专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO2006121487A2 CIRCUIT MODULE WITH THERMAL CASING SYSTEMS AND METHODS 审中-公开
标题翻译：具有热壳系统和方法的电路模块
公开(公告)号：WO2006121487A2
公开(公告)日：2006-11-16
申请号：PCT/US2006/007004
申请日：2006-02-28
申请人： STAKTEK GROUP L.P. , WEHRLY, James, Douglas, Jr. , WILDER, James , WOLFE, Mark , GOODWIN, Paul
发明人： WEHRLY, James, Douglas, Jr. , WILDER, James , WOLFE, Mark , GOODWIN, Paul
IPC分类号： G06F11/00
CPC分类号： H05K1/189 , H05K1/0203 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572
摘要： Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. The populated flexible circuitry is disposed about an edge of a rigid substrate preferably devised from thermally-conductive materials and one or more thermal spreaders are disposed in thermal contact with at least some of the constituent integrated circuitry of the module. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.
摘要翻译：灵活的电路装有沿主要侧面或两侧设置的集成电路（IC）。触点沿柔性电路分布，以提供模块与应用环境之间的连接。填充的柔性电路围绕刚性衬底的边缘设置，优选地由导热材料设计，并且一个或多个散热器布置成与模块的组成集成电路中的至少一些热接触。可选地，作为附加的热管理特征，模块可以包括设置在较高热能IC器件附近的高导热性散热器或区域。在优选实施例中，来自衬底主体或衬底芯的延伸部促进模块的IC之间的热变化减小，同时提供用于从模块中排出热能的放大表面。

2. 发明申请

WO2006121488A3 OPTIMIZED MOUNTING AREA CIRCUIT MODULE SYSTEM AND METHOD 审中-公开
标题翻译：优化安装区域电路模块系统及方法
公开(公告)号：WO2006121488A3
公开(公告)日：2008-01-03
申请号：PCT/US2006007192
申请日：2006-02-28
申请人： STAKTEK GROUP LP , WEHRLY JAMES DOUGLAS JR , WOLFE MARK , GOODWIN PAUL
发明人： WEHRLY JAMES DOUGLAS JR , WOLFE MARK , GOODWIN PAUL
IPC分类号： H05K7/20 , H01R12/16 , H05K1/00 , H05K7/00
CPC分类号： H05K1/189 , H01L25/0652 , H01L25/105 , H01L2924/0002 , H05K1/0203 , H05K1/118 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/09445 , H05K2201/10159 , H05K2201/1056 , H05K2201/10734 , H05K2203/1572 , H01L2924/00
摘要： A flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of its major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. A rigid substrate is configured to provide space on one side where the populated flex is disposed while in some embodiments, heat management or cooling structures are arranged on one side of the module to mitigate thermal accumulation in the module.
摘要翻译：灵活的电路填充有沿其主要一侧或两侧设置的集成电路（IC）。触点沿柔性电路分布，以提供模块与应用环境之间的连接。刚性基板被配置为在其上布置有人造弹性体的一侧上提供空间，而在一些实施例中，热管理或冷却结构布置在模块的一侧以减轻模块中的热积聚。

