H01L2224/48091 , H01L2224/48135 , H01L2224/48472 , H01L2224/48599 , H01L2224/48699 , H01L2224/49052 , H01L2224/49111 , H01L2224/49174 , H01L2224/49175 , H01L2224/73265 , H01L2224/85207 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/1903 , H01L2924/19032 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/3025 , H01P1/047 , H05K1/0243 , H05K2203/049 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
摘要： A method of improving electrical interconnections between two electrical elements (510,550) is made available by providing a meta-material overlay (700) in conjunction with the electrical interconnection (530) The meta-material overlay is designed to make the electrical signal propagating via the electrical interconnection to act as though the permittivity and permeability of the dielectric medium within which the electrical interconnection is formed are different than the real component permittivity and permeability of the dielectric medium surrounding the electrical interconnection. In some instances the permittivity and permeability resulting from the meta-material cause the signal to propagate as if the permittivity and permeability have negative values. Accordingly the method provides for electrical interconnections possessing enhanced control and stability of impedance, reduced noise, and reduced loss. Alternative embodiments of the meta- material overlay provide, the enhancements for conventional discrete wire bonds whilst also facilitating single integrated designs compatible with tape implementation.
摘要翻译：通过提供与电互连（530）结合的超材料覆层（700），改善了改善两个电气元件（510,550）之间的电互连的方法。超材料覆层被设计成使电信号经由电互连用作形成电互连的电介质的介电常数和导磁率不同于围绕电互连的电介质的实分量介电常数和磁导率。在某些情况下，由超常材料产生的介电常数和磁导率会导致信号传播，就好像介电常数和磁导率具有负值一样。因此，该方法提供具有增强的阻抗的稳定性，降低的噪声和减少的损耗的电互连。元材料覆盖层的替代实施例提供了常规分立线接合的增强，同时还促进与磁带实现兼容的单一集成设计。

2. 发明申请

WO2008075315A2 BRAZED FLIP-CHIP MOUNTING OF INTEGRATED CIRCUITS 审中-公开
标题翻译：集成电路的布线片式安装
公开(公告)号：WO2008075315A2
公开(公告)日：2008-06-26
申请号：PCT/IB2007/055259
申请日：2007-12-20
申请人： NXP B.V. , WYLAND, Christopher
发明人： WYLAND, Christopher
IPC分类号： H01L23/485
CPC分类号： H01L23/16 , B23K1/0016 , B23K2201/36 , H01L23/10 , H01L24/10 , H01L24/13 , H01L24/29 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/0554 , H01L2224/05568 , H01L2224/05572 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2224/1401 , H01L2224/1403 , H01L2224/16225 , H01L2224/17051 , H01L2224/29111 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/81232 , H01L2224/81801 , H01L2224/83101 , H01L2224/838 , H01L2924/0001 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0781 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/15311 , H01L2924/157 , H01L2924/15787 , H01L2924/16195 , H01L2924/3011 , H05K3/3436 , H05K3/3494 , H05K2203/1163 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method of flip-chip mounting a circuit to a substrate is provided by brazing together metallic elements formed on both the circuit and substrate. The brazing being achieved by initiating a chemical exothermic reaction in a multilayer stacked material disposed between the metallic elements on the circuit and substrate. Advantageously the chemical exothermic reaction provides a means of locally brazing the metallic elements without necessitating raising the circuit and substrate to a high temperature such as required in conventional flip-chip assembly with solder reflow. According to an exemplary embodiment of the invention the metallic elements are electrical conductors and an electrical trigger signal is provided via the metallic elements to initiate the chemical exothermic reaction.
摘要翻译：通过将形成在电路和基板上的金属元件钎焊在一起来提供将电路倒装芯片安装到基板的方法。通过在设置在电路和基板上的金属元件之间的多层堆叠材料中引发化学放热反应来实现钎焊。有利地，化学放热反应提供了局部钎焊金属元件的方法，而不需要将电路和衬底升高到高温，例如在常规的倒装芯片组装中所需要的焊料回流。根据本发明的示例性实施例，金属元件是电导体，并且经由金属元件提供电触发信号以引发化学放热反应。

