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    • 4. 发明申请
    • MULTI-CORE DATA ARRAY POWER GATING CACHE RESTORAL PROGRAMMING MECHANISM
    • 多核心数据阵列功率调节缓存编程机制
    • WO2015177593A1
    • 2015-11-26
    • PCT/IB2014/003198
    • 2014-12-12
    • VIA ALLIANCE SEMICONDUCTOR CO., LTD.
    • HENRY, G., GlennJAIN, Dinesh, K.GASKINS, Stephan
    • G11C17/18G11C29/00
    • G06F12/0893G06F1/3275G06F8/66G06F9/4403G06F12/0811G06F12/12G06F15/177G06F2212/222G06F2212/283G06F2212/601G11C7/20G11C17/16G11C17/18G11C2029/4402
    • An apparatus including a device programmer (310), a stores (1130), and a plurality of cores (332; 1101). The device programmer (310) programs a semiconductor fuse array (336) with compressed configuration data for a plurality of cores (332; 1101) disposed on a die (330). The stores (1130) has a plurality of sub-stores (1131; 1132; 1133; 1134) that each correspond to each of the plurality of cores (1101), where one of the plurality of cores (1101) is configured to access the semiconductor fuse array (336) upon power- up/reset to read and decompress the configuration data, and to store a plurality of decompressed configuration data sets for one or more cache memories (1102) within the each of the plurality of cores (1101) in the plurality of sub-stores (1131; 1132; 1133; 1134). The plurality of cores each has sleep logic (1106) that is configured to subsequently access a corresponding one of the each of the plurality of sub-stores (1131; 1132; 1133; 1134) to retrieve and employ the decompressed configuration data sets to initialize the one or more caches (1102) following a power gating event.
    • 一种包括设备编程器(310),存储器(1130)和多个核心(332; 1101)的设备。 器件编程器(310)用设置在管芯(330)上的多个芯(332; 1101)的压缩配置数据来编程半导体熔丝阵列(336)。 存储器(1130)具有多个子存储器(1131; 1132; 1133; 1134),每个子存储器对应于多个核心(1101)中的每一个,多个核心(1101)中的一个被配置为访问 在上电/复位时,半导体熔丝阵列(336)读取和解压缩配置数据,并且存储多个解压缩的配置数据集,用于在多个核心(1101)内的每一个内部的一个或多个高速缓冲存储器(1102) 在多个子商店中(1131; 1132; 1133; 1134)。 多个核心各具有休眠逻辑(1106),其被配置为随后访问多个子存储(1131; 1132; 1133; 1134)中的每一个子对象的对应的一个,以检索和使用解压缩的配置数据集来初始化 在电源门控事件之后的一个或多个高速缓存(1102)。
    • 5. 发明申请
    • ANTI-FUSE MEMORY CELL
    • 防静电记忆体细胞
    • WO2015149182A1
    • 2015-10-08
    • PCT/CA2015/050266
    • 2015-04-02
    • SIDENSE CORPORATION
    • KURJANOWICZ, Wlodek
    • H01L21/02G11C17/16H01L21/316H01L21/8247H01L27/115
    • G11C17/16H01L21/823462H01L23/5252H01L27/11206
    • An anti-fuse memory cell having a variable thickness gate oxide. The variable thickness gate oxide is formed by depositing a first oxide over a channel region of the anti-fuse memory cell, removing the first oxide in a thin oxide area of the channel region, and then thermally growing a second oxide in the thin oxide area. The remaining first oxide defines a thick oxide area of the channel region. The second oxide growth occurs under the remaining first oxide, but at a rate less than thermal oxide growth in the thin oxide area. This results in a combined thickness of the first oxide and the second oxide in the thick oxide area being greater than second oxide in the thin oxide area.
    • 具有可变厚度栅极氧化物的反熔丝存储单元。 可变厚度栅极氧化物是通过在抗熔丝存储单元的沟道区域上沉积第一氧化物,去除沟道区域的薄氧化物区域中的第一氧化物,然后在薄氧化物区域中热生长第二氧化物 。 剩余的第一氧化物限定沟道区的厚氧化物区域。 第二氧化物生长发生在剩余的第一氧化物之下,但是以低于薄氧化物区域中的氧化物生长的速率发生。 这导致厚氧化物区域中的第一氧化物和第二氧化物的组合厚度大于薄氧化物区域中的第二氧化物。
    • 10. 发明申请
    • REWRITABLE MEMORY DEVICE WITH MULTI-LEVEL, WRITE-ONCE MEMORY CELLS
    • 具有多级一体化存储器单元的可恢复存储器件
    • WO2011078917A1
    • 2011-06-30
    • PCT/US2010/055547
    • 2010-11-05
    • SANDISK CORPORATIONSCHEUERLEIN, Roy, E.FASOLI, Luca
    • SCHEUERLEIN, Roy, E.FASOLI, Luca
    • G11C11/56G11C16/34G11C17/16
    • G11C11/5692G11C16/349G11C17/16G11C2211/5641G11C2211/5646
    • The embodiments described herein are directed to a memory device with multi level, write-once memory cells. In one embodiment, a memory device has a memory array comprising a plurality of multi-level write-once memory cells, wherein each memory cell is programmable to one of a plurality of resistivity levels. The memory device also contains circuitry configured to select a group of memory cells from the memory array, and read a set of flag bits associated with the group of memory cells. The set of flag bits indicate a number of times the group of memory cells has been written to. The circuitry is also configured to select a threshold read level appropriate for the number of times the group of memory cells has been written to, and for each memory cell in the group, read the memory cell as an unprogrammed single-bit memory cell or as a programmed single-bit memory cell based on the selected threshold read level.
    • 这里描述的实施例涉及具有多级,一次写入存储器单元的存储器件。 在一个实施例中,存储器装置具有包括多个多级一次写入存储器单元的存储器阵列,其中每个存储器单元可编程为多个电阻率水平中的一个。 存储器件还包含被配置为从存储器阵列中选择一组存储器单元的电路,并且读取与该组存储器单元相关联的一组标志位。 该组标志位指示存储器单元组被写入的次数。 电路还被配置为选择适合于已经写入存储器单元组的次数的阈值读取电平,并且对于组中的每个存储器单元,读取作为未编程的单位存储器单元的存储器单元或者作为 基于所选择的阈值读取电平的编程的单位存储器单元。