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1. 发明申请

WO2004001904A8 STABILIZED WIRE BONDED ELECTRICAL CONNECTIONS AND METHOD OF MAKING SAME 审中-公开
标题翻译：稳定电线连接电气连接及其制造方法
公开(公告)号：WO2004001904A8
公开(公告)日：2004-05-21
申请号：PCT/US0319295
申请日：2003-06-19
申请人： RAZON ELI
发明人： RAZON ELI
IPC分类号： H01L21/00 , H01L21/607 , H01L23/485 , H01L23/498 , H01R13/24 , H05K3/32 , H01R
CPC分类号： H01L24/85 , H01L21/4825 , H01L23/49811 , H01L24/10 , H01L24/13 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/13 , H01L2224/13099 , H01L2224/131 , H01L2224/13144 , H01L2224/16225 , H01L2224/32225 , H01L2224/43 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45611 , H01L2224/45616 , H01L2224/45639 , H01L2224/45644 , H01L2224/45655 , H01L2224/4809 , H01L2224/48091 , H01L2224/48227 , H01L2224/48455 , H01L2224/48472 , H01L2224/73204 , H01L2224/78302 , H01L2224/78313 , H01L2224/78318 , H01L2224/85205 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01075 , H01L2924/01079 , H01L2924/01084 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/19042 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01R13/2407 , H05K3/325 , H05K2201/10265 , H05K2201/10719 , H01L2924/00014 , H01L2924/00011 , H01L2924/00 , H01L2924/00015
摘要： A new and improved electrical connector is provided for Ball Grid Array (BGA) devices and Direct Chip Attach (DCA) devices that solves the prior art problems of mismatch in the coefficient of thermal between a semiconductor die and its substrate, PC board or carrier. The electrical connector consists of a resilient loop of wire that is permanently wire bonded at a first and a second bond position to an electrode or contact pad of a die or an interposer. The closed loop of wire is stable in the X and Y direction and resilient in the Z direction which enables the wire bonded die or interposer to be temporarily attached to a carrier or test board for all forms of tests as well as being removable and reworkable even after being permanently soldered in place on a substrate or PC board. Since the loop shaped connectors are resilient in X, Y and Z directions, the die or interposer may be clamped onto a PC board or substrate to provide a lead free electrical connection that does not require any underfill. The loop size may be made with highly conductive and/or plated (coated) wire in sizes from about 2.5 mils diameter up to about 30 mils using wire having a diameter of about 1.0 mils up to 5.0 mils to replace prior art balls used on pads of about 3 mils size or greater.
摘要翻译：为球栅阵列（BGA）器件和直接芯片连接（DCA）器件提供了一种新的改进的电连接器，其解决了半导体管芯及其衬底，PC板或载体之间的热系数不匹配的现有技术问题。电连接器由电线的弹性回路组成，其在第一和第二接合位置处永久地引线接合到模具或插入件的电极或接触焊盘。线的闭环在X和Y方向上是稳定的，并且在Z方向上具有弹性，这使得线接合模具或插入件能够临时连接到载体或测试板以进行所有形式的测试，并且甚至可移除和再加工在基板或PC板上永久焊接到位之后。由于环形连接器在X，Y和Z方向上具有弹性，所以芯片或插入件可夹在PC板或基板上，以提供不需要任何底部填充的无铅电连接。可以使用具有约1.0密耳至高达5.0密耳直径的线的直径大约2.5密耳直径至约30密耳的高导电性和/或电镀（涂覆）线制成环尺寸，以代替在垫上使用的现有技术球约3密耳尺寸或更大。

