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1. 发明申请

WO2015137936A1 MICROELECTRONIC PACKAGE HAVING A PASSIVE MICROELECTRONIC DEVICE DISPOSED WITHIN A PACKAGE BODY 审中-公开
标题翻译：具有在包装体内处理的被动微电子器件的微电子封装
公开(公告)号：WO2015137936A1
公开(公告)日：2015-09-17
申请号：PCT/US2014/024112
申请日：2014-03-12
申请人： INTEL CORPORATION , MEYER, Thorsten , OFNER, Gerald , WOLTER, Andreas , SEIDEMANN, Georg , ALBERS, Sven , GEISSLER, Christian
发明人： MEYER, Thorsten , OFNER, Gerald , WOLTER, Andreas , SEIDEMANN, Georg , ALBERS, Sven , GEISSLER, Christian
IPC分类号： H01L23/12
CPC分类号： H01L23/49838 , H01L21/4853 , H01L21/4857 , H01L21/565 , H01L23/13 , H01L23/3114 , H01L23/49816 , H01L23/49822 , H01L23/50 , H01L24/16 , H01L24/19 , H01L24/20 , H01L24/96 , H01L25/16 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/24195 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/92244 , H01L2924/15151 , H01L2924/15159 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/1815 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105
摘要： A microelectronic package including a passive microelectronic device disposed within a package body, wherein the package body is the portion of the microelectronic package which provides support and/or rigidity to the microelectronic package. In a flip-chip type microelectronic package, the package body may comprise a microelectronic substrate to which an active microelectronic device is electrically attached. In an embedded device type microelectronic package, the package body may comprise the material in which the active microelectronic device is embedded.
摘要翻译：一种微电子封装，包括设置在封装主体内的无源微电子器件，其中所述封装体是所述微电子封装的对所述微电子封装提供支撑和/或刚度的部分。在倒装芯片型微电子封装中，封装主体可以包括微电子衬底，活性微电子器件电连接到微电子衬底。在嵌入式设备型微电子封装中，封装体可以包括其中嵌入有源微电子器件的材料。

2. 发明申请

WO2015088486A1 ANTENNA ON CERAMICS FOR A PACKAGED DIE 审中-公开
标题翻译：用于包装的陶瓷的天线
公开(公告)号：WO2015088486A1
公开(公告)日：2015-06-18
申请号：PCT/US2013/073950
申请日：2013-12-09
申请人： INTEL CORPORATION , WOLTER, Andreas , MARUTHAMUTHU, Saravana , KNUDSEN, Mikael , MEYER, Thorsten , SEIDEMANN, Georg , HERRERO, Pablo , JAERVINEN, Pauli
发明人： WOLTER, Andreas , MARUTHAMUTHU, Saravana , KNUDSEN, Mikael , MEYER, Thorsten , SEIDEMANN, Georg , HERRERO, Pablo , JAERVINEN, Pauli
IPC分类号： H01L23/66
CPC分类号： H01L23/66 , H01L21/4846 , H01L23/295 , H01L23/3128 , H01L23/481 , H01L23/49833 , H01L23/49838 , H01L23/552 , H01L24/16 , H01L24/17 , H01L24/19 , H01L24/20 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L25/0657 , H01L25/105 , H01L2223/6616 , H01L2223/6677 , H01L2224/12105 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/2919 , H01L2224/32225 , H01L2224/73253 , H01L2224/73267 , H01L2225/06517 , H01L2225/06548 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/1421 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01Q1/38 , H01Q1/50 , H01Q1/526 , H01L2924/00
摘要： An antenna is described on ceramics that may be used for a packaged die. In one example, a package has a die, a ceramic substrate over the die, an antenna attached to the ceramic substrate, and conductive leads electrically connecting the antenna to the die.
摘要翻译：在可用于封装模具的陶瓷上描述天线。在一个示例中，封装具有管芯，管芯上的陶瓷衬底，附着到陶瓷衬底的天线以及将天线电连接到管芯的导电引线。

