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61. 发明申请

WO2011005567A2 WIRELESS MULTIBAND SECURITY 审中-公开
标题翻译：无线多业务安全
公开(公告)号：WO2011005567A2
公开(公告)日：2011-01-13
申请号：PCT/US2010/039641
申请日：2010-06-23
申请人： MARVELL WORLD TRADE LTD. , LIU, Yong , LAMBERT, Paul A.
发明人： LIU, Yong , LAMBERT, Paul A.
IPC分类号： H04L29/06
CPC分类号： H04W12/06 , H04L63/0428 , H04L63/08 , H04L63/20 , H04W12/04 , H04W84/18 , H04W88/06
摘要： A network device includes a first physical layer (PHY) module, a second physical layer (PHY) module, and a security module. The first PHY module is configured to operate in a first frequency band. The second PHY module is configured to operate in a second frequency band. The security module is configured to establish security for the first frequency band responsive to the network device operating in the first frequency band. The security module is further configured to establish security for the second frequency band prior to the network device switching operation from the first frequency band to the second frequency band.
摘要翻译：网络设备包括第一物理层（PHY）模块，第二物理层（PHY）模块和安全模块。第一PHY模块被配置为在第一频带中操作。第二PHY模块被配置为在第二频带中操作。安全模块被配置为响应于在第一频带中操作的网络设备建立第一频带的安全性。安全模块还被配置为在网络设备从第一频带切换到第二频带之前建立第二频带的安全性。

62. 发明申请

WO2011001367A1 A GRID FOR ILLUMINATION APPARATUS 审中-公开
标题翻译：用于照明设备的网格
公开(公告)号：WO2011001367A1
公开(公告)日：2011-01-06
申请号：PCT/IB2010/052950
申请日：2010-06-29
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , LIU, Yong , YIP, Kun-Wah , LOU, Di
发明人： LIU, Yong , YIP, Kun-Wah , LOU, Di
IPC分类号： F21V11/06
CPC分类号： F21V11/06 , F21V25/00 , F21Y2103/00 , H05K9/0041
摘要： The invention relates to illumination, especially to a grid for illumination apparatus. This invention provides a grid (100) for attenuating electromagnetic radiation from a light source. The grid comprises a plurality of baffles (110), each baffle being electro conductive, wherein the plurality of baffles are configured to form a plurality of cells (120), each cell being formed as a waveguide so as to attenuate the electromagnetic radiation from the light source. In this way, the electromagnetic radiation from the light source can be reduced or prevented so as to decrease the danger to users.
摘要翻译：本发明涉及照明，特别涉及照明装置的格栅。本发明提供一种用于衰减来自光源的电磁辐射的电网（100）。栅格包括多个挡板（110），每个挡板是导电的，其中多个挡板被配置为形成多个单元（120），每个单元被形成为波导，以便衰减来自光源。以这种方式，可以减少或防止来自光源的电磁辐射，以减少对用户的危害。

63. 发明申请

WO2010044069A1 METHOD, DEVICE AND SYSTEM FOR IDENTIFYING ELECTRONIC PRODUCTS 审中-公开
标题翻译：用于识别电子产品的方法，装置和系统
公开(公告)号：WO2010044069A1
公开(公告)日：2010-04-22
申请号：PCT/IB2009/054526
申请日：2009-10-15
申请人： KONINKLIJKE PHILIPS ELECTRONICS N.V. , QIAN, Xuecheng , LIU, Yong , JIA, Yugang
发明人： QIAN, Xuecheng , LIU, Yong , JIA, Yugang
IPC分类号： G07D7/04 , G07D7/02 , G01R31/28
CPC分类号： G07D7/04 , G07D7/02
摘要： The present invention provides a technical solution to identify an electronic product by means of the intrinsic physical character thereof, for the purpose of detecting fake products. The present invention provides a technical solution for obtaining the eigenvector of an operating electronic product by using a metal coil. The metal coil receives the electromagnetic wave emitted by the electronic product and converts it to an analog electrical signal, which analog electrical signal is then converted to a digital electrical signal, and then, the digital electrical signal is processed, in order to obtain a processed signal sequence as the eigenvector of said electronic product. On the basis of extracting the eigenvector, the present invention further provides a method, an identifying device and an identifying system for identifying an electronic product. A metal coil is used in the present invention, so that it is capable of detecting electromagnetic wave signals of a quite weak intensity, and the range of electronic products that can be identified using the characteristic information of the electromagnetic wave emitted by the electronic product is broadened effectively.
摘要翻译：为了检测假冒产品，本发明提供了通过其固有物理特征识别电子产品的技术方案。本发明提供一种通过使用金属线圈获得操作电子产品的特征向量的技术方案。金属线圈接收由电子产品发射的电磁波，并将其转换为模拟电信号，然后将模拟电信号转换为数字电信号，然后对数字电信号进行处理，以获得处理信号序列作为所述电子产品的特征向量。在提取特征向量的基础上，本发明还提供了一种用于识别电子产品的方法，识别装置和识别系统。在本发明中使用金属线圈，能够检测强度很弱的电磁波信号，使用电子产品发出的电磁波的特征信息可以识别的电子产品的范围是有效扩大。

