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1. 发明申请

WO2010147695A1 SELECTIVE DEPOSITION OF METAL ON PLASTIC SUBSTRATES 审中-公开
标题翻译：金属选择性沉积在塑料基材上
公开(公告)号：WO2010147695A1
公开(公告)日：2010-12-23
申请号：PCT/US2010/030313
申请日：2010-04-08
申请人： MACDERMID, INCORPORATED , HAMILTON, Robert , WOJTASZEK, Mark
发明人： HAMILTON, Robert , WOJTASZEK, Mark
IPC分类号： C25D5/02
CPC分类号： C23C18/1607 , C23C18/1608 , C23C18/1641 , C23C18/1653 , C23C18/166 , C23C18/2046 , C23C18/2086 , C23C18/30 , C23C18/36 , C23C18/40
摘要： The present invention relates to a method of selectively plating a plastic article comprising a first polymer resin portion and a second polymer resin portion, wherein said first polymer resin portion is not rendered plateable by sulfonation and said second polymer resin portion is rendered plateable by sulfonation. The method comprises the steps of sulfonating the plastic article, activating the sulfonated plastic article to accept plating thereon, and plating the sulfonated and activated article in an electroless plating bath. The plastic article is selectively plated such that the first polymer resin portion does not have plating thereon and the second polymer resin portion is elecrolessly plated.
摘要翻译：本发明涉及一种选择性地镀覆包含第一聚合物树脂部分和第二聚合物树脂部分的塑料制品的方法，其中所述第一聚合物树脂部分不能通过磺化而使其平版化，并且所述第二聚合物树脂部分通过磺化使其平版化。该方法包括以下步骤：将塑料制品磺化，活化磺化塑料制品以在其上接受电镀，并将磺化和活化的物品镀在化学镀浴中。选择性地对塑料制品进行电镀，使得第一聚合物树脂部分不具有电镀，并且第二聚合物树脂部分被无电镀。

2. 发明申请

WO2009000674A3 SUBSTRATE WITH A CATALYTICALLY ACTIVE SURFACE AND METHOD FOR THE PRODUCTION THEREOF 审中-公开
标题翻译：与用于催化活性表面和方法及其基底
公开(公告)号：WO2009000674A3
公开(公告)日：2009-11-26
申请号：PCT/EP2008057462
申请日：2008-06-13
申请人： SIEMENS AG , DOYE CHRISTIAN , JENSEN JENS DAHL , KRUEGER URSUS , KUNERT KATHRIN , SCHNEIDER MANUELA
发明人： DOYE CHRISTIAN , JENSEN JENS DAHL , KRUEGER URSUS , KUNERT KATHRIN , SCHNEIDER MANUELA
IPC分类号： C23C18/16 , B01J23/40 , B01J23/48 , C23C18/18 , C23C18/42 , C25D5/02 , C25D5/18
CPC分类号： C25D5/02 , B01J23/40 , B01J23/48 , B01J35/006 , B01J35/023 , B01J37/16 , B01J37/348 , C23C18/1607 , C23C18/1637 , C23C18/42 , C25D5/18
摘要： The invention relates to a substrate (11) with a catalytic surface (12), which is formed, for example, from silver. According to the invention, the surface is formed with a nobler metal in the form of islands (14) with an average diameter of less than 1 mm. By these means, islands (14) with a comparatively high catalytic activity are formed, since these islands (14) make available an active surface which is large relative to the material used. Furthermore, the subject matter of the invention is a method for the production of the substrate according to the invention.
摘要翻译：本发明涉及一种例如银构成的基板（11），其具有催化表面（12）。根据本发明，提供的是与岛（14）的形式的更贵重金属的表面以小于1微米的直径mittlem形成。这有利地产生岛（14）的相对高的催化活性，因为它们提供相对于材料的使用提供了大量的活性表面积。本发明进一步提供根据本发明的用于在衬底的制备方法。

