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1. 发明申请

WO2009075411A1 METHOD FOR ARRANGING A PLURALITY OF CONNECTING ELEMENTS 审中-公开
标题翻译：连接多元连接元件的方法
公开(公告)号：WO2009075411A1
公开(公告)日：2009-06-18
申请号：PCT/KR2008/001483
申请日：2008-03-17
申请人： PHICOM CORPORATION , LEE, Oug Ki
发明人： LEE, Oug Ki
IPC分类号： H01L21/60
CPC分类号： G01R1/06727 , G01R1/07342 , Y10T29/49147 , Y10T29/49204 , Y10T29/49208 , Y10T29/49222 , Y10T29/49224
摘要： The present invention relates to a method for arranging a plurality of connecting elements corresponding to a plurality of electronic components which is required to be subject to an electric test for inspecting a fault. The method for arranging a plurality of connecting elements on electronic substrates such that the connecting elements may simultaneously contact with a plurality of electronic components comprises the steps of fabricating each connecting element to have the first extending region at one end extended in a certain direction with a regular width and the second extending region at the other end extended in a certain direction with a regular width; and coupling the first extending region of each connecting element to a fixing post formed in a pre-determined region of the electronic substrate in order to be parallel with the second extending region of each connecting element, wherein each of the second extending region extends at the same length.
摘要翻译：本发明涉及一种用于布置多个连接元件的方法，所述多个连接元件对应于需要进行用于检查故障的电气测试的多个电子部件。用于在电子基板上布置多个连接元件以使得连接元件可以同时接触多个电子部件的方法包括以下步骤：制造每个连接元件，以使其一端的第一延伸区域在一定方向上延伸，另一端的规则宽度和第二延伸区域以规则的宽度在一定方向延伸; 并且将每个连接元件的第一延伸区域耦合到形成在电子基板的预定区域中的固定柱，以便与每个连接元件的第二延伸区域平行，其中第二延伸区域中的每一个在长度相同

2. 发明申请

WO2004032566A1 BONE VIBRATING SPEAKER USING THE DIAPHRAGM AND MOBILE PHONE THEREBY 审中-公开
标题翻译：使用透镜和手机的骨骼振动扬声器
公开(公告)号：WO2004032566A1
公开(公告)日：2004-04-15
申请号：PCT/KR2003/001480
申请日：2003-07-24
申请人： PHICOM CORPORATION , LEE, Oug-ki , KIM, Joo-Bae
发明人： LEE, Oug-ki , KIM, Joo-Bae
IPC分类号： H04R1/00
CPC分类号： H04M1/03 , H04R9/06 , H04R2400/03 , H04R2460/13
摘要： The present invention relates to a bone conduction speaker using a vibrating plate. The bone conduction speaker using a vibrating plate according to the present invention is characterized in that the bone conducting speaker comprises: a body having a shape of a cylinder with an upper portion and a lower portion opened; a mastoid having a lower diameter and a upper diameter, wherein the lower diameter is relatively smaller than the upper diameter; a vibrating late being inserted to a lower portion of the mastoid to close an upper opening portion of the body, wherein the vibrating plate is made of an elastic material; an auxiliary vibrating plate being inserted to a lower portion of the mastoid under the vibrating plate which is inserted to the mastoid; a vibrating coil being attached on a lower side of the auxiliary vibrating plate; a speaker plate being fixed at an inner central portion of the body having the shape of the cylinder, wherein a central hole is provided at the central portion of the speaker plate; a ring type magnet being fixed on the speaker plate; a yoke, wherein an edge portion of the yoke is fixed on the ring type magnet and a central portion of the yoke has a protrusion which protrudes in the inside direction of the central hole of the speaker plate; an acoustic vibrating plate being fixed at a lower portion of the body to close a lower plane of the body; an acoustic coil being fixed on the acoustic vibrating plate and being inserted between the ring type magnet and the yoke; and an electrical signal input unit for applying a predetermined electrical signal to at least one of the vibrating coil and acoustic coil.
摘要翻译：本发明涉及使用振动板的骨传导扬声器。使用根据本发明的振动板的骨传导扬声器的特征在于，所述骨导扬声器包括：主体，其具有开口的上部和下部的圆柱体的形状; 具有较小直径和上直径的乳突，其中所述下直径相对小于所述上直径; 振动后期插入到乳突下部以封闭主体的上部开口部分，其中振动板由弹性材料制成; 辅助振动板被插入乳突下方的乳突下部，插入到乳突中; 振动线圈安装在辅助振动板的下侧; 扬声器板固定在具有气缸形状的本体的内部中心部分，其中在扬声器板的中心部分设置有中心孔; 环形磁体固定在扬声器板上; 磁轭，其中磁轭的边缘部分固定在环形磁体上，磁轭的中心部分具有在扬声器板的中心孔的内部方向上突出的突起; 声学振动板固定在本体的下部以闭合主体的下平面; 声学线圈固定在声振动板上并插入在环形磁体和磁轭之间; 以及电信号输入单元，用于将预定的电信号施加到振动线圈和声线圈中的至少一个。

