专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2016152938A1 めっき品の製造方法审中-公开
标题翻译：生产制品的方法
公开(公告)号：WO2016152938A1
公开(公告)日：2016-09-29
申请号：PCT/JP2016/059264
申请日：2016-03-23
申请人：オーエム産業株式会社 , 岡山県
发明人：西村　宜幸 , 三宅　莉枝 , 福田　千紗 , 高見沢　政男 , 水戸岡　豊
IPC分类号： C23C18/18 , H05K3/18
CPC分类号： C23C18/1612 , C23C18/08 , C23C18/1639 , C23C18/1667 , C23C18/18 , C23C18/1868 , C23C18/1893 , C23C18/32 , C23C18/38 , C23C18/42 , C23C18/54 , H05K3/18
摘要：　ガラス基材の表面にめっき皮膜パターンが形成されためっき品の製造方法であって、ガラス基材の表面の一部の領域にパルスレーザーを照射する第１工程と、ガラス基材の表面に無電解めっき触媒を付着させる第２工程と、ガラス基材において、パルスレーザーが照射されていない箇所に付着した触媒を選択的に失活させるか又は触媒を選択的に除去する第３工程と、第３工程の後に無電解めっきを行い、パルスレーザーを照射した領域にのみ選択的にめっき皮膜を形成する第４工程とを備えるめっき品の製造方法。これにより、ガラス基材の表面に密着性の良好なめっき皮膜パターンが形成されためっき品を、簡易に製造することができる。
摘要翻译：一种电镀制品的制造方法，其中在玻璃基材的表面上形成镀膜图案。该方法包括：用脉冲激光照射玻璃基板的表面的一些区域的第一步骤; 使化学镀催化剂附着在玻璃基材的表面上的第二工序; 选择性地去活化或选择性除去附着在玻璃基底区域上的催化剂的第三步骤，所述区域未被脉冲激光照射; 以及第四步骤，仅通过在第三步骤之后进行无电镀来在脉冲激光照射的区域上选择性地形成镀膜。因此，可以容易地制造其中在玻璃基底的表面上形成表现出优异粘附性的镀膜图案的电镀制品。

2. 发明申请

WO2013097728A1 METHOD OF METALIZING SURFACE AND ARTICLE OBTAINABLE 审中-公开
标题翻译：金属化表面和可获得物品的方法
公开(公告)号：WO2013097728A1
公开(公告)日：2013-07-04
申请号：PCT/CN2012/087588
申请日：2012-12-26
申请人： SHENZHEN BYD AUTO R & D COMPANY LIMITED , BYD COMPANY LIMITED
发明人： MIAO, Weifeng
IPC分类号： C23C18/18 , C25D5/24 , C25D5/02 , C09D11/02 , H05K3/14
CPC分类号： C23C18/1882 , C09D11/037 , C09D11/322 , C09D11/52 , C23C18/1608 , C23C18/1639 , C23C18/165 , C23C18/1865 , C23C18/1879 , C23C18/2033 , C23C18/206 , C23C28/00 , C25D5/02 , H05K1/097 , H05K3/18 , H05K3/246 , H05K2203/1105
摘要： A method of metalizing a surface of an insulation substrate is provided and an article obtainable by the method is also provided. The method may comprise the steps of: applying an ink composition onto a surface to be metalized of the insulation substrate, obtaining an insulation substrate with an ink layer; subjecting the insulation substrate with an ink layer to heat treatment at a temperature of about 500 to 1000 degree Celsius in an non-reactive atmosphere; plating at least one metal layer on the ink layer, the ink composition comprises a metal compound and an ink vehicle, the metal compound is at least one selected from a group consisting of a nano-copper oxide, a nano- cuprous oxide, a compound of formula (I) and a compound of formula (II), ΤϊO2-σ (I), M 1 M 2 p O q (II), 0.05≤σ≤ 1.8, M 1 is at least one element selected from a group consisting of groups 2, 9-12 of the periodic table according to IUPAC nomenclature, M 2 is at least one element selected from a group consisting of groups 3-8,10 and 13 of the periodic table according to IUPAC nomenclature, 0
摘要翻译：提供了绝缘基板的表面金属化方法，并且还提供了可通过该方法获得的制品。该方法可以包括以下步骤：将油墨组合物施加到绝缘基板的金属化表面上，获得具有油墨层的绝缘基板; 在非反应性气氛中对具有油墨层的绝缘基板进行约500至1000摄氏度的温度的热处理; 在油墨层上镀覆至少一层金属层，油墨组合物包含金属化合物和油墨载体，金属化合物是选自纳米氧化铜，纳米氧化亚铜，化合物中的至少一种的式（I）化合物和式（II）化合物，Tau＆idigr; O 2 -Sigma（I），M1M2 pOq（II），0.05≤σ= 1.8，M1是选自由以下组成的组中的至少一种元素：根据IUPAC命名法，周期表的2,9-12是M2，根据IUPAC命名法，M2是选自周期表的组3-8,10和13中的至少一种元素，0

