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1. 发明申请

WO2003063055A3 GENERATION AND VERIFICATION OF A DIGITIZED SIGNATURE 审中-公开
公开(公告)号：WO2003063055A3
公开(公告)日：2003-07-31
申请号：PCT/US2003/001453
申请日：2003-01-16
申请人： AMERASIA INTERNATIONAL TECHNOLOGY, INC. , CHUNG, Kevin, Kwong-Tai , SHI, Xiaoming
发明人： CHUNG, Kevin, Kwong-Tai , SHI, Xiaoming
IPC分类号： G06K9/00
摘要： Digitized signatures (10, 10’) are recorded in respective digitized signature records (40). Each digitized signature record (40) includes at least the position of each point of a signature in coordinates relative to a coordinate of a previous point thereof and time. Digitized signatures are identified, verified or authenticated by comparing characteristics thereof, may be indexed for facilitating comparison (146), may be utilized for network and internet transactions, and may be converted to image format.

2. 发明申请

WO9967087A9 METHOD OF MAKING AN ADHESIVE PREFORM LID FOR ELECTRONIC DEVICES 审中-公开
标题翻译：制造用于电子设备的粘合预浸料的方法
公开(公告)号：WO9967087A9
公开(公告)日：2000-05-04
申请号：PCT/US9913738
申请日：1999-06-17
申请人： AMERASIA INTERNATIONAL TECHNOL , CHUNG KEVIN KWONG TAI
发明人： CHUNG KEVIN KWONG-TAI
IPC分类号： H05K9/00 , B29C65/50 , B29C65/52 , H01L21/48 , H01L21/50 , H01L23/04 , B32B4/00 , B32B31/00 , B44C1/165 , H01J5/00 , H01J5/02 , H01L9/00
CPC分类号： H01L24/97 , B29C65/4815 , B29C65/4835 , B29C65/50 , B29C65/5007 , B29C65/52 , B29C65/526 , B29C65/76 , B29C66/112 , B29C66/114 , B29C66/53461 , B29C66/7392 , B29C66/73921 , B29C66/7394 , B29L2031/3061 , H01L21/4803 , H01L21/50 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/16152 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3011 , H01L2924/3025 , Y10T428/24851 , Y10T428/28 , H01L2924/00
摘要： An electronic device (22) is enclosed within a package or module (10) having a lid (40) that is sealed with an adhesive preform (30) that has been pre-applied onto the bonding areas of the lid (40). The adhesive preforms (30) are formed of a wet adhesive deposited on a release substrate (32) as a preform in predetermined locations with respect to a set of reference guide holes (34, 36) so as to facilitate subsequent attachment to lids (40) with pick-and-place equipment or a guide plate. The wet adhesive preforms (30) are B-staged or dried to form dry solid adhesive preforms (30). Both the lids (40) and the adhesive preforms (30) may be formed of electrically insulating or electrically conducting materials. In use, the lids (40) and adhesive preforms (30) are attached to enclose the electronic device (22) by bonding the adhesive preforms (30) at temperatures that are substantially lower than those at which the soldering of conventional lids is typically performed.
摘要翻译：电子设备（22）被封装在具有盖（40）的封装或模块（10）内，所述盖（40）被预先施加到盖（40）的接合区上的粘合剂预成型件（30）密封。粘合剂预成型件（30）由相对于一组参考导向孔（34,36）预定位置沉积在作为预成型件的脱模基板（32）上的湿粘合剂形成，以便于随后附接到盖（40 ）配有拾放设备或导板。湿粘合剂预成型件（30）分段或干燥以形成干固体粘合剂预成型件（30）。盖（40）和粘合剂预成型件（30）都可以由电绝缘或导电材料形成。在使用中，盖子（40）和粘合剂预成型件（30）通过在基本上低于通常执行传统盖子的焊接的温度下粘合粘合剂预成型件（30）而附接以包围电子设备（22）。