3. 发明申请

WO2014209358A1 MICROELECTROMECHANICAL SYSTEM (MEMS) ON APPLICATION SPECIFIC INTEGRATED CIRCUIT (ASIC) 审中-公开
标题翻译：应用特定集成电路（ASIC）上的微电子机电系统（MEMS）
公开(公告)号：WO2014209358A1
公开(公告)日：2014-12-31
申请号：PCT/US2013/048552
申请日：2013-06-28
申请人： INTEL IP CORPORATION , OFNER, Gerald , MEYER, Thorsten , MAHNKOPF, Reinhard , GEISSLER, Christian , AUGUSTIN, Andreas
发明人： OFNER, Gerald , MEYER, Thorsten
IPC分类号： H01L25/18 , H01L25/00
CPC分类号： B81C1/00238 , B81B7/008 , B81B2201/0235 , B81B2201/0242 , B81B2201/025 , B81B2201/0257 , B81B2201/0264 , B81B2201/0271 , B81B2201/10 , B81B2207/012 , B81B2207/053 , B81B2207/07 , B81B2207/096 , B81C1/0023 , B81C2203/0792 , H01L2224/16225 , H01L2224/48091 , H01L2924/15311 , H01L2924/00014
摘要： In embodiments, a package assembly may include an application-specific integrated circuit (ASIC) and a microelectromechanical system (MEMS) having an active side and an inactive side. In embodiments, the MEMS may be coupled directly to the ASIC by way of one or more interconnects. The MEMS, ASIC, and one or more interconnects may define or form a cavity such that the active portion of the MEMS is within the cavity. In some embodiments, the package assembly may include a plurality of MEMS coupled directly to the ASIC by way of a plurality of one or more interconnects. Other embodiments may be described and/or claimed.
摘要翻译：在实施例中，封装组件可以包括专用集成电路（ASIC）和具有有源侧和无源侧的微机电系统（MEMS）。在实施例中，MEMS可以通过一个或多个互连直接耦合到ASIC。 MEMS，ASIC和一个或多个互连可以限定或形成空腔，使得MEMS的有源部分在空腔内。在一些实施例中，封装组件可以包括通过多个一个或多个互连件直接耦合到ASIC的多个MEMS。可以描述和/或要求保护其他实施例。

4. 发明申请

WO2014209307A1 BULK ACOUSTIC WAVE RESONATOR TUNER CIRCUITS 审中-公开
标题翻译：大容量声波谐波调谐电路
公开(公告)号：WO2014209307A1
公开(公告)日：2014-12-31
申请号：PCT/US2013/047993
申请日：2013-06-26
申请人： INTEL IP CORPORATION , MARUTHAMUTHU, Saravana , MEYER, Thorsten , HERRERO, Pablo , WOLTER, Andreas , SEIDEMANN, Georg , KNUDSEN, Mikael , JAERVINEN, Pauli
发明人： MARUTHAMUTHU, Saravana , MEYER, Thorsten , HERRERO, Pablo , WOLTER, Andreas , SEIDEMANN, Georg , KNUDSEN, Mikael , JAERVINEN, Pauli
IPC分类号： H04B1/48
CPC分类号： H03H9/0014 , H01Q5/335 , H03H7/40 , H04B1/0458
摘要： Techniques and configurations are disclosed for bulk acoustic wave resonator (BAWR) tuner circuits and their use in integrated circuit (IC) packages and mobile communication devices for radio frequency (RF) communication. In some embodiments, a mobile communication device may include an antenna; a transmitter circuit having an output port, a tuner circuit having one or more BAWRs, an antenna port coupled to the antenna, a transmitter port coupled to the output port of the transmitter circuit, and a control port; and a control circuit, coupled to the control port, configured to adjust an impedance of the tuner circuit, via adjustment of a BAWR or another component of the tuner circuit, based at least in part on an impedance of the antenna. Other embodiments may be described and/or claimed.
摘要翻译：公开了用于体声波谐振器（BAWR）调谐器电路及其在集成电路（IC）封装中的使用和用于射频（RF）通信的移动通信设备的技术和配置。在一些实施例中，移动通信设备可以包括天线; 具有输出端口的发射机电路，具有一个或多个BAWR的调谐器电路，耦合到天线的天线端口，耦合到发射机电路的输出端口的发射机端口和控制端口; 以及耦合到控制端口的控制电路，其被配置为至少部分地基于天线的阻抗来调节调谐器电路的阻抗，经由调谐调谐器电路的BAWR或另一部件。可以描述和/或要求保护其他实施例。