3. 发明申请

WO2008051853A3 HIGH DENSITY IC MODULE 审中-公开
标题翻译：高密度IC模块
公开(公告)号：WO2008051853A3
公开(公告)日：2009-05-07
申请号：PCT/US2007081964
申请日：2007-10-19
申请人： STAKTEK GROUP LP , PARTRIDGE JULIAN , SZEWERENKO LELAND , WEHRLY JAMES DOUGLAS JR
发明人： PARTRIDGE JULIAN , SZEWERENKO LELAND , WEHRLY JAMES DOUGLAS JR
IPC分类号： H01L41/083
CPC分类号： H01L25/0657 , H01L23/5387 , H01L24/81 , H01L24/90 , H01L2224/81203 , H01L2224/81205 , H01L2224/81801 , H01L2224/90 , H01L2225/06517 , H01L2225/0652 , H01L2225/06572 , H01L2225/06582 , H01L2225/06589 , H01L2924/01327 , H01L2924/09701 , H01L2924/14 , H01L2924/00
摘要： A system and method for assembling dual-die integrated circuit packages using thermocompression bonding or thermosonic bonding to bond a second die (8) to a substrate (4) opposite a first die (6) bonded to the substrate (4). The second die (8) is bonded using heat conducted through the first die (6) to the substrate (4), and optionally through an underfill material. The first (6) and second (8) die are connected such that bumps (10) are connected to common bonding pads (12) on the substrate (4). Bumps (10) on one of the die extend through openings in the substrate (4) to connect to the common bonding pads (12). The bonding pads (12) are within the perimeter of the first die (6).
摘要翻译：一种用于使用热压粘合或热超声键合来组装双模集成电路封装的系统和方法，用于将第二裸片（8）与与衬底（4）相对的第一裸片（6）相对的衬底（4）结合。第二模具（8）使用通过第一模具（6）传导的热量与基板（4）结合，并且任选地通过底部填充材料粘结。第一（6）和第二（8）管芯被连接成使得凸块（10）连接到衬底（4）上的公共接合焊盘（12）。其中一个模具上的凸起（10）延伸穿过基板（4）中的开口，以连接到公共接合焊盘（12）。接合焊盘（12）在第一管芯（6）的周边内。

4. 发明申请

WO2007136917A2 MANAGED MEMORY COMPONENT 审中-公开
标题翻译：管理记忆组件
公开(公告)号：WO2007136917A2
公开(公告)日：2007-11-29
申请号：PCT/US2007064407
申请日：2007-03-20
申请人： STAKTEK GROUP LP , WEHRLY JAMES DOUGLAS JR , SZEWERENKO LELAND , ROPER DAVID L
发明人： WEHRLY JAMES DOUGLAS JR , SZEWERENKO LELAND , ROPER DAVID L
IPC分类号： G06F17/50 , H01L23/12 , H01L23/495 , H01L25/00 , H03K19/00 , H03K19/177 , H04N3/14
CPC分类号： H05K1/181 , H01L23/4985 , H01L24/28 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L2224/05599 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/484 , H01L2224/49175 , H01L2224/4943 , H01L2224/73265 , H01L2224/83 , H01L2224/85399 , H01L2924/00014 , H01L2924/01006 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/01094 , H01L2924/014 , H01L2924/078 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H05K1/182 , H05K1/189 , H05K2201/10545 , H05K2201/10689 , H05K2203/049 , Y02P70/611 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： A system and method for combining a leaded package IC (12) and a semiconductor die (14) using a flex circuitry (20). The leaded packaged IC (12) is disposed along an obverse side of a flex circuit. In a preferred embodiment, the lower surface of the body of the leaded packaged IC (12) contacts the surface of the flex circuitry (20). The semiconductor die (14) is disposed beneath the leaded package IC (12) and, in preferred embodiments, disposed in a window that passes through at least a part of the flex circuitry (20) and is attached to a conductive layer of the flex circuitry (20). In other embodiments, the semiconductor die is attached to the body of the leaded packaged IC. The flex circuitry preferably employs at least two conductive layers (20M1, 20M2).
摘要翻译：一种用于使用柔性电路（20）组合引线封装IC（12）和半导体管芯（14）的系统和方法。引线封装IC（12）沿柔性电路的正面设置。在优选实施例中，引线封装IC（12）的主体的下表面接触柔性电路（20）的表面。半导体管芯（14）设置在引线封装IC（12）的下方，并且在优选实施例中，设置在通过柔性电路（20）的至少一部分的窗口中，并连接到柔性导体的导电层电路（20）。在其他实施例中，半导体管芯附接到引线封装IC的主体。柔性电路优选地采用至少两个导电层（20M1,20M2）。