3. 发明申请

WO9956509A9 FLIP CHIP DEVICES WITH FLEXIBLE CONDUCTIVE ADHESIVE 审中-公开
标题翻译：具有柔性导电粘合剂的片状芯片装置
公开(公告)号：WO9956509A9
公开(公告)日：2000-03-16
申请号：PCT/US9908787
申请日：1999-04-22
申请人： AMERASIA INTERNATIONAL TECHNOL , CHUNG KEVIN KWONG TAI
发明人： CHUNG KEVIN KWONG-TAI
IPC分类号： H01L21/60 , H05K1/18 , H05K3/24 , H05K3/32
CPC分类号： H01L24/83 , H01L24/29 , H01L24/81 , H01L2224/1319 , H01L2224/16225 , H01L2224/16227 , H01L2224/29101 , H01L2224/2919 , H01L2224/73204 , H01L2224/81801 , H01L2224/8319 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H05K3/244 , H05K3/321 , H05K2201/0129 , H05K2201/0133 , H05K2201/10636 , H05K2201/10674 , H05K2201/10977 , H05K2201/10984 , Y02P70/611 , H01L2924/00 , H01L2924/3512
摘要： An electronic device (10, 100) includes one or more semiconductor chips (30, 130) interconnected to a next level substrate (20, 120) in a flip chip manner using flexible conductive adhesive (40, 140) having a low modulus of elasticity. The flexible conductive adhesive (40, 140) is applied as conductive bumps (40, 140) on the contact pads (24, 124) of the substrate (20, 120) or on the contact pads (34, 134) of the semiconductor chips (30, 130) and is a flexible thermoplastic or thermosetting resin filled with electrically-conductive particles. Other electronic devices (44, 46, 144, 146), such as packaged components including resistors, capacitors and the like, are bonded with the same flexible conductive adhesive bump (24, 124, 34, 134) approach as is employed for the semiconductor chips (30, 130). The contact pads of both the chip (30, 130) and the next level substrate (20, 120) are preferably passivated with a metallic coating (38), preferably a precious metal, prior to interconnection to inhibit oxidation of the pads (37). A flexible insulating organic underfill (150) may be used, preferably one having substantially the same low modulus of elasticity as that of the flexible conductive adhesive (40, 140).
摘要翻译：电子设备（10,100）包括以倒装芯片方式与使用具有低弹性模量的柔性导电粘合剂（40,140）互连到下一级衬底（20,120）的一个或多个半导体芯片（30,130）。柔性导电粘合剂（40,140）作为导电凸块（40,140）施加在衬底（20,120）的接触焊盘（24,124）上或半导体芯片的接触焊盘（34,134）上（30,130），并且是填充有导电颗粒的柔性热塑性或热固性树脂。诸如包括电阻器，电容器等的封装部件的其它电子器件（44,46,144,146）与用于半导体的相同的柔性导电粘合剂凸块（24,124,34,134）接合芯片（30,130）。芯片（30,130）和下一级基板（20,120）的接触垫优选在互连之前用金属涂层（38），优选贵金属钝化，以抑制焊盘（37）的氧化。。可以使用柔性绝缘有机底部填充物（150），优选地具有与柔性导电粘合剂（40,140）基本相同的低弹性模量的柔性绝缘有机底部填充物（150）。

