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    • 9. 发明申请
    • ELECTROSTATIC CHUCK FOR SEMICONDUCTOR WORKPIECES
    • 用于半导体工件的静电切割机
    • WO2006115731A1
    • 2006-11-02
    • PCT/US2006/013078
    • 2006-04-06
    • APPLIED MATERIALS, INC.ISHIKAWA, TetsuyaLUE, Brian
    • ISHIKAWA, TetsuyaLUE, Brian
    • H01L21/683B23Q3/15H02N13/00B23Q3/154
    • H02N13/00H01L21/67103H01L21/6831
    • A chuck for a semiconductor workpiece features integrated resistive heating and electrostatic bipolar chucking elements on a thermal pedestal. These integrated heating and chucking elements maintain wafer flatness, as well as uniformity of an underlying gap accommodating a thermal gas between the workpiece and the chuck. In accordance with one embodiment of the present invention, a laminated Kapton wafer heater is attached to the top of the thermal surface, under the wafer: At least two electrical voltage zones are isolated within the heater, in order to create a chucking force between the chuck and the wafer without having to contact the wafer with an electrical conductor. These voltage zones can be created by using separate conducting elements as well as by imposing a DC bias on zones including the resistive heating elements.
    • 用于半导体工件的卡盘在热基座上具有集成的电阻加热和静电双极夹紧元件。 这些集成的加热和夹紧元件保持晶圆平坦度,以及在工件和卡盘之间容纳热气体的底部间隙的均匀性。 根据本发明的一个实施例,层压的Kapton晶片加热器附着在晶片下面的热表面的顶部:至少两个电压区在加热器内隔离,以便在加热器之间产生夹紧力 卡盘和晶片,而不必与电导体接触晶片。 这些电压区可以通过使用单独的导电元件以及通过在包括电阻加热元件的区域上施加DC偏压来产生。