5. 发明申请

WO2007044019A1 LEADED PACKAGE INTEGRATED CIRCUIT STACKING 审中-公开
标题翻译：引导式封装集成电路堆栈
公开(公告)号：WO2007044019A1
公开(公告)日：2007-04-19
申请号：PCT/US2005/039307
申请日：2005-10-28
申请人： STAKTEK GROUP L.P. , WEHRLY, James, Douglas, Jr. , ROPER, David, L.
发明人： WEHRLY, James, Douglas, Jr. , ROPER, David, L.
IPC分类号： H01L29/40
CPC分类号： H05K1/147 , H01L23/49827 , H01L23/5387 , H01L25/105 , H01L2225/1029 , H01L2225/107 , H01L2924/0002 , H05K1/141 , H05K1/189 , H05K3/3421 , H05K2201/049 , H05K2201/056 , H05K2201/09445 , H05K2201/10515 , H05K2201/10689 , H01L2924/00
摘要： A system and method for electrically and thermally coupling adjacent IC packages to one another in a stacked configuration is provided. A flex circuit is inserted in part between ICs to be stacked and provides a connective field that provides plural contact areas that connect to respective leads of the ICs. Thus, the flex does not require discrete leads which must be individually aligned with the individual leads of the constituent ICs employed in the stack. The principle may be employed to aggregate two or more contact areas for respective connection to leads of constituent ICs but is most profitably employed with a continuous connective field that provides contact areas for many leads of the ICs.
摘要翻译：提供了一种用于将堆叠配置中相邻IC封装彼此电和热耦合的系统和方法。将柔性电路部分地插入待堆叠的IC之间，并且提供连接到IC的各个引线的多个接触区域的连接场。因此，柔性件不需要离散引线，这些引线必须与堆叠中采用的构成IC的各引脚单独对齐。该原理可以用于聚合两个或更多个接触区域以用于分量连接到构成IC的引线，但是对于提供IC的许多引线的接触面积的连续连接场最有利地使用。

6. 发明申请

WO2006028643A2 CIRCUIT MODULE SYSTEM AND METHOD 审中-公开
标题翻译：电路模块系统和方法
公开(公告)号：WO2006028643A2
公开(公告)日：2006-03-16
申请号：PCT/US2005/028547
申请日：2005-08-10
申请人： STAKTEK GROUP L.P. , GOODWIN, Paul , CADY, James , WEHRLY, James, Douglas, Jr.
发明人： GOODWIN, Paul , CADY, James , WEHRLY, James, Douglas, Jr.
IPC分类号： H05K7/06 , H05K7/10
CPC分类号： H05K1/189 , G11C5/04 , H01L25/105 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H05K1/0203 , H05K1/118 , H05K1/181 , H05K3/0061 , H05K2201/056 , H05K2201/1056 , H05K2201/10734 , H05K2201/2018 , H05K2203/1572 , H01L2224/0401
摘要： Flexible circuitry is populated with integrated circuits (ICs) disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection to the ICs. Preferably, the flexible circuitry is disposed about an edge of a rigid, thermally-conductive substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. In alternative, but also preferred embodiments, the ICs on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are windows, pockets, or cutaway areas in the substrate. Other embodiments may only populate one side of the flexible circuit or may remove substrate material to reduce module profile. In preferred embodiments, the contacts distributed along the flexible circuitry are configured for insertion into an edge connector socket such as those found in general purpose and server computers. Preferred substrates are comprised of thermally conductive material. Extensions from the substrate in preferred embodiments can be expected to reduce thermal module loading and encourage reduced thermal variations amongst the integrated circuits of the module during operation.
摘要翻译：灵活的电路填充有沿其主要一侧或两侧设置的集成电路（IC）。沿柔性电路分布的触点提供与IC的连接。优选地，柔性电路围绕刚性的导热基底的边缘设置，因此将集成电路置于衬底的一侧或两侧，在衬底的一侧或两侧上具有一层或两层集成电路。在替代方案中，也是优选实施例中，最靠近基板的柔性电路侧的IC至少部分地设置在基板中的窗口，凹穴或切口区域中。其他实施例可以仅填充柔性电路的一侧或者可以移除衬底材料以减少模块轮廓。在优选实施例中，沿着柔性电路分布的触点被配置为插入到诸如在通用和服务器计算机中找到的边缘连接器插座中。优选的衬底由导热材料构成。预期在优选实施例中，来自衬底的延伸可以减少热模块负载并且促进在操作期间模块的集成电路之间的热变化减小。

