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    • 5. 发明申请
    • MOCVD SINGLE CHAMBER SPLIT PROCESS FOR LED MANUFACTURING
    • 用于LED制造的MOCVD单室分离工艺
    • WO2010129183A2
    • 2010-11-11
    • PCT/US2010032032
    • 2010-04-22
    • APPLIED MATERIALS INCKRYLIOUK OLGA
    • KRYLIOUK OLGA
    • H01L33/02
    • C23C16/303C23C16/4405C23C16/45563C23C16/45574H01L21/0237H01L21/0254H01L21/0262H01L33/007
    • In one embodiment a method for fabricating a compound nitride semiconductor device comprising positioning one or more substrates on a susceptor in a processing region of a metal organic chemical vapor deposition (MOCVD) chamber comprising a showerhead, depositing a gallium nitride layer over the substrate with a thermal chemical-vapor-deposition process within the MOCVD chamber by flowing a first gallium containing precursor and a first nitrogen containing precursor through the showerhead into the MOCVD chamber, removing the one or more substrates from the MOCVD chamber without exposing the one or more substrates to atmosphere, flowing a chlorine gas into the processing chamber to remove contaminants from the showerhead, transferring the one or more substrates into the MOCVD chamber after removing contaminants from the showerhead, and depositing an InGaN layer over the GaN layer with a thermal chemical-vapor-deposition process within the MOCVD chamber is provided.
    • 在一个实施例中,一种制造复合氮化物半导体器件的方法,包括在包括喷头的金属有机化学气相沉积(MOCVD)室的处理区域中的基座上放置一个或多个衬底,在衬底上沉积氮化镓层 通过将第一含镓前体和第一含氮前体通过喷头喷射到MOCVD室中,在MOCVD室内的热化学气相沉积工艺,从MOCVD室中移除一个或多个基板,而不将一个或多个基板暴露于 将氯气流入处理室以从喷头去除污染物,在从喷头中除去污染物之后将一个或多个基板转移到MOCVD室中,并且在GaN层上沉积具有热化学气相沉积的InGaN层, 提供MOCVD室内的沉积工艺。