3. 发明申请

WO2009117187A1 PROCESS FOR PREVENTING PLATING ON A PORTION OF A MOLDED PLASTIC PART 审中-公开
标题翻译：用于防止塑胶部件上的镀层的方法
公开(公告)号：WO2009117187A1
公开(公告)日：2009-09-24
申请号：PCT/US2009/033641
申请日：2009-02-10
申请人： MACDERMID, INCORPORATED , WOJTASZEK, Mark , HAMILTON, Robert
发明人： WOJTASZEK, Mark , HAMILTON, Robert
IPC分类号： C23C18/54
CPC分类号： H05K3/182 , C23C18/1607 , C23C18/1608 , C23C18/1641 , C23C18/24 , C23C18/31 , H05K1/0373 , H05K2201/09118 , H05K2203/0713 , Y10T428/31504
摘要： The present invention relates to a method of incorporating a catalytic poison into a non-plating grade resin portion of a double shot molded plastic part, to retard the tendency of any electroless plating chemistry to be deposited on that portion that contains the catalytic poison. After surface treatment, only one portion of the molded part becomes receptive to electroless plating while the other portion does not.
摘要翻译：本发明涉及一种将催化毒物掺入双注射成型塑料部件的非电镀级树脂部分中的方法，以阻止任何化学镀化学沉积在含有催化毒物的部分上的倾向。在表面处理之后，只有一部分成型部件接受化学镀，而另一部分不成型。

4. 发明申请

WO00016597A1 PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD 审中-公开
标题翻译：印刷线路板及其制造方法
公开(公告)号：WO00016597A1
公开(公告)日：2000-03-23
申请号：PCT/JP1999/005003
申请日：1999-09-14
IPC分类号： C23C18/34 , C25D5/18 , H05K3/00 , H05K3/10 , H05K3/18 , H05K3/24 , H05K3/38 , H05K3/42 , H05K3/46 , H05K1/09
CPC分类号： H05K3/4644 , C23C18/1607 , C23C18/1653 , C23C18/22 , C23C18/30 , C23C18/34 , C23C18/405 , C23C28/00 , C23C28/023 , C23C28/42 , C25D3/38 , C25D5/022 , C25D5/18 , C25D5/34 , C25D7/123 , H01L2224/16225 , H01L2924/15174 , H01L2924/15311 , H05K3/0038 , H05K3/108 , H05K3/181 , H05K3/241 , H05K3/381 , H05K3/382 , H05K3/384 , H05K3/421 , H05K3/423 , H05K3/427 , H05K3/4602 , H05K3/4652 , H05K3/4661 , H05K2201/0215 , H05K2201/0344 , H05K2201/0347 , H05K2201/09509 , H05K2201/09536 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0353 , H05K2203/0723 , H05K2203/1476 , H05K2203/1492 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A method for manufacturing a printed wiring board having a high-density wiring and a highly-reliable connection between conductor layers even if the annealing process is omitted because a conductor circuit made of an electroplating layer excellent in crystallinity and uniform electrodepositability and formed on a base sheet and a via hole are provided. The method comprising forming an interlayer resin insulating layer on a conductor wiring forming board, making an opening for making a via hole in the interlayer resin insulating layer, forming an electroless plating layer (1008) on the interlayer resin insulating layer, applying a resist film (1003) to the layer (1008), forming an electroplating film thereon, removing the resist film, and removing the electroless plating layer by etching so as to form a conductor wiring and a via hole characterized in that the electroless plating layer (1008) serves as a cathode, the plating metal serves as an anode, and electroplating is performed intermittently while maintaining the voltage between the anode and cathode at a constant value.
摘要翻译：即使退火处理被省略，因为具有高结晶度和电沉积性均匀的电镀层制成的导体电路形成在基底上，所以制造具有高密度布线和导体层之间高可靠性连接的印刷布线板的方法片和通孔。该方法包括在导体布线形成基板上形成层间树脂绝缘层，在层间树脂绝缘层上形成通孔的开口，在层间树脂绝缘层上形成化学镀层（1008），涂敷抗蚀膜（1003）到层（1008），在其上形成电镀膜，去除抗蚀剂膜，并通过蚀刻去除化学镀层以形成导体布线和通孔，其特征在于，化学镀层（1008）作为阴极，电镀金属用作阳极，并且在将阳极和阴极之间的电压维持在恒定值的同时间歇地进行电镀。

