基本信息:
- 专利标题： METALIZATION OF SURFACES
- 专利标题（中）：表面金属化
- 申请号：PCT/EP2015/059144 申请日：2015-04-28
- 公开(公告)号：WO2015165874A1 公开(公告)日：2015-11-05
- 发明人： ATTHOFF, Björn , GÖTHE, Sven
- 申请人： CUPTRONIC TECHNOLOGY LTD.
- 申请人地址： P.O. Box 58341 3733 Limassol CY
- 专利权人： CUPTRONIC TECHNOLOGY LTD.
- 当前专利权人： CUPTRONIC TECHNOLOGY LTD.
- 当前专利权人地址： P.O. Box 58341 3733 Limassol CY
- 代理机构： B&L GRUPPEN AB
- 优先权： SE1450500-2 20140428
- 主分类号： C23C18/20
- IPC分类号： C23C18/20 ; C23C18/16 ; C23C18/30
摘要：
A method of metallizing substrate with abstractable hydrogen atoms and/or unsaturations on the surface, comprising the steps: a) contacting the substrate with a polymerizable unit, at least one initiator which can be activated by both heat and actinic radiation, and optionally at least one solvent, b) inducing a polymerization reaction c) depositing a second metal on an already applied first metal to obtain a metal coating. A first metal is added as ions and/or small metal particles during the process. Ions are reduced to the first metal. Advantages include that the adhesion is improved, the process time is shortened, blisters in the metal coating are avoided, the polymer layer below the metal coating becomes less prone to swelling for instance in contact with water.
摘要（中）：
一种在表面上具有可抽取的氢原子和/或不饱和基团金属化衬底的方法，包括以下步骤：a）使所述衬底与可聚合单元接触，所述至少一种引发剂可以通过热和光化辐射二者被激活， 一种溶剂，b）引发聚合反应c）在已经施加的第一金属上沉积第二种金属以获得金属涂层。 在该过程中，作为离子和/或小金属颗粒添加第一金属。 离子被还原成第一金属。 优点包括提高粘合性，缩短处理时间，避免金属涂层中的水泡，金属涂层以下的聚合物层变得不容易膨胀，例如与水接触。