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    • 22. 发明申请
    • TWIN WELL SPLIT-CHANNEL OTP MEMORY CELL
    • 双通道分支通道OTP存储单元
    • WO2011050464A1
    • 2011-05-05
    • PCT/CA2010/001700
    • 2010-10-29
    • SIDENSE CORP.KURJANOWICZ, Wlodek
    • KURJANOWICZ, Wlodek
    • G11C17/08G11C17/14
    • G11C17/16H01L27/112H01L27/11206
    • A one time programmable memory cell having twin wells to improve dielectric breakdown while minimizing current leakage. The memory cell is manufactured using a standard CMOS process used for core and I/O (input/output) circuitry. A two transistor memory cell having an access transistor and an anti-fuse device, or a single transistor memory cell 100 having a dual thickness gate oxide 114 & 116, are formed in twin wells 102 & 104. The twin wells are opposite in type to each other, where one can be an N-type well 102 while the other can be a P-type well 104. The anti-fuse device is formed with a thin gate oxide and in a well similar to that used for the core circuitry. The access transistor is formed with a thick gate oxide and in a well similar to that used for I/O circuitry.
    • 具有双阱的一次性可编程存储单元,以在减少电流泄漏的同时改善电介质击穿。 存储单元使用用于核心和I / O(输入/输出)电路的标准CMOS工艺制造。 具有存取晶体管和反熔丝器件的双晶体管存储单元或具有双厚度栅极氧化物114和116的单晶体管存储单元100形成在双阱102和104中。双阱的类型与 彼此可以是N型阱102,而另一个可以是P型阱104.抗熔丝器件由薄栅极氧化物形成,并且与用于核心电路的阱类似。 存取晶体管形成有厚栅极氧化物,并且与用于I / O电路的阱类似。
    • 30. 发明申请
    • THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE AND METHOD OF MAKING SAME
    • 三维集成电路结构及其制作方法
    • WO2005010934A2
    • 2005-02-03
    • PCT/US2004/020122
    • 2004-06-23
    • LEE, Sang-Yun
    • H01L
    • B82Y10/00H01L21/8221H01L21/84H01L27/0688H01L27/10805H01L27/11H01L27/1104H01L27/112H01L27/11206H01L27/115H01L27/11502H01L27/11507H01L27/11556H01L27/11568H01L27/228H01L27/2454H01L28/55H01L29/78642H01L29/7881H01L29/792H01L29/7926H01L29/8613H01L29/872
    • Vertically oriented semiconductor devices may be added to a separately fabricated substrate that includes electrical devices and/or interconnect. The plurality of vertically oriented semiconductor devices are physically separated from each other, and are not disposed within the same semiconductor body, or semiconductor substrate. The plurality of vertically oriented semiconductor devices may be added to the separately fabricated substrate as a thin layer including several doped semiconductor regions which, subsequent to attachment, are etched to produce individual doped stack structures. Alternatively, the plurality of vertically oriented semiconductor devices may be fabricated prior to attachment to the separately fabricated substrate. The doped stack structures may form the basis for diodes, capacitors, n-MOSFETs, p-MOSFETs, bipolar transistors, and floating gate transistors. Ferroelectric memory devices, Ferromagnetic memory devices, chalcogenide phase change devices, may be formed in a stackable add-on layer for use in conjunction with a separately fabricated substrate. Stackable add-on layers may include interconnect lines.
    • 垂直取向的半导体器件可以添加到包括电子器件和/或互连的单独制造的衬底中。 多个垂直取向的半导体器件在物理上彼此分离,并且不设置在同一半导体本体或半导体衬底内。 可以将多个垂直取向的半导体器件添加到单独制造的衬底中,作为包括几个掺杂半导体区域的薄层,其在附着之后被蚀刻以产生单独的掺杂堆叠结构。 或者,可以在附接到单独制造的基板之前制造多个垂直取向的半导体器件。 掺杂的堆叠结构可以形成二极管,电容器,n-MOSFET,p-MOSFET,双极晶体管和浮栅晶体管的基础。 铁电存储器件,铁磁存储器件,硫族化物相变器件可以形成在可堆叠的附加层中,与单独制造的衬底结合使用。 可堆叠的附加层可以包括互连线。