2. 发明申请

WO2004001904A2 STABILIZED WIRE BONDED ELECTRICAL CONNECTIONS AND METHOD OF MAKING SAME 审中-公开
标题翻译：稳定电线连接电气连接及其制造方法
公开(公告)号：WO2004001904A2
公开(公告)日：2003-12-31
申请号：PCT/US2003/019295
申请日：2003-06-19
申请人： RAZON, Eli
发明人： RAZON, Eli
IPC分类号： H01R
CPC分类号： H01L24/85 , H01L21/4825 , H01L23/49811 , H01L24/10 , H01L24/13 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/13 , H01L2224/13099 , H01L2224/131 , H01L2224/13144 , H01L2224/16225 , H01L2224/32225 , H01L2224/43 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45611 , H01L2224/45616 , H01L2224/45639 , H01L2224/45644 , H01L2224/45655 , H01L2224/4809 , H01L2224/48091 , H01L2224/48227 , H01L2224/48455 , H01L2224/48472 , H01L2224/73204 , H01L2224/78302 , H01L2224/78313 , H01L2224/78318 , H01L2224/85205 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01075 , H01L2924/01079 , H01L2924/01084 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/19042 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01R13/2407 , H05K3/325 , H05K2201/10265 , H05K2201/10719 , H01L2924/00011 , H01L2924/00 , H01L2924/00015 , H01L2224/85399 , H01L2224/05599
摘要： A new and improved electrical connector is provided for Ball Grid Array (BGA) devices and Direct Chip Attach (DCA) devices that solves the prior art problems of mismatch in the coefficient of thermal between a semiconductor die and its substrate, PC board or carrier. The electrical connector consists of a resilient loop of wire that is permanently wire bonded at a first and a second bond position to an electrode or contact pad of a die or an interposer. The closed loop of wire is stable in the X and Y direction and resilient in the Z direction which enables the wire bonded die or interposer to be temporarily attached to a carrier or test board for all forms of tests as well as being removable and reworkable even after being permanently soldered in place on a substrate or PC board. Since the loop shaped connectors are resilient in X, Y and Z directions, the die or interposer may be clamped onto a PC board or substrate to provide a lead free electrical connection that does not require any underfill. The loop size may be made with highly conductive and/or plated (coated) wire in sizes from about 2.5 mils diameter up to about 30 mils using wire having a diameter of about 1.0 mils up to 5.0 mils to replace prior art balls used on pads of about 3 mils size or greater.
摘要翻译：为球栅阵列（BGA）器件和直接芯片连接（DCA）器件提供了一种新的改进的电连接器，其解决了半导体管芯及其衬底，PC板或载体之间的热系数不匹配的现有技术问题。电连接器由电线的弹性回路组成，其在第一和第二接合位置处永久地引线接合到模具或插入件的电极或接触焊盘。线的闭环在X和Y方向上是稳定的，并且在Z方向上具有弹性，这使得线接合模具或插入件能够临时连接到载体或测试板以进行所有形式的测试，并且甚至可移除和再加工在基板或PC板上永久焊接到位之后。由于环形连接器在X，Y和Z方向上具有弹性，所以芯片或插入件可夹在PC板或基板上，以提供不需要任何底部填充的无铅电连接。可以使用具有约1.0密耳至高达5.0密耳直径的线的直径大约2.5密耳直径至约30密耳的高导电性和/或电镀（涂覆）线制成环尺寸，以代替在垫上使用的现有技术球约3密耳尺寸或更大。

