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1. 发明申请

WO2015077772A1 ELECTRODEPOSITION OF COPPER 审中-公开
标题翻译：铜的电沉积
公开(公告)号：WO2015077772A1
公开(公告)日：2015-05-28
申请号：PCT/US2014/067403
申请日：2014-11-25
申请人： ENTHONE INC.
发明人： PANECCASIO, Vincent , WHITTEN, Kyle , COMMANDER, John , HURTUBISE, Richard , ROUYA, Eric
IPC分类号： C25D3/38 , H05K3/00
CPC分类号： C25D3/38 , H01L21/2885 , H01L21/76879 , H01L23/53228 , H05K1/09 , H05K3/187 , H05K3/188 , H05K3/423
摘要： In electrolytic copper plating, an aqueous composition comprising a source of copper ions and at least one alkylene or polyalkylene glycol monoether which is soluble in the aqueous phase and has molecular weight not greater than about 500 for improving the efficacy of other additives such as, for example, levelers and suppressors; and a related plating method.
摘要翻译：在电解铜电镀中，包含铜离子源和至少一种可溶于水相的亚烷基或聚亚烷基二醇单醚的水性组合物，其分子量不大于约500以提高其它添加剂的效力，例如例如，整平器和抑制器; 和相关电镀方法。

2. 发明申请

WO2013097480A1 一种阶梯电路板制作工艺审中-公开
公开(公告)号：WO2013097480A1
公开(公告)日：2013-07-04
申请号：PCT/CN2012/080829
申请日：2012-08-31
申请人：深圳崇达多层线路板有限公司 , 宋建远 , 彭卫红 , 谢萍萍 , 刘东
发明人：宋建远 , 彭卫红 , 谢萍萍 , 刘东
IPC分类号： H05K3/00
CPC分类号： H05K3/00 , H05K1/0269 , H05K3/0017 , H05K3/0044 , H05K3/0047 , H05K3/0073 , H05K3/12 , H05K3/188 , H05K3/3452 , H05K3/42 , H05K3/425 , H05K3/428 , H05K3/4623 , H05K3/4629 , H05K2201/09036 , H05K2201/09845 , H05K2203/0315 , H05K2203/162 , Y10T29/49004 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , Y10T29/49179
摘要：一种阶梯电路板制作工艺，包括步骤：A）对线路板基板进行开料、内层印制图形后内层蚀刻、锣阶梯槽、铣垫片，棕化、压板处理后，对其外层进行钻孔；B）将钻孔后的线路板基板进行外层沉铜，然后将整个线路板基板进行电镀；C）通过镀孔菲林进行图形转移；D）将线路板基板进行图形镀铜，并对图形镀铜后的线路板基板锣连接片（SET）外形，然后进行外层蚀刻；E）阻焊塞孔后丝印阻焊及文字；F）全板沉镍金后丝印字符，成型线路板；G）测试检查成品板的电气性能及外观，制得成品。在该工艺中在制作阶梯槽的时候采用先铣阶梯槽，防止层压时流胶，后使用聚四氟乙烯PTFE高温阻胶垫片层压的方式制作，可以有效避免因后铣槽而产生的层间缝隙。

3. 发明申请

WO2011059769A1 METAL DEPOSITION 审中-公开
标题翻译：金属沉积
公开(公告)号：WO2011059769A1
公开(公告)日：2011-05-19
申请号：PCT/US2010/054563
申请日：2010-10-28
申请人： SHOCKING TECHNOLOGIES, INC. , KOSOWSKY, Lex
发明人： KOSOWSKY, Lex
IPC分类号： C25D5/48
CPC分类号： C25D5/022 , C25D5/54 , H05K1/0254 , H05K1/0373 , H05K1/167 , H05K3/107 , H05K3/188 , H05K3/388 , H05K3/423 , H05K3/426 , H05K2201/0215 , H05K2201/0738 , H05K2203/105
摘要： Systems and methods include depositing one or more materials on a voltage switchable dielectric material. In certain aspects, a voltage switchable dielectric material is disposed on a conductive backplane. In some embodiments, a voltage switchable dielectric material includes regions having different characteristic voltages associated with deposition thereon. Some embodiments include masking, and may include the use of a removable contact mask. Certain embodiments include electrografting. Some embodiments include an intermediate layer disposed between two layers.
摘要翻译：系统和方法包括在可开关电介质材料上沉积一种或多种材料。在某些方面，电压可切换介电材料设置在导电背板上。在一些实施例中，电压可切换介电材料包括具有与其上沉积相关联的不同特征电压的区域。一些实施例包括掩蔽，并且可以包括使用可移除的接触掩模。某些实施例包括电驱动。一些实施例包括设置在两层之间的中间层。