3. 发明申请

WO2009034557A2 METHOD AND APPARATUS FOR FORMING ARBITRARY STRUCTURES FOR INTEGRATED CIRCUIT DEVICES 审中-公开
标题翻译：用于形成集成电路器件的任意结构的方法和设备
公开(公告)号：WO2009034557A2
公开(公告)日：2009-03-19
申请号：PCT/IB2008/053714
申请日：2008-09-12
申请人： NXP B.V. , WYLAND, Christopher
发明人： WYLAND, Christopher
CPC分类号： H05K3/00 , B33Y80/00 , H01L21/4846 , H01L23/473 , H01L23/5389 , H01L24/82 , H01L25/0655 , H01L25/0657 , H01L2223/6622 , H01L2224/16225 , H01L2224/24227 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/01066 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/10329 , H01L2924/14 , H01L2924/15787 , H05K1/0237 , H05K1/185 , H05K3/0005 , H05K3/0082 , H05K3/1241 , H05K3/4644 , H05K3/4664 , H05K2201/09836 , Y02P80/30 , H01L2924/00014 , H01L2924/00
摘要： A method of implementing arbitrary structures to provide electrical interconnection and mechanical fixturing for integrated circuits is provided. According to exemplary embodiments of the invention said arbitrary structures are manufactured using three dimensional manufacturing processes employing only additive steps for all materials within the arbitrary structure. Accordingly the arbitrary structure is provided in a single step incorporating mechanical, electrical, and thermal elements as required by the design incorporating simultaneously dielectric and metallic materials. The arbitrary structures may be manufactured directly in association with the integrated circuits or separately for subsequent assembly to the integrated circuits. Arbitrary structures ranging from a fraction of to all of the structural and electrical elements required for packaging the integrated circuit(s) being provided by the arbitrary structures according to the design boundary established.
摘要翻译：提供了一种实现任意结构以提供集成电路的电互连和机械固定的方法。根据本发明的示例性实施例，所述任意结构使用三维制造工艺来制造，所述三维制造工艺仅对任意结构内的所有材料采用添加步骤。因此，任意结构在结合机械，电和热元件的单个步骤中提供，如同时并入介电和金属材料的设计所要求的。任意结构可以直接与集成电路相关联地制造或单独制造用于随后组装到集成电路。任意结构的范围从一小部分到包装集成电路所需的所有结构和电气元件由任意结构根据设计边界确定。

4. 发明申请

WO2008096283A1 DESIGN METHOD FOR TRANSMISSION LINES USING META-MATERIALS 审中-公开
标题翻译：使用金属材料的变速器线路的设计方法
公开(公告)号：WO2008096283A1
公开(公告)日：2008-08-14
申请号：PCT/IB2008/050263
申请日：2008-01-24
申请人： NXP B.V. , WYLAND, Christopher
发明人： WYLAND, Christopher
IPC分类号： H01P3/08
CPC分类号： H01P3/08 , H01L23/66 , H01L2924/0002 , H01L2924/19051 , H01L2924/3011 , H01L2924/00
摘要： High frequency circuits for wireless, digital and microwave applications place requirements upon the impedance of their signal lines, interconnects and packaging. In designing and implementing the substrates for these signal lines it is beneficial to employ meta-materials to provide the desired impedance. Such meta-materials providing a means to provide modified permittivity and permeability for the substrate, these being different than the real permittivity and permeability of the insulator used. In an example embodiment, a substrate is configured as a meta-material. It is desirable therefore to have a means to model these meta-material aspects of the signal lines rapidly and accurately allowing the circuits, interconnects and packages to be designed and implemented without expensive and exhaustive iterative experimental characterization. Within the cited invention design parameters for the meta-material structure are determined in dependence upon input parameters characterising the conductive medium, dielectric medium enveloping the conductive material, and the pre-determined shapes of the conductive medium.
摘要翻译：用于无线，数字和微波应用的高频电路要求其信号线，互连和封装的阻抗。在设计和实施这些信号线的衬底时，使用超临界材料来提供期望的阻抗是有益的。这种超临界材料提供了为衬底提供改良的介电常数和磁导率的方法，这些不同于所用绝缘体的实际介电常数和磁导率。在示例性实施例中，将衬底配置为超常材料。因此，希望有一种手段可以快速，准确地模拟信号线的这些超材料方面，从而可以设计和实现电路，互连和封装，而无需昂贵和详尽的迭代实验表征。在所引用的本发明中，用于超常材料结构的设计参数根据表征导电介质的输入参数，包封导电材料的介电介质和导电介质的预定形状来确定。

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