3. 发明申请

WO2008108576A1 APPARATUS FOR INSPECTING ELECTRICAL CONDITION AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：检查电气条件的装置及其制造方法
公开(公告)号：WO2008108576A1
公开(公告)日：2008-09-12
申请号：PCT/KR2008/001232
申请日：2008-03-04
申请人： PHICOM CORPORATION , LEE, Oug-Ki
发明人： LEE, Oug-Ki
IPC分类号： G01R1/067
CPC分类号： G01R1/07314 , G01R1/0416 , G01R3/00 , G01R31/2889
摘要： In an apparatus for inspecting electrical condition and a method of manufacturing the apparatus, a first substrate has a first surface on which a probe tip is disposed to make contact with an object to be inspected and a second surface on which a pad is disposed to receive electrical signals from the object via the probe tip. A second substrate is disposed opposite to the first substrate to receive the electrical signals from the pad. A connecting section is disposed in a vertical direction between the first substrate and the second substrate to electrically connect the first substrate with the second substrate. Further, the connecting section is configured to make surface contact with the pad.
摘要翻译：在用于检查电气条件的装置和制造该装置的方法中，第一基板具有第一表面，探针尖端设置在该第一表面上以与要检查的物体接触，并且第二表面设置有垫，以接收来自物体的电信号经由探针尖端。第二衬底与第一衬底相对设置以从衬垫接收电信号。连接部在第一基板和第二基板之间沿垂直方向设置，以将第一基板与第二基板电连接。此外，连接部被配置为与衬垫表面接触。

4. 发明申请

WO2006080621A1 MANUFACTURE METHOD OF VERTICAL-TYPE ELECTRIC CONTACTOR AND VERTICAL-TYPE ELECTRIC CONTACTOR THEREOF 审中-公开
标题翻译：立式电动接触器及垂直式电动接触器的制造方法
公开(公告)号：WO2006080621A1
公开(公告)日：2006-08-03
申请号：PCT/KR2005/003114
申请日：2005-09-20
申请人： PHICOM CORPORATION , LEE, Oug-Ki
发明人： LEE, Oug-Ki
IPC分类号： H01L21/66
CPC分类号： G01R3/00 , G01R1/06727 , G01R1/07342
摘要： A method for fabricating a vertical-type electric contactor includes forming a first passivation pattern on a sacrificial substrate for forming at least one tip; performing an etch process, using the first passivation pattern as an etch mask, to form a trench in the sacrificial substrate; removing the first passivation pattern and forming a second passivation pattern to offer a space for forming a support beam, wherein the tip is merged with one end of the support beam; filling the trench and the space with a conductive material to form a tip and a support beam; forming a third passivation pattern on a sacrificial substrate including the tip and the support beam to offer a space for forming a hollow body; filling the space offered by the third passivation pattern with a conductive material to form a hollow body; bonding the hollow body with a bump formed on a micro-probe head (MPH); and removing the sacrificial substrate to open a tip of an electric contactor.
摘要翻译：一种用于制造垂直型电接触器的方法，包括在牺牲衬底上形成第一钝化图案以形成至少一个尖端; 执行蚀刻工艺，使用第一钝化图案作为蚀刻掩模，以在牺牲衬底中形成沟槽; 去除所述第一钝化图案并形成第二钝化图案以提供用于形成支撑梁的空间，其中所述尖端与所述支撑梁的一端汇合; 用导电材料填充沟槽和空间以形成尖端和支撑梁; 在包括尖端和支撑梁的牺牲基板上形成第三钝化图案以提供用于形成中空体的空间; 用导电材料填充由第三钝化图案提供的空间以形成中空体; 用形成在微探头（MPH）上的凸块粘合中空体; 以及去除所述牺牲基板以打开电接触器的尖端。

