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1. 发明申请

WO2014100648A1 THIN-FILM ENCAPSULATED INFRARED SENSOR 审中-公开
标题翻译：薄膜封装的红外传感器
公开(公告)号：WO2014100648A1
公开(公告)日：2014-06-26
申请号：PCT/US2013/077052
申请日：2013-12-20
申请人： ROBERT BOSCH GmbH , PURKL, Fabian , YAMA, Gary , FEYH, Ando , GRAHAM, Andrew , SAMARAO, Ashwin , O'BRIEN, Gary
发明人： PURKL, Fabian , YAMA, Gary , FEYH, Ando , GRAHAM, Andrew , SAMARAO, Ashwin , O'BRIEN, Gary
IPC分类号： G01J5/04 , G01J5/20
CPC分类号： H01L31/0203 , G01J5/045 , G01J5/20 , H01L31/09 , H01L31/18
摘要： A method of fabricating a bolometer infrared sensor includes depositing a first sacrificial layer on a surface of a substrate over a sensor region, and forming an absorber structure for the infrared sensor on top of the first sacrificial layer. A second sacrificial layer is deposited on top of the absorber structure. An encapsulating thin film is then deposited on top of the second sacrificial layer. Vent holes are formed in the encapsulating thin film. The first and the second sacrificial layers are removed below the encapsulating thin film to release the absorber structure and form a cavity above the sensing region that extends down to the substrate in which the absorber structure is located via the vent holes. The vent holes are then closed in a vacuum environment to seal the absorber structure within the cavity.
摘要翻译：一种制造测辐射热计红外传感器的方法包括在传感器区域上的衬底表面上沉积第一牺牲层，以及在第一牺牲层的顶部上形成用于红外传感器的吸收体结构。第二牺牲层沉积在吸收体结构的顶部。然后将封装的薄膜沉积在第二牺牲层的顶部上。在封装薄膜中形成排气孔。在封装薄膜下方移除第一和第二牺牲层以释放吸收体结构，并在感测区域上方形成一个空腔，该腔体通过通气孔向下延伸到吸收体结构位于其中的衬底。然后在真空环境中关闭通气孔以密封空腔内的吸收体结构。

2. 发明申请

WO2014099915A1 RESISTIVE MEMS HUMIDITY SENSOR 审中-公开
标题翻译：电阻式MEMS湿度传感器
公开(公告)号：WO2014099915A1
公开(公告)日：2014-06-26
申请号：PCT/US2013/075677
申请日：2013-12-17
申请人： ROBERT BOSCH GMBH , FEYH, Ando , GRAHAM, Andrew , SAMARAO, Ashwin , YAMA, Gary , O'BRIEN, Gary
发明人： FEYH, Ando , GRAHAM, Andrew , SAMARAO, Ashwin , YAMA, Gary , O'BRIEN, Gary
IPC分类号： G01N27/12
CPC分类号： G01N27/121
摘要： A semiconductor device includes a substrate, an insulating film provided on a surface of the substrate, and a sensing film formed of a conductive material deposited on top of the insulating film. The sensing film defines at least one conductive path between a first position and a second position on the insulating film. A first circuit connection is electrically connected to the sensing film at the first position on the insulating layer, and a second circuit connection is electrically connected to the sensing film at the second position. A control circuit is operatively connected to the first circuit connection and the second circuit connection for measuring an electrical resistance of the sensing film. The sensing film has a thickness that enables a resistivity of the sensing film to be altered predictably in a manner that is dependent on ambient moisture content.
摘要翻译：半导体器件包括衬底，设置在衬底的表面上的绝缘膜和由沉积在绝缘膜的顶部上的导电材料形成的感测膜。感测膜在绝缘膜上的第一位置和第二位置之间限定至少一个导电路径。第一电路连接在绝缘层上的第一位置处电连接到感测膜，并且第二电路连接在第二位置电连接到感测膜。控制电路可操作地连接到第一电路连接和用于测量感测膜的电阻的第二电路连接。感测膜具有能够以取决于环境水分含量的方式预测地改变感测膜的电阻率的厚度。