7. 发明申请

WO2004109802A1 MEMORY EXPANSION AND INTEGRATED CIRCUIT STACKING SYSTEM AND METHOD 审中-公开
标题翻译：内存扩展和集成电路堆叠系统和方法
公开(公告)号：WO2004109802A1
公开(公告)日：2004-12-16
申请号：PCT/US2003/029000
申请日：2003-09-15
申请人： STAKTEK GROUP, L.P. , RAPPORT, Russell , CADY, James, W. , WILDER, James , ROPER, David, L. , WEHRLY, James, Douglas, Jr. , BUCHLE, Jeff
发明人： RAPPORT, Russell , CADY, James, W. , WILDER, James , ROPER, David, L. , WEHRLY, James, Douglas, Jr. , BUCHLE, Jeff
IPC分类号： H01L25/10
CPC分类号： H01L23/3114 , H01L23/49816 , H01L23/49827 , H01L23/49838 , H01L23/4985 , H01L23/50 , H01L23/5387 , H01L25/0657 , H01L25/105 , H01L2224/16237 , H01L2224/73253 , H01L2225/06517 , H01L2225/06541 , H01L2225/06579 , H01L2225/06586 , H01L2225/107 , H01L2924/00014 , H01L2924/01055 , H01L2924/15173 , H01L2924/15311 , H01L2924/19041 , H01L2924/3011 , H05K1/141 , H05K1/147 , H05K1/189 , H05K3/363 , H05K2201/056 , H05K2201/10689 , H05K2201/10734 , H01L2224/0401
摘要： The present invention stacks integrated circuits (ICs) into modules that conserve PWB or other board surface area. In another aspect, the invention provides a lower capacitance memory expansion addressing system and method and preferably with the CSP stacked modules provided herein. In a preferred embodiment in accordance with the invention, a form standard provides a physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design. In a preferred embodiment, the form standard will be devised of heat transference material such as copper to improve thermal performance. In a preferred embodiment of the memory addressing system, a high speed switching system selects a data line associated with each level of a stacked module to reduce the loading effect upon data signals in memory access.
摘要翻译：本发明将集成电路（IC）堆叠成节省PWB或其他板表面积的模块。在另一方面，本发明提供了一种较低电容存储器扩展寻址系统和方法，并且优选地具有本文提供的CSP堆叠模块。在根据本发明的优选实施例中，形式标准提供了一种物理形式，其允许在广泛的CSP封装系列中发现的许多变化的封装尺寸在使用标准连接柔性电路设计时被有利地使用。在优选实施例中，将设计形式标准，以便传热材料例如铜，以改善热性能。在存储器寻址系统的优选实施例中，高速交换系统选择与堆叠模块的每个级别相关联的数据线，以减少对存储器访问中的数据信号的负载影响。

8. 发明申请

WO2008060816A3 STACKABLE MICROPACKAGES AND STACKED MODULES 审中-公开
标题翻译：可堆叠的微型封装和堆叠模块
公开(公告)号：WO2008060816A3
公开(公告)日：2008-07-24
申请号：PCT/US2007081931
申请日：2007-10-19
申请人： STAKTEK GROUP LP , SZEWERENKO LELAND , GOODWIN PAUL , WEHRLY JAMES DOUGLAS JR
发明人： SZEWERENKO LELAND , GOODWIN PAUL , WEHRLY JAMES DOUGLAS JR
IPC分类号： H01L23/02
CPC分类号： H01L25/0657 , H01L24/48 , H01L2224/48227 , H01L2224/48471 , H01L2224/48479 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06527 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2224/4554
摘要： The present invention provides a system and method for devising stackable assemblies (70) that may be then stacked to create a stacked circuit module (50). One or more integrated circuit (IC) die (12) are disposed on one or more sides of a redistribution substrate (20) that is preferably flexible circuitry. In some preferred embodiments, the die (12) and redistribution substrate (20) are bonded together and wire-bond (33) connected. Two or more stackable assemblies (70) are interconnected through frame members (30) to create low profile high density stacked circuit modules (50).
摘要翻译：本发明提供了用于设计可堆叠组件（70）的系统和方法，所述可堆叠组件（70）然后可被堆叠以形成堆叠电路模块（50）。一个或多个集成电路（IC）管芯（12）设置在优选为柔性电路的再分配衬底（20）的一个或多个侧面上。在一些优选实施例中，管芯（12）和再分配基板（20）被结合在一起并且引线结合（33）被连接。两个或更多个可堆叠组件（70）通过框架构件（30）互连以形成低轮廓高密度堆叠电路模块（50）。