5. 发明申请

WO2003067650A1 METHOD FOR MANUFACTURING ELECTRIC CONTACT ELEMENT FOR TESTING ELECTRO DEVICE AND ELECTRIC CONTACT ELEMENT THEREBY 审中-公开
标题翻译：制造用于测试电子设备和电接触元件的电接触元件的方法
公开(公告)号：WO2003067650A1
公开(公告)日：2003-08-14
申请号：PCT/KR2002/002073
申请日：2002-11-08
申请人： PHICOM CORPORATION , Lee, Oug-Ki
发明人： Lee, Oug-Ki
IPC分类号： H01L21/66
CPC分类号： G01R3/00 , G01R1/06727 , G01R1/06733 , G01R1/07342 , H05K3/4092
摘要： Disclosed is a method for manufacturing an electrical contact element used to test an electronic device, and an electrical contact element manufactured with forming the electrical contact element having the tip portion and the beam portion. The method comprises the step of conducting one or more times, after defining the trench, anisotropic etching in the trench in such a way as to increase a depth of the trench and round an inner surface of the trench. The electrical contact element comprises a beam portion having a multi-stepped configuration which comprises a three, bar-shaped part with having a width greater than the upper part. Each parts are connected at the other end thereof with an electronic component, through a bump; and a tip portion formed integrally with a free end of the first part of the beam portion.
摘要翻译：公开了一种用于制造用于测试电子设备的电接触元件的方法，以及形成具有尖端部分和梁部分的电接触元件的电接触元件。该方法包括在限定沟槽之后进行一次或多次，在沟槽中进行各向异性蚀刻的步骤，以增加沟槽的深度并且绕沟槽的内表面。电接触元件包括具有多级构造的梁部分，其包括具有大于上部部分的宽度的三个棒状部分。每个部件的另一端通过凸块与电子部件连接; 以及与梁部分的第一部分的自由端一体形成的尖端部分。

6. 发明申请

WO2007015600A1 VERTICAL PROBE AND METHODS OF FABRICATING AND BONDING THE SAME 审中-公开
标题翻译：垂直探针及其制作方法
公开(公告)号：WO2007015600A1
公开(公告)日：2007-02-08
申请号：PCT/KR2006/002830
申请日：2006-07-19
申请人： PHICOM CORPORATION , LEE, Oug-Ki
发明人： LEE, Oug-Ki
IPC分类号： G01R1/067
CPC分类号： G01R1/06733 , G01R1/06744 , G01R3/00
摘要： Disclosed is a vertical probe and methods of fabricating and bonding the same. The probe is comprised of a contactor equipped with two tips, a connector electrically linking with a measuring terminal of a measurement system, and a bump connecting the contactor to the connector and buffing physical stress to the contactor.
摘要翻译：公开了一种垂直探针及其制造和粘合方法。该探针由配备有两个尖端的接触器，与测量系统的测量端子电连接的连接器以及将接触器连接到连接器并将接触器的物理应力抛光的凸块组成。

