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1. 发明申请

WO2009048255A2 METHOD FOR WAFER TEST AND PROBE CARD FOR THE SAME 审中-公开
标题翻译：用于其测试和探针卡的方法
公开(公告)号：WO2009048255A2
公开(公告)日：2009-04-16
申请号：PCT/KR2008/005900
申请日：2008-10-08
申请人： AMST CO., LTD. , CHUNG, In Buhm , SONG, Byung Chang , KIM, Dong Il
发明人： CHUNG, In Buhm , SONG, Byung Chang , KIM, Dong Il
IPC分类号： H01L21/66
CPC分类号： G01R31/2887 , G01R1/0491
摘要： A method of testing a wafer capable of minimizing the asymmetrical thermal deformation of a probe card when a wafer is tested using a probe card and of minimizing the number of times of tests to effectively test a large area wafer and a probe card for the same is presented. For the wafer test method for testing semiconductor chips on a wafer using a probe card, the method includes creating virtual repeating units corresponding to N semiconductor chips, wherein the N is natural number larger than or equal to 2, arranging the plurality of repeating units on the wafer and moving the probe card or the wafer N times and testing the semiconductor chips on a wafer, wherein the semiconductor chips in the repeating units are sequentially tested one by one per each touchdown. Also, the probe cards to realize above mentioned method have been described.
摘要翻译：当使用探针卡测试晶片并且最小化有效测试大面积晶片和探针卡的测试次数的最小化时，测试能够最小化探针卡的不对称热变形的晶片的方法是呈现。对于使用探针卡对晶片上的半导体芯片进行测试的晶片测试方法，该方法包括创建对应于N个半导体芯片的虚拟重复单元，其中N是大于或等于2的自然数，将多个重复单元设置在晶片并移动探针卡或晶片N次并测试晶片上的半导体芯片，其中重复单元中的半导体芯片每次触地一个接一个地依次测试。另外，已经描述了用于实现上述方法的探针卡。

2. 发明申请

WO2011004956A1 PROBE CARD 审中-公开
标题翻译：探针卡
公开(公告)号：WO2011004956A1
公开(公告)日：2011-01-13
申请号：PCT/KR2010/002540
申请日：2010-04-22
申请人： AMST CO., LTD. , SHIM, yun hee , YOON, sung hee , YOO, seung ho , SONG, byung chang , CHUNG, in buhm , KIM, dong il
发明人： SHIM, yun hee , YOON, sung hee , YOO, seung ho , SONG, byung chang , CHUNG, in buhm , KIM, dong il
IPC分类号： H01L21/66
CPC分类号： G01R31/2889 , G01R1/06727 , G01R1/07342
摘要： Provided is a probe card which has a space transformer which may be effectively changed to correspond to a change in wafer chip structure and is capable of maximizing acceptable channels of the space transformer. The probe card for testing a semiconductor chip on a wafer includes: a space transformer body in which a plurality of unit probe modules are arranged at intervals; a main circuit board to which an electrical signal is applied from an external test device; a reinforcement plate for supporting the main circuit board such that the unit probe modules become stable against an external effect; a standing conductive medium which is inserted into a penetration portion provided in the space transformer body; a lower surface circuit board in which the standing conductive medium is electrically connected to the unit probe module as a flexible conductive medium and the standing conductive media are mounted; and a mutual connection member for electrically connecting the lower surface circuit board to the main circuit board.
摘要翻译：提供了一种具有可以有效地改变以对应于晶片芯片结构的变化并且能够使空间变压器的可接受的通道最大化的空间变压器的探针卡。用于测试晶片上的半导体芯片的探针卡包括：空间变换器主体，多个单元探针模块间隔排列; 主电路板，从外部测试装置向其施加电信号; 用于支撑主电路板的加强板，使得单元探针模块抵抗外部效应变得稳定; 插入到设置在所述空间变换器主体中的贯通部的立体导电介质; 其中，所述立体导电介质与所述单元探针模块电连接为柔性导电介质并且所述直立导电介质安装在其中; 以及用于将下表面电路板电连接到主电路板的相互连接构件。

