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1. 发明申请

WO2013036561A2 BROAD-AREA LIGHTING SYSTEMS 审中-公开
标题翻译：广域照明系统
公开(公告)号：WO2013036561A2
公开(公告)日：2013-03-14
申请号：PCT/US2012/053841
申请日：2012-09-06
申请人： COOLEDGE LIGHTING, INC. , TISCHLER, Michael , SCHICK, Philippe , SHEEN, Calvin, Wade
发明人： TISCHLER, Michael , SCHICK, Philippe , SHEEN, Calvin, Wade
IPC分类号： H01L25/075 , F21V5/04 , F21V5/00 , F21K99/00
CPC分类号： H05K3/32 , H01L21/6835 , H01L24/24 , H01L24/82 , H01L25/0753 , H01L33/08 , H01L33/44 , H01L33/48 , H01L33/50 , H01L2221/6834 , H01L2221/68363 , H01L2224/16225 , H01L2224/24101 , H01L2224/24227 , H01L2224/245 , H01L2224/24992 , H01L2224/32238 , H01L2224/73204 , H01L2224/82104 , H01L2224/82105 , H01L2224/82138 , H01L2224/82855 , H01L2224/83424 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83486 , H01L2224/96 , H01L2924/01029 , H01L2924/07802 , H01L2924/07811 , H01L2924/12041 , H01L2924/12042 , H01L2924/15153 , H01L2924/15787 , H05K3/321 , H05K13/00 , Y10T29/49117 , Y10T29/4913 , H01L2924/00014 , H01L2924/01049 , H01L2924/0105 , H01L2924/053 , H01L2224/82 , H01L2924/01013 , H01L2924/01079 , H01L2924/01047 , H01L2924/01078 , H01L2924/00
摘要： In accordance with certain embodiments, illumination systems are formed by aligning light-emitting elements with optical elements and/or disposing light-conversion materials on the light-emitting elements, as well as by providing electrical connectivity to the light-emitting elements
摘要翻译：根据某些实施例，通过将发光元件与光学元件对准和/或在发光元件上设置光转换材料以及通过提供与发光元件的电连接来形成照明系统

2. 发明申请

WO2011082497A4 PACKAGE FOR LIGHT EMITTING AND RECEIVING DEVICES 审中-公开
标题翻译：包装的发光和接收装置
公开(公告)号：WO2011082497A4
公开(公告)日：2011-09-29
申请号：PCT/CA2011050006
申请日：2011-01-10
申请人： COOLEDGE LIGHTING INC , SPEIER INGO , ASHDOWN IAN , SCHICK PHILIPPE
发明人： SPEIER INGO , ASHDOWN IAN , SCHICK PHILIPPE
IPC分类号： H01L33/48 , H01L33/60 , H01L33/62
CPC分类号： H01L25/167 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/486 , H01L33/50 , H01L33/507 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： A package includes one or more lighting devices having electrical contact points, a substrate for supporting the lighting devices, a plurality of electrically conductive traces defined on the substrate so as to provide electrical contacts in close proximity to contact points of the lighting devices, a planarization or encapsulation layer applied on the substrate so as to cover at least the conductive traces thereon, and a conductive layer deposited over the contact points on each of the lighting devices and the electrical contacts of the conductive traces so as to electrically interconnect the respective devices and traces to provide a circuit path for supply of electrical drive power to the lighting devices via the conductive traces.
摘要翻译：封装包括具有电接触点的一个或多个照明装置，用于支撑照明装置的衬底，限定在衬底上的多个导电迹线以提供紧邻照明装置的接触点的电接触，平坦化或封装层，以至少覆盖其上的导电迹线，以及沉积在每个发光器件上的接触点和导电迹线的电触点上的导电层，以便电连接相应的器件，以及迹线以提供用于经由导电迹线向照明设备供应电驱动功率的电路路径。