3. 发明申请

WO2014150093A1 TRENCH BASED CAPACITIVE HUMIDITY SENSOR 审中-公开
标题翻译：基于TRENCH的电容式湿度传感器
公开(公告)号：WO2014150093A1
公开(公告)日：2014-09-25
申请号：PCT/US2014/022205
申请日：2014-03-09
申请人： ROBERT BOSCH GMBH , O'BRIEN, Gary , FEYH, Ando , GRAHAM, Andrew , SAMARAO, Ashwin , YAMA, Gary
发明人： O'BRIEN, Gary , FEYH, Ando , GRAHAM, Andrew , SAMARAO, Ashwin , YAMA, Gary
IPC分类号： G01N27/22
CPC分类号： G01N27/223 , B81B7/0006 , B81B2201/0292 , G01N27/225
摘要： A trenched base capacitive humidity sensor includes a plurality of trenches formed in a conductive layer, such as polysilicon or metal, on a substrate. The trenches are arranged parallel to the each other and partition the conductive layer into a plurality of trenched silicon electrodes. At least two trenched silicon electrodes are configured to form a capacitive humidity sensor. The trenches that define the trenched silicon electrodes can be filled partially ( e.g. , sidewall coverage) or completely with polyimide (PI) or silicon nitride (SiN). A polyimide layer may also be provided on the conductive layer over the trenches and trenched electrodes. The trenches and the trenched silicon electrodes may have different widths to enable different sensor characteristics in the same structure.
摘要翻译：沟底基电容式湿度传感器包括在基板上形成在诸如多晶硅或金属的导电层中的多个沟槽。沟槽彼此平行配置，并将导电层分隔成多个沟槽硅电极。至少两个沟槽硅电极被配置成形成电容式湿度传感器。限定沟槽硅电极的沟槽可以部分地（例如，侧壁覆盖）填充或完全用聚酰亚胺（PI）或氮化硅（SiN）填充。也可以在沟槽和沟槽电极上的导电层上设置聚酰亚胺层。沟槽和沟槽硅电极可以具有不同的宽度，以实现相同结构中不同的传感器特性。

4. 发明申请

WO2014159946A1 MEMS DEVICE HAVING A GETTER 审中-公开
标题翻译：具有GETTER的MEMS器件
公开(公告)号：WO2014159946A1
公开(公告)日：2014-10-02
申请号：PCT/US2014/025498
申请日：2014-03-13
申请人： ROBERT BOSCH GMBH , SAMARAO, Ashwin , O'BRIEN, Gary , FEYH, Ando , YAMA, Gary , GRAHAM, Andrew , KIM, Bongsang , PURKL, Fabian
发明人： SAMARAO, Ashwin , O'BRIEN, Gary , FEYH, Ando , YAMA, Gary , GRAHAM, Andrew , KIM, Bongsang , PURKL, Fabian
IPC分类号： H01L23/12 , H01L21/322 , B81B7/02
CPC分类号： B81C1/00285 , B81C2201/0115 , B81C2203/0109 , B81C2203/0118 , B81C2203/035 , H01L21/3223 , H01L21/3225 , H01L23/28
摘要： A microelectromechanical system (MEMS) device includes a high density getter. The high density getter includes a silicon surface area formed by porosification or by the formation of trenches within a sealed cavity of the device. The silicon surface area includes a deposition of titanium or other gettering material to reduce the amount of gas present in the sealed chamber such that a low pressure chamber is formed. The high density getter is used in bolometers and gyroscopes but is not limited to those devices.
摘要翻译：微机电系统（MEMS）装置包括高密度吸气剂。高密度吸气剂包括通过孔化形成的硅表面积或通过在该装置的密封腔内形成沟槽。硅表面积包括钛或其它吸气材料的沉积物，以减少密封室中存在的气体的量，从而形成低压室。高密度吸气剂用于测辐射仪和陀螺仪，但不限于这些设备。

5. 发明申请

WO2014150089A1 PASSIVATION LAYER FOR HARSH ENVIRONMENTS AND METHODS OF FABRICATION THEREOF 审中-公开
标题翻译：哈桑环境的钝化层及其制造方法
公开(公告)号：WO2014150089A1
公开(公告)日：2014-09-25
申请号：PCT/US2014/022180
申请日：2014-03-08
申请人： ROBERT BOSCH GMBH , FEYH, Ando , PURKL, Fabian , GRAHAM, Andrew , YAMA, Gary
发明人： FEYH, Ando , PURKL, Fabian , GRAHAM, Andrew , YAMA, Gary
IPC分类号： H01L21/205
CPC分类号： B81C1/00809 , B81C2201/016 , H01L21/02601 , H01L23/3192 , H01L45/146 , H01L2924/0002 , H01L2924/00
摘要： A method of fabricating a passivation layer and a passivation layer for an electronic device. The passivation layer includes at least one passivation film layer and at least one nanoparticle layer. A first film layer is formed of an insulating matrix, such as aluminum oxide (Al 2 O 3 ) and a first layer of a noble metal nanoparticle layer, such as a platinum nanoparticle layer, is deposited on the first film layer. Additional layers are formed of alternating film layers and nanoparticle layers. The resulting passivation layer provides a thin and robust passivation layer of high film quality to protect electronic devices, components, and systems from the disruptive environmental conditions.
摘要翻译：一种制造电子器件的钝化层和钝化层的方法。钝化层包括至少一个钝化膜层和至少一个纳米颗粒层。第一膜层由诸如氧化铝（Al2O3）的绝缘基体形成，并且第一层金属纳米颗粒层（例如铂纳米颗粒层）沉积在第一膜层上。附加层由交替的膜层和纳米颗粒层形成。所得到的钝化层提供了一种薄且坚固的高膜质量的钝化层，以保护电子设备，组件和系统免受破坏性环境条件的影响。