5. 发明申请

WO2017131683A1 INTEGRATED CIRCUIT PACKAGES 审中-公开
标题翻译：集成电路封装
公开(公告)号：WO2017131683A1
公开(公告)日：2017-08-03
申请号：PCT/US2016/015260
申请日：2016-01-28
申请人： INTEL IP CORPORATION , GANESAN, Sanka , MEYER, Thorsten , OFNER, Gerald
发明人： GANESAN, Sanka , MEYER, Thorsten , OFNER, Gerald
IPC分类号： H01L23/48 , H01L23/28
CPC分类号： H01L24/97 , H01L21/561 , H01L21/568 , H01L23/295 , H01L23/3128 , H01L23/48 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/16238 , H01L2224/29298 , H01L2224/32225 , H01L2224/73204 , H01L2224/81005 , H01L2224/83005 , H01L2224/83192 , H01L2224/92125 , H01L2224/97 , H01L2924/1434 , H01L2924/15192 , H01L2924/15311 , H01L2924/15313 , H01L2924/3511 , H01L2224/81 , H01L2224/83 , H01L2924/014 , H01L2924/00014
摘要： Disclosed herein are integrated circuit (IC) packages, and related structures and techniques. In some embodiments, an IC package may include: a die; a redistribution structure, wherein the die is coupled to the redistribution structure via first-level interconnects and solder; a solder resist; and second-level interconnects coupled to the redistribution structure through openings in the solder resist.
摘要翻译：这里公开了集成电路（IC）封装，以及相关的结构和技术。在一些实施例中，IC封装可以包括：管芯; 重新分布结构，其中所述管芯经由第一级互连和焊料耦合到所述重分布结构; 阻焊剂; 以及通过阻焊剂中的开口耦合到重分布结构的第二级互连。

6. 发明申请

WO2014092769A1 SENSOR HIERARCHY 审中-公开
标题翻译：传感器分层
公开(公告)号：WO2014092769A1
公开(公告)日：2014-06-19
申请号：PCT/US2013/043515
申请日：2013-05-31
申请人： INTEL CORPORATION , MEYER, Thorsten , LUEBBERS, Enno , LYAKH, Mikhail , KINSELLA, Ray
发明人： MEYER, Thorsten , LUEBBERS, Enno , LYAKH, Mikhail , KINSELLA, Ray
IPC分类号： G01D21/00
CPC分类号： G06K19/07345 , G05B11/01 , G05B19/048 , G05B23/0221
摘要： In general, systems/devices consistent with the present disclosure may be configured to interact with (e.g., receive information from and/or control the operation of) sensors organized based on a hierarchy. The term hierarchy, as referenced herein, may describe an arrangement of items (e.g., sensors) into leveled groups organized based on at least one criterion including, for example, ability, complexity, energy consumption, etc. In one embodiment, a system/device may comprise, for example, at least one first level sensor, at least one second level sensor and a sensor control module. The first level sensor may be configured to generate first level sensor information based on sensing an event. The sensor module may be configured to control operation of the at least one second level sensor based on the first level sensor information.
摘要翻译：通常，与本公开一致的系统/设备可以被配置为与基于层次结构组织的传感器交互（例如，接收来自和/或控制）的传感器。如本文所提及的，术语层级可以将项目（例如，传感器）的布置描述为基于包括例如能力，复杂性，能量消耗等的至少一个标准组织的平坦组。在一个实施例中，系统/ 装置可以包括例如至少一个第一水平传感器，至少一个第二水平传感器和传感器控制模块。第一级传感器可以被配置为基于感测事件来生成第一级传感器信息。传感器模块可以被配置为基于第一级传感器信息来控制至少一个第二级传感器的操作。