3. 发明申请

WO2006105638A1 ELECTRONIC DEVICE PACKAGE WITH AN INTEGRATED EVAPORATOR 审中-公开
标题翻译：具有集成蒸发器的电子设备包装
公开(公告)号：WO2006105638A1
公开(公告)日：2006-10-12
申请号：PCT/CA2006/000492
申请日：2006-04-04
申请人： TIR SYSTEMS LTD. , SCHICK, Philippe
发明人： SCHICK, Philippe
IPC分类号： H01L23/46 , H01L23/02
CPC分类号： F21V29/51 , F21V29/54 , F21V29/83 , F28D15/0275 , F28D15/04 , H01L23/3675 , H01L23/427 , H01L33/648 , H01L2924/0002 , H01L2924/12044 , H05K1/0203 , H05K1/0209 , H05K2201/10106 , H01L2924/00
摘要： The present invention provides an electronic device package that can be fabricated using standard package fabrication technologies while providing a desired level of thermal transfer capability to an attachable thermal management system. The electronic device package according to the present invention comprises a housing that is specifically designed to couple with an evaporator portion of a thermal management system, for example a heat pipe. One or more electronic devices are mounted in thermal contact with the evaporator portion of the thermal management system. Upon completion of the fabrication of the package using standard techniques, the evaporator portion of the electronic device package is operatively coupled with a secondary portion of the thermal management system. In this manner the electronic device package can be fabricated to incorporate a desired thermal management system, while being fabricated using standard package fabrication processes and machinery.
摘要翻译：本发明提供一种可以使用标准封装制造技术制造的电子器件封装，同时向可附接的热管理系统提供期望水平的热传递能力。根据本发明的电子器件封装包括专门设计成与热管理系统（例如热管）的蒸发器部分连接的壳体。一个或多个电子装置与热管理系统的蒸发器部分热接触地安装。在使用标准技术完成封装的制造之后，电子器件封装的蒸发器部分与热管理系统的次级部分可操作地耦合。以这种方式，可以制造电子器件封装以并入期望的热管理系统，同时使用标准封装制造工艺和机械制造。

4. 发明申请

WO2011082497A1 PACKAGE FOR LIGHT EMITTING AND RECEIVING DEVICES 审中-公开
标题翻译：用于发光和接收装置的包装
公开(公告)号：WO2011082497A1
公开(公告)日：2011-07-14
申请号：PCT/CA2011/050006
申请日：2011-01-10
申请人： COOLEDGE LIGHTING INC. , SPEIER , Ingo , ASHDOWN, Ian , SCHICK , Philippe
发明人： SPEIER , Ingo , ASHDOWN, Ian , SCHICK , Philippe
IPC分类号： H01L33/48 , H01L33/60 , H01L33/62
CPC分类号： H01L25/167 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/486 , H01L33/50 , H01L33/507 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： A package includes one or more lighting devices having electrical contact points, a substrate for supporting the lighting devices, a plurality of electrically conductive traces defined on the substrate so as to provide electrical contacts in close proximity to contact points of the lighting devices, a planarization or encapsulation layer applied on the substrate so as to cover at least the conductive traces thereon, and a conductive layer deposited over the contact points on each of the lighting devices and the electrical contacts of the conductive traces so as to electrically interconnect the respective devices and traces to provide a circuit path for supply of electrical drive power to the lighting devices via the conductive traces.
摘要翻译：包装包括一个或多个具有电接触点的照明装置，用于支撑照明装置的基板，限定在基板上的多个导电迹线，以便提供紧靠照明装置的接触点的电触头，平坦化或封装层，以便至少覆盖其上的导电迹线，以及沉积在每个照明装置上的接触点和导电迹线的电触点上的导电层，以便电连接相应的器件和轨迹以提供用于经由导电迹线向照明装置提供电驱动电力的电路路径。

