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1. 发明申请

WO2007075998A3 THREE DIMENSIONAL MICROSTRUCTURES AND METHODS FOR MAKING THREE DIMENSIONAL MICROSTRUCTURES 审中-公开
标题翻译：三维微结构的三维微结构和方法制作三维微结构
公开(公告)号：WO2007075998A3
公开(公告)日：2008-05-02
申请号：PCT/US2006048989
申请日：2006-12-19
申请人： FORMFACTOR INC , MATHIEU GAETAN L , FANG TRELIANT , HOBBS ERIC D
发明人： MATHIEU GAETAN L , FANG TRELIANT , HOBBS ERIC D
IPC分类号： H01L21/20
CPC分类号： B81C1/0046 , B33Y10/00 , B81B2201/014 , B81B2203/0118 , B81C2201/0184 , B81C2201/0197 , C23C18/1608 , C23C18/1844 , C25D1/003 , C25D1/12 , C25D5/02 , G01R1/06755 , G01R3/00 , H01L21/288 , H01L21/76873 , H01L2924/0001 , H01L2924/0002 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01055 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/1461 , H05K3/1275 , H01L2224/13099 , H01L2924/00
摘要： Systems and methods for depositing a plurality of droplets in a three-dimensional array are disclosed. The array can comprise a first type of droplets disposed to form a support structure and a second type of droplets forming a conductive seed layer on the support structure. A structure material can be electrodeposited onto the seed layer to create a three-dimensional structure.
摘要翻译：公开了用于在三维阵列中沉积多个液滴的系统和方法。阵列可以包括设置成形成支撑结构的第一类型的液滴和在支撑结构上形成导电种子层的第二类型的液滴。可以将结构材料电沉积到种子层上以产生三维结构。

2. 发明申请

WO2008118677A3 STIFFENING CONNECTOR AND PROBE CARD ASSEMBLY INCORPORATING SAME 审中-公开
标题翻译：加固连接器和探头卡组合
公开(公告)号：WO2008118677A3
公开(公告)日：2009-12-30
申请号：PCT/US2008057284
申请日：2008-03-17
申请人： FORMFACTOR INC , HOBBS ERIC D , MATHIEU GAETAN L
发明人： HOBBS ERIC D , MATHIEU GAETAN L
IPC分类号： G01R1/06
CPC分类号： G01R31/2889 , G01R1/07342
摘要： A stiffening connector assembly and methods of use are provided herein. In some embodiments a stiffening connector assembly includes a connector configured to be coupled to a substrate; and a mechanism coupled to the connector and configured to restrict rotational movement of the connector with respect to the substrate when coupled thereto. The mechanism may further provide a lateral degree of freedom of movement in a direction substantially parallel to the substrate.
摘要翻译：本文提供了加强连接器组件和使用方法。在一些实施例中，加强连接器组件包括被配置为联接到基板的连接器; 以及耦合到所述连接器并且被配置为当连接到所述连接器时相对于所述基板限制所述连接器的旋转运动的机构。该机构还可以在基本上平行于基底的方向上提供横向移动自由度。

3. 发明申请

WO2006113708A3 APPARATUS AND METHOD FOR MANAGING THERMALLY INDUCED MOTION OF A PROBE CARD ASSEMBLY 审中-公开
标题翻译：用于管理探针卡组件的热诱导运动的装置和方法
公开(公告)号：WO2006113708A3
公开(公告)日：2009-05-07
申请号：PCT/US2006014554
申请日：2006-04-18
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , GRUBE GARY W , HOBBS ERIC D , MATHIEU GAETAN L , SHINDE MAKARAND S , SPORCK A NICHOLAS , WATSON THOMAS N , SLOCUM ALEXANDER N
发明人： ELDRIDGE BENJAMIN N , GRUBE GARY W , HOBBS ERIC D , MATHIEU GAETAN L , SHINDE MAKARAND S , SPORCK A NICHOLAS , WATSON THOMAS N , SLOCUM ALEXANDER N
IPC分类号： G01R31/02
CPC分类号： G01R31/2874 , G01R31/2863 , G01R31/2889 , Y10T29/5313
摘要： A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.
摘要翻译：探针卡组件可以包括具有用于接触要测试的电子设备的探针的探针头组件。探针头组件可以电连接到布线基板并且机械地附接到加强板。布线基板可以提供到测试装置的电连接，并且加强板可以提供用于将探针卡组件附接到测试装置的结构。加强板可以具有比布线基板更大的机械强度，并且可以比布线基板更不易受热引起的移动。布线基板可以在布线基板的中心位置处附接到加强板。可以在将布线基板附接到加强板的其他位置处设置空间，使得布线基板能够相对于加强板膨胀和收缩。

