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1. 发明申请

WO2009105497A2 APPARATUS AND METHOD FOR ADJUSTING THERMALLY INDUCED MOVEMENT OF ELECTRO-MECHANICAL ASSEMBLIES 审中-公开
标题翻译：用于调节机电组件的热引起的运动的装置和方法
公开(公告)号：WO2009105497A2
公开(公告)日：2009-08-27
申请号：PCT/US2009034440
申请日：2009-02-19
申请人： FORMFACTOR INC , MCFARLAND ANDREW W , YASUMURA KEVIN Y , HOBBS ERIC D , BREINLINGER KEITH J
发明人： MCFARLAND ANDREW W , YASUMURA KEVIN Y , HOBBS ERIC D , BREINLINGER KEITH J
IPC分类号： H01L21/66 , G01R1/073
CPC分类号： G01R1/44 , G01R1/07307 , G01R31/2891
摘要： A thermal adjustment apparatus for adjusting one or more thermally induced movements of an electro-mechanical assembly includes: a compensating element expanding at a first rate different from a second rate at which the electro-mechanical assembly expands for generating a counteracting force in response to changes in temperature; and a coupling mechanism coupling the compensating element to the electro-mechanical assembly, and being adjustable to control an amount of the counteracting force applied to the electro-mechanical assembly as temperature changes.
摘要翻译：一种用于调节机电组件的一个或多个热感应运动的热调节装置包括：补偿元件，其以不同于第二速率的第一速率膨胀，在第一速率下机电组件膨胀以响应于变化而产生反作用力温度; 以及将补偿元件联接到机电组件的联接机构，并且该联接机构可调节以随着温度改变来控制施加到机电组件的抵抗力的量。

2. 发明申请

WO2008051773A3 PROBE CARD ASSEMBLY WITH A MECHANICALLY DECOUPLED WIRING SUBSTRATE 审中-公开
标题翻译：具有机械去耦线路基板的探针卡组件
公开(公告)号：WO2008051773A3
公开(公告)日：2008-10-30
申请号：PCT/US2007081706
申请日：2007-10-18
申请人： FORMFACTOR INC , HOBBS ERIC D , SLOCUM ALEXANDER H , ELDRIDGE BENJAMIN N , BREINLINGER KEITH J , POWELL SHAWN
发明人： HOBBS ERIC D , SLOCUM ALEXANDER H , ELDRIDGE BENJAMIN N , BREINLINGER KEITH J , POWELL SHAWN
IPC分类号： G01R31/02
CPC分类号： G01R31/2893
摘要： A probe card assembly can comprise a probe head assembly and a wiring substrate. The probe head assembly can comprise a plurality of probes disposed to contact an electronic device disposed on a holder in a test housing. The wiring substrate can include an electrical interface to a test controller and a plurality of electrical wiring composing electrical paths between the electrical interface and ones of the probes, and the wiring substrate can comprise a first portion on which the electrical interface is disposed and a second portion composing the probe head assembly. The second portion of the wiring substrate can be moveable with respect to the first portion of the wiring substrate.
摘要翻译：探针卡组件可以包括探针头组件和布线衬底。探针头组件可以包括多个探针，所述多个探针被设置为接触设置在测试外壳中的保持器上的电子器件。布线基板可以包括到测试控制器的电接口以及构成电接口和其中一个探头之间的电路径的多个电布线，并且布线基板可以包括布置有电接口的第一部分和布置在第一部分上的第二部分构成探头组件的部分。布线衬底的第二部分可以相对于布线衬底的第一部分移动。