5. 发明申请

WO2013055786A1 AQUEOUS ACTIVATOR SOLUTION AND PROCESS FOR ELECTROLESS COPPER DEPOSITION ON LASER-DIRECT STRUCTURED SUBSTRATES 审中-公开
标题翻译：活性激光器解决方案和激光直接结构基板上电镀铜沉积工艺
公开(公告)号：WO2013055786A1
公开(公告)日：2013-04-18
申请号：PCT/US2012/059547
申请日：2012-10-10
申请人： ENTHONE INC
发明人： BASTENBECK, Edwin, W. , ORSCHEL, Harald , PRINZ, Ulrich
IPC分类号： C23C18/16 , C23C18/20 , H05K3/18 , C23C18/30 , C23C18/22 , C23C18/38 , C23C18/42
CPC分类号： H05K3/182 , B05D3/005 , B05D5/12 , C23C18/1607 , C23C18/1641 , C23C18/166 , C23C18/204 , C23C18/2086 , C23C18/22 , C23C18/30 , C23C18/38 , C23C18/42 , H05K3/185 , H05K2201/0236
摘要： The invention disclosed relates to an aqueous activator solution and a method for the electroless deposition of copper on a laser direct structured substrate surface. By the invention, an aqueous activator solution comprising a strong reducing agent is proposed to enhance the catalytic activity of the irradiated surface area of a LDS substrate.
摘要翻译：所公开的本发明涉及水激活剂溶液和用于在激光直接结构化的衬底表面上无电沉积铜的方法。通过本发明，提出了含有强还原剂的水活化剂溶液，以提高LDS基材的照射表面积的催化活性。

6. 发明申请

WO2012007865A3 METALLIZATION PROCESSES, MIXTURES, AND ELECTRONIC DEVICES 审中-公开
标题翻译：金属化工艺，混合物和电子器件
公开(公告)号：WO2012007865A3
公开(公告)日：2012-05-18
申请号：PCT/IB2011052907
申请日：2011-07-01
申请人： LAM RES CORP , LAM RES AG , KOLICS ARTUR , REDEKER FRITZ
发明人： KOLICS ARTUR , REDEKER FRITZ
IPC分类号： H01L21/288
CPC分类号： H05K1/09 , C23C18/1607 , C23C18/1662 , C23C18/1834 , C23C18/1844 , C23C18/31 , C23C18/40 , C23C18/50 , C23C18/52 , C25D3/12 , C25D3/20 , C25D3/22 , C25D3/30 , C25D3/38 , C25D3/46 , C25D3/48 , C25D3/50 , C25D3/54 , C25D3/562 , C25D5/02 , C25D7/123 , C25D15/00 , H01L21/288 , H01L21/2885 , H01L21/76877 , H01L21/76898 , H01L23/53209 , H01L23/53238 , H01L23/53252 , H01L23/53266 , H01L2924/0002 , H01L2924/00
摘要： One aspect of the present invention is a method of processing a substrate. In one embodiment, the method comprises forming an electrical conductor on or in the substrate by providing a mixture comprising metal particles and an electroless deposition solution and electrolessly depositing a metal matrix and co-depositing the metal particles. In another embodiment, the method comprises forming an electrical conductor on or in the substrate by providing a mixture comprising metal particles and an electrochemical plating solution and electrochemically plating a metal matrix and co-depositing the metal particles. Another aspect of the present invention is a mixture for the formation of an electrical conductor on or in a substrate. Another aspect of the present invention is an electronic device.
摘要翻译：本发明的一个方面是一种处理衬底的方法。在一个实施方案中，该方法包括通过提供包含金属颗粒和无电镀沉积溶液的混合物和无电沉积金属基质并共沉积金属颗粒在基底上或基底上形成电导体。在另一个实施方案中，该方法包括通过提供包含金属颗粒和电化学电镀溶液的混合物以及电化学镀金属基质并共沉积金属颗粒在基底上或基底上形成电导体。本发明的另一方面是用于在基底上或基底中形成电导体的混合物。本发明的另一方面是电子设备。