3. 发明申请

WO2001036986A1 PROBE CARD 审中-公开
标题翻译：探针卡
公开(公告)号：WO2001036986A1
公开(公告)日：2001-05-25
申请号：PCT/KR2000000086
申请日：2000-02-03
申请人： HO SAN ELECTRONICS CO., LTD. , KIM, Soo, Hak , KIM, Dong, Il , AHN, Young, Kyun , CHUNG, Sam, Won , SONG, Byung, Chang , JEONG, Ha, Poong
发明人： HO SAN ELECTRONICS CO., LTD.
IPC分类号： G01R1/073
CPC分类号： G01R31/2886 , G01R1/07342 , G01R3/00
摘要： This invention relates to a probe card manufactured by the steps of: attaching an insulator board, which is made of a silicone glass material and has a plurality of fine probes formed through an etching process, to a circuit board; bonding the fine probes to the circuit board with wires to connect circuitally; and circuitally connecting the circuit board to a main circuit board using a pad in which metal threads are implanted finely, thereby improving productivity of the probe card having the fine probes. The insulator board having the fine probes touching a circuit element which is the subject of measurement, the circuit board to which the insulator board is attached and which has a plurality of terminals connected to the probes with the wires in the one-to-one correspondence, the main circuit board connected to an exploring equipment which transfers measurement signal to the circuit element, and the pad placed between the circuit board and the main circuit board are made of insulating material. The numerous metal threads, which are implanted and projected from the lower surface of the circuit board and the upper surface of the main circuit board, connect the circuit boards circuitally.
摘要翻译：本发明涉及一种探针卡，其通过以下步骤制造：将由硅玻璃材料制成并具有多个通过蚀刻工艺形成的精细探针的绝缘体板连接到电路板; 用细线将精细探头连接到电路板上，以电路连接; 并且使用其中精细地注入金属线的焊盘将电路板电路连接到主电路板，从而提高具有精细探针的探针卡的生产率。绝缘体板具有接触作为测量对象的电路元件的精细探针，与绝缘体板相连接的电路板，并且具有多个端子，该多个端子以一对一对应的方式与导线连接到探针连接到将测量信号传送到电路元件的探测设备的主电路板，并且放置在电路板和主电路板之间的焊盘由绝缘材料制成。从电路板的下表面和主电路板的上表面植入和突出的多个金属线路电路连接电路板。

4. 发明申请

WO2009048255A3 METHOD FOR WAFER TEST AND PROBE CARD FOR THE SAME 审中-公开
标题翻译：用于晶片测试和探针卡的方法
公开(公告)号：WO2009048255A3
公开(公告)日：2009-05-28
申请号：PCT/KR2008005900
申请日：2008-10-08
申请人： AMST CO LTD , CHUNG IN BUHM , SONG BYUNG CHANG , KIM DONG IL
发明人： CHUNG IN BUHM , SONG BYUNG CHANG , KIM DONG IL
IPC分类号： H01L21/66
CPC分类号： G01R31/2887 , G01R1/0491
摘要： A method of testing a wafer capable of minimizing the asymmetrical thermal deformation of a probe card when a wafer is tested using a probe card and of minimizing the number of times of tests to effectively test a large area wafer and a probe card for the same is presented. For the wafer test method for testing semiconductor chips on a wafer using a probe card, the method includes creating virtual repeating units corresponding to N semiconductor chips, wherein the N is natural number larger than or equal to 2, arranging the plurality of repeating units on the wafer and moving the probe card or the wafer N times and testing the semiconductor chips on a wafer, wherein the semiconductor chips in the repeating units are sequentially tested one by one per each touchdown. Also, the probe cards to realize above mentioned method have been described.
摘要翻译：一种测试晶片的方法，当使用探针卡测试晶片时，能够最小化探针卡的非对称热变形，并且最小化有效地测试大面积晶片和探针卡的测试次数的方法是呈现。对于使用探针卡在晶片上测试半导体芯片的晶片测试方法，该方法包括创建对应于N个半导体芯片的虚拟重复单元，其中N是大于或等于2的自然数，将多个重复单元布置在晶片并将探针卡或晶片移动N次，并测试晶片上的半导体芯片，其中重复单元中的半导体芯片按照每次着地顺序依次测试。而且，已经描述了实现上述方法的探针卡。

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