3. 发明申请

WO2009031892A1 AN ELECTROLESS PROCESS FOR DEPOSITING A METAL ON A NON-CATALYTIC SUBSTRATE 审中-公开
标题翻译：一种用于在非催化基材上沉积金属的电沉积工艺
公开(公告)号：WO2009031892A1
公开(公告)日：2009-03-12
申请号：PCT/NL2008/050583
申请日：2008-09-05
申请人： NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO , TACKEN, Roland Anthony , DE ZWART, Renatus Marius , HOVESTAD, Arjan
发明人： TACKEN, Roland Anthony , DE ZWART, Renatus Marius , HOVESTAD, Arjan
IPC分类号： C23C18/20 , C23C18/16 , C23C18/30
CPC分类号： C23C18/1678 , C23C18/1639 , C23C18/1641 , C23C18/31 , C23C18/34 , C23C18/36 , C23C18/40 , C23C18/405 , C23C18/44 , Y10T428/31678
摘要： The invention provides an electroless process for depositing a metal on an essentially catalyst-free substrate, which process comprises the steps of: (a)providing an essentially catalyst-free substrate; and (b) exposing said essentially catalyst-free substrate to an electroless solution to deposit the metal on the substrate, which solution comprises metal ions and a reducing agent for reducing the metal ions into the metal, whereby at least the surface of the substrate has a temperature or is heated to a temperature (T1) which is higher than the temperature (T2) of the solution.
摘要翻译：本发明提供了一种用于在基本上无催化剂的衬底上沉积金属的无电镀方法，该方法包括以下步骤：（a）提供基本上不含催化剂的衬底; 和（b）将所述基本上无催化剂的衬底暴露于无电溶液以将金属沉积在衬底上，该溶液包含金属离子和用于将金属离子还原成金属的还原剂，由此至少衬底的表面具有或者被加热到比溶液的温度（T2）高的温度（T1）。

4. 发明申请

WO2019018604A1 METHODS FOR METALIZING VIAS WITHIN A SUBSTRATE 审中-公开
公开(公告)号：WO2019018604A1
公开(公告)日：2019-01-24
申请号：PCT/US2018/042825
申请日：2018-07-19
申请人： CORNING INCORPORATED
发明人： JAYARAMAN, Shrisudersan
IPC分类号： C23C18/54 , H01L21/288
CPC分类号： C23C18/1603 , C03C17/10 , C03C2217/263 , C03C2218/111 , C23C18/1639 , C23C18/1687 , C23C18/38 , C23C18/54 , H01L21/288 , H01L21/486 , H01L21/7688 , H01L21/76898
摘要： Methods of metalizing vias (106) are disclosed. A method of metalizing at least one via (106) includes contacting a substrate (100) with a sacrificial metal sheet (110). The substrate (100) includes a first surface (102), a second surface (104), and the at least one via (106) extending between the first surface (102) and the second surface (104) and the first surface (102) or the second surface (102) of the substrate (100) contacts a surface (112) of the sacrificial metal sheet (110). The method further includes applying a solution (120) comprising metal ions to the substrate (100) and the sacrificial metal sheet (110) such that a Galvanic displacement reaction occurs between the sacrificial metal sheet (110) and the metal ions in the solution (120) until the metal ions form a metal coating (108) on at least one surface of the at least one via (106).