7. 发明申请

WO2011098428A1 METHOD FOR METALLISING OBJECTS WHICH HAVE AT LEAST TWO DIFFERENT PLASTICS ON THE SURFACE 审中-公开
标题翻译：用于在表面上进行至少两种不同塑性的物体的金属化方法
公开(公告)号：WO2011098428A1
公开(公告)日：2011-08-18
申请号：PCT/EP2011/051757
申请日：2011-02-07
申请人： ATOTECH DEUTSCHLAND GMBH , EWALD, Heinz , PEREIRA, Arnaldo
发明人： EWALD, Heinz , PEREIRA, Arnaldo
IPC分类号： C23C18/16 , C23C18/20 , C23C18/30 , C25D5/02 , C25D5/20 , C25D5/56 , H05K3/18
CPC分类号： C25D5/022 , C23C18/1607 , C23C18/1653 , C23C18/2086 , C23C18/30 , C23C18/36 , C23C18/405 , C25D5/20 , C25D5/56
摘要： The following method is proposed in order to improve selectivity during metallisation of surface areas to be metallised on objects 7 having different plastics while not allowing the areas not to be metallised to be metallised: A) etching of the objects 7 with an etching solution; B) treatment of the objects 7 with a solution of a colloid or with a metal compound, the metal being a metal of Group VIIIB or IB of the Periodic Table of the Elements; and C) electrolytic metallisation of the objects 7 with a metallisation solution. According to the present invention the objects 7 are subjected to ultrasonic treatment during the treatment in a further method step following method step B) and before method step C) in order to avoid metallisation of at least one first plastic exposed on the surface of the objects 7 while at least one second plastic exposed on the surface of the objects 7 is metallised.
摘要翻译：提出了以下方法，以便提高在具有不同塑料的物体7上进行金属化的表面区域的金属化期间的选择性，同时不允许将不被金属化的区域金属化：A）用蚀刻溶液蚀刻物体7; B）用胶体或金属化合物溶液处理物体7，金属是元素周期表第VIIIB族或IB族的金属; 和C）用金属化溶液电镀金属化物体7。根据本发明，在处理期间，在方法步骤B）和方法步骤C）之前的方法步骤中，对象7进行超声波处理，以避免暴露在物体表面上的至少一种第一塑料的金属化而在物体7的表面上暴露的至少一个第二塑料是金属化的。

8. 发明申请

WO2009000674A2 SUBSTRAT MIT EINER KATALYTISCH WIRKSAMEN OBERFLÄCHE UND VERFAHREN ZU DESSEN HERSTELLUNG 审中-公开
标题翻译：与用于催化活性表面和方法及其基底
公开(公告)号：WO2009000674A2
公开(公告)日：2008-12-31
申请号：PCT/EP2008/057462
申请日：2008-06-13
申请人： SIEMENS AKTIENGESELLSCHAFT , DOYE, Christian , JENSEN, Jens Dahl , KRÜGER, Ursus , KUNERT, Kathrin , SCHNEIDER, Manuela
发明人： DOYE, Christian , JENSEN, Jens Dahl , KRÜGER, Ursus , KUNERT, Kathrin , SCHNEIDER, Manuela
IPC分类号： C23C18/16 , C23C18/18 , C23C18/42 , C25D5/02 , C25D5/18 , B01J23/40 , B01J23/48
CPC分类号： C25D5/02 , B01J23/40 , B01J23/48 , B01J35/006 , B01J35/023 , B01J37/16 , B01J37/348 , C23C18/1607 , C23C18/1637 , C23C18/42 , C25D5/18
摘要： Die Erfindung betrifft ein Substrat (11) mit einer katalytischen Oberfläche (12), die beispielsweise aus Silber gebildet ist. Erfindungsgemäß ist vorgesehen, dass die Oberfläche mit einem edleren Metall in Form von Inseln (14) mit einem mittlem Durchmesser von weniger als 1 μm ausgebildet sind. Hierdurch entsteht vorteilhaft eine vergleichsweise hohe katalytische Wirkung der Inseln (14), da diese im Verhältnis zum Materialeinsatz eine große aktive Oberfläche zur Verfügung stellen. Gegenstand der Erfindung ist weiterhin ein Verfahren zur Herstellung des erfindungsgemäßen Substrates.
摘要翻译：本发明涉及一种例如银构成的基板（11），其具有催化表面（12）。根据本发明，提供的是与岛（14）的形式的更贵重金属的表面以小于1微米的直径mittlem形成。这有利地产生岛（14）的相对高的催化活性，因为它们提供相对于材料的使用提供了大量的活性表面积。本发明进一步提供根据本发明的用于在衬底的制备方法。