3. 发明申请

WO2013129253A1 パワー半導体装置及びその製造方法並びにボンディングワイヤ审中-公开
标题翻译：功率半导体器件，其制造方法和接合线
公开(公告)号：WO2013129253A1
公开(公告)日：2013-09-06
申请号：PCT/JP2013/054524
申请日：2013-02-22
申请人：日鉄住金マイクロメタル株式会社 , 学校法人早稲田大学
发明人：巽　宏平 , 山田　隆 , 小田　大造
IPC分类号： H01L21/60 , H01L21/607
CPC分类号： H01L24/05 , H01L24/03 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/03444 , H01L2224/0345 , H01L2224/0346 , H01L2224/04042 , H01L2224/05007 , H01L2224/05073 , H01L2224/05082 , H01L2224/05083 , H01L2224/05084 , H01L2224/05118 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05166 , H01L2224/05169 , H01L2224/05171 , H01L2224/05172 , H01L2224/05184 , H01L2224/05618 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/05672 , H01L2224/05684 , H01L2224/32245 , H01L2224/43 , H01L2224/4312 , H01L2224/43125 , H01L2224/4321 , H01L2224/43848 , H01L2224/43986 , H01L2224/45005 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45611 , H01L2224/45618 , H01L2224/45624 , H01L2224/45639 , H01L2224/45644 , H01L2224/45647 , H01L2224/45655 , H01L2224/45664 , H01L2224/45666 , H01L2224/45669 , H01L2224/45671 , H01L2224/45672 , H01L2224/45684 , H01L2224/45686 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/48463 , H01L2224/48472 , H01L2224/48818 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/48866 , H01L2224/48869 , H01L2224/48871 , H01L2224/48872 , H01L2224/48884 , H01L2224/73265 , H01L2224/78313 , H01L2224/85205 , H01L2224/85207 , H01L2224/85439 , H01L2224/8592 , H01L2924/00011 , H01L2924/00014 , H01L2924/01047 , H01L2924/10253 , H01L2924/10272 , H01L2924/1305 , H01L2924/13055 , H01L2924/15747 , H01L2924/20103 , H01L2924/351 , H01L2924/00015 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/00012 , H01L2924/00 , H01L2924/01079 , H01L2924/01046 , H01L2924/013 , H01L2924/00013 , H01L2924/01202 , H01L2924/20107 , H01L2924/20106 , H01L2224/29099 , H01L2924/01023 , H01L2924/01074 , H01L2924/01049
摘要：　パワー半導体装置の電流容量の大容量化、高温環境での使用に際し、熱応力が発生しても問題なく使用でき、ワイヤ自身の発熱を低減でき、高温環境でも接合部の信頼性を確保することができるパワー半導体装置及びその製造方法並びにボンディングワイヤを提供することを課題とする。パワー半導体素子２上の金属電極（素子電極３）ともう一方の金属電極（接続電極４）とを金属ワイヤ５によって双方ともウェッジ接続したパワー半導体装置１において、金属ワイヤ５は直径５０μｍ超２ｍｍ以下のＡｇ又はＡｇ合金ワイヤであり、素子電極３は表面に５０Å厚以上のＮｉ、Ｃｒ、Ｃｕ、Ｐｄ、Ｖ、Ｔｉ、Ｐｔ、Ｚｎ、Ａｇ、Ａｕ、Ｗ、Ａｌの金属層又はこれらの合金層を１層以上有する。これにより、Ａｇワイヤを用いるにもかかわらず電極との接合部信頼性を確保でき、大電流での使用時に金属ワイヤ自身の発熱を低減でき、高温での耐熱性を改善することができる。
摘要翻译：本发明解决了提供以下问题：功率半导体器件，即使产生热应力也能够毫无问题地使用，能够减少由线产生的热量，能够确保接合部的可靠性即使在高温环境下，当功率半导体器件的电流容量增加并且功率半导体器件在高温环境下使用时; 一种制造功率半导体器件的方法; 和接合线。在功率半导体器件（1）中，功率半导体元件（2）上的金属电极（元件电极（3））和另一个金属电极（连接电极（4））都通过装置楔形连接的金属线（5）。金属线（5）是直径大于50um但是等于或小于2mm的Ag线或Ag合金线，元件电极（3）的表面上具有一个或多个金属层或合金层，其中每一层的厚度均为50埃以上，所述金属层由选自Ni，Cr，Cu，Pd，V，Ti，Pt，Zn，Ag，Au，W和 Al，所述合金层由选自这些金属的金属构成。因此，与使用Ag线的事实无关，可以确保对电极的接合部的可靠性，当使用大电流时可以减少由金属线产生的热量，并且提高高温下的耐热性。

