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    • 7. 发明申请
    • FORMATION OF A LAYER ON A SEMICONDUCTOR SUBSTRATE
    • 在半导体衬底上形成一层
    • WO2017174535A1
    • 2017-10-12
    • PCT/EP2017/057906
    • 2017-04-04
    • AIXTRON SE
    • KELMAN, MaximJIA, ZhongyuanNAG, SomnathDITIZIO, Robert
    • H01L21/20
    • H01L21/02634C23C16/50C23C16/52H01L21/02381H01L21/02538H01L21/02658H01L21/02661H01L21/02694
    • Described herein are techniques for forming an epitaxial III-V layer on a substrate. In a pre-clean chamber, a native oxygen layer may be replaced with a passivation layer bytreating the substrate with a hydrogen plasma (or products of a plasma decomposition). In a deposition chamber, the temperature of the substrate may beelevated to a temperature less than 700°C. While the substrate temperature is elevated, a group V precursor may beflowed into the deposition chamber in order to transform the hydrogen terminated (Si-H) surface of the passivation layer into an Arsenic terminated (Si-As) surface. After the substrate has been cooled, a group III precursor and the group V precursor may beflowed in order to form a nucleation layer. Finally, at an elevated temperature, the group III precursor and group V precursor may beflowed in order to form a bulk III-V layer.
    • 这里描述的是用于在衬底上形成外延III-V层的技术。 在预清洁室中,通过用氢等离子体(或等离子体分解产物)处理衬底,可以用钝化层代替天然氧层。 在沉积室中,衬底的温度可升高到低于700℃的温度。 在衬底温度升高的同时,V族前驱物可以流入沉积室,以便将钝化层的氢封端(Si-H)表面转变成砷封端(Si-As)表面。 在衬底已经冷却之后,可以使III族前体和V族前体流动以形成成核层。 最后,在升高的温度下,III族前体和V族前体可以流动以形成III-V体层。