4. 发明申请

WO2010049730A1 IMPROVEMENTS RELATING TO ADDITIVE MANUFACTURING PROCESSES 审中-公开
标题翻译：关于添加剂制造工艺的改进
公开(公告)号：WO2010049730A1
公开(公告)日：2010-05-06
申请号：PCT/GB2009/051446
申请日：2009-10-28
申请人： BAE SYSTEMS PLC , SIDHU, Jagit
发明人： SIDHU, Jagit
IPC分类号： H05K3/24 , C25D5/04
CPC分类号： C25D5/04 , B33Y10/00 , B33Y30/00 , C25D5/02 , H05K3/1241 , H05K3/188 , H05K3/241 , H05K3/246 , H05K2201/0347 , H05K2203/0195 , H05K2203/092 , H05K2203/101
摘要： A method of and apparatus for forming components on a substrate. The method comprise in a first step applying a surface treatment to said substrate to form a patterned area having at least some electrical conductivity; in a second step electroplating onto the patterned area by means of a tool comprising a first electrode and a source for in situ supply of electrolyte, by providing an anode current to the first electrode, causing the patterned area at least in the vicinity of the tool to function as a cathode, and passing electrolyte between said patterned area and said first electrode, thereby to deposit conductive material onto said patterned area. The apparatus implements the method. Conductive material may be built up to an extent that the component so formed approximates to the bulk properties of the conductive material. The surface treatment itself therefore is not required to create good conduction properties.
摘要翻译：一种在基板上形成部件的方法和装置。该方法包括在第一步骤中对所述基底施加表面处理以形成具有至少一些导电性的图案化区域; 在通过向第一电极提供阳极电流的工具中，借助于包括第一电极和用于原位供应电解质的源的工具电镀到图案化区域上的第二步骤中，使至少在工具附近的图案化区域用作阴极，并且在所述图案化区域和所述第一电极之间通过电解质，从而将导电材料沉积到所述图案化区域上。该装置实现该方法。导电材料可以被构建成使得如此形成的部件接近于导电材料的整体性质的程度。因此，表面处理本身不需要产生良好的导电性能。

5. 发明申请

WO2005092043A2 PROCESS FOR FABRICATION OF PRINTED CIRCUIT BOARDS 审中-公开
标题翻译：印刷电路板的制造工艺
公开(公告)号：WO2005092043A2
公开(公告)日：2005-10-06
申请号：PCT/US2005/009428
申请日：2005-03-21
申请人： EPIC RESEARCH COMPANY, INC. , BOYACK, James, A. , ROTH, Peter, H. , BERG, N., Edward
发明人： BOYACK, James, A. , ROTH, Peter, H. , BERG, N., Edward
IPC分类号： B05D3/02 , C23C18/16 , C23C18/28 , G03F9/00 , H05K3/18 , H05K3/46
CPC分类号： C23C18/1605 , C23C18/1608 , C23C18/1879 , C23C18/1882 , C23C18/2066 , C23C18/30 , H05K3/184 , H05K3/188 , H05K3/465 , H05K3/4661 , H05K2201/0257 , H05K2201/0329 , H05K2203/0716 , Y10T428/24802
摘要： A method of making a printed circuit board by coating a surface of a substrate with an electrically conductive polymer and curing or setting the polymer on the substrate. The polymer coating is laced with a catalytic reducing agent.
摘要翻译：一种制造印刷电路板的方法，该方法是用导电聚合物涂覆基材表面并固化或固化该基材上的聚合物。聚合物涂层带有催化还原剂。