4. 发明申请

WO2003081661A1 ボンディングワイヤーおよびそれを使用した集積回路デバイス审中-公开
标题翻译：使用相同的连接线和集成电路器件
公开(公告)号：WO2003081661A1
公开(公告)日：2003-10-02
申请号：PCT/JP2003/003492
申请日：2003-03-24
申请人：住友電工ウインテック株式会社 , 野中毅 , 改森信吾 , 井岡正則 , 深萱正人
发明人：野中毅 , 改森信吾 , 井岡正則 , 深萱正人
IPC分类号： H01L21/60
CPC分类号： H01L24/45 , H01L24/43 , H01L2224/4321 , H01L2224/43825 , H01L2224/43848 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45611 , H01L2224/45618 , H01L2224/45623 , H01L2224/45624 , H01L2224/45639 , H01L2224/45644 , H01L2224/45655 , H01L2224/45657 , H01L2224/4566 , H01L2224/45664 , H01L2224/45666 , H01L2224/45669 , H01L2224/4567 , H01L2224/45671 , H01L2224/45673 , H01L2224/45676 , H01L2224/45678 , H01L2224/45683 , H01L2924/00011 , H01L2924/00014 , H01L2924/01204 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/19043 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/01016 , H01L2924/01004 , H01L2924/01047 , H01L2924/0104 , H01L2924/01008 , H01L2924/01026 , H01L2924/0105 , H01L2924/01024 , H01L2924/0103 , H01L2924/01001 , H01L2924/00015 , H01L2224/48 , H01L2924/00 , H01L2924/01006
摘要：広いボール径範囲にわたって、真球のボールを安定的に形成し、かつメッキをする際にメッキ液の劣化をもたらさずに製造することができ、さらに被覆層と芯材との密着性にすぐれるボンディングワイヤーであって、銅を主成分とする芯材、該芯材上に形成された銅以外の金属からなる異種金属層、および該異種金属層の上に形成され、銅よりも高融点の耐酸化性金属からなる被覆層を有することを特徴とするボンディングワイヤーおよびそれを使用した集積回路デバイス。
摘要翻译：一种接合线，其特征在于，其包括以铜为主要材料的芯材，包含形成在所述芯材上的铜以外的金属的不同金属层，以及包含熔点高于铜在不同的金属层上形成; 以及使用该接合线的集成电路器件。接合线可以在球的直径的宽范围内形成具有真圆形的球，可以使用不会劣化电镀液的电镀技术来制造，并且涂层对于核心材料。

5. 发明申请

WO00057472A1 METHOD OF CONNECTING A CONNECTING WIRE TO A CONTACT OF AN INTEGRATED CIRCUIT 审中-公开
标题翻译：方法用于连接连接线与连接接触AN集成电路
公开(公告)号：WO00057472A1
公开(公告)日：2000-09-28
申请号：PCT/DE2000/000907
申请日：2000-03-24
IPC分类号： H01L21/603 , H01L23/485
CPC分类号： H01L24/85 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/02166 , H01L2224/03422 , H01L2224/03436 , H01L2224/03464 , H01L2224/04042 , H01L2224/05073 , H01L2224/05147 , H01L2224/05601 , H01L2224/05609 , H01L2224/05611 , H01L2224/05616 , H01L2224/05624 , H01L2224/05647 , H01L2224/05666 , H01L2224/32225 , H01L2224/45014 , H01L2224/45015 , H01L2224/45032 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/4556 , H01L2224/45565 , H01L2224/456 , H01L2224/45686 , H01L2224/48091 , H01L2224/48247 , H01L2224/48463 , H01L2224/4847 , H01L2224/48601 , H01L2224/48609 , H01L2224/48611 , H01L2224/48616 , H01L2224/48624 , H01L2224/48647 , H01L2224/48666 , H01L2224/48701 , H01L2224/48709 , H01L2224/48711 , H01L2224/48716 , H01L2224/48724 , H01L2224/48747 , H01L2224/48766 , H01L2224/48801 , H01L2224/48809 , H01L2224/48811 , H01L2224/48816 , H01L2224/48847 , H01L2224/48866 , H01L2224/78252 , H01L2224/78313 , H01L2224/85075 , H01L2224/85201 , H01L2224/8581 , H01L2224/85815 , H01L2224/85825 , H01L2224/8583 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01018 , H01L2924/0102 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01052 , H01L2924/01061 , H01L2924/01068 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/14 , H01L2924/00014 , H01L2224/45666 , H01L2224/45647 , H01L2924/0494 , H01L2924/01014 , H01L2924/00015 , H01L2924/0108 , H01L2224/45611 , H01L2924/00 , H01L2224/48824
摘要： An integrated circuit (1) with a semiconductor substrate (2) comprises electrically active zones to which an electric voltage can be applied via contacts (3). The contacts (3) comprise a contact layer made of copper. The invention provides for each contact (3) to present a connecting wire (7), as well as for a solder layer (6) consisting substantially of a solder-metal compound to be located in an area between the connecting wire (7) and the contact (3).
摘要翻译：一种集成电路（1），包括一个半导体衬底（2）具有通过连接触点（3）与电电压作用时电有源区。连接接点（3）具有由铜构成的连接层，其中，在每个连接接触件（3）设有一个连接线（7），且进一步其中在所述连接线（7）和终端之间的区域（3）提供了一种钎焊层（6），基本上由焊料金属化合物。

