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1. 发明申请

WO2014032970A1 METHOD FOR LAYING A WIRE CONDUCTOR ONTO A SUBSTRATE AND FOR CONNECTING IT TO A CHIP 审中-公开
标题翻译：将导线导入基板并将其连接到芯片的方法
公开(公告)号：WO2014032970A1
公开(公告)日：2014-03-06
申请号：PCT/EP2013/066963
申请日：2013-08-14
申请人： FINLAY, Garreth , HYNES, Fergus
发明人： FINLAY, Garreth , HYNES, Fergus
IPC分类号： H01L21/607 , G06K19/077 , B23K20/00
CPC分类号： G06K19/07781 , G06K19/07754 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/05599 , H01L2224/45099 , H01L2224/45611 , H01L2224/4813 , H01L2224/78 , H01L2224/85205 , H01L2224/85801 , H01L2224/8585 , H01L2924/00014 , H01L2224/85399
摘要： Method for laying a wire conductor (3) on a substrate (2) by means of a wire laying pin (10), which embeds the wire conductor (3) under the influence of ultrasound into the surface of the substrate (2), and for the electrically conductive connection of the wire conductor (3) to a contact surface (7,8) of a chip (4), which is attached to the substrate, by means of a welding die (11), wherein the wire laying pin (10), subsequent to an attachment of the wire conductor (3) to the substrate (2), is lifted off the substrate (2) and then moved into a position starting from which the wire conductor (3) forms a straight wire line (15) extending in the air space above the substrate (2) and extending from the mouth of the wire laying pin (10) to an attachment point (F) at which the wire conductor (3) is attached to the substrate (2) or embedded into the substrate(2), whereupon the welding die (11) grips the wire in the area between the wire laying pin (10) and the end point (14) of the wire laying cycle, brings it up to the contact surface (7,8) of the chip (4) associated therewith, and welds it to the contact surface or whereupon a wire gripper (12) grips the wire conductor (3) in the area between the wire laying pin (10) and the attachment point (F), the wire gripper (12) and preferably also the wire laying pin (10) are then moved in such a way that the wire conductor (3) spanned in between them from now on traverses the contact surface (7,8) of the chip (4) associated therewith, finally the welding die (11) presses the wire conductor (3) spanned in between the wire gripper (12) and the wire laying pin (10) onto the contact surface (7,8) and welds it to the contact surface.
摘要翻译：用于通过敷线销（10）将线导体（3）放置在基板（2）上的方法，其将超导线下的导线（3）嵌入基板（2）的表面;以及用于通过焊接模具（11）将线导体（3）导电连接到附接到基板的芯片（4）的接触表面（7,8）上，其中布线销（10）在将导线（3）连接到基板（2）之后，被提升离开基板（2），然后移动到从导线（3）形成直线导线（15），其在所述基板（2）上方的空气空间中延伸并且从所述电线敷设销（10）的口延伸到所述电线导体（3）附接到所述基板（2）的附接点（F）或嵌入到基板（2）中，于是焊接模具（11）在电线敷设销（10）和电线铺设的终点（14）之间的区域中握住电线 g循环，将其带到与其相关联的芯片（4）的接触表面（7,8）上，并将其焊接到接触表面上，或者由此将线夹（12）夹在线导体（3）之间的区域中电线敷设销（10）和安装点（F），电线夹持器（12）以及优选的电线敷设销（10）然后移动，使得导线（3）跨过它们之间现在横穿与其相关联的芯片（4）的接触表面（7,8），最后焊接模具（11）挤压跨在导线夹持器（12）和导线敷设销（10）之间的导线（3））到接触表面（7,8）上并将其焊接到接触表面。

2. 发明申请

WO2011036150A1 METHOD FOR CONNECTING AT LEAST ONE WIRE CONDUCTOR DISPOSED ON A SUBSTRATE WITH A CHIP OF A TRANSPONDER UNIT 审中-公开
标题翻译：将基底处理的至少一根导线连接到传感器单元的芯片上的方法
公开(公告)号：WO2011036150A1
公开(公告)日：2011-03-31
申请号：PCT/EP2010/063898
申请日：2010-09-21
申请人： ATS AUTOMATION TECHNOLOGY SERVICES , HYNES, Fergus , FINLAY, Garreth
发明人： HYNES, Fergus , FINLAY, Garreth
IPC分类号： G06K19/077 , H05K1/18
CPC分类号： G06K19/07749 , G06K19/0775 , H05K1/184 , H05K3/103 , H05K3/328 , H05K2201/0382 , H05K2201/0394 , H05K2201/10287 , H05K2201/10727
摘要： Method for connecting at least one wire conductor (6) with at least one terminal device (22a, 22b) of a chip module (5) for producing a transponder device (1) comprising a coil device (2) and said chip module (5), wherein, in a first method step, the coil device (2) is disposed and fixed on a substrate (3), and, in a further method step, the wire conductor (6) of the coil device (2) is connected to the chip module (5), characterised in that, during the first method step, end portions (7a, 7b) of the wire conductor (6) are laid so as to extend across the accommodating window (4) in a spaced-apart relation in a central area (Z) of an accommodating window (4) for the chip module (5), the partial areas (8a, 8b) of the wire conductor (6) extending across the accommodating window (4) are displaced from said central area (Z) towards a corresponding edge (23a, 23b) of the accommodating window (4) by means of a positioning device (3) until at least a section of the partial area (8a, 8b) extends over the desired position of a terminal area (22a, 22b), the chip module (5) is subsequently inserted into the accommodating window (4) and the section is then connected in an electrically conductive manner with the terminal area (22a, 22b).
摘要翻译：用于将至少一个线导体（6）与芯片模块（5）的至少一个终端装置（22a，22b）连接起来用于产生包括线圈装置（2）和所述芯片模块（5）的应答器装置（1）的方法），其中，在第一方法步骤中，线圈装置（2）被布置并固定在基板（3）上，并且在另一方法步骤中，线圈装置（2）的导线（6）被连接所述芯片模块（5）的特征在于，在所述第一方法步骤期间，所述导线（6）的端部（7a，7b）被放置成以间隔开的方式延伸穿过所述容纳窗（4）在用于芯片模块（5）的容纳窗（4）的中心区域（Z）中，延伸穿过容纳窗（4）的导线（6）的部分区域（8a，8b）从所述中心区域（Z）通过定位装置（3）朝向容纳窗（4）的对应边缘（23a，23b）延伸，直到部分区域（8a，8b）的至少一部分延伸在端子区域（22a，22b）的期望位置之后，芯片模块（5）随后插入容纳窗口（4）中，然后将该部分与端子区域（22a，22b）以导电方式连接，。

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