4. 发明申请

WO2011156397A2 SOLAR CELL INTERCONNECTION, MODULE, PANEL AND METHOD 审中-公开
标题翻译：太阳能电池互连，模块，面板和方法
公开(公告)号：WO2011156397A2
公开(公告)日：2011-12-15
申请号：PCT/US2011/039476
申请日：2011-06-07
申请人： AMERASIA INTERNATIONAL TECHNOLOGY, INC. , CHUNG, Kevin, Kwong-Tai
发明人： CHUNG, Kevin, Kwong-Tai
IPC分类号： H01L31/18
CPC分类号： H01L31/048 , B32B17/10018 , B32B17/10871 , H01L31/02013 , H01L31/0504 , H01L31/0512 , H01L31/052 , H01L31/1876 , Y02E10/50 , Y02P70/521
摘要： A laminated module or panel 100, 200 of solar cells 400 and a laminating method 500 for making same comprise a top layer 200 of melt flowable optically transparent molecularly flexible thermoplastic and a rear sheet 300 of melt flowable insulating molecularly flexible thermoplastic both melt flowing at a temperature between about 80°C and 250°C and having a low glass transition temperature. Solar cells 400 are encapsulated 530, 560 by melt flowing the top layer 200 and rear sheet 300, and electrical connections are provided between front and back contacts thereof. Light passing through the transparent top layer 200 impinges upon the solar cells 400 and the laminated module 100, 200 exhibits sufficient flexural modulus without cross-linking chemical curing. Electrical connections 210, 220, 310, 320, 415, 425, 430 may be provided by melt flowable electrically conductive molecularly flexible thermoplastic adhesive 210, 220, 310, 320 or by metal strips 415, 425, 432 or by both.
摘要翻译：太阳能电池400的层叠模块或面板100,200以及用于制造它的叠层方法500包括可熔融流动的光学透明分子柔性热塑性塑料的顶层200和可熔融流动的绝缘分子柔性热塑性塑料的后片300，温度在约80℃至250℃之间，玻璃化转变温度低。太阳能电池400通过熔化流动顶层200和后片300而被封装530,560，并且在其前和后接触之间提供电连接。穿过透明顶层200的光照射到太阳能电池400上，并且层叠模块100,200表现出足够的弯曲模量而不交联化学固化。电连接210,220,310,320,415,425,430可以由熔体流动的导电分子柔性热塑性粘合剂210,220,310,320或金属带415,425,432或两者提供。

5. 发明申请

WO03062961A8 PACKET-BASED INTERNET VOTING TRANSACTIONS WITH BIOMETRIC AUTHENTICATION 审中-公开
标题翻译：基于分组的互联网投票交易与生物识别
公开(公告)号：WO03062961A8
公开(公告)日：2004-04-15
申请号：PCT/US0302080
申请日：2003-01-23
申请人： AMERASIA INT TECHNOLOGY INC , CHUNG KEVIN KWONG-TAI , SHI XIAOMING , MINADEO JAMES A
发明人： CHUNG KEVIN KWONG-TAI , SHI XIAOMING , MINADEO JAMES A
IPC分类号： G06K7/10 , G06K17/00 , G06Q10/10 , G07C13/00 , H01Q1/22 , H04L29/06 , G06F
CPC分类号： H04L63/0861 , G06K7/10346 , G06K2017/0045 , G06K2017/009 , G06Q10/10 , G07C13/00 , H04L63/12
摘要： ABSTRACT Internet voting or other Internet transaction comprises transmitting three information packets via the Internet. At least one information packet includes an identifier that is authenticated, such as a key, a biometric digitized signature or other biometric identifier. Where an information packet may include transaction information in a predetermined form, information packets including information in another form may be processed separately.
摘要翻译：摘要互联网投票或其他互联网交易包括通过互联网传输三个信息包。至少一个信息分组包括被认证的标识符，例如密钥，生物特征数字化签名或其他生物特征识别符。在信息分组可以包括预定形式的交易信息的情况下，可以单独处理包括另一形式的信息的信息分组。