6. 发明申请

WO2016098707A1 半導体装置用ボンディングワイヤ审中-公开
标题翻译：用于半导体器件的接合线
公开(公告)号：WO2016098707A1
公开(公告)日：2016-06-23
申请号：PCT/JP2015/084823
申请日：2015-12-11
申请人：新日鉄住金マテリアルズ株式会社 , 日鉄住金マイクロメタル株式会社
发明人：小山田　哲哉 , 宇野　智裕 , 小田　大造 , 山田　隆
IPC分类号： H01L21/60 , C22C5/06 , C22F1/00 , C22F1/14
CPC分类号： H01L24/45 , B23K35/0227 , B23K35/3006 , B23K35/322 , H01L24/05 , H01L24/43 , H01L24/48 , H01L24/85 , H01L2224/05624 , H01L2224/43125 , H01L2224/4321 , H01L2224/435 , H01L2224/437 , H01L2224/43825 , H01L2224/43826 , H01L2224/43827 , H01L2224/43848 , H01L2224/45015 , H01L2224/45105 , H01L2224/45109 , H01L2224/45111 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/45169 , H01L2224/45541 , H01L2224/45565 , H01L2224/45572 , H01L2224/45605 , H01L2224/45609 , H01L2224/45611 , H01L2224/45639 , H01L2224/45644 , H01L2224/45664 , H01L2224/45669 , H01L2224/48463 , H01L2224/48465 , H01L2224/48507 , H01L2224/78301 , H01L2224/85045 , H01L2224/85065 , H01L2224/85075 , H01L2224/85203 , H01L2224/85205 , H01L2924/00011 , H01L2924/01005 , H01L2924/01015 , H01L2924/0102 , H01L2924/01034 , H01L2924/01057 , H01L2924/0132 , H01L2924/10253 , H01L2924/181 , H01L2924/00014 , H01L2924/01031 , H01L2924/01049 , H01L2924/0105 , H01L2924/01029 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/01204 , H01L2924/20105 , H01L2924/01001 , H01L2924/01007 , H01L2924/01004 , H01L2924/00012 , H01L2924/00015
摘要：　Ｇａ，Ｉｎ及びＳｎの１種以上を総計で０．１～３．０ａｔ．％含み、残部がＡｇおよび不可避不純物からなる芯材と、前記芯材の表面に形成された、Ｐｄ及びＰｔの１種以上、又は、Ｐｄ及びＰｔの１種以上とＡｇ、を含み、残部が不可避不純物からなる被覆層とを備え、前記被覆層の厚さが０．００５～０．０７０μｍであることを特徴とする、メモリ用ボンディングワイヤに要求されるボール接合信頼性、ウェッジ接合性を同時に満足することができるボンディングワイヤを提供する。
摘要翻译：提供一种接合线，其特征在于，包括：芯材，其包含总量为0.1〜3.0原子％的Ga，In和Sn中的至少一种，其余为Ag和不可避免的杂质; 以及形成在所述芯材的表面上并且包含Pd和Pt或Ag中的至少一种以及Pd和Pt中的至少一种的涂层，其余部分包含不可避免的杂质; 其中所述涂层的厚度为0.005-0.070μm。接合线能够同时满足用于存储器的接合线所需的球接合可靠性和楔形粘合性。