9. 发明申请

WO2002093991A1 METHOD FOR ELECTROLESS DEPOSITION AND PATTERNING OF A METAL ON A SUBSTRATE 审中-公开
标题翻译：用于电镀沉积和在基材上形成金属的方法
公开(公告)号：WO2002093991A1
公开(公告)日：2002-11-21
申请号：PCT/IB2002/001225
申请日：2002-04-04
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION , DELAMARCHE, Emmanuel , FLAKE, John, C. , GEISSLER, Matthias , GRAHAM, William, S. , MAGNUSON, Roy, H. , MICHEL, Bruno , SCHMID, Heinz
发明人： DELAMARCHE, Emmanuel , FLAKE, John, C. , GEISSLER, Matthias , GRAHAM, William, S. , MAGNUSON, Roy, H. , MICHEL, Bruno , SCHMID, Heinz
IPC分类号： H05K3/06
CPC分类号： B82Y30/00 , C23C18/1605 , C23C18/1607 , C23C18/1893 , C23F1/02 , C23F1/34 , H01L21/4846 , H05K3/0079 , H05K3/061 , H05K3/181 , H05K3/389 , H05K2203/0108 , H05K2203/0537 , H05K2203/0585 , H05K2203/1168
摘要： A method for manufacturing a patterned metal layer on a substrate is provided which comprises the step of electrolessly depositing a blanket metal film of a metal onto a substrate, followed by subsequently patterning said metal layer by means of microcontact printing. The deposited metal can be overplated with another metal, which can be microcontact printed to serve as an etch mask.
摘要翻译：提供了一种用于在基板上制造图案化金属层的方法，其包括将金属的覆盖金属膜无电沉积到基板上的步骤，随后通过微接触印刷对所述金属层进行图案化。沉积的金属可以用另一种金属进行过电镀，其可以被微接触印制以用作蚀刻掩模。

10. 发明申请

WO2015165874A1 METALIZATION OF SURFACES 审中-公开
标题翻译：表面金属化
公开(公告)号：WO2015165874A1
公开(公告)日：2015-11-05
申请号：PCT/EP2015/059144
申请日：2015-04-28
申请人： CUPTRONIC TECHNOLOGY LTD.
发明人： ATTHOFF, Björn , GÖTHE, Sven
IPC分类号： C23C18/20 , C23C18/16 , C23C18/30
CPC分类号： C23C18/1612 , C23C18/1607 , C23C18/1639 , C23C18/1641 , C23C18/165 , C23C18/2033 , C23C18/204 , C23C18/208 , C23C18/2086 , C23C18/30
摘要： A method of metallizing substrate with abstractable hydrogen atoms and/or unsaturations on the surface, comprising the steps: a) contacting the substrate with a polymerizable unit, at least one initiator which can be activated by both heat and actinic radiation, and optionally at least one solvent, b) inducing a polymerization reaction c) depositing a second metal on an already applied first metal to obtain a metal coating. A first metal is added as ions and/or small metal particles during the process. Ions are reduced to the first metal. Advantages include that the adhesion is improved, the process time is shortened, blisters in the metal coating are avoided, the polymer layer below the metal coating becomes less prone to swelling for instance in contact with water.
摘要翻译：一种在表面上具有可抽取的氢原子和/或不饱和基团金属化衬底的方法，包括以下步骤：a）使所述衬底与可聚合单元接触，所述至少一种引发剂可以通过热和光化辐射二者被激活，一种溶剂，b）引发聚合反应c）在已经施加的第一金属上沉积第二种金属以获得金属涂层。在该过程中，作为离子和/或小金属颗粒添加第一金属。离子被还原成第一金属。优点包括提高粘合性，缩短处理时间，避免金属涂层中的水泡，金属涂层以下的聚合物层变得不容易膨胀，例如与水接触。

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