6. 发明申请

WO2003062961A2 PACKET-BASED INTERNET VOTING TRANSACTIONS WITH BIOMETRIC AUTHENTICATION 审中-公开
标题翻译：基于分组的互联网投票交易与生物识别
公开(公告)号：WO2003062961A2
公开(公告)日：2003-07-31
申请号：PCT/US2003/002080
申请日：2003-01-23
申请人： AMERASIA INTERNATIONAL TECHNOLOGY, INC. , CHUNG, Kevin, Kwong-Tai , SHI, Xiaoming , MINADEO, James, A.
发明人： CHUNG, Kevin, Kwong-Tai , SHI, Xiaoming , MINADEO, James, A.
IPC分类号： G06F
CPC分类号： H04L63/0861 , G06K7/10346 , G06K2017/0045 , G06K2017/009 , G06Q10/10 , G07C13/00 , H04L63/12
摘要： ABSTRACT Internet voting or other Internet transaction comprises transmitting three information packets via the Internet. At least one information packet includes an identifier that is authenticated, such as a key, a biometric digitized signature or other biometric identifier. Where an information packet may include transaction information in a predetermined form, information packets including information in another form may be processed separately.
摘要翻译：摘要互联网投票或其他互联网交易包括通过互联网传输三个信息包。至少一个信息分组包括被认证的标识符，例如密钥，生物特征数字化签名或其他生物特征识别符。在信息分组可以包括预定形式的交易信息的情况下，可以单独处理包括另一形式的信息的信息分组。

7. 发明申请

WO2006026365A2 OBJECT MONITORING, LOCATING, AND TRACKING METHOD, SYSTEM, AND RFID DEVICE 审中-公开
标题翻译：对象监测，定位和跟踪方法，系统和RFID设备
公开(公告)号：WO2006026365A2
公开(公告)日：2006-03-09
申请号：PCT/US2005030272
申请日：2005-08-25
申请人： AMERASIA INT TECHNOLOGY INC , CHUNG KEVIN KWONG-TAI , CHU CYNTHIA TING-WAH , SHI XIAOMING , LI JING JIAN , ZOU MING
发明人： CHUNG KEVIN KWONG-TAI , CHU CYNTHIA TING-WAH , SHI XIAOMING , LI JING JIAN , ZOU MING
IPC分类号： H04Q5/22 , G06F17/00 , G08B1/08 , G08B21/00
CPC分类号： G08B13/2491 , B60R2325/105 , G06K2017/0045 , G08B13/2462
摘要： A method (200, 300) and system (100, 300) for monitoring a container or other object (T, 30, 80) comprises an RFID device (T, 30), e.g., interior the container, transmitting (225) messages including unique identifying information, and a receiving device (30, TS) exterior the object (T, 30, 80) receiving, storing, and/or relaying (235-240) messages received from the RFID device (T, 30). Receptions (235) of messages transmitted by the RFID device (T, 30) when the object (T, 30, 80) is closed and when it is not closed are processed (245-285) to provide an indication of the location of the object (T, 30, 80) and/or whether the object (T, 30, 80) has or has not been opened. Messages may include power level codes and be transmitted (225-230)at more than one power level, and may be processed (245-285) for monitoring, locating and/or tracking (245-290, 300) the object (T, 30, 80).
摘要翻译：用于监视容器或其他物体（T，30,80）的方法（200,300）和系统（100,300）包括例如在容器内部的RFID设备（T，30），其发送（225）消息，包括唯一标识信息，以及接收，存储和/或中继（235-240）从RFID设备（T，30）接收的消息的物体（T，30,80）外部的接收设备（30，TS）。当对象（T，30,80）被关闭并且其未被关闭时，由RFID设备（T，30）发送的消息的接收（235）被处理（245-285）以提供对象（T，30,80）和/或对象（T，30,80）是否已经打开。消息可以包括功率级代码并且以多于一个功率级发送（225-230），并且可以处理（245-285）用于监视，定位和/或跟踪（245-290,300）对象（T， 30，80）。