64. 发明申请

WO2010033322A3 STACKING QUAD PRE-MOLDED COMPONENT PACKAGES, SYSTEMS USING THE SAME, AND METHODS OF MAKING THE SAME 审中-公开
公开(公告)号：WO2010033322A3
公开(公告)日：2010-03-25
申请号：PCT/US2009/053597
申请日：2009-08-12
申请人： FAIRCHILD SEMICONDUCTOR CORPORATION , LIU, Yong , ALLEN, Howard , QIAN, Qiuxiao
发明人： LIU, Yong , ALLEN, Howard , QIAN, Qiuxiao
IPC分类号： H01L23/12 , H01L23/495
摘要： Pre-molded component packages that may be as thin as a leadframe for a semiconductor die, systems using the same, and methods of making the same are disclosed. The leads of an exemplary package are exposed at both surfaces at the leadframe. The packages may be stacked upon one another and electrically coupled at the exposed portions of their leads.

65. 发明申请

WO2010025012A3 MOLDED ULTRA THIN SEMICONDUCTOR DIE PACKAGES, SYSTEMS USING THE SAME, AND METHODS OF MAKING THE SAME 审中-公开
公开(公告)号：WO2010025012A3
公开(公告)日：2010-03-04
申请号：PCT/US2009/052707
申请日：2009-08-04
申请人： FAIRCHILD SEMICONDUCTOR CORPORATION , LIU, Yong
发明人： LIU, Yong
IPC分类号： H01L23/48 , H01L23/12
摘要： Disclosed are molded ultra-thin semiconductor die packages, systems that incorporate such packages, and methods of making such packages. An exemplary package comprises a leadframe having an aperture formed between the leadframe's first and second surfaces, and a plurality of leads disposed adjacent to the aperture. The package further comprises a semiconductor disposed in the aperture of the leadframe with its top surface substantially flush with the leadframe's first surface, and at least one gap between at least one side surface of the semiconductor die and at least one lead of the leadframe. A body of electrically insulating material is disposed in the at least one gap. A plurality of conductive members interconnect leads of the leadframe with conductive regions on the die's top surface, with at least one conductive member having a portion disposed over at least a portion of the body of insulating material.

66. 发明申请

WO2009114406A3 SEMICONDUCTOR DIE PACKAGE INCLUDING IC DRIVER AND BRIDGE 审中-公开
公开(公告)号：WO2009114406A3
公开(公告)日：2009-09-17
申请号：PCT/US2009/036290
申请日：2009-03-06
申请人： FAIRCHILD SEMICONDUCTOR CORPORATION , LIU, Yong , ZHANG, Jiangyuan , QIAN, Qiuxiao
发明人： LIU, Yong , ZHANG, Jiangyuan , QIAN, Qiuxiao
IPC分类号： H01L23/48 , H01L23/495
摘要： A semiconductor die package. Embodiments of the semiconductor die package are usable in backlight circuitry. Systems in packages may include a bridge circuit or a part thereof, and a integrated circuit die, such as a driver die, encapsulated by a molding material or other package. The bridge circuit may be stacked on opposing surfaces of a leadframe.