6. 发明申请

WO2015103220A1 ROBUST INERTIAL SENSORS 审中-公开
标题翻译：坚固的惯性传感器
公开(公告)号：WO2015103220A1
公开(公告)日：2015-07-09
申请号：PCT/US2014/072694
申请日：2014-12-30
申请人： ROBERT BOSCH GMBH , KIM, Bonsang , FEYH, Ando , GRAHAM, Andrew , O'BRIEN, Gary , BAUS, Michael , MAIER, Ralf , KOC, Mariusz
发明人： KIM, Bonsang , FEYH, Ando , GRAHAM, Andrew , O'BRIEN, Gary , BAUS, Michael , MAIER, Ralf , KOC, Mariusz
IPC分类号： G01P15/08 , G01D5/241
CPC分类号： G01C19/5769 , B81B7/0016 , B81B2201/0235 , B81B2201/0242 , B81B2201/0264 , B81B2207/012 , G01P1/003 , G01P1/023 , G01P15/0802 , G01P15/18 , G01P2015/084 , G01P2015/0882 , H01L2224/48137 , H01L2924/16152
摘要： In one embodiment, a sensor includes a rigid wafer outer body, a first cavity located within the rigid wafer outer body, a first spring supported by the rigid wafer outer body and extending into the first cavity, a second spring supported by the rigid wafer outer body and extending into the first cavity, and a first sensor structure supported by the first spring and the second spring within the first cavity.
摘要翻译：在一个实施例中，传感器包括刚性晶片外部主体，位于刚性晶片外部主体内的第一腔体，由刚性晶片外部主体支撑并延伸到第一腔体中的第一弹簧，由刚性晶片外部支撑的第二弹簧并且延伸到第一腔体中，以及由第一弹簧和第二弹簧支撑在第一腔内的第一传感器结构。

7. 发明申请

WO2014150259A1 AN ELECTRONIC DEVICE WITH AN INTERLOCKING MOLD PACKAGE 审中-公开
标题翻译：具有互连模具包的电子设备
公开(公告)号：WO2014150259A1
公开(公告)日：2014-09-25
申请号：PCT/US2014/022740
申请日：2014-03-10
申请人： ROBERT BOSCH GMBH , FEYH, Ando , O'BRIEN, Gary , GRAHAM, Andrew
发明人： FEYH, Ando , O'BRIEN, Gary , GRAHAM, Andrew
IPC分类号： H01L23/28
CPC分类号： H01L23/3142 , B81B7/0077 , B81C2203/0154 , B81C2203/0163 , H01L21/56 , H01L21/565 , H01L23/3121 , H01L2224/48091 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： An electronic device includes a mold package which encapsulates a portion of the electronic device and does not encapsulate another portion of the electronic device to enable a sensing portion of the electronic device to be exposed to a condition to be sensed. In an electronic sensing device having a sensor formed by a substrate such as silicon, a sensor area is not encapsulated, but areas surrounding the sensor area are encapsulated. The area surrounding the sensor area includes one or more trenches or interlock structures formed in the surrounding substrate which receives the mold material to provide an interlock feature. The interlock feature reduces or substantially prevents the mold from delaminating at an interface of the mold and the substrate.
摘要翻译：电子设备包括：模具包装，其封装电子设备的一部分，并且不封装电子设备的另一部分，以使电子设备的感测部分能够暴露于待感测的状态。在具有由诸如硅的基板形成的传感器的电子感测装置中，传感器区域不被封装，而是封装传感器区域周围的区域。围绕传感器区域的区域包括形成在周围基底中的一个或多个沟槽或互锁结构，其接收模具材料以提供互锁特征。互锁特征减少或基本上防止模具在模具和基底的界面处分层。