8. 发明申请

WO0070676A9 HIGH-DENSITY ELECTRONIC PACKAGE, AND METHOD FOR MAKING SAME 审中-公开
标题翻译：高密度电子包装及其制造方法
公开(公告)号：WO0070676A9
公开(公告)日：2002-07-04
申请号：PCT/US0013077
申请日：2000-05-11
申请人： AMERASIA INT TECHNOLOGY INC , CHUNG KEVIN KWONG-TAI
发明人： CHUNG KEVIN KWONG-TAI
IPC分类号： H01L23/29 , B32B3/08 , B32B7/12 , B32B33/00 , B32B37/20 , G06K19/077 , H01L23/055 , H01L23/12 , H01L23/31 , H01L23/498 , H01L23/538 , H01L25/065 , H01Q1/22 , H01Q1/36 , H01Q1/38 , H01Q7/00 , H01Q23/00 , H05K1/00 , H05K1/11 , H05K1/16 , H05K3/40 , H05K3/42 , H01L23/02 , H01R9/00 , H05K7/02
CPC分类号： B32B37/203 , B32B3/08 , B32B7/12 , B32B33/00 , B32B2310/0831 , B32B2425/00 , B32B2429/00 , G06K19/07743 , G06K19/07745 , G06K19/07747 , H01L23/055 , H01L23/49838 , H01L23/4985 , H01L23/49855 , H01L23/5387 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2224/16237 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/97 , H01L2225/0651 , H01L2225/06517 , H01L2225/0652 , H01L2225/06527 , H01L2225/06541 , H01L2225/06572 , H01L2225/06579 , H01L2225/06582 , H01L2225/06586 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/15173 , H01L2924/15174 , H01L2924/15311 , H01L2924/1532 , H01L2924/15787 , H01L2924/16152 , H01L2924/1627 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H01Q1/22 , H01Q1/2208 , H01Q1/36 , H01Q1/38 , H01Q7/00 , H01Q7/005 , H01Q23/00 , H05K1/0393 , H05K1/113 , H05K1/165 , H05K3/4069 , H05K3/423 , H05K2201/0355 , H05K2201/0394 , H05K2201/10674 , H05K2203/1453 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/05644 , H01L2224/05655 , H01L2224/05664
摘要： A high density electronic package (100, 100'', 300, 300') includes a low-modulus-of-elasticity flexible adhesive interposer substrate (110, 210, 310, 330, 500) to which an electronic device, (120, 320, 620, 622, 624, 626) such as a semiconductor chip or die or other component, is attached. The flexible adhesive interposer substrate (110, 210, 310, 330, 500) includes a sheet or layer (111, 211, 311, 331, 520, 530) of a molecularly flexible adhesive having via holes therein in which are built up conductive vias (112, 212, 312, 315, 335, 550, 618) to which contacts of the electronic device (120, 320, 620, 622, 624, 626) connect. A thin layer of metal foil (113, 213, 313, 510, 540) on one surface of the flexible adhesive sheet (111, 211, 311, 331, 520, 530) is patterned to provide contacts and to connect electrically to the conductive vias (112, 212, 312, 315, 335, 550, 618). The electronic device (120, 320, 620, 622, 624, 626) may be covered by a lid (130) or by an encapsulant (137) attached to the flexible adhesive interposer substrate (110, 210, 310, 330, 500) and/or the electronic device (120, 320, 620, 622, 624, 626). An electronic package (300) may include a plurality of electronic devices (320-1, 320-2, 320-3) and respective flexible adhesive interposers (310-1, 310-2, 310-3, 330-1, 330-2, 330-3) that are electrically interconnected.
摘要翻译：高密度电子封装（100,100“，300,300'）包括低弹性模量柔性粘合剂插入物基板（110,210,310,330,500），电子装置（120， 320,620,622,624,626），例如半导体芯片或管芯或其他部件。柔性粘合剂插入物基板（110,210,310,330,500）包括分子柔性粘合剂的片或层（111,211,311,331,520,530），其中具有通孔，其中构成导电通孔（120,320,620,622,624,626）的触点连接到所述电子设备（112,212,312,315,335,550,618）。在柔性粘合片（111,211,311,331,520,530）的一个表面上的薄金属箔（113,213,313,510,540）被图案化以提供触点并且电连接到导电过孔（112,212,312,315,335,550,618）。电子设备（120,320,620,622,624,626）可以被盖（130）或通过附接到柔性粘合剂插入物基板（110,210,310,330,500）上的密封剂（137）覆盖，和/或电子设备（120,320,620,622,624,626）。电子封装（300）可以包括多个电子设备（320-1,320-2,320-3）和相应的柔性粘合剂插入件（310-1,310-2,310-3,330-1,330-3） 2,330-3），其被电互连。