67. 发明申请

WO2009042546A2 STACKED DUAL-DIE PACKAGES, METHODS OF MAKING, AND SYSTEMS INCORPORATING SAID PACKAGES 审中-公开
标题翻译：堆叠双重包装，制造方法和包含所述包装的系统
公开(公告)号：WO2009042546A2
公开(公告)日：2009-04-02
申请号：PCT/US2008/077238
申请日：2008-09-22
申请人： FAIRCHILD SEMICONDUCTOR CORPORATION , LIU, Yong , ALLEN, Howard , QIAN, Qiuxiao , JU, Jianhong
发明人： LIU, Yong , ALLEN, Howard , QIAN, Qiuxiao , JU, Jianhong
IPC分类号： H01L23/12
CPC分类号： H01L24/06 , H01L23/3121 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/39 , H01L24/48 , H01L24/49 , H01L24/50 , H01L24/73 , H01L25/0657 , H01L25/18 , H01L25/50 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/16145 , H01L2224/16225 , H01L2224/16245 , H01L2224/2919 , H01L2224/32145 , H01L2224/32245 , H01L2224/37599 , H01L2224/45014 , H01L2224/45139 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/83101 , H01L2224/83192 , H01L2224/83801 , H01L2224/8385 , H01L2224/83855 , H01L2224/85399 , H01L2224/92247 , H01L2225/0651 , H01L2225/06513 , H01L2225/06527 , H01L2225/06589 , H01L2924/00011 , H01L2924/00014 , H01L2924/01023 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/0781 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3025 , H01L2924/0665 , H01L2224/45099 , H01L2924/00 , H01L2924/00012 , H01L2924/01049 , H01L2224/37099
摘要： A semiconductor die package. It includes a substrate having a first surface and a second surface, a first semiconductor die having its front surface facing the first surface of the substrate, a conductive adhesive disposed between the first semiconductor die and the first surface of the substrate, and a second semiconductor die located on the first semiconductor die. The front surface of second semiconductor die faces away from the first semiconductor die, and the back surface faces toward the first semiconductor die. A plurality of conductive structures electrically couple regions at the front surface of the second semiconductor die to conductive regions at the first surface of the substrate.
摘要翻译：半导体管芯封装。其包括具有第一表面和第二表面的基板，第一半导体管芯，其前表面面向基板的第一表面，导电粘合剂设置在第一半导体管芯与基板的第一表面之间，以及第二半导体位于第一半导体管芯上的管芯。第二半导体管芯的正面远离第一半导体管芯，并且背面朝向第一半导体管芯。多个导电结构将第二半导体管芯的前表面处的区域电耦合到衬底的第一表面处的导电区域。

68. 发明申请

WO2009042447A1 A BONDING PAD STRUCTURE ALLOWING WIRE BONDING OVER AN ACTIVE AREA IN A SEMICONDUCTOR DIE AND METHOD OF MANUFACTURING SAME 审中-公开
标题翻译：在半导体器件中通过活性区域连接线的接合片结构及其制造方法
公开(公告)号：WO2009042447A1
公开(公告)日：2009-04-02
申请号：PCT/US2008/076506
申请日：2008-09-16
申请人： FAIRCHILD SEMICONDUCTOR CORPORATION , LIU, Yong , QIAN, Qiuxiao , GRANADA, Honorio, T.
发明人： LIU, Yong , QIAN, Qiuxiao , GRANADA, Honorio, T.
IPC分类号： H01L21/60
CPC分类号： H01L23/49811 , H01L21/4853 , H01L24/03 , H01L24/05 , H01L2224/02166 , H01L2224/05184 , H01L2224/05556 , H01L2224/05557 , H01L2224/05624 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/01074 , H01L2924/01029
摘要： A wire bonding pad over an active area of a semiconductor die has grooves in two orthogonal sections thereof in the top surface of said wire bonding pad.
摘要翻译：在半导体管芯的有源区域上的引线接合焊盘在所述引线接合焊盘的顶表面中的两个正交部分具有凹槽。