6. 发明申请

WO2004021366A2 MIXTURES COMPRISING THIOPHENE/ANION DISPERSIONS AND CERTAIN ADDITIVES FOR PRODUCING COATINGS EXHIBITING IMPROVED CONDUCTIVITY, AND METHODS RELATED THERETO 审中-公开
标题翻译：包含噻吩/阴离子分散体和特定添加剂的混合物用于制备表现出改进的导电性的涂层，以及与其相关的方法
公开(公告)号：WO2004021366A2
公开(公告)日：2004-03-11
申请号：PCT/US2003/001842
申请日：2003-01-21
申请人： ELECON, INC. , GO, Pin , FREITAG, Dieter , CONNELL, John, W.
发明人： GO, Pin , FREITAG, Dieter , CONNELL, John, W.
IPC分类号： H01B1/00
CPC分类号： H01B1/12 , H01B1/122 , H01G9/028 , H01L51/0037 , H01L51/5206 , H05K3/188 , Y02E10/549 , Y02P70/521
摘要： Disclosed are mixtures comprising aqueous thiophene/anion dispersions, such as polythiophene/polystyrene sulfonate aqueous dispersions, and additives, as well as coatings produced therefrom. Coatings produced from these mixtures yield significant improvements in electrical conductivity without the need for a high temperature treatment as compared to coatings produced from unmodified aqueous polythiophene dispersions (e.g., Baytron®P) and to coatings produced from state-of the-art aqueous polythiophene-additive mixtures. These conductivity improvements are achieved without detracting from the optical transparency of the coating. Because characteristics of volume resistivity of less than 6.6 ohm-cm and optical transmission greater than 80% are important for conductive coating applications, coatings produced from the mixtures of the present invention have significant advantages over coatings produced from the state-of-the-art mixtures in many applications. Also disclosed are a variety of substrates or articles of manufacture coated with the mixtures of the present invention for use in various applications where a combination of high electrical conductivity, -excellent optical transparency and low temperature processing are important, such as electronic and optoelectronic devices.
摘要翻译：所公开的是包含含水噻吩/阴离子分散体如聚噻吩/聚苯乙烯磺酸盐水分散体和添加剂的混合物，以及由其制成的涂层。与由未改性的含水聚噻吩分散体（例如BaytronP）生产的涂层相比，由这些混合物生产的涂层产生显着的电导率改进，而不需要高温处理，并且由现有技术的含水聚噻吩 - 添加混合物。这些导电性改进是在不减损涂层的光学透明度的情况下实现的。由于体积电阻率小于6.6ohm-cm且光学透射率大于80％的特性对于导电涂层应用是重要的，因此由本发明的混合物生产的涂层与由现有技术生产的涂层相比具有显着的优点许多应用中的混合物。还公开了用本发明混合物涂覆的各种基材或制品，用于高导电性，优异的光学透明性和低温处理的重要组合的各种应用中，例如电子和光电子器件。

7. 发明申请

WO2002078122A1 ELECTRICALLY CONDUCTIVE PATTERNS, ANTENNAS AND METHODS OF MANUFACTURE 审中-公开
标题翻译：电导体图案，天线和制造方法
公开(公告)号：WO2002078122A1
公开(公告)日：2002-10-03
申请号：PCT/US2002/009408
申请日：2002-03-25
申请人： LUCH, Daniel
发明人： LUCH, Daniel
IPC分类号： H01Q1/00
CPC分类号： H01Q1/2208 , G06K19/07779 , G06K19/07783 , H01L2224/16225 , H01Q1/22 , H01Q1/2225 , H01Q1/243 , H01Q1/38 , H05K1/182 , H05K3/188 , H05K3/245
摘要： The invention teaches improved, novel methods and materials for the production of electrically conductive patterns, antennas and complex circuitry. The invention contemplates the use of directly electroplateable resins for production of these article. The unique suitability of directly electroplateable resins to allow facile manufacture of the electrically conductive patterns desired using a broad range of processing and manufacturing approaches is demonstrated.
摘要翻译：本发明教导了用于生产导电图案，天线和复杂电路的改进的新颖方法和材料。本发明考虑使用直接电镀树脂来生产这些制品。证明了使用广泛的加工和制造方法直接电镀树脂的独特适用性，以便容易地制造所期望的导电图案。