3. 发明申请

WO2011082180A3 TEST SYSTEMS AND METHODS FOR TESTING ELECTRONIC DEVICES 审中-公开
标题翻译：用于测试电子设备的测试系统和方法
公开(公告)号：WO2011082180A3
公开(公告)日：2011-10-27
申请号：PCT/US2010062256
申请日：2010-12-28
申请人： FORMFACTOR INC , BERRY TOMMIE E , BREINLINGER KEITH J , HOBBS ERIC D , LORANGER MARC , SLOCUM ALEXANDER H , WILSON ADRIAN S
发明人： BERRY TOMMIE E , BREINLINGER KEITH J , HOBBS ERIC D , LORANGER MARC , SLOCUM ALEXANDER H , WILSON ADRIAN S
IPC分类号： G01R31/26 , H01L21/66
CPC分类号： G01R31/2891
摘要： Devices under test (DUTs) can be tested in a test system that includes an aligner and test cells. A DUT can be moved into and clamped in an aligned position on a carrier in the aligner. In the align position, electrically conductive terminals of the DUT can be in a predetermined position with respect to carrier alignment features of the carrier. The DUT/carrier combination can then be moved from the aligner into one of the test cells, where alignment features of the carrier are mechanically coupled with alignment features of a contactor in the test cell. The mechanical coupling automatically aligns terminals of the DUT with probes of the contactor. The probes thus contact and make electrical connections with the terminals of the DUT. The DUT is then tested. The aligner and each of the test cells can be separate and independent devices so that a DUT can be aligned in the aligner while other DUTs, having previously been aligned to a carrier in the aligner, are tested in a test cell.
摘要翻译：被测设备（DUT）可以在包括对准器和测试单元的测试系统中进行测试。 DUT可以被移动并被夹持在对准器中的载体上的对准位置。在对准位置，DUT的导电端子可以相对于载体的载体对准特征处于预定位置。然后可以将DUT /载体组合从对准器移动到测试单元之一中，其中载体的对准特征与测试单元中的接触器的对准特征机械耦合。机械联轴器将DUT的端子自动对准接触器的探头。探头因此与DUT的端子接触并进行电气连接。然后测试DUT。对准器和每个测试单元可以是分离和独立的器件，使得DUT可以在对准器中对准，而在测试单元中测试已经与对准器中的载体对准的其它DUT。

4. 发明申请

WO2012128907A3 NON-LINEAR VERTICAL LEAF SPRING 审中-公开
标题翻译：非线性垂直叶片弹簧
公开(公告)号：WO2012128907A3
公开(公告)日：2012-11-08
申请号：PCT/US2012027216
申请日：2012-03-01
申请人： FORMFACTOR INC , BREINLINGER KEITH J , ARMSTRONG MICHAEL J , ELDRIDGE BENJAMIN N , GRITTERS JOHN K , HOBBS ERIC D
发明人： BREINLINGER KEITH J , ARMSTRONG MICHAEL J , ELDRIDGE BENJAMIN N , GRITTERS JOHN K , HOBBS ERIC D
IPC分类号： G01R1/067 , G01R31/26 , G01R31/28
CPC分类号： G01R1/06716 , G01R1/06733 , G01R1/07357 , H01R13/2407 , H01R43/16 , Y10T29/49204
摘要： An electrically conductive contact element can include a first base and a second base with elongate, spaced apart leaves between the bases. A first end of each leaf can be coupled to the first base and an opposite second end of the leaf can be coupled to the second base. A body of the leaf between the first end and the second end can be sufficiently elongate to respond to a force through said contact element substantially parallel with the first axis and the second axis by first compressing axially while said force is less than a buckling force and then bending while said force is greater than the buckling force.
摘要翻译：导电接触元件可以包括第一基座和第二基座，在基座之间具有细长的间隔开的叶片。每个叶片的第一端可以联接到第一基部，并且叶片的相对的第二端部可以联接到第二基部。在第一端和第二端之间的叶片的本体可以充分地伸长以响应通过所述接触元件基本平行于第一轴线和第二轴线的力，同时通过首先轴向压缩，同时所述力小于屈曲力，并且然后在所述力大于屈曲力的情况下弯曲。