5. 发明申请

WO1993001567A1 CAR PARK MANAGEMENT METHOD AND SYSTEM 审中-公开
标题翻译：汽车公园管理方法与系统
公开(公告)号：WO1993001567A1
公开(公告)日：1993-01-21
申请号：PCT/CH1992000138
申请日：1992-07-08
申请人： SCHICK, Philippe
IPC分类号： G07B15/04
CPC分类号： G08G1/14 , G07B15/04 , G08G1/142 , G08G1/146 , G08G1/149
摘要： A car park management method and system, wherein a system (2, 20, 21) for monitoring the use of each parking space individually is combined, through a computer system (10), with a payment system (5, 50), whereby the parking fee, which corresponds exactly to the actual parking time, is collected for each parking space individually. Said management system further comprises a light signalling system (3, 30, 31, 32, 33) for guiding a user to the next free space, as well as a video monitoring system (9, 90) for preventing fraud. Said management system, which is usable in pre-payment or post-payment car parks, simplifies parking management for the operator and enhances user convenience.
摘要翻译：一种停车场管理方法和系统，其中，用于通过计算机系统（10）与支付系统（5,50）组合用于单独监视每个停车空间的使用的系统（2,20,21），由此每个停车位分别收集与实际停车时间相对应的停车费。所述管理系统还包括用于将用户引导到下一个可用空间的光信号系统（3,30,31,32,33）以及用于防止欺诈的视频监控系统（9,90）。可用于预付款或后付费停车场的所述管理系统简化了操作员的停车管理，并提高了用户便利性。

6. 发明申请

WO2012000114A1 ELECTRONIC DEVICES WITH YIELDING SUBSTRATES 审中-公开
标题翻译：带有焊接基板的电子设备
公开(公告)号：WO2012000114A1
公开(公告)日：2012-01-05
申请号：PCT/CA2011/050399
申请日：2011-06-29
申请人： COOLEDGE LIGHTNING INC. , TISCHLER, Michael , SCHICK, Philippe , ASHDOWN, Ian , SHEEN, Calvin Wade , JUNGWIRTH, Paul
发明人： TISCHLER, Michael , SCHICK, Philippe , ASHDOWN, Ian , SHEEN, Calvin Wade , JUNGWIRTH, Paul
IPC分类号： H01L29/02 , H01L23/488 , H01L29/40
CPC分类号： F21K9/66 , F21K9/20 , F21K9/275 , F21K9/278 , F21K9/64 , F21K9/65 , F21V3/02 , F21V9/30 , F21V23/003 , F21V23/02 , F21V29/74 , F21Y2115/10 , G02F1/133603 , H01L23/367 , H01L23/4985 , H01L23/5387 , H01L24/32 , H01L24/83 , H01L25/0753 , H01L27/156 , H01L31/0468 , H01L33/0025 , H01L33/06 , H01L33/08 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/36 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/505 , H01L33/58 , H01L33/60 , H01L33/62 , H01L51/0097 , H01L2224/06102 , H01L2224/16225 , H01L2224/2929 , H01L2224/32225 , H01L2224/73204 , H01L2224/83385 , H01L2224/83851 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01063 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/10253 , H01L2924/10321 , H01L2924/10322 , H01L2924/10323 , H01L2924/10324 , H01L2924/10328 , H01L2924/10329 , H01L2924/1033 , H01L2924/10331 , H01L2924/10332 , H01L2924/10333 , H01L2924/10334 , H01L2924/10335 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/381 , H02S30/00 , H05B33/0854 , H05B37/0218 , H05B37/0227 , H05B37/0245 , H05K1/189 , H05K3/323 , H05K2201/09036 , H05K2201/10106 , H05K2203/302 , H01L2924/01015 , H01L2924/01031 , H01L2924/01051 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
摘要： In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
摘要翻译：根据某些实施例，尽管半导体管芯的表面具有任何非平面性或半导体管芯接触件的非共面性，半导体管芯也用压力激活的粘合剂直接粘附到屈服基底上。