7. 发明申请

WO2004030080A1 A HOLLOW MICROPROBE USING A MEMS TECHNIQUE AND A METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：使用MEMS技术的中空麦克风及其制造方法
公开(公告)号：WO2004030080A1
公开(公告)日：2004-04-08
申请号：PCT/KR2003/001414
申请日：2003-07-16
申请人： PHICOM CORPORATION , LEE, Oug-ki
发明人： LEE, Oug-ki
IPC分类号： H01L21/66
CPC分类号： G01R1/06733 , G01R3/00 , Y10T29/49117
摘要： The present invention relates to a hollow microprobe using an MEMS technique and a method of manufacturing the same. A method of manufacturing a hollow microprobe using an MEMS technique according to the present invention comprises: a step of forming a protection film pattern on a substrate; a step of forming a through hole on the substrate using the protection film pattern as a mask; a step of forming a seed layer on the upper portion of the protection film pattern of the substrate provided with the through hole and an inside wall of the through hole; a step of removing the seed layer of the upper portion of the substrate and the protection film to remain the seed layer only in the inside surface of the though hole, a step of forming a buried conductor within the through of the substrate by an electroplating method; a step of planarizing the top surface of the substrate provided with the buried conductor; a step of forming a base conductive film on the substrate which its top surface is planarized; a step of forming a first tip supporter on the substrate provided with the base conductive film and having a oblique surface sloping down; a step of rounding the top surface of the first tip supporter; a step of forming a second tip supporter; a step of forming a second tip supporter on the outside surface of the first tip supporter to open the top surface of the first tip supporter; a step of forming a conductive material tip on the outside surface of the second tip supporter; and a step of removing the top surface of the opened first tip supporter with a predetermined depth.
摘要翻译：本发明涉及使用MEMS技术的中空微探针及其制造方法。使用根据本发明的MEMS技术制造中空微探针的方法包括：在衬底上形成保护膜图案的步骤; 使用保护膜图案作为掩模在基板上形成通孔的步骤; 在设置有通孔的基板和通孔的内壁的保护膜图案的上部上形成种子层的步骤; 除去基板的上部的种子层和保护膜的步骤仅在通孔的内表面中保留种子层，通过电镀法在基板的通孔内形成掩埋导体的步骤 ; 平面化设置有掩埋导体的衬底的顶表面的步骤; 在基板上形成基底导电膜的步骤，其顶面被平坦化; 在设置有基底导电膜的基板上形成第一末端支撑体并具有向下倾斜的倾斜面的步骤; 使所述第一尖端支撑件的顶面倒圆的步骤; 形成第二尖端支撑件的步骤; 在第一末端支撑体的外表面上形成第二末端支撑件以打开第一末端支撑件的顶表面的步骤; 在第二末端支撑体的外表面上形成导电材料尖端的步骤; 以及以预定深度去除所述打开的第一末端支撑件的顶表面的步骤。

8. 发明申请

WO2006101327A1 PROBE CARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：探针卡及其制造方法
公开(公告)号：WO2006101327A1
公开(公告)日：2006-09-28
申请号：PCT/KR2006/001008
申请日：2006-03-20
申请人： PHICOM CORPORATION , LEE, Oug-Ki
发明人： LEE, Oug-Ki
IPC分类号： H01L21/66
CPC分类号： G01R1/07342 , G01R3/00 , Y10T29/49117
摘要： A probe card includes a first micro probe head (MPH), a second MPH, and needles. The first MPH includes first conductive traces into which a test signal for testing an object having outer terminals is inputted. The second MPH includes second conductive traces electrically connected to the first conductive traces, respectively, and arranged corresponding to the outer terminals. The second MPH is detachably combined with the first MPH. The needles are electrically connected to the second conductive traces, respectively, to make contact with the outer terminals, respectively. Thus, only the second MPH may be replaced with a new one in accordance with alterations to the object so that time and costs for manufacturing the probe card may be reduced.
摘要翻译：探针卡包括第一微探头（MPH），第二MPH和针。第一MPH包括输入用于测试具有外部端子的物体的测试信号的第一导电迹线。第二MPH包括分别电连接到第一导电迹线并且对应于外部端子布置的第二导电迹线。第二MPH与第一MPH可拆卸地组合。针分别电连接到第二导电迹线以分别与外部端子接触。因此，根据对象的改变，仅可以用新的MPH替换第二MPH，从而可以减少制造探针卡的时间和成本。