4. 发明申请

WO2007002249A3 METHOD AND APPARATUS FOR ADJUSTING A MULTI-SUBSTRATE PROBE STRUCTURE 审中-公开
标题翻译：用于调节多基片探测器结构的方法和设备
公开(公告)号：WO2007002249A3
公开(公告)日：2007-11-22
申请号：PCT/US2006024238
申请日：2006-06-21
申请人： FORMFACTOR INC , HOBBS ERIC D , ELDRIDGE BENJAMIN N , MA LUNYU , MATHIEU GAETAN L , MURPHY STEVEN T , SHINDE MAKARAND S , SLOCUM ALEXANDER H
发明人： HOBBS ERIC D , ELDRIDGE BENJAMIN N , MA LUNYU , MATHIEU GAETAN L , MURPHY STEVEN T , SHINDE MAKARAND S , SLOCUM ALEXANDER H
IPC分类号： G01R31/02
CPC分类号： G01R31/2886 , G01R1/073 , G01R31/31905 , Y10T29/49128 , Y10T29/4913 , Y10T29/49133 , Y10T29/49147 , Y10T29/49208 , Y10T29/49222
摘要： A probe card assembly comprises multiple probe substrates attached to a mounting assembly. Each probe substrate includes a set of probes, and together, the sets of probes on each probe substrate compose an array of probes for contacting a device to be tested. Adjustment mechanisms are configured to impart forces to each probe substrate to move individually each substrate with respect to the mounting assembly. The adjustment mechanisms may translate each probe substrate in an "x," "y," and/or "z" direction and may further rotate each probe substrate about any one or more of the forgoing directions. The adjustment mechanisms may further change a shape of one or more of the probe substrates. The probes can thus be aligned and/or planarized with respect to contacts on the device to be tested.
摘要翻译：探针卡组件包括连接到安装组件的多个探针基底。每个探针基底包括一组探针，并且一起，每个探针基底上的探针组构成用于接触待测试装置的探针阵列。调节机构被配置为向每个探针基底施加力以相对于安装组件单独地移动每个基底。调整机构可以沿“x”，“y”和/或“z”方向平移每个探针基板，并且可以围绕任何一个或多个前述方向进一步旋转每个探针基板。调整机构可以进一步改变一个或多个探针基板的形状。因此探针可以相对于待测试设备上的触点对齐和/或平坦化。

5. 发明申请

WO2007065012A3 APPARATUS AND METHOD FOR ADJUSTING AN ORIENTATION OF PROBES 审中-公开
标题翻译：调整探头方向的装置和方法
公开(公告)号：WO2007065012A3
公开(公告)日：2009-02-12
申请号：PCT/US2006046277
申请日：2006-12-04
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , HOBBS ERIC D , MATHIEU GAETAN L , SHINDE MAKARAND S , SLOCUM ALEXANDER H
发明人： ELDRIDGE BENJAMIN N , HOBBS ERIC D , MATHIEU GAETAN L , SHINDE MAKARAND S , SLOCUM ALEXANDER H
IPC分类号： G01R31/02
CPC分类号： G01R31/2891 , G01R31/31905
摘要： Probes of a probe card assembly can be adjusted with respect to an element of the probe card assembly, which can be an element of the probe card assembly that facilitates mounting of the probe card assembly to a test apparatus. The probe card assembly can then be mounted in a test apparatus, and an orientation of the probe card assembly can be adjusted with respect to the test apparatus, such as a structural part of the test apparatus or a structural element attached to the test apparatus.
摘要翻译：可以相对于探针卡组件的元件调整探针卡组件的探针，探针卡组件可以是探针卡组件的元件，其有助于将探针卡组件安装到测试装置。然后可以将探针卡组件安装在测试装置中，并且可以相对于测试装置（例如测试装置的结构部分或连接到测试装置的结构元件）来调整探针卡组件的取向。