7. 发明申请

WO2011072373A1 METHOD AND MAGNETIC TRANSFER STAMP FOR TRANSFERRING SEMICONDUCTOR DICE USING MAGNETIC TRANSFER PRINTING TECHNIQUES 审中-公开
标题翻译：使用磁性传输印刷技术传输半导体数字的方法和磁转印
公开(公告)号：WO2011072373A1
公开(公告)日：2011-06-23
申请号：PCT/CA2010/001950
申请日：2010-12-14
申请人： COOLEDGE LIGHTING INC. , ASHDOWN, Ian , SPEIER, Ingo , SCHICK, Philippe , SHEEN, Calvin Wade
发明人： ASHDOWN, Ian , SPEIER, Ingo , SCHICK, Philippe , SHEEN, Calvin Wade
IPC分类号： H01L21/67 , H01L21/58 , H01L33/00
CPC分类号： H01L24/95 , H01L21/6835 , H01L24/75 , H01L24/83 , H01L2221/6835 , H01L2221/68368 , H01L2221/68381 , H01L2224/2919 , H01L2224/83192 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/01058 , H01L2924/0106 , H01L2924/01064 , H01L2924/01066 , H01L2924/01073 , H01L2924/01075 , H01L2924/01078 , H01L2924/01088 , H01L2924/01094 , H01L2924/01105 , H01L2924/0132 , H01L2924/0133 , H01L2924/0665 , H01L2924/14 , H01L2924/1461 , H01L2924/19041 , H01L2924/00 , H01L2924/01027 , H01L2924/01028 , H01L2924/01026
摘要： Releasable semiconductor dice are deposited with a magnetic layer a nd held by magnetic forces to a magnetic or electromagnetic transfer stamp for the transfer of the dice from a host substrate directly or indirectly to a target substrate.
摘要翻译：可释放的半导体管芯被磁性层沉积，并且通过磁力保持在磁性或电磁传递印模上，以将芯片从主体衬底直接或间接地转移到目标衬底。

8. 发明申请

WO2007053939A1 PASSIVE THERMAL MANAGEMENT SYSTEM 审中-公开
标题翻译：被动热管理系统
公开(公告)号：WO2007053939A1
公开(公告)日：2007-05-18
申请号：PCT/CA2006/001827
申请日：2006-11-08
申请人： TIR SYSTEMS LTD. , SCHICK, Philippe , JAMES, Daryl
发明人： SCHICK, Philippe , JAMES, Daryl
IPC分类号： F28F1/12 , F21V15/01 , F21V15/06 , F28D1/04
CPC分类号： F21V29/004 , F21V29/713 , F21V29/77 , F21V29/773 , F28D15/0266 , F28D15/0275 , F28F1/14 , F28F1/20 , F28F1/24 , F28F1/32 , F28F1/34
摘要： A traditional passive thermal management system can only be used effectively in a single orientation because it relies on the buoyancy of the heated air to create natural convection. A passive thermal management system is provided which includes means for transferring heat away from a heat source (10) in any orientation. The system comprises a heat pipe (14) which is thermally coupled to the heat source (10). The heat pipe (14) is capable of transferring heat away from the heat source (10), wherein this heat is transferred along the length of the heat pipe (14). Thermally coupled to the heat pipe (14) is a fin system (12), which provides a means for extraction of the heat from the heat pipe (14) and transfer of this heat to the environment thereby dissipating the heat generated at the heat source (10). The fin system (12) is configured to provide a desired level of heat transfer to the environment independent of the orientation of the thermal management system.
摘要翻译：传统的被动热管理系统只能在单一方向上有效使用，因为它依赖于热空气的浮力来产生自然对流。提供了一种被动热管理系统，其包括用于以任何方向从热源（10）传递热量的装置。该系统包括热耦合到热源（10）的热管（14）。热管（14）能够将热量从热源（10）传出，其中该热量沿着热管（14）的长度传送。与热管（14）热耦合的是翅片系统（12），其提供用于从热管（14）提取热量并将热量传递到环境的装置，从而消散在热源处产生的热量（10）。翅片系统（12）被配置为提供与热管理系统的取向无关的所需水平的传热到环境。