7. 发明申请

WO2012002764A2 METAL-SEMICONDUCTOR CONVERGENCE ELECTRIC CIRCUIT DEVICES AND ELECTRIC CIRCUIT SYSTEMS USING THE SAME 审中-公开
标题翻译：金属半导体集成电路设备和使用该电路的电路系统
公开(公告)号：WO2012002764A2
公开(公告)日：2012-01-05
申请号：PCT/KR2011004838
申请日：2011-07-01
申请人： KOREA ELECTRONICS TELECOMM , KIM HYUN-TAK , KIM BONG JUN
发明人： KIM HYUN-TAK , KIM BONG JUN
IPC分类号： H01L23/36
CPC分类号： H01L23/62 , H01L25/167 , H01L2224/45109 , H01L2224/45111 , H01L2224/45116 , H01L2224/45118 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45149 , H01L2224/45155 , H01L2224/45157 , H01L2224/4516 , H01L2224/45166 , H01L2224/45169 , H01L2224/45171 , H01L2224/45172 , H01L2224/4518 , H01L2224/45184 , H01L2224/45565 , H01L2224/45611 , H01L2924/00014 , H01L2924/01013 , H01L2924/01028 , H01L2924/01047 , H01L2924/12036 , H01L2924/1305 , H01L2924/1306 , H01L2924/00 , H01L2224/48
摘要： Provided are metal-semiconductor convergence electric circuit devices. The device includes a semiconductor device, a metal resistor exhibiting resistance increased with an increase in temperature thereof, and an interconnection line connecting the semiconductor device with the metal resistor in series and having a resistance lower than that of the metal resistor. The semiconductor device is configured to exhibit resistance decreased with an increase in temperature thereof and compensate the resistance increase of the metal resistor.
摘要翻译：提供了金属 - 半导体会聚电路装置。该器件包括半导体器件，呈现电阻随温度升高而呈现电阻的金属电阻器，以及将半导体器件与金属电阻器串联连接并具有低于金属电阻器的电阻的互连线。半导体器件被配置为表现出随着其温度升高而降低的电阻并且补偿金属电阻器的电阻增加。

