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    • 1. 发明申请
    • METAL OXIDE TFT WITH IMPROVED SOURCE/DRAIN CONTACTS
    • 具有改进源/漏联系的金属氧化物薄膜
    • WO2012170160A1
    • 2012-12-13
    • PCT/US2012/038075
    • 2012-05-16
    • CBRITE INC.SHIEH, Chan-longYU, GangFOONG, Fatt
    • SHIEH, Chan-longYU, GangFOONG, Fatt
    • H01L21/36H01L21/44H01L21/465
    • H01L29/7869H01L21/428H01L29/45H01L29/66969H01L29/78606
    • A method of forming ohmic source/drain contacts in a metal oxide semiconductor thin film transistor includes providing a gate, a gate dielectric, a high carrier concentration metal oxide semiconductor active layer with a band gap and spaced apart source/drain metal contacts in a thin film transistor configuration. The spaced apart source/drain metal contacts define a channel region in the active layer. An oxidizing ambient is provided adjacent the channel region and the gate and the channel region are heated in the oxidizing ambient to reduce the carrier concentration in the channel area. Alternatively or in addition each of the source/drain contacts includes a very thin layer of low work function metal positioned on the metal oxide semiconductor active layer and a barrier layer of high work function metal is positioned on the low work function metal.
    • 在金属氧化物半导体薄膜晶体管中形成欧姆源极/漏极接触的方法包括:提供栅极,栅极电介质,具有带隙的高载流子浓度金属氧化物半导体有源层和间隔开的薄/弱金属氧化物半导体有源层 薄膜晶体管配置。 间隔开的源极/漏极金属触点限定有源层中的沟道区。 在沟道区域附近提供氧化环境,并且在氧化环境中加热栅极和沟道区域以降低沟道区域中的载流子浓度。 或者或另外每个源极/漏极触点包括位于金属氧化物半导体有源层上的非常薄的低功函数金属层,并且高功函数金属的阻挡层位于低功函数金属上。
    • 2. 发明申请
    • AMOLED WITH CASCADED OLED STRUCTURES
    • 嵌入式OLED结构
    • WO2011022144A1
    • 2011-02-24
    • PCT/US2010/042385
    • 2010-07-19
    • CBRITE INC.SHIEH, Chan-longYU, Gang
    • SHIEH, Chan-longYU, Gang
    • H01L51/50
    • H01L27/3244H01L27/3204H01L27/3246
    • An active matrix organic light emitting display includes a plurality of pixels with each pixel including at least one organic light emitting diode circuit. Each diode circuit producing a predetermined amount of light Im in response to power W applied to the circuit and including n organic light emitting diodes cascaded in series so as to increase voltage dropped across the cascaded diodes by the factor of n, where n is an integer greater than one. Each diode of the n organic light emitting diodes produces approximately 1/n of the predetermined amount of light Im so as to reduce current flowing in the diodes by 1/n. The organic light emitting diode circuit of each pixel includes a thin film transistor current driver with the cascaded diodes connected in the source/drain circuit so the current driver provides the current flowing in the diodes.
    • 有源矩阵有机发光显示器包括多个像素,每个像素包括至少一个有机发光二极管电路。 每个二极管电路响应于施加到电路的功率W产生预定量的光Im,并且包括串联级联的n个有机发光二极管,以便增加跨越级联二极管的电压以n为因子,其中n是整数 大于一。 n个有机发光二极管的每个二极管产生大约1 / n个预定量的光Im,以便将在二极管中流动的电流减少1 / n。 每个像素的有机发光二极管电路包括薄膜晶体管电流驱动器,其中级联二极管连接在源极/漏极电路中,因此电流驱动器提供流过二极管的电流。
    • 3. 发明申请
    • METAL OXIDE TFT WITH IMPROVED CARRIER MOBILITY
    • 具有改进载体移动性的金属氧化物薄膜
    • WO2010009128A1
    • 2010-01-21
    • PCT/US2009/050542
    • 2009-07-14
    • CBRITE INC.
    • H01L35/24
    • H01L29/7869H01L29/66969H01L29/78696
    • A fabrication method is used in conjunction with a semiconductor device having a metal oxide active layer less than lOOnm thick and the upper major surface and the lower major surface have material in abutting engagement to form underlying interfaces and overlying interfaces. The method of fabrication includes controlling interfacial interactions in the underlying interfaces and the overlying interfaces to adjust the carrier density in the adjacent metal oxide by selecting a metal oxide for the metal oxide active layer and by selecting a specific material for the material in abutting engagement. The method also includes one or both steps of controlling interactions in underlying interfaces by surface treatment of an underlying material forming a component of the underlying interface and controlling interactions in overlying interfaces by surface treatment of the metal oxide film performed prior to deposition of material on the metal oxide layer.
    • 制造方法与具有小于100nm厚的金属氧化物活性层的半导体器件结合使用,并且上主表面和下主表面具有邻接接合的材料以形成下面的界面和上覆界面。 制造方法包括通过选择用于金属氧化物活性层的金属氧化物并通过选择用于邻接接合的材料的特定材料来控制底层界面和上覆界面中的界面相互作用来调节相邻金属氧化物中的载流子密度。 该方法还包括一个或两个步骤,通过对形成下面界面的组分的下层材料进行表面处理来控制底层界面中的相互作用,并且通过在将材料沉积在其上的材料之前进行的金属氧化物膜的表面处理来控制覆盖界面中的相互作用 金属氧化物层。
    • 5. 发明申请
    • MOTFT WITH UN-PATTERNED ETCH-STOP
    • 具有不间断蚀刻的MOTFT
    • WO2015073502A1
    • 2015-05-21
    • PCT/US2014/065161
    • 2014-11-12
    • CBRITE INC.
