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    • 31. 发明申请
    • METHODS OF FABRICATING SUBSTRATES
    • 制造基材的方法
    • WO2010065249A3
    • 2010-07-22
    • PCT/US2009063978
    • 2009-11-11
    • MICRON TECHNOLOGY INCSILLS SCOTTSANDHU GURTEJ SDEVILLIERS ANTON
    • SILLS SCOTTSANDHU GURTEJ SDEVILLIERS ANTON
    • H01L21/027
    • H01L21/31138G03F7/0035H01L21/0273H01L21/0337H01L21/0338
    • A method of fabricating a substrate includes forming spaced first features and spaced second features over a substrate. The first and second features alternate with one another and are spaced relative one another. Width of the spaced second features is laterally trimmed to a greater degree than any lateral trimming of width of the spaced first features while laterally trimming width of the spaced second features. After laterally trimming of the second features, spacers are formed on sidewalls of the spaced first features and on sidewalls of the spaced second features. The spacers are of some different composition from that of the spaced first features and from that of the spaced second features. After forming the spacers, the spaced first features and the spaced second features are removed from the substrate. The substrate is processed through a mask pattern comprising the spacers. Other embodiments are disclosed.
    • 制造衬底的方法包括在衬底上形成间隔开的第一特征和间隔开的第二特征。 第一和第二特征彼此交替并且相对于彼此间隔开。 间隔开的第二特征的宽度横向修剪到比间隔开的第一特征的宽度的任何横向修整更大的程度,而横向修剪间隔开的第二特征的宽度。 在横向修整第二特征之后,在间隔开的第一特征的侧壁上和间隔开的第二特征的侧壁上形成间隔物。 间隔物具有与间隔开的第一特征和间隔开的第二特征不同的组成。 在形成间隔物之后,将间隔开的第一部件和间隔开的第二部件从基板上移除。 衬底通过包括间隔物的掩模图案进行处理。 公开了其他实施例。
    • 33. 发明申请
    • TOPOGRAPHY DIRECTED PATTERNING
    • 地形指导图案
    • WO2007127496A3
    • 2008-01-17
    • PCT/US2007011524
    • 2007-05-14
    • MICRON TECHNOLOGY INCSANDHU GURTEJ S
    • SANDHU GURTEJ S
    • B82B3/00H01L21/033H01L21/308
    • H01L21/3081G03F7/0002H01L21/0332H01L21/0337H01L21/0338H01L21/3086H01L21/3088Y10T428/24058Y10T428/2995
    • A pattern having exceptionally small features is formed on a partially fabricated integrated circuit (102) during integrated circuit fabrication. The pattern comprises features (162), (164) formed by self-organizing material, such as diblock copolymers. The organization of the copolymers is directed by spacers (152) which have been formed by a pitch multiplication process in which the spacers (152) are formed at the sides of sacrificial mandrels (142), which are later removed to leave the spaced-apart, free-standing spacers (152). Diblock copolymers, composed of two immiscible block species, are deposited over and in the space between the spacers (152). The copolymers are made to self-organize, with each block species aggregating with other block species of the same type.
    • 在集成电路制造期间,在部分制造的集成电路(102)上形成具有特别小特征的图案。 图案包括由自组织材料形成的特征(162),(164),例如二嵌段共聚物。 共聚物的组织由间隔物(152)引导,间隔物(152)已经通过间距倍增过程形成,其中间隔物(152)形成在牺牲心轴(142)的侧面,后者被移除以离开间隔开 ,独立式间隔件(152)。 由两个不混溶的嵌段物质组成的二嵌段共聚物沉积在间隔物(152)之上和之间的空间中。 使共聚物自组织,每个嵌段物质与相同类型的其它嵌段物种聚集。
    • 35. 发明申请
    • MEMORY CELLS AND METHODS OF STORING INFORMATION
    • 记忆细胞和存储信息的方法
    • WO2013015934A3
    • 2013-04-18
    • PCT/US2012044483
    • 2012-06-27
    • MICRON TECHNOLOGY INCSANDHU GURTEJ SRAMASWAMY D V NIRMAL
    • SANDHU GURTEJ SRAMASWAMY D V NIRMAL
    • H01L27/115H01L21/8247
    • H01L29/792G11C16/0416G11C16/3418H01L21/28273H01L29/788
    • Some embodiments include memory cells which have channel-supporting material, dielectric material over the channel-supporting material, carrier-trapping material over the dielectric material and an electrically conductive electrode material over and directly against the carrier-trapping material; where the carrier-trapping material includes gallium, indium, zinc and oxygen. Some embodiments include methods of storing information. A memory cell to is provided which has a channel-supporting material, a dielectric material over the channel-supporting material, a carrier-trapping material over the dielectric material, and an electrically conductive electrode material over and directly against the carrier-trapping material; where the carrier-trapping material includes gallium, indium, zinc and oxygen. It is determined if carriers are trapped in the carrier-trapping material to thereby ascertain a memory state of the memory cell.
    • 一些实施例包括具有通道支撑材料,在通道支撑材料上的电介质材料,介电材料上方的载流子捕获材料以及超过并直接抵靠载体捕获材料的导电电极材料的存储单元; 其中载流子捕获材料包括镓,铟,锌和氧。 一些实施例包括存储信息的方法。 提供一种存储单元,其具有通道支撑材料,在通道支撑材料上方的介电材料,介电材料上的载流子捕获材料,以及在载体捕获材料上方并直接抵靠载体捕获材料的导电电极材料; 其中载流子捕获材料包括镓,铟,锌和氧。 确定载体是否被捕获在载流子捕获材料中,从而确定存储单元的存储状态。
    • 36. 发明申请
    • SPIN TORQUE TRANSFER MEMORY CELL STRUCTURES AND METHODS
    • 旋转转矩记忆细胞结构和方法
    • WO2012036733A3
    • 2012-06-07
    • PCT/US2011001584
    • 2011-09-13
    • MICRON TECHNOLOGY INCKRAMER STEPHEN JSANDHU GURTEJ S
    • KRAMER STEPHEN JSANDHU GURTEJ S
    • G11C11/16
    • H01L27/228G11C11/161G11C11/1675G11C11/5607H01L43/08
    • Spin Torque Transfer (STT) memory cell structures and methods are described herein. One or more STT memory cell structures comprise a STT stack including: a pinned ferromagnetic material in contact with an antiferromagnetic material; a tunneling barrier material positioned between a ferromagnetic storage material and the pinned ferromagnetic material; a multiferroic material in contact with the ferromagnetic storage material; and a first electrode and a second electrode, wherein the antiferromagnetic material, the pinned ferromagnetic material, and the ferromagnetic storage material are located between the first electrode and the second electrode. The STT memory cell structure can include a third electrode and a fourth electrode, wherein at least a first portion of the multiferroic material is located between the third and the fourth electrode.
    • 本文描述了旋转转矩传递(STT)存储单元结构和方法。 一个或多个STT存储器单元结构包括STT堆叠,其包括:与反铁磁材料接触的钉扎铁磁材料; 位于铁磁存储材料和被钉扎的铁磁材料之间的隧道阻挡材料; 与铁磁存储材料接触的多铁性材料; 以及第一电极和第二电极,其中所述反铁磁材料,所述钉扎铁磁材料和所述铁磁存储材料位于所述第一电极和所述第二电极之间。 STT存储单元结构可以包括第三电极和第四电极,其中多铁性材料的至少第一部分位于第三和第四电极之间。