8. 发明申请

WO2005038902A1 ボンディングワイヤーおよびそれを使用した集積回路デバイス审中-公开
标题翻译：使用相同的连接线和集成电路器件
公开(公告)号：WO2005038902A1
公开(公告)日：2005-04-28
申请号：PCT/JP2004/015448
申请日：2004-10-13
申请人：住友電気工業株式会社 , 改森信吾 , 野中毅 , 井岡正則
发明人：改森信吾 , 野中毅 , 井岡正則
IPC分类号： H01L21/60
CPC分类号： H01L24/85 , B23K20/007 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/4312 , H01L2224/4321 , H01L2224/43825 , H01L2224/43848 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/456 , H01L2224/45611 , H01L2224/45618 , H01L2224/45623 , H01L2224/45624 , H01L2224/45639 , H01L2224/45644 , H01L2224/45647 , H01L2224/45649 , H01L2224/45655 , H01L2224/45657 , H01L2224/4566 , H01L2224/45663 , H01L2224/45664 , H01L2224/45666 , H01L2224/45669 , H01L2224/4567 , H01L2224/45671 , H01L2224/45673 , H01L2224/45676 , H01L2224/45678 , H01L2224/45683 , H01L2224/48091 , H01L2224/48247 , H01L2224/48463 , H01L2224/48639 , H01L2224/48839 , H01L2224/78301 , H01L2224/85205 , H01L2224/85439 , H01L2924/00011 , H01L2924/01204 , H01L2924/01206 , H01L2924/14 , H01L2924/15747 , H01L2924/20752 , H01L2924/00014 , H01L2924/01004 , H01L2924/0105 , H01L2924/0103 , H01L2924/0104 , H01L2924/01047 , H01L2924/01024 , H01L2924/01026 , H01L2924/01008 , H01L2924/01016 , H01L2924/01001 , H01L2924/01029 , H01L2924/00 , H01L2924/013 , H01L2924/20751 , H01L2924/20753 , H01L2924/20754 , H01L2924/00015 , H01L2924/01076 , H01L2924/01006
摘要：芯材と前記芯材上に形成された被覆層とを有し、かつ前記被覆層は芯材よりも高融点の金属からなり、さらに下記の少なくとも１つの特徴を有するボンディングワイヤー：１．芯材の溶融時の被覆材との濡れ接触角が２０度以上、２．ボンディングワイヤーを、その先端を水平面に接触するように垂下し、前記先端から１５ｃｍ上を切断してボンディングワイヤーを前記水平面に落下させることにより形成される円弧の曲率半径が、３５ｍｍ以上である、３．０．２％耐力が０．１１５ｍＮ／μｍ２以上かつ０．１６５ｍＮ／μｍ２以下である、及び４．被覆層のビッカース硬度が３００以下である。
摘要翻译：一种接合线，其具有芯材，并且在所述芯材上形成包括熔点高于所述芯材料的熔点的金属的涂层，并且还具有以下特征中的至少一个：1.湿接触角具有涂层材料的熔融芯材的温度为20度以上，2.当允许接合线垂下来形成的圆弧的曲率半径，使得其尖端与水平面接触，并且线在尖端上方15厘米处被切割，并且切割线被允许落在水平面上，为35mm以上。 0.2％偏移屈服强度为0.115〜0.165mN / mum2，4.涂层的维氏硬度为300以下。

9. 发明申请

WO2014032970A1 METHOD FOR LAYING A WIRE CONDUCTOR ONTO A SUBSTRATE AND FOR CONNECTING IT TO A CHIP 审中-公开
标题翻译：将导线导入基板并将其连接到芯片的方法
公开(公告)号：WO2014032970A1
公开(公告)日：2014-03-06
申请号：PCT/EP2013/066963
申请日：2013-08-14
申请人： FINLAY, Garreth , HYNES, Fergus
发明人： FINLAY, Garreth , HYNES, Fergus
IPC分类号： H01L21/607 , G06K19/077 , B23K20/00
CPC分类号： G06K19/07781 , G06K19/07754 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/05599 , H01L2224/45099 , H01L2224/45611 , H01L2224/4813 , H01L2224/78 , H01L2224/85205 , H01L2224/85801 , H01L2224/8585 , H01L2924/00014 , H01L2224/85399
摘要： Method for laying a wire conductor (3) on a substrate (2) by means of a wire laying pin (10), which embeds the wire conductor (3) under the influence of ultrasound into the surface of the substrate (2), and for the electrically conductive connection of the wire conductor (3) to a contact surface (7,8) of a chip (4), which is attached to the substrate, by means of a welding die (11), wherein the wire laying pin (10), subsequent to an attachment of the wire conductor (3) to the substrate (2), is lifted off the substrate (2) and then moved into a position starting from which the wire conductor (3) forms a straight wire line (15) extending in the air space above the substrate (2) and extending from the mouth of the wire laying pin (10) to an attachment point (F) at which the wire conductor (3) is attached to the substrate (2) or embedded into the substrate(2), whereupon the welding die (11) grips the wire in the area between the wire laying pin (10) and the end point (14) of the wire laying cycle, brings it up to the contact surface (7,8) of the chip (4) associated therewith, and welds it to the contact surface or whereupon a wire gripper (12) grips the wire conductor (3) in the area between the wire laying pin (10) and the attachment point (F), the wire gripper (12) and preferably also the wire laying pin (10) are then moved in such a way that the wire conductor (3) spanned in between them from now on traverses the contact surface (7,8) of the chip (4) associated therewith, finally the welding die (11) presses the wire conductor (3) spanned in between the wire gripper (12) and the wire laying pin (10) onto the contact surface (7,8) and welds it to the contact surface.
摘要翻译：用于通过敷线销（10）将线导体（3）放置在基板（2）上的方法，其将超导线下的导线（3）嵌入基板（2）的表面;以及用于通过焊接模具（11）将线导体（3）导电连接到附接到基板的芯片（4）的接触表面（7,8）上，其中布线销（10）在将导线（3）连接到基板（2）之后，被提升离开基板（2），然后移动到从导线（3）形成直线导线（15），其在所述基板（2）上方的空气空间中延伸并且从所述电线敷设销（10）的口延伸到所述电线导体（3）附接到所述基板（2）的附接点（F）或嵌入到基板（2）中，于是焊接模具（11）在电线敷设销（10）和电线铺设的终点（14）之间的区域中握住电线 g循环，将其带到与其相关联的芯片（4）的接触表面（7,8）上，并将其焊接到接触表面上，或者由此将线夹（12）夹在线导体（3）之间的区域中电线敷设销（10）和安装点（F），电线夹持器（12）以及优选的电线敷设销（10）然后移动，使得导线（3）跨过它们之间现在横穿与其相关联的芯片（4）的接触表面（7,8），最后焊接模具（11）挤压跨在导线夹持器（12）和导线敷设销（10）之间的导线（3））到接触表面（7,8）上并将其焊接到接触表面。