9. 发明申请

WO2004084296A1 PROBE POSITIONING AND BONDING DEVICE AND PROBE BONDING METHOD 审中-公开
标题翻译：探针定位与接合装置及探头连接方法
公开(公告)号：WO2004084296A1
公开(公告)日：2004-09-30
申请号：PCT/KR2004/000560
申请日：2004-03-16
申请人： PHICOM CORPORATION , LEE, Oug-Ki , LEE, Jung-Hoon
发明人： LEE, Oug-Ki , LEE, Jung-Hoon
IPC分类号： H01L21/66
CPC分类号： G01R3/00 , B23K26/0861 , G01R1/06711 , G01R1/07342 , G01R31/2887
摘要： Disclosed herein are a probe positioning and bonding device and a probe bonding method, and more particularly a probe positioning and bonding device used to fix probes to prescribed positions on a substrate so that a probe card used for semiconductor integrated circuit testing equipment is manufactured, and a probe bonding method using the same. The probe positioning and bonding device comprises a stage unit disposed on a working table, a microscope disposed above the stage unit while being supported by means of a first supporting member disposed on the working table, a probe fixing unit disposed above the stage unit and below the microscope while being supported by means of a second supporting member disposed on the working table, and a light source unit supported by means of a third supporting member disposed on the working table. The light source unit is disposed toward the upper part of the stage unit.
摘要翻译：这里公开了探针定位和接合装置和探针接合方法，更具体地，涉及用于将探针固定到基板上的规定位置的探针定位和接合装置，从而制造用于半导体集成电路检测设备的探针卡，以及使用其的探针接合方法。探针定位和接合装置包括设置在工作台上的台单元，设置在平台单元上方的显微镜，同时由设置在工作台上的第一支撑构件支撑;探针固定单元，设置在平台单元上方和下方显微镜同时由设置在工作台上的第二支撑构件支撑，以及由设置在工作台上的第三支撑构件支撑的光源单元。光源单元朝向台单元的上部设置。

10. 发明申请

WO2004084295A1 PROBE AND METHOD OF MAKING SAME 审中-公开
标题翻译：探索和制作方法
公开(公告)号：WO2004084295A1
公开(公告)日：2004-09-30
申请号：PCT/KR2004/000559
申请日：2004-03-16
申请人： PHICOM CORPORATION , LEE, Oug-Ki , LEE, Jung-Hoon
发明人： LEE, Oug-Ki , LEE, Jung-Hoon
IPC分类号： H01L21/66
CPC分类号： G01R1/06744 , G01R1/06711 , G01R1/07307 , G01R1/07342 , G01R3/00
摘要： Disclosed herein are a probe and a method of making the same, and more particularly to a probe having a minute pitch, with which a probe card corresponding to arrangement of pads formed with a massed shape or other various shapes on a wafer is made, and a method of making the same. The probe having a prescribed thickness and formed in the shape of a flat plate. The probe comprises a body part bent at the middle thereof so that the body part is elastically tensioned or compressed when a tension force or a compression force is applied to the body part at the upper and lower ends thereof, a connection part integrally formed with the lower end of the body part, the connection part being fixed to a substrate, and a tip part integrally formed with the upper end of the body part, the tip part contacting a pad of an element.
摘要翻译：本文公开了一种探针及其制造方法，更具体地说，涉及一种具有微小间距的探针，其中形成了与晶片上形成有组合形状或其它各种形状的焊盘排列相对应的探针卡，以及制作相同的方法。探针具有规定的厚度并形成为平板状。探头包括在其中间弯曲的主体部分，使得当在其上端和下端处对主体部分施加张力或压缩力时，主体部分被弹性张紧或压缩，与主体部分的上端和下端一体形成的连接部分主体部分的下端，连接部分固定到基底，以及与主体部分的上端一体形成的尖端部分，尖端部分接触元件的垫。

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