8. 发明申请

WO2014070930A2 SURFACE CHARGE MITIGATION LAYER FOR MEMS SENSORS 审中-公开
标题翻译： MEMS传感器的表面电荷减缓层
公开(公告)号：WO2014070930A2
公开(公告)日：2014-05-08
申请号：PCT/US2013/067576
申请日：2013-10-30
申请人： ROBERT BOSCH GMBH , GRAHAM, Andrew , FEYH, Ando , O'BRIEN, Gary
发明人： GRAHAM, Andrew , FEYH, Ando , O'BRIEN, Gary
CPC分类号： B81B7/0064 , B81B2201/0264 , H01L29/72
摘要： A semiconductor device includes a substrate. At least one transducer is provided on the substrate. The at least one transducer includes at least one electrically conductive circuit element. A dielectric layer is deposited onto the substrate over the at least one transducer. A surface charge mitigation layer formed of a conductive material is deposited onto the outer surface of the dielectric layer with the surface charge mitigation layer being electrically coupled to ground potential. The surface charge mitigation layer may be deposited to a thickness of 10nm or less, and the transducer may comprise a microelectromechanical systems (MEMS) device, such as a MEMS pressure sensor. The surface charge mitigation layer may be patterned to include pores to enhance the flexibility as well as the optical properties of the mitigation layer.
摘要翻译：半导体器件包括衬底。在基板上设置至少一个换能器。至少一个换能器包括至少一个导电电路元件。介电层通过至少一个换能器沉积到衬底上。由导电材料形成的表面电荷缓解层沉积在电介质层的外表面上，其中表面电荷缓解层与地电位电耦合。表面电荷缓解层可以沉积到10nm或更小的厚度，并且换能器可以包括诸如MEMS压力传感器的微机电系统（MEMS）装置。表面电荷缓解层可以被图案化以包括孔，以增强缓解层的柔性以及光学特性。

9. 发明申请

WO2014093304A2 SENSOR WITH AN EMBEDDED THERMISTOR FOR PRECISE LOCAL TEMPERATURE MEASUREMENT 审中-公开
标题翻译：具有嵌入式热敏电阻的传感器用于精确的局部温度测量
公开(公告)号：WO2014093304A2
公开(公告)日：2014-06-19
申请号：PCT/US2013/074051
申请日：2013-12-10
申请人： ROBERT BOSCH GMBH , GRAHAM, Andrew , FEYH, Ando , O'BRIEN, Gary
发明人： GRAHAM, Andrew , FEYH, Ando , O'BRIEN, Gary
IPC分类号： G01K1/14
CPC分类号： G01K7/226 , B81B7/008 , B81B7/0087 , B81B2201/0264 , B81B2207/03 , Y10T29/49085
摘要： A resistive temperature sensor (thermistor) for a microelectromechanical system (MEMS) device provides local temperatures of MEMS sensors and other MEMS devices for temperature compensation. Local accurate temperatures of the sensors and other devices provide for temperature compensation of such sensors or devices. By incorporating the thermistor structure into a MEMS device, an accurate temperature is sensed and measured adjacent to or within the structural layers of the device. In one embodiment, the thermistor is located within a few micrometers of the primary device.
摘要翻译：用于微机电系统（MEMS）器件的电阻式温度传感器（热敏电阻）提供MEMS传感器和其他MEMS器件的温度补偿的局部温度。传感器和其他设备的本地准确温度可提供这种传感器或设备的温度补偿。通过将热敏电阻结构结合到MEMS器件中，在设备的结构层附近或内部感测和测量精确的温度。在一个实施例中，热敏电阻位于主要装置的几微米内。

10. 发明申请

WO2014066768A2 COMBINED PRESSURE AND HUMIDITY SENSOR 审中-公开
标题翻译：组合式压力和湿度传感器
公开(公告)号：WO2014066768A2
公开(公告)日：2014-05-01
申请号：PCT/US2013/066825
申请日：2013-10-25
申请人： ROBERT BOSCH GMBH , LAMMEL, Gerhard , WAFFENSCHMIDT, Sybille , FEYH, Ando , O'BRIEN, Gary , GRAHAM, Andrew
发明人： LAMMEL, Gerhard , WAFFENSCHMIDT, Sybille , FEYH, Ando , O'BRIEN, Gary , GRAHAM, Andrew
IPC分类号： G01L19/00
CPC分类号： G01N27/041 , G01D3/0365 , G01L19/0038 , G01L19/0092 , G01L19/141 , G01L19/143 , G01L19/147 , G01N27/223 , H01L2224/16225 , H01L2224/32145 , H01L2224/48091 , H01L2224/73253 , H01L2224/73265 , H01L2924/15174 , H01L2924/00014
摘要： A sensor device package includes a pressure sensor and a humidity sensor mounted on the same substrate and in the same housing with light protection for the pressure sensor a media opening for gas exchange for the humidity sensor. Light protection and rapid response times are provided through strategic positioning of the media opening, strategic arrangement of the pressure sensor, humidity sensor, and the media opening, and/or the use of opaque materials.
摘要翻译：一种传感器装置包括一个压力传感器和一个湿度传感器，该传感器和湿度传感器安装在相同的基板上，同时在相同的外壳中，具有用于压力传感器的光保护，用于湿度传感器的气体交换通过介质打开的策略性定位，压力传感器的策略布置，湿度传感器和介质打开，和/或使用不透明材料来提供光保护和快速响应时间。

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