10. 发明申请

WO2004001904A3 STABILIZED WIRE BONDED ELECTRICAL CONNECTIONS AND METHOD OF MAKING SAME 审中-公开
标题翻译：稳定电线连接电气连接及其制造方法
公开(公告)号：WO2004001904A3
公开(公告)日：2005-04-28
申请号：PCT/US0319295
申请日：2003-06-19
申请人： RAZON ELI
发明人： RAZON ELI
IPC分类号： H01L21/00 , H01L21/607 , H01L23/485 , H01L23/498 , H01R13/24 , H05K3/32 , H05K3/00 , B23K31/02 , H01K1/00 , H01R4/02 , H01R43/16
CPC分类号： H01L24/85 , H01L21/4825 , H01L23/49811 , H01L24/10 , H01L24/13 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/13 , H01L2224/13099 , H01L2224/131 , H01L2224/13144 , H01L2224/16225 , H01L2224/32225 , H01L2224/43 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45611 , H01L2224/45616 , H01L2224/45639 , H01L2224/45644 , H01L2224/45655 , H01L2224/4809 , H01L2224/48091 , H01L2224/48227 , H01L2224/48455 , H01L2224/48472 , H01L2224/73204 , H01L2224/78302 , H01L2224/78313 , H01L2224/78318 , H01L2224/85205 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01075 , H01L2924/01079 , H01L2924/01084 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/19042 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01R13/2407 , H05K3/325 , H05K2201/10265 , H05K2201/10719 , H01L2924/00014 , H01L2924/00011 , H01L2924/00 , H01L2924/00015
摘要： A electrical connector which consists of a resilient loop (37) or wire (28) is Permanently bonded at a first (35) and second (36) bond position to an Electrode or contact pad (29) of a die or an interposer (15). The Closed loop Of wire (28) is stable in the X and Y direction and is resilient in the Z direction thus enabling the wire bonded die (11) or interposer (15) to be temporarily attached to a carrier or test board for various tests.
摘要翻译：由弹性环（37）或线（28）组成的电连接器在第一（35）和第二（36）接合位置处永久地接合到管芯或插入件（15）的电极或接触垫（29））。线（28）的闭环在X和Y方向上是稳定的，并且在Z方向上具有弹性，从而使得引线接合管芯（11）或插入件（15）能够暂时地附接到载体或测试板进行各种测试。

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