9. 发明申请

WO2011156397A3 SOLAR CELL INTERCONNECTION, MODULE, PANEL AND METHOD 审中-公开
标题翻译：太阳能电池互连，模块，面板和方法
公开(公告)号：WO2011156397A3
公开(公告)日：2013-06-13
申请号：PCT/US2011039476
申请日：2011-06-07
申请人： AMERASIA INT TECHNOLOGY INC , CHUNG KEVIN KWONG-TAI
发明人： CHUNG KEVIN KWONG-TAI
IPC分类号： H02N6/00
CPC分类号： H01L31/048 , B32B17/10018 , B32B17/10871 , H01L31/02013 , H01L31/0504 , H01L31/0512 , H01L31/052 , H01L31/1876 , Y02E10/50 , Y02P70/521
摘要： A laminated module or panel 100, 200 of solar cells 400 and a laminating method 500 for making same comprise a top layer 200 of melt flowable optically transparent molecularly flexible thermoplastic and a rear sheet 300 of melt flowable insulating molecularly flexible thermoplastic both melt flowing at a temperature between about 80°C and 250°C and having a low glass transition temperature. Solar cells 400 are encapsulated 530, 560 by melt flowing the top layer 200 and rear sheet 300, and electrical connections are provided between front and back contacts thereof. Light passing through the transparent top layer 200 impinges upon the solar cells 400 and the laminated module 100, 200 exhibits sufficient flexural modulus without cross-linking chemical curing. Electrical connections 210, 220, 310, 320, 415, 425, 430 may be provided by melt flowable electrically conductive molecularly flexible thermoplastic adhesive 210, 220, 310, 320 or by metal strips 415, 425, 432 or by both.
摘要翻译：太阳能电池400的层压模块或面板100,200和用于制造它的叠层方法500包括可熔融流动的光学透明的分子柔性热塑性塑料的顶层200和熔体流动的绝缘分子柔性热塑性塑料的后片300，温度在约80℃至250℃之间，玻璃化转变温度低。太阳能电池400通过熔化流动顶层200和后片300而被封装530,560，并且电连接被提供在它们的前和后接触之间。穿过透明顶层200的光照射到太阳能电池400上，并且层叠模块100,200表现出足够的弯曲模量而不交联化学固化。电连接210,220,310,320,415,425,430可以由熔体流动的导电分子柔性热塑性粘合剂210,220,310,320或金属带415,425,432或两者来提供。

10. 发明申请

WO2006026365A3 OBJECT MONITORING, LOCATING, AND TRACKING METHOD, SYSTEM, AND RFID DEVICE 审中-公开
公开(公告)号：WO2006026365A3
公开(公告)日：2006-03-09
申请号：PCT/US2005/030272
申请日：2005-08-25
申请人： Amerasia International Technology, Inc. , CHUNG, Kevin Kwong-Tai , CHU, Cynthia Ting-Wah , SHI, Xiaoming , LI, Jing Jian , ZOU, Ming
发明人： CHUNG, Kevin Kwong-Tai , CHU, Cynthia Ting-Wah , SHI, Xiaoming , LI, Jing Jian , ZOU, Ming
IPC分类号： G08B13/14
摘要： A method (200, 300) and system (100, 300) for monitoring a container or other object (T, 30, 80) comprises an RFID device (T, 30), e.g., interior the container, transmitting (225) messages including unique identifying information, and a receiving device (30, TS) exterior the object (T, 30, 80) receiving, storing, and/or relaying (235-240) messages received from the RFID device (T, 30). Receptions (235) of messages transmitted by the RFID device (T, 30) when the object (T, 30, 80) is closed and when it is not closed are processed (245-285) to provide an indication of the location of the object (T, 30, 80) and/or whether the object (T, 30, 80) has or has not been opened. Messages may include power level codes and be transmitted (225-230)at more than one power level, and may be processed (245-285) for monitoring, locating and/or tracking (245-290, 300) the object (T, 30, 80).

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