5. 发明申请

WO2016089906A1 COMPOSITE STRUCTURAL COMPONENT 审中-公开
标题翻译：复合结构构件
公开(公告)号：WO2016089906A1
公开(公告)日：2016-06-09
申请号：PCT/US2015/063252
申请日：2015-12-01
申请人： RAYTHEON COMPANY
发明人： CARLSTEN, Curtis, B. , MURROW, Jonathan , ITEM, Erik, F.
IPC分类号： F42B10/14 , F42B12/76
CPC分类号： C23C18/1616 , B32B37/16 , B63B3/16 , B64C1/00 , B64C2001/0072 , C23C18/08 , C23C18/16 , C23C18/1601 , C23C18/1603 , C23C18/1614 , C23C18/1633 , C23C18/1639 , C23C18/1641 , F42B10/143 , F42B12/76
摘要： A composite structural component is disclosed. The composite structural component can include a lattice structure, a casing disposed about at least a portion of the lattice structure, and a skin adhered to a surface of the casing. The lattice structure and the casing can be formed of a polymeric material and the skin can be formed of a metallic material.
摘要翻译：公开了复合结构部件。所述复合结构部件可以包括格子结构，围绕所述格子结构的至少一部分设置的壳体，以及附着在所述壳体的表面上的皮肤。格子结构和外壳可以由聚合物材料形成，并且皮肤可以由金属材料形成。

6. 发明申请

WO2014106503A2 METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE STRUCTURE ON A NON-CONDUCTIVE SUBSTRATE MATERIAL, AND ADDITIVE AND SUBSTRATE MATERIAL INTENDED THEREFOR 审中-公开
标题翻译：方法用于生产导电结构体上非导电基底，并在此给出关于添加剂和备份
公开(公告)号：WO2014106503A2
公开(公告)日：2014-07-10
申请号：PCT/DE2013100412
申请日：2013-12-06
申请人： LPKF LASER & ELECTRONICS AG
发明人： KRÜGER ROBIN ALEXANDER , RÖSENER BERND , JOHN WOLFGANG , SCHNOOR ARNE , OSTHOLT ROMAN
IPC分类号： C23C18/16
CPC分类号： C23C18/1868 , C08J3/226 , C08J2323/06 , C08J2323/12 , C08J2375/04 , C08J2467/02 , C08J2467/03 , C08K3/22 , C08K2003/2248 , C08K2003/2272 , C23C18/1608 , C23C18/1612 , C23C18/1639 , C23C18/1641 , C23C18/1642 , C23C18/204 , C23C18/28 , H01B1/02 , H05K3/185 , H05K2201/0236 , H05K2201/0999 , H05K2203/107 , H05K2203/1157 , C08L67/02
摘要： The invention relates to a method for producing an electrically conductive structure, in particular a conducting track, on a non-conductive substrate material, which contains an additive (1) having at least one metal compound. For this purpose, the substrate material is irradiated by means of a laser in order to selectively activate the metal compounds, for example inorganic metal compounds, contained in the additive (1). The metal seeds formed by the activation are then metallized in order to create the electrically conductive structure on the substrate material. Because the additive (1) is provided with an in particular full-surface coating before the additive is introduced into the substrate material, such that the additive (1) is reduced and the coating is oxidized by the laser activation, the reaction partners necessary for the required chemical reaction with the additive (1) are provided by the coating. Because of the thereby significantly reduced interaction with the substrate material, the limitation to certain plastics or plastic groups also is lifted.
摘要翻译：本发明涉及一种用于产生导电结构，特别是一个导体线路，在一个非导电性载体材料，其中包含与至少一种金属化合物的添加剂（1）的方法。载体材料是由激光的手段来激活金属化合物如（1）中包含的添加剂，例如无机选择性照射其上。然后由活化所形成的金属核被金属化，以提供在载体材料上的导电结构。通过将添加剂（1）在载体材料提供有之前引入一个特定的全表面涂层，从而使由激光激活，添加剂（1）被还原和涂层被氧化以被用于与该添加剂所要求的化学反应（1）由包衣提供了必要的反应物。由于与在同一时间所述载体材料得到的基本上减少的相互作用，在某些塑料或塑料基的限制删去。