    • YU, GangSHIEH, Chan-LongMUSOLF, JuergenFOONG, FattXIAO, Tian
    • H01L21/36H01L21/38H01L29/86
    • H01L27/1203H01L21/02565H01L21/02664H01L29/24H01L29/66969H01L29/7869
    • A method of fabricating a high mobility semiconductor metal oxide thin film transistor including the steps of depositing a layer of semiconductor metal oxide material, depositing a blanket layer of etch-stop material on the layer of MO material, and patterning a layer of source/drain metal on the blanket layer of etch-stop material including etching the layer of source/drain metal into source/drain terminals positioned to define a channel area in the semiconductor metal oxide layer. The etch-stop material being electrically conductive in a direction perpendicular to the plane of the blanket layer at least under the source/drain terminals to provide electrical contact between each of the source/drain terminals and the layer of semiconductor metal oxide material. The etch-stop material is also chemical robust to protect the layer of semiconductor metal oxide channel material during the etching process.
    • 一种制造高迁移率半导体金属氧化物薄膜晶体管的方法,包括以下步骤:沉积半导体金属氧化物材料层,在MO材料层上沉积蚀刻停止材料的覆盖层,以及图案化源/漏层 包括将源极/漏极金属层蚀刻成定位成限定半导体金属氧化物层中的沟道区域的源极/漏极端子的蚀刻停止材料的覆盖层上的金属。 蚀刻停止材料至少在源极/漏极端子之下在垂直于覆盖层的平面的方向上导电,以提供每个源极/漏极端子和半导体金属氧化物材料层之间的电接触。 蚀刻停止材料也是化学稳固的,以在蚀刻工艺期间保护半导体金属氧化物沟道材料层。
    • 8. 发明申请
    • DUAL DETECTION SCHEME FOR DNA SEQUENCING
    • DNA测序的双重检测方案
    • WO2018034982A1
    • 2018-02-22
    • PCT/US2017/046500
    • 2017-08-11
    • CBRITE INC.
    • GUNNING, KerryACKLEY, DonaldSHIEH, Chan-long
    • C12Q1/68C12M1/34
    • G01N21/6428C12Q1/6869G01N27/4145G01N2021/6439G01N2201/062C12Q2563/107C12Q2565/607
    • Apparatus for fluorescent and ion sensing of DNA nucleotide incorporation events including DNA nucleotide incorporation structure designed to have sequencing primers bonded to a surface for the incorporation of DNA nucleotides thereon. At least some of the DNA nucleotides having a fluorescent label. A photodiode positioned adjacent the incorporation structure and an illumination device positioned adjacent the DNA nucleotide incorporation structure to illuminate DNA nucleotides incorporated onto the sequencing primers. The illumination device exciting the fluorescent labels when incorporation occurs and the photodiode positioned to sense the excited fluorescent labels. Ion sensing apparatus positioned adjacent the DNA nucleotide incorporation structure including a metal oxide thin film transistor with a gate electrically coupled to receive an electrical signal indicative of ion emissions produced by the DNA nucleotide incorporated onto DNA target fragments or sequencing primers.
    • 用于DNA核苷酸掺入事件的荧光和离子感应的装置,包括DNA核苷酸掺入结构,其被设计为具有结合到表面以将DNA核苷酸掺入其上的测序引物。 至少一些具有荧光标记的DNA核苷酸。 位于掺入结构附近的光电二极管和位于DNA核苷酸掺入结构附近的照明装置,以照射掺入到测序引物中的DNA核苷酸。 照明装置在结合时激发荧光标签并且光电二极管定位为感测激发的荧光标签。 离子感测装置位于DNA核苷酸掺入结构附近,包括金属氧化物薄膜晶体管,其栅极电耦合以接收指示由掺入DNA靶片段或测序引物的DNA核苷酸产生的离子发射的电信号。
    • 9. 发明申请
    • PIXELATED IMAGER WITH MOTFET AND PROCESS
    • 像素图像与MOTFET和过程
    • WO2014093244A1
    • 2014-06-19
    • PCT/US2013/073920
    • 2013-12-09
    • CBRITE INC.
    • SHIEH, Chan-longYU, Gang
    • H01L31/036
    • H01L31/20H01L27/1225H01L27/1463H01L27/14632H01L27/14663H01L27/14687H01L27/14692H01L31/0368H01L31/0376Y02E10/50
    • A method of fabricating a pixelated imager includes providing a substrate with bottom contact layer and sensing element blanket layers on the contact layer. The blanket layers are separated into an array of sensing elements by trenches isolating adjacent sensing elements. A sensing element electrode is formed adjacent each sensing element overlying a trench and defining a TFT. A layer of metal oxide semiconductor material is formed on a dielectric layer overlying the electrodes and on an exposed upper surface of the blanket layers defining the sensing element adjacent each TFT. A layer of metal is deposited on each TFT and separated into source/drain electrodes on opposite sides of the electrode.The metal forming one of the electrodes contacts the MOS material overlying the exposed surf ace of the semiconductor layer, whereby each sensing element in the array is electrically connected to the adjacent TFT by the MOS material.
    • 制造像素化成像器的方法包括在接触层上提供具有底部接触层和感测元件覆盖层的衬底。 橡皮布层通过隔离相邻感测元件的沟槽分离成感测元件的阵列。 感测元件电极邻近覆盖沟槽的每个感测元件形成并且限定TFT。 一层金属氧化物半导体材料形成在覆盖电极的电介质层上,并且在覆盖层的暴露的上表面上形成与每个TFT相邻的感测元件。 在每个TFT上沉积一层金属,并将其分离成电极的相对侧上的源/漏电极。形成电极之一的金属接触覆盖半导体层暴露的凸起的MOS材料,由此在 阵列通过MOS材料电连接到相邻的TFT。