7. 发明申请

WO2015099684A1 PACKAGE ON PACKAGE ARCHITECTURE AND METHOD FOR MAKING 审中-公开
标题翻译：包装架构和制作方法
公开(公告)号：WO2015099684A1
公开(公告)日：2015-07-02
申请号：PCT/US2013/077601
申请日：2013-12-23
申请人： INTEL CORPORATION , GANESAN, Sanka , GUZEK, John S. , NIMKAR, Nitesh , REINGRUBER, Klaus , MEYER, Thorsten
发明人： GANESAN, Sanka , GUZEK, John S. , NIMKAR, Nitesh , REINGRUBER, Klaus , MEYER, Thorsten
IPC分类号： H01L23/12
CPC分类号： H01L23/5226 , H01L21/565 , H01L21/568 , H01L21/76877 , H01L23/3128 , H01L23/3171 , H01L23/49811 , H01L23/49827 , H01L23/5389 , H01L24/19 , H01L24/96 , H01L25/0655 , H01L25/105 , H01L25/50 , H01L2224/12105 , H01L2224/16225 , H01L2225/06548 , H01L2225/1035 , H01L2225/1058 , H01L2225/1088 , H01L2924/15311 , H01L2924/181 , H01L2924/19105 , H01L2924/3511 , H01L2924/00
摘要： Embodiments of the present disclosure are directed to package assemblies and methods for fabricating package assemblies. In one embodiment, a package assembly includes a die at least partially embedded in a mold compound; and a through mold via (TMV). The TMV may have vertical sides or may include two different portions with varying shapes. In some instances, prefabricated via bars may be used during fabrication. Package assemblies of the present disclosure may include package-on-package (POP) interconnects having a pitch of less than 0.3 mm. Other embodiments may be described and/or claimed.
摘要翻译：本公开的实施例涉及用于制造包装组件的包装组件和方法。在一个实施例中，包装组件包括至少部分地嵌入模具化合物中的模具; 和通孔（TMV）。 TMV可以具有垂直侧面或者可以包括具有变化形状的两个不同部分。在一些情况下，可以在制造期间使用预制通孔条。本公开的封装组件可以包括具有小于0.3mm的间距的封装封装（POP）互连。可以描述和/或要求保护其他实施例。

8. 发明申请

WO2014100076A1 DERIVING ENVIRONMENTAL CONTEXT AND ACTIONS FROM AD-HOC STATE BROADCAST 审中-公开
标题翻译：衍生自环境广泛的环境条件和行动
公开(公告)号：WO2014100076A1
公开(公告)日：2014-06-26
申请号：PCT/US2013/075927
申请日：2013-12-18
申请人： INTEL CORPORATION , LUEBBERS, Enno , MEYER, Thorsten , LYAKH, Mikhail , KINSELLA, Ray
发明人： LUEBBERS, Enno , MEYER, Thorsten , LYAKH, Mikhail , KINSELLA, Ray
IPC分类号： H04W4/06 , H04W88/02
CPC分类号： H04W4/001 , H04W4/50
摘要： Context state decisions of other users, based on the state of their mobile devices in the vicinity, are used to determine if it reasonable to have your device make or suggest a similar state change. By broadcasting state changes or identifiable actions to all other devices in the vicinity using short-range communications, devices can anonymously notify others in their vicinity of actions they or their users have taken. By collecting and analyzing these notifications, devices can then build their own understanding of the current context and autonomously decide on appropriate actions to take for themselves.
摘要翻译：根据其附近的移动设备的状态，其他用户的上下文状态决定被用于确定您的设备是否合理或建议类似的状态更改。通过使用短距离通信向附近的所有其他设备广播状态更改或可识别的操作，设备可以匿名通知其附近的其他人或他们的用户采取的行动。通过收集和分析这些通知，设备然后可以建立自己对当前环境的理解，并自主决定为自己采取的适当行动。