6. 发明申请

WO2009042940A3 COMPONENT ASSEMBLY AND ALIGNMENT 审中-公开
标题翻译：部件组装和对准
公开(公告)号：WO2009042940A3
公开(公告)日：2009-05-14
申请号：PCT/US2008077984
申请日：2008-09-26
申请人： FORMFACTOR INC , ELDRIDGE BENJAMIN N , HOBBS ERIC D , MATHIEU GAETAN L
发明人： ELDRIDGE BENJAMIN N , HOBBS ERIC D , MATHIEU GAETAN L
IPC分类号： H01L21/66 , H01L21/68
CPC分类号： G01R31/2891 , G01R1/06716 , G01R1/07342 , G11C29/56 , G11C29/56016 , G11C2029/5602 , H01L21/682 , Y10T29/49002
摘要： A method or an apparatus for aligning a plurality of structures can include applying a first force in a first plane to a first structure. The method can also include constraining in the first plane the first structure with respect to a second structure such that the first structure is in a position with respect to the second structure that aligns first features on the first structure with second features on the second structures. The second feature can be in a second plane that is generally parallel to the first plane. The first and second structures can be first and second electronic components, which can be components of a probe card assembly.
摘要翻译：用于对齐多个结构的方法或装置可以包括将第一平面中的第一力施加到第一结构。该方法还可以包括在第一平面中相对于第二结构约束第一结构，使得第一结构相对于第二结构处于使第一结构上的第一特征与第二结构上的第二特征对齐的位置。第二个特征可以在与第一平面大致平行的第二平面中。第一和第二结构可以是第一和第二电子部件，其可以是探针卡组件的部件。

7. 发明申请

WO2009105497A2 APPARATUS AND METHOD FOR ADJUSTING THERMALLY INDUCED MOVEMENT OF ELECTRO-MECHANICAL ASSEMBLIES 审中-公开
标题翻译：用于调节机电组件的热引起的运动的装置和方法
公开(公告)号：WO2009105497A2
公开(公告)日：2009-08-27
申请号：PCT/US2009034440
申请日：2009-02-19
申请人： FORMFACTOR INC , MCFARLAND ANDREW W , YASUMURA KEVIN Y , HOBBS ERIC D , BREINLINGER KEITH J
发明人： MCFARLAND ANDREW W , YASUMURA KEVIN Y , HOBBS ERIC D , BREINLINGER KEITH J
IPC分类号： H01L21/66 , G01R1/073
CPC分类号： G01R1/44 , G01R1/07307 , G01R31/2891
摘要： A thermal adjustment apparatus for adjusting one or more thermally induced movements of an electro-mechanical assembly includes: a compensating element expanding at a first rate different from a second rate at which the electro-mechanical assembly expands for generating a counteracting force in response to changes in temperature; and a coupling mechanism coupling the compensating element to the electro-mechanical assembly, and being adjustable to control an amount of the counteracting force applied to the electro-mechanical assembly as temperature changes.
摘要翻译：一种用于调节机电组件的一个或多个热感应运动的热调节装置包括：补偿元件，其以不同于第二速率的第一速率膨胀，在第一速率下机电组件膨胀以响应于变化而产生反作用力温度; 以及将补偿元件联接到机电组件的联接机构，并且该联接机构可调节以随着温度改变来控制施加到机电组件的抵抗力的量。

8. 发明申请

WO2009042679A3 STIFFENER ASSEMBLY FOR USE WITH TESTING DEVICES 审中-公开
标题翻译：强化装置与测试装置一起使用
公开(公告)号：WO2009042679A3
公开(公告)日：2009-07-09
申请号：PCT/US2008077512
申请日：2008-09-24
申请人： FORMFACTOR INC , HOBBS ERIC D , MCFARLAND ANDREW W
发明人： HOBBS ERIC D , MCFARLAND ANDREW W
IPC分类号： G01R1/067 , H01L21/66 , H01R12/00
CPC分类号： G01R1/07378
摘要： A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener assembly for use with testing devices can be part of a probe card assembly that can include a stiffener assembly comprising an upper stiffener coupled to a plurality of lower stiffeners; and a substrate constrained between the upper stiffener and the plurality of lower stiffeners, the stiffener assembly restricting non-planar flex of the substrate while facilitating radial movement of the substrate with respect to the stiffener assembly.
摘要翻译：本文提供了一种与测试装置一起使用的加强装置。在一些实施例中，用于与测试装置一起使用的加强件组件可以是探针卡组件的一部分，其可以包括加强件组件，该加强件组件包括联接到多个下加强件的上加强件; 以及限制在所述上加强件和所述多个下加强件之间的衬底，所述加强件组件限制所述衬底的非平面弯曲，同时促进所述衬底相对于所述加强件组件的径向移动。