9. 发明申请

WO2006056066A1 INTEGRATED MODULAR LIGHTING UNIT 审中-公开
标题翻译：集成模块化灯具
公开(公告)号：WO2006056066A1
公开(公告)日：2006-06-01
申请号：PCT/CA2005/001792
申请日：2005-11-29
申请人： TIR SYSTEMS LTD. , ASHDOWN, Ian , JUNGWIRTH, Paul , ROBINSON, Shane, P. , SCHICK, Philippe , SPEIER, Ingo , YORK, Allan, Brent
发明人： ASHDOWN, Ian , JUNGWIRTH, Paul , ROBINSON, Shane, P. , SCHICK, Philippe , SPEIER, Ingo , YORK, Allan, Brent
IPC分类号： H05B33/00 , H05B37/02 , H05B33/12 , F21S2/00
CPC分类号： F21V29/51 , F21S6/00 , F21S6/007 , F21V9/08 , F21V23/0457 , F21V29/004 , F21V29/54 , F21V29/717 , F21V29/763 , F21Y2115/10 , H05B33/0869
摘要： The present invention provides an integrated self-contained lighting module which can be used on its own, or in conjunction with other modules to produce white light, or light of any other colour within the colour spectrum. Each module comprises one or more light-emitting elements, a drive and control system, a feedback system, thermal management system, optical system, and optionally a communication system enabling communication between modules and/or other control systems. Depending on the configuration, the lighting module can operatc autonomously or its functionality can be determined based on either or both internal signals and externally received signals.
摘要翻译：本发明提供一种集成的独立照明模块，其可以单独使用，或与其它模块结合使用以产生白光，或者在色谱范围内的任何其它颜色的光。每个模块包括一个或多个发光元件，驱动和控制系统，反馈系统，热管理系统，光学系统和可选地实现模块和/或其他控制系统之间的通信的通信系统。根据配置，照明模块可以自动操作，或者可以基于内部信号和外部接收信号中的一个或两个来确定其功能。

10. 发明申请

WO2015023540A1 LIGHT-EMITTING ELEMENT REPAIR IN ARRAY-BASED LIGHTING DEVICES 审中-公开
标题翻译：基于阵列照明设备的发光元件修复
公开(公告)号：WO2015023540A1
公开(公告)日：2015-02-19
申请号：PCT/US2014/050376
申请日：2014-08-08
申请人： COOLEDGE LIGHTING INC. , TISCHLER, Michael, A. , PINNINGTON, Thomas , SCHICK, Philippe , JUNGWIRTH, Paul
发明人： TISCHLER, Michael, A. , PINNINGTON, Thomas , SCHICK, Philippe , JUNGWIRTH, Paul
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/62 , H01L2924/0002 , H05B33/0893 , H05B37/036 , H05B37/04 , H05K1/0268 , H05K1/0269 , H05K1/0386 , H05K1/141 , H05K1/147 , H05K3/225 , H05K3/288 , H05K3/305 , H05K2201/049 , H05K2201/09045 , H05K2201/09063 , H05K2201/09918 , H05K2201/10106 , H05K2201/10113 , H05K2201/10303 , H05K2201/10386 , H05K2201/10757 , H05K2201/10795 , H05K2201/10871 , H05K2201/10878 , H05K2201/2054 , H05K2203/1545 , H05K2203/162 , H05K2203/166 , H05K2203/175 , H05K2203/176 , H01L2924/00
摘要： A method for repairing a lighting system comprises identifying a fault location; disposing over or under the substrate at the fault location a patch comprising (i) a patch substrate, (ii) two conductive traces disposed on the patch substrate, and (iii) a replacement light-emitting element electrically coupled to the two conductive traces of the patch; and electrically connecting the replacement light-emitting element across the fault location by electrically connecting each of the conductive traces of the patch to one of the conductive traces defining the fault location.
摘要翻译：修理照明系统的方法包括识别故障位置; 在所述故障位置处布置在所述基底之上或之下的贴片，所述贴片包括（i）贴片衬底，（ii）布置在所述贴片衬底上的两个导电迹线，以及（iii）替代发光元件，电耦合到所述两个导电迹线补丁; 以及通过将所述贴片的每个所述导电迹线电连接到限定所述故障位置的导电迹线之一来将所述替代发光元件电连接在所述故障位置上。

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