9. 发明申请

WO2008051853A2 HIGH DENSITY IC MODULE 审中-公开
标题翻译：高密度IC模块
公开(公告)号：WO2008051853A2
公开(公告)日：2008-05-02
申请号：PCT/US2007/081964
申请日：2007-10-19
申请人： STAKTEK GROUP L.P. , PARTRIDGE, Julian , SZEWERENKO, Leland , WEHRLY, James, Douglas, Jr.
发明人： PARTRIDGE, Julian , SZEWERENKO, Leland , WEHRLY, James, Douglas, Jr.
IPC分类号： H01L21/58 , H01L23/48
CPC分类号： H01L25/0657 , H01L23/5387 , H01L24/81 , H01L24/90 , H01L2224/81203 , H01L2224/81205 , H01L2224/81801 , H01L2224/90 , H01L2225/06517 , H01L2225/0652 , H01L2225/06572 , H01L2225/06582 , H01L2225/06589 , H01L2924/01327 , H01L2924/09701 , H01L2924/14 , H01L2924/00
摘要： A system and method for assembling dual-die integrated circuit packages using thermocompression bonding or thermosonic bonding to bond a second die (8) to a substrate (4) opposite a first die (6) bonded to the substrate (4). The second die (8) is bonded using heat conducted through the first die (6) to the substrate (4), and optionally through an underfill material. The first (6) and second (8) die are connected such that bumps (10) are connected to common bonding pads (12) on the substrate (4). Bumps (10) on one of the die extend through openings in the substrate (4) to connect to the common bonding pads (12). The bonding pads (12) are within the perimeter of the first die (6).
摘要翻译：一种用于使用热压粘合或热超声键合来组装双模集成电路封装的系统和方法，用于将第二裸片（8）与与衬底（4）相对的第一裸片（6）相对的衬底（4）结合。第二模具（8）使用通过第一模具（6）传导的热量与基板（4）结合，并且任选地通过底部填充材料粘结。第一（6）和第二（8）管芯被连接成使得凸块（10）连接到衬底（4）上的公共接合焊盘（12）。其中一个模具上的凸起（10）延伸穿过基板（4）中的开口，以连接到公共接合焊盘（12）。接合焊盘（12）在第一管芯（6）的周边内。

10. 发明申请

WO2006121489A3 COMPACT MODULE SYSTEM AND METHOD 审中-公开
标题翻译：紧凑型模块系统和方法
公开(公告)号：WO2006121489A3
公开(公告)日：2008-01-03
申请号：PCT/US2006007193
申请日：2006-02-28
申请人： STAKTEK GROUP LP , CADY JAMES W , WEHRLY JAMES DOUGLAS JR , GOODWIN PAUL
发明人： CADY JAMES W , WEHRLY JAMES DOUGLAS JR , GOODWIN PAUL
IPC分类号： G11C8/00
CPC分类号： H05K1/189 , H05K2201/056 , H05K2201/10159 , H05K2201/10189
摘要： A flexible circuit is populated on one or both sides and disposed about a substrate to create a circuit module. Along one of its edges, the flex circuit is connected to a connective facility such as a multiple pin connector while the flex circuit is disposed about a thermally-conductive form that provides structure to create a module with plural layers of circuitry in a single module. In preferred embodiments, the form is metallic and, in alternative preferred embodiments, the module circuitry is disposed within a housing. Preferred embodiments may be devised that present a compact flash module within a housing that may be connected to or into a system or product through a connective facility that is preferably a male or female socket connector while the housing is configured to mechanically adapt to an application environment.
摘要翻译：柔性电路填充在一侧或两侧并且设置在基板周围以形成电路模块。沿着其边缘之一，柔性电路连接到诸如多针连接器的连接设备，而柔性电路围绕导热形式设置，其提供结构以在单个模块中创建具有多层电路的模块。在优选实施例中，该形式是金属的，并且在替代优选实施例中，模块电路设置在壳体内。可以设计出优选实施例，其在壳体内呈现紧凑型闪光模块，其可以通过连接设备连接到系统或产品，该连接设备优选地是公插座或母插座连接器，而壳体被配置成机械地适应应用环境。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式