9. 发明申请

WO2008051773A3 PROBE CARD ASSEMBLY WITH A MECHANICALLY DECOUPLED WIRING SUBSTRATE 审中-公开
标题翻译：具有机械去耦线路基板的探针卡组件
公开(公告)号：WO2008051773A3
公开(公告)日：2008-10-30
申请号：PCT/US2007081706
申请日：2007-10-18
申请人： FORMFACTOR INC , HOBBS ERIC D , SLOCUM ALEXANDER H , ELDRIDGE BENJAMIN N , BREINLINGER KEITH J , POWELL SHAWN
发明人： HOBBS ERIC D , SLOCUM ALEXANDER H , ELDRIDGE BENJAMIN N , BREINLINGER KEITH J , POWELL SHAWN
IPC分类号： G01R31/02
CPC分类号： G01R31/2893
摘要： A probe card assembly can comprise a probe head assembly and a wiring substrate. The probe head assembly can comprise a plurality of probes disposed to contact an electronic device disposed on a holder in a test housing. The wiring substrate can include an electrical interface to a test controller and a plurality of electrical wiring composing electrical paths between the electrical interface and ones of the probes, and the wiring substrate can comprise a first portion on which the electrical interface is disposed and a second portion composing the probe head assembly. The second portion of the wiring substrate can be moveable with respect to the first portion of the wiring substrate.
摘要翻译：探针卡组件可以包括探针头组件和布线衬底。探针头组件可以包括多个探针，所述多个探针被设置为接触设置在测试外壳中的保持器上的电子器件。布线基板可以包括到测试控制器的电接口以及构成电接口和其中一个探头之间的电路径的多个电布线，并且布线基板可以包括布置有电接口的第一部分和布置在第一部分上的第二部分构成探头组件的部分。布线衬底的第二部分可以相对于布线衬底的第一部分移动。

10. 发明申请

WO2011082180A3 TEST SYSTEMS AND METHODS FOR TESTING ELECTRONIC DEVICES 审中-公开
标题翻译：用于测试电子设备的测试系统和方法
公开(公告)号：WO2011082180A3
公开(公告)日：2011-10-27
申请号：PCT/US2010062256
申请日：2010-12-28
申请人： FORMFACTOR INC , BERRY TOMMIE E , BREINLINGER KEITH J , HOBBS ERIC D , LORANGER MARC , SLOCUM ALEXANDER H , WILSON ADRIAN S
发明人： BERRY TOMMIE E , BREINLINGER KEITH J , HOBBS ERIC D , LORANGER MARC , SLOCUM ALEXANDER H , WILSON ADRIAN S
IPC分类号： G01R31/26 , H01L21/66
CPC分类号： G01R31/2891
摘要： Devices under test (DUTs) can be tested in a test system that includes an aligner and test cells. A DUT can be moved into and clamped in an aligned position on a carrier in the aligner. In the align position, electrically conductive terminals of the DUT can be in a predetermined position with respect to carrier alignment features of the carrier. The DUT/carrier combination can then be moved from the aligner into one of the test cells, where alignment features of the carrier are mechanically coupled with alignment features of a contactor in the test cell. The mechanical coupling automatically aligns terminals of the DUT with probes of the contactor. The probes thus contact and make electrical connections with the terminals of the DUT. The DUT is then tested. The aligner and each of the test cells can be separate and independent devices so that a DUT can be aligned in the aligner while other DUTs, having previously been aligned to a carrier in the aligner, are tested in a test cell.
摘要翻译：被测设备（DUT）可以在包括对准器和测试单元的测试系统中进行测试。 DUT可以被移动并被夹持在对准器中的载体上的对准位置。在对准位置，DUT的导电端子可以相对于载体的载体对准特征处于预定位置。然后可以将DUT /载体组合从对准器移动到测试单元之一中，其中载体的对准特征与测试单元中的接触器的对准特征机械耦合。机械联轴器将DUT的端子自动对准接触器的探头。探头因此与DUT的端子接触并进行电气连接。然后测试DUT。对准器和每个测试单元可以是分离和独立的器件，使得DUT可以在对准器中对准，而在测试单元中测试已经与对准器中的载体对准的其它DUT。

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