5. 发明申请

WO2010065353A3 MECHANICAL DECOUPLING OF A PROBE CARD ASSEMBLY TO IMPROVE THERMAL RESPONSE 审中-公开
标题翻译：探针卡组件的机械解耦改善热响应
公开(公告)号：WO2010065353A3
公开(公告)日：2010-08-05
申请号：PCT/US2009065426
申请日：2009-11-21
申请人： FORMFACTOR INC , BREINLINGER KEITH J , HOBBS ERIC D
发明人： BREINLINGER KEITH J , HOBBS ERIC D
IPC分类号： H01L21/66
CPC分类号： G01R31/2889
摘要： A stiffener structure, a wiring substrate, and a frame having a major surface disposed in a stack can be part of a probe card assembly. The wiring substrate can be disposed between the frame and the stiffener structure, and probe substrates can be coupled to the frame by one or more non-adjustably fixed coupling mechanisms. Each of the probe substrates can have probes that are electrically connected through the probe card assembly to an electrical interface on the wiring substrate to a test controller. The non-adjustably fixed coupling mechanisms can be simultaneously stiff in a first direction perpendicular to the major surface and flexible in a second direction generally parallel to the major surface.
摘要翻译：加强结构，布线基板和主表面布置成堆叠的框架可以是探针卡组件的一部分。布线衬底可以布置在框架和加强件结构之间，并且探针衬底可以通过一个或多个不可调整固定的耦合机构耦合到框架。每个探针基底可以具有通过探针卡组件电连接到布线基底上的电接口到测试控制器的探针。不可调节地固定的联接机构可以在垂直于主表面的第一方向上同时是刚性的，并且在大致平行于主表面的第二方向上可以是柔性的。

6. 发明申请

WO2011082183A3 WAFER TEST CASSETTE SYSTEM 审中-公开
标题翻译： WAFER测试CASSETTE系统
公开(公告)号：WO2011082183A3
公开(公告)日：2011-11-17
申请号：PCT/US2010062260
申请日：2010-12-28
申请人： FORMFACTOR INC , BREINLINGER KEITH J , HOBBS ERIC D
发明人： BREINLINGER KEITH J , HOBBS ERIC D
IPC分类号： H01L21/66 , G01R31/26
CPC分类号： G01R1/0491 , G01R31/3025
摘要： Wafer cassette systems and methods of using wafer cassette systems. A wafer cassette system can include a base and a probe card assembly. The base and the probe card assembly can each include complementary interlocking alignment elements. The alignment elements can constrain relative movement of the base and probe card assembly in directions parallel to a wafer receiving surface of the base, while permitting relative movement in a direction perpendicular to the receiving surface.
摘要翻译：晶片盒系统和使用晶片盒系统的方法。晶片盒系统可以包括基座和探针卡组件。底座和探针卡组件可各自包括互补的互锁对准元件。对准元件可以限制底座和探针卡组件在平行于底座的晶片接收表面的方向上的相对移动，同时允许在垂直于接收表面的方向上的相对移动。

7. 发明申请

WO2009042679A3 STIFFENER ASSEMBLY FOR USE WITH TESTING DEVICES 审中-公开
标题翻译：强化装置与测试装置一起使用
公开(公告)号：WO2009042679A3
公开(公告)日：2009-07-09
申请号：PCT/US2008077512
申请日：2008-09-24
申请人： FORMFACTOR INC , HOBBS ERIC D , MCFARLAND ANDREW W
发明人： HOBBS ERIC D , MCFARLAND ANDREW W
IPC分类号： G01R1/067 , H01L21/66 , H01R12/00
CPC分类号： G01R1/07378
摘要： A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener assembly for use with testing devices can be part of a probe card assembly that can include a stiffener assembly comprising an upper stiffener coupled to a plurality of lower stiffeners; and a substrate constrained between the upper stiffener and the plurality of lower stiffeners, the stiffener assembly restricting non-planar flex of the substrate while facilitating radial movement of the substrate with respect to the stiffener assembly.
摘要翻译：本文提供了一种与测试装置一起使用的加强装置。在一些实施例中，用于与测试装置一起使用的加强件组件可以是探针卡组件的一部分，其可以包括加强件组件，该加强件组件包括联接到多个下加强件的上加强件; 以及限制在所述上加强件和所述多个下加强件之间的衬底，所述加强件组件限制所述衬底的非平面弯曲，同时促进所述衬底相对于所述加强件组件的径向移动。