8. 发明申请

WO1995000882A1 SOLUBLE, CONDUCTIVE COPOLYMER, THE PREPARATION AND USE THEREOF 审中-公开
标题翻译：可溶性，导电共聚物，其制备和使用
公开(公告)号：WO1995000882A1
公开(公告)日：1995-01-05
申请号：PCT/NL1994000144
申请日：1994-06-20
申请人： NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO , DE RUITER, Barteld , KOCK, Theodorus, Johannes, Jacobus, Maria
发明人： NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO
IPC分类号： G03F07/038
CPC分类号： H01B1/127 , C08G61/126 , C08G73/0611 , G03F7/0045 , G03F7/0388 , H05K3/188
摘要： The invention relates to a soluble copolymer which is conductive as a result of the presence of a conjugated system, which copolymer contains, in side chains, functional groups as well as groups conferring solubility, it being possible for the polymer chains to be covalently bonded to one another via the functional groups, which yields a cured copolymer network, a method for the preparation thereof, a method for the production of a conductive pattern by metallisation, preferably via an electrolytic process on a conductive pattern, and a conductive pattern obtained in this way.
摘要翻译：本发明涉及由于存在共轭体系而导电的可溶性共聚物，该共聚物在侧链中含有赋予溶解性的基团，聚合物链可能共价结合到通过官能团，其产生固化的共聚物网络，其制备方法，通过金属化制备导电图案的方法，优选通过导电图案上的电解工艺，以及在该方法中获得的导电图案办法。

9. 发明申请

WO2019134208A1 5G通讯高频信号板镀金蚀刻工艺审中-公开
公开(公告)号：WO2019134208A1
公开(公告)日：2019-07-11
申请号：PCT/CN2018/074899
申请日：2018-02-01
申请人：昆山首源电子科技有限公司
发明人：刘继挺 , 刘庆峰
IPC分类号： H05K3/24
CPC分类号： H05K3/188 , C25D3/12 , C25D3/48 , C25D5/12 , C25D5/34 , C25D5/40 , C25D7/00 , H05K1/117 , H05K3/181 , H05K3/227 , H05K3/244 , H05K3/3452 , H05K2201/0338
摘要：一种5G通讯高频信号板镀金蚀刻工艺，按下述步骤进行：外层干膜、插头镀金、去膜和碱性蚀刻，碱性蚀刻液包括氯化铜50-250g/L、氯化铵70-150g/L和氨水，pH值为9-10，蚀刻时温度为50-60℃；所述氨水与所述碱性蚀刻液的比例为(550-800)：1000。该5G通讯高频信号板镀金蚀刻工艺，镀金后直接走碱性蚀刻工艺，省去镀金后走外层蚀刻流程，节省外层压膜、曝光、显影的成本，提高了流速，满足了5G通讯对线路板的要求，即该5G通讯高频信号板传输速率快，传输延时低且可靠性好。

10. 发明申请

WO2017139087A1 LEVELER COMPOSITIONS FOR USE IN COPPER DEPOSITION IN MANUFACTURE OF MICROELECTRONICS 审中-公开
标题翻译：用于微电子制造中铜沉积的电位器组合物
公开(公告)号：WO2017139087A1
公开(公告)日：2017-08-17
申请号：PCT/US2017/014651
申请日：2017-01-24
申请人： MACDERMID ENTHONE INC.
发明人： PANECCASIO, Vincent , WHITTEN, Kyle , RICHARDSON, Thomas, B. , LI, Ivan
IPC分类号： C08G65/24 , C25D3/02 , C25D3/38 , H01L21/02 , H01L21/288 , H01L21/768
CPC分类号： C25D3/38 , C08G65/24 , C08G65/33396 , C25D7/12 , C25D7/123 , H01L21/486 , H01L21/76898 , H01L23/481 , H01L23/49827 , H01L23/49866 , H01L23/53228 , H01L25/0657 , H01L2225/06513 , H01L2225/06541 , H05K3/188 , H05K3/424 , H05K2203/0723
摘要： An aqueous electrolytic composition and a process for electrodeposition of copper on a dielectric or semiconductor base structure using the aqueous electrolytic composition. The process includes (i) contacting a metalizing substrate comprising a seminal conductive layer on the base structure with an aqueous electrolytic deposition composition; and (ii) supplying electrical current to the electrolytic deposition composition to deposit copper on the substrate. The aqueous electrolytic composition comprises: (a) copper ions; (b) an acid; (c) a suppressor; and (d) a quaternized poly(epihalohydrin) comprising n repeating units corresponding to structure IN and p repeating units corresponding to structure IP:
摘要翻译：本发明涉及含水电解质组合物和使用该含水电解质组合物在电介质或半导体基底结构上电沉积铜的方法。该方法包括（i）使包含基础结构上的精液导电层的金属化基材与含水电解沉积组合物接触; 和（ii）向电解沉积组合物供应电流以将铜沉积在基底上。该含水电解质组合物包含：（a）铜离子; （b）酸; （c）抑制者; 和（d）包含对应于结构IN的n个重复单元和对应于结构IP的p个重复单元的季铵化聚（表卤代醇）：

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