9. 发明申请

WO2016048363A1 INTEGRATED CIRCUIT PACKAGE HAVING WIRE-BONDED MULTI-DIE STACK 审中-公开
标题翻译：具有接线多层叠层的集成电路封装
公开(公告)号：WO2016048363A1
公开(公告)日：2016-03-31
申请号：PCT/US2014/057781
申请日：2014-09-26
申请人： INTEL CORPORATION , MEYER, Thorsten , JAERVINEN, Pauli , PATTEN, Richard
发明人： MEYER, Thorsten , JAERVINEN, Pauli , PATTEN, Richard
IPC分类号： H01L25/07 , H01L23/49
CPC分类号： H01L25/0657 , H01L21/568 , H01L23/3128 , H01L23/3135 , H01L23/481 , H01L23/49 , H01L23/528 , H01L24/19 , H01L24/20 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L24/96 , H01L25/07 , H01L25/50 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/12105 , H01L2224/131 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/48228 , H01L2224/48235 , H01L2224/73215 , H01L2224/73265 , H01L2224/85444 , H01L2224/85455 , H01L2224/92247 , H01L2225/0651 , H01L2225/06548 , H01L2225/06575 , H01L2924/00014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01079 , H01L2924/0665 , H01L2924/14 , H01L2924/1433 , H01L2924/1434 , H01L2924/15151 , H01L2924/15311 , H01L2924/1579 , H01L2924/181 , H01L2924/00012 , H01L2924/014 , H01L2924/00 , H01L2924/207
摘要： Embodiments of the present disclosure are directed towards an integrated circuit (IC) package including a first die at least partially embedded in a first encapsulation layer and a second die at least partially embedded in a second encapsulation layer. The first die may have a first plurality of die-level interconnect structures disposed at a first side of the first encapsulation layer. The IC package may also include a plurality of electrical routing features at least partially embedded in the first encapsulation layer and configured to route electrical signals between a first and second side of the first encapsulation layer. The second side may be disposed opposite to the first side. The second die may have a second plurality of die-level interconnect structures that may be electrically coupled with at least a subset of the plurality of electrical routing features by bonding wires.
摘要翻译：本公开的实施例涉及集成电路（IC）封装，其包括至少部分地嵌入第一封装层中的第一裸片和至少部分地嵌入第二封装层中的第二裸片。第一管芯可以具有设置在第一封装层的第一侧的第一多个管芯级互连结构。 IC封装还可以包括至少部分地嵌入在第一封装层中并被配置为在第一封装层的第一和第二侧之间路由电信号的多个电路由特征。第二侧可以布置成与第一侧相对。第二管芯可以具有第二多个管芯级互连结构，其可以通过接合引线与多个电路径特征的至少一个子集电耦合。

10. 发明申请

WO2011107212A1 FAHRZEUGINNENAUSSTATTUNGSTEIL UND VERFAHREN ZU DESSEN HERSTELLUNG 审中-公开
标题翻译：车辆内饰件与方法研究
公开(公告)号：WO2011107212A1
公开(公告)日：2011-09-09
申请号：PCT/EP2011/000622
申请日：2011-02-10
申请人： JOHNSON CONTROLS GMBH , WOLFF, Martin , SCHIDAN, Alexander , MEYER, Thorsten , HUBE, Oliver , KALUS, Holger , ZIMMERMANN, Detlef
发明人： WOLFF, Martin , SCHIDAN, Alexander , MEYER, Thorsten , HUBE, Oliver , KALUS, Holger , ZIMMERMANN, Detlef
IPC分类号： B60R21/04
CPC分类号： B60R21/04 , B60R7/046 , B60R13/0243 , B60R21/0428 , B60R2021/0421
摘要： Es wird ein Fahrzeuginnenausstattungsteil (10), insbesondere für ein Kraftfahrzeug, und ein Verfahren zur Herstellung eines Fahrzeuginnenausstattungsteil vorgeschlagen, wobei das Fahrzeuginnenausstattungsteil einen Trägerelement und einen Energieabsorptionselement aufweist, wobei das Trägerelement mit dem Energieabsorptionselement einstückig mittels eines Verbindungsbereichs verbunden ist und wobei mittels des Verbindungsbereichs das Trägerelement relativ zum Energieabsorptionselement vormontierbar vorgesehen ist.
摘要翻译：本发明提供一种车辆内饰件（10），特别是用于机动车辆的，并提出了生产车辆内饰构件，的方法，其中所述车辆内饰构件，其包括支撑构件和能量吸收构件，其中所述支撑构件以所述能量吸收元件一体地由连接部进行连接的，并且其中，由所述连接区域的装置，所述支撑构件被提供预组装相对于能量吸收元件。

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