8. 发明申请

WO2009042976A2 APPARATUS FOR TESTING DEVICES 审中-公开
标题翻译：设备测试设备
公开(公告)号：WO2009042976A2
公开(公告)日：2009-04-02
申请号：PCT/US2008078036
申请日：2008-09-26
申请人： FORMFACTOR INC , HOBBS ERIC D , KAWAMATA NOBUHIRO , MCFARLAND ANDREW W , URAKAWA YOICHI , REYNOLDS CARL V
发明人： HOBBS ERIC D , KAWAMATA NOBUHIRO , MCFARLAND ANDREW W , URAKAWA YOICHI , REYNOLDS CARL V
IPC分类号： H01L21/66
CPC分类号： G01R31/2863 , G01R31/2889 , G01R31/31905
摘要： Methods and apparatus for testing semiconductor devices are provided herein. In some embodiments, an assembly for testing semiconductor devices can include a probe card assembly; and a thermal barrier disposed proximate an upper surface of the probe card assembly, the thermal barrier can restrict thermal transfer between tester side boundary conditions and portions of the probe card assembly disposed beneath the thermal barrier.
摘要翻译：本文提供了用于测试半导体器件的方法和设备。在一些实施例中，用于测试半导体器件的组件可以包括探针卡组件; 以及设置在探针卡组件的上表面附近的热障，热障可以限制测试仪侧边界条件和布置在热障下面的探针卡组件的部分之间的热传递。

9. 发明申请

WO2008082859A3 STIFFENER ASSEMBLY FOR USE WITH TESTING DEVICES 审中-公开
标题翻译：强化装置与测试装置一起使用
公开(公告)号：WO2008082859A3
公开(公告)日：2008-11-27
申请号：PCT/US2007086892
申请日：2007-12-08
申请人： FORMFACTOR INC , HOBBS ERIC D , MCFARLAND ANDREW W
发明人： HOBBS ERIC D , MCFARLAND ANDREW W
IPC分类号： G01R31/02 , G01R31/26
CPC分类号： G01R1/07378
摘要： A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener for use with testing devices includes an inner member; an outer member disposed in a predominantly spaced apart relation to the inner member; and a plurality of alignment mechanisms for orienting the inner and outer members with respect to each other, wherein the alignment mechanisms transfer forces applied to a lower surface of the inner member to the outer member and provide the predominant conductive heat transfer passageway between the inner and outer members.
摘要翻译：本文提供了一种与测试装置一起使用的加强装置。在一些实施例中，用于与测试装置一起使用的加强件包括内部构件; 与所述内部构件以主要间隔开的关系设置的外部构件; 以及用于使内部和外部构件相对于彼此定向的多个对准机构，其中对准机构将施加到内部构件的下表面的力传递到外部构件，并且在内部构件和内部构件之间提供主要的导电传热通道外部成员。

10. 发明申请

WO2008118677A3 STIFFENING CONNECTOR AND PROBE CARD ASSEMBLY INCORPORATING SAME 审中-公开
标题翻译：加固连接器和探头卡组合
公开(公告)号：WO2008118677A3
公开(公告)日：2009-12-30
申请号：PCT/US2008057284
申请日：2008-03-17
申请人： FORMFACTOR INC , HOBBS ERIC D , MATHIEU GAETAN L
发明人： HOBBS ERIC D , MATHIEU GAETAN L
IPC分类号： G01R1/06
CPC分类号： G01R31/2889 , G01R1/07342
摘要： A stiffening connector assembly and methods of use are provided herein. In some embodiments a stiffening connector assembly includes a connector configured to be coupled to a substrate; and a mechanism coupled to the connector and configured to restrict rotational movement of the connector with respect to the substrate when coupled thereto. The mechanism may further provide a lateral degree of freedom of movement in a direction substantially parallel to the substrate.
摘要翻译：本文提供了加强连接器组件和使用方法。在一些实施例中，加强连接器组件包括被配置为联接到基板的连接器; 以及耦合到所述连接器并且被配置为当连接到所述连接器时相对于所述基板限制所述连接器的旋转运动的机构。该机构还可以在基本上平行于基底的方向上提供横向移动自由度。

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