69. 发明申请

WO2005099419A2 METHODS AND APPARATUS FOR MANIPULATION AND/OR DETECTION OF BIOLOGICAL SAMPLES AND OTHER OBJECTS 审中-公开
标题翻译：用于操作和/或检测生物样本和其他对象的方法和设备
公开(公告)号：WO2005099419A2
公开(公告)日：2005-10-27
申请号：PCT/US2005/012719
申请日：2005-04-13
申请人： PRESIDENT AND FELLOWS OF HARVARD COLLEGE , HAM, Donhee , WESTERVELT, Robert , HUNT, Thomas , LIU, Yong , LEE, Hakho
发明人： HAM, Donhee , WESTERVELT, Robert , HUNT, Thomas , LIU, Yong , LEE, Hakho
IPC分类号： G01R33/30 , G01R33/465 , G01R33/56
CPC分类号： G01R33/302 , B01L3/502761 , B01L2200/0668 , B01L2200/147 , B01L2300/0816 , B01L2300/0819 , B01L2300/0877 , B01L2300/1822 , B01L2300/1827 , B01L2400/043 , G01N15/1031 , G01N24/08 , G01N24/10 , G01R33/307 , G01R33/34092 , G01R33/3415 , G01R33/465 , G01R33/4808 , G01R33/5604
摘要： Methods and apparatus for manipulation, detection, imaging, characterization, sorting and/or assembly of biological or other materials, involving an integration of CMOS or other semiconductor-based technology and microfluidics. In one implementation, various components relating to the generation of electric and/or magnetic fields are implemented on an IC chip that is fabricated using standard protocols. The generated electric and/or magnetic fields are used to manipulate and/or detect one or more dielectric and/or magnetic particles and distinguish different types of particles. A microfluidic system is fabricated either directly on top of the IC chip, or as a separate entity that is then appropriately bonded to the IC chip, to facilitate the introduction and removal of cells in a biocompatible environment, or other particles/objects of interest suspended in a fluid. The patterned electric and/or magnetic fields generated by the IC chip can trap and move biological cells or other objects inside the microfluidic system. Electric and/or magnetic field generating components also may be controlled using signals of various frequencies so as to detect one or more cells, particles or objects of interest, and even the type of particle or object of interest, by measuring resonance characteristics associated with interactions between samples and one or more of the field-generating devices. Such systems may be employed in a variety of biological and medical related applications, including cell sorting and tissue assembly.
摘要翻译：用于生物或其他材料的操纵，检测，成像，表征，分类和/或组装的方法和设备，涉及CMOS或其他基于半导体的技术与微流体的集成。在一个实施方式中，在使用标准协议制造的IC芯片上实现与产生电场和/或磁场有关的各种组件。所产生的电场和/或磁场用于操纵和/或检测一个或多个电介质和/或磁性颗粒并区分不同类型的颗粒。微流体系统直接在IC芯片的顶部制造，或作为单独的实体制造，然后适当地粘合到IC芯片，以促进引入和移除生物相容性环境中的细胞或悬浮的其他粒子/目标物体在流体中。由IC芯片产生的图案化的电场和/或磁场可以捕获和移动微流体系统内部的生物细胞或其他物体。还可以使用各种频率的信号来控制电和/或磁场生成组件，以便通过测量与相互作用相关联的共振特征来检测一个或多个细胞，感兴趣的粒子或物体，甚至感兴趣的粒子或物体的类型样品与一个或多个场生成装置之间。这样的系统可用于各种生物和医学相关应用，包括细胞分选和组织装配。

70. 发明申请

WO2016053767A1 NOVEL CRYSTALLINE FORMS OF A BACE INHIBITOR, COMPOSITIONS, AND THEIR USE 审中-公开
标题翻译：一种新型的晶体形态抑制剂，组合物及其使用
公开(公告)号：WO2016053767A1
公开(公告)日：2016-04-07
申请号：PCT/US2015/052096
申请日：2015-09-25
申请人： MERCK SHARP & DOHME CORP. , TRZASKA, Scott , DANCE, Zachary, E. , LIU, Yong , VARSOLONA, Richard John , YORK, Gregory
发明人： TRZASKA, Scott , LIU, Yong , VARSOLONA, Richard John , YORK, Gregory
IPC分类号： A61P25/28 , C07D285/18 , C07D417/14
CPC分类号： C07D417/12 , C07B2200/13 , C07C309/30
摘要： The present invention provides four crystalline forms of verubecestat, as well as pharmaceutically acceptable compositions thereof, each of which may be useful in treating, preventing, ameliorating, and/or delaying the onset of an Aβ pathology and/or a symptom or symptoms thereof. Non-limiting examples of such Aβ pathologies, including Alzheimer's disease, are disclosed herein.
摘要翻译：本发明提供了四种结晶形式的止卵石，以及其药学上可接受的组合物，其各自可用于治疗，预防，改善和/或延迟Aβ病理学和/或其症状或症状的发作。这种Aβ病理学的非限制性实例，包括阿尔茨海默病，在此公开。

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