7. 发明申请

WO2012072658A3 PROCESS FOR COATING NANOPARTICLES WITH METAL BY MEANS OF ELECTROLESS DEPOSITION TECHNIQUES 审中-公开
标题翻译：方法用于涂覆金属纳米粒子的电源LOSER沉积
公开(公告)号：WO2012072658A3
公开(公告)日：2013-12-12
申请号：PCT/EP2011071338
申请日：2011-11-30
申请人： UNIV DRESDEN TECH , LOHE MARTIN R , NICKEL WINFRIED , GROTHE JULIA , KASKEL STEFAN
发明人： LOHE MARTIN R , NICKEL WINFRIED , GROTHE JULIA , KASKEL STEFAN
IPC分类号： C23C18/16 , B82B3/00 , B82Y30/00 , C23C18/18
CPC分类号： C23C18/1639 , B01J13/02 , B82Y30/00 , B82Y40/00 , C23C18/1658 , C23C18/1662 , C23C18/1882 , C23C18/31
摘要： The present invention relates to a process for coating nanoparticles with metal by means of an electroless deposition technique. The process does not use expensive noble metal salts and reducing agents and can be carried out in water as solvent and at low temperatures. The homogeneous metal-coated nanoparticles are particularly suitable for use as fillers in metal-matrix composites, in which the deposited metal layer functions as dispersion compatibilizer between non-metallic nanoparticles and metal matrix. The introduction of such metal-coated nanoparticles produced according to the invention into metals is easier compared to unfunctionalized particles in the case of which agglomerate formation occurs, which significantly reduces the production costs for the metal-matrix composites. The process of the invention comprises the steps: a) thiol functionalization of the surface of the nanoparticles, b) contacting of the nanoparticles with an aqueous metal salt solution, c) addition of a reducing agent which reduces the metal salt solution, as a result of which deposition of metal on the nanoparticles occurs.
摘要翻译：本发明涉及一种通过电沉积涂覆金属纳米颗粒的方法。过程做而无需使用昂贵的贵金属的盐和还原剂的并且可以在水作为溶剂并在低温下进行。将均匀的金属涂覆的纳米颗粒特别适合于用作金属基复合材料的填料，其中，所述沉积的金属层用作所述非金属纳米颗粒和金属基体之间的分散体启动子。根据本发明在金属，例如金属涂覆的纳米颗粒的掺入进行比较，未官能化的颗粒，其中附聚发生变得更容易，这显著减少了金属基复合材料的制造成本。本发明的方法包括以下步骤：a）Thiolfunktionalisierung纳米粒子表面，b）用金属盐水溶液接触纳米颗粒，c）将降低所述金属盐溶液，由此存在于纳米粒子的金属沉积的还原剂。

8. 发明申请

WO2007146082A2 MOLDED POLYMER COMPRISING SILICONE AND AT LEAST ONE METAL TRACE AND A PROCESS OF MANUFACTURING THE SAME 审中-公开
标题翻译：包含硅胶和至少一种金属追踪的模制聚合物及其制造方法
公开(公告)号：WO2007146082A2
公开(公告)日：2007-12-21
申请号：PCT/US2007013447
申请日：2007-06-06
申请人： SECOND SIGHT MEDICAL PROD INC , DOHENY EYE INST , LAUDE LUCIEN , GREENBERG ROBERT J
发明人： LAUDE LUCIEN , GREENBERG ROBERT J
CPC分类号： H05K3/185 , A61N1/0543 , C23C18/1639 , C23C18/1653 , C23C18/1692 , C23C18/1868 , C23C18/1882 , C23C18/31 , H05K1/032 , H05K3/0035 , H05K3/107 , H05K3/465 , H05K3/4661 , H05K2201/0162 , H05K2201/096 , H05K2203/107 , Y10T428/24917 , Y10T428/31663
摘要： The present invention provides a flexible electrode array, comprising a silicone containing body, at least one metal trace layer and at least one electrode pad. on the surface. The present invention further provides a process of manufacturing a flexible electrode array, comprising: a) irradiating a surface area of a molded silicone containing layer yielding traces with a light beam emitted by a pulsed UV laser source, b) immersing said irradiated molded silicone layer for inducing the deposit of metal ions to form metal traces, c) applying a silicone containing layer on said silicone containing layer and said metal traces, d) irradiating the surface for drilling holes into the surface of the molded silicone containing layer, and e) immersing said irradiated molded silicone layer for inducing the deposit of metal ions to form metal electrode pads.
摘要翻译：本发明提供了一种柔性电极阵列，其包括含硅树脂体，至少一个金属迹线层和至少一个电极焊盘。在表面上。本发明还提供一种制造柔性电极阵列的方法，包括：a）照射模制的含硅氧烷层的表面积，产生具有由脉冲UV激光源发射的光束的痕迹，b）将所述照射的模制硅氧烷层用于诱导金属离子沉积以形成金属迹线，c）在所述含硅层和所述金属迹线上施加含硅氧烷层，d）将所述表面照射到所述模制的含硅氧烷层的表面中，e）浸渍所述照射的模制的硅氧烷层以诱导金属离子的沉积形成金属电极焊盘。

9. 发明申请

WO2005035827A1 METHOD FOR METALLIZING A COMPONENT COMPRISING PARTS OF DIFFERENT NON-METALLIC MATERIALS 审中-公开
标题翻译：用于金属化包含不同非金属材料部件的组件的方法
公开(公告)号：WO2005035827A1
公开(公告)日：2005-04-21
申请号：PCT/NL2004/000734
申请日：2004-10-18
申请人： NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWE- TENSCHAPPELIJK ONDERZOEK TNO , TACKEN, Roland, Anthony
发明人： TACKEN, Roland, Anthony
IPC分类号： C23C18/20
CPC分类号： C23C18/1608 , C23C18/1639 , C23C18/1641 , C23C18/1889 , C23C18/208 , C23C18/285 , C23C18/30 , Y10T428/31678
摘要： Method for metallizing a component, comprising a first part (1), made of a first material (e.g. polymer), and a second part (2), made of a second material (e.g. polymer). A metallizing seed layer (6), e.g. catalytic to the subsequent chemical metallization process, is applied at the surface of the component, after which the surface of the component, including the metallizing seed layer, is exposed to a solvent (7) in which the surface of the first part (1) is, and the surface of the second part (2) is not soluble. In a following step the surface of the component is exposed to a metallizing environment (9) that, however, will only be metallized on the surface of the second component part.
摘要翻译：用于金属化部件的方法，包括由第一材料（例如聚合物）制成的第一部分（1）和由第二材料（例如聚合物）制成的第二部分（2）。金属化种子层（6），例如催化到后续的化学金属化过程被施加在部件的表面上，然后将包括金属化种子层的部件的表面暴露于其中第一部分（1）的表面的溶剂（7）并且第二部分（2）的表面是不溶的。在随后的步骤中，组件的表面暴露于金属化环境（9），然而，金属化环境（9）将仅在第二组分部分的表面上金属化。

10. 发明申请

WO2018107846A1 一种镀镍碳化硅颗粒及其制备方法审中-公开
公开(公告)号：WO2018107846A1
公开(公告)日：2018-06-21
申请号：PCT/CN2017/102828
申请日：2017-09-22
申请人：苏州金仓合金新材料有限公司
发明人：孙飞 , 赵勇 , 埃里克斯⋅高登
IPC分类号： C23C18/36 , C23C18/18 , B22F1/02
CPC分类号： B22F1/025 , C23C18/1639 , C23C18/1882 , C23C18/36
摘要：一种镀镍碳化硅颗粒的制备方法，其包括以下步骤：步骤一：活化碳化硅颗粒；步骤二：洗涤、过滤并烘干；步骤三：化学镀镍；步骤四：洗涤、过滤并烘干。选取一定粒径的碳化硅颗粒，通过清洗-活化处理-特定溶液镀镍的方法，将碳化硅颗粒表面进行涂层、镀镍，使碳化硅颗粒表面均匀附着镍，从而提高碳化硅与金属材料的均匀融合程度，避免出现复合材料的偏析